0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
LM48555TLBD

LM48555TLBD

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Ceramic

  • 描述:

    BOARD EVALUATION LM48555TL

  • 详情介绍
  • 数据手册
  • 价格&库存
LM48555TLBD 数据手册
User's Guide SNAA041A – April 2007 – Revised May 2013 AN-1611 LM48555 Evaluation Board 1 Quick Start Guide 1. 2. 3. 4. 2 Apply power supply voltage to positive terminal of JU4, and source ground to the negative terminal. Short the terminals of JU1 to release the device from shutdown mode. Connect a ceramic speaker, and series resistance load across the output terminals of JU3. Apply a differential audio signal to the positive and negative terminals of JU2. Introduction The LM48555 is an audio power amplifier designed to drive ceramic speakers in portable applications. The LM48555 outputs15.5VP-P with less than 1% THD + N while operating from a 3.2V power supply. The LM48555 features differential inputs for improved noise rejection and a low power shutdown mode. The LM48555 includes advanced click and pop suppression that eliminates audible turn-on and turn-off transients. Additionally, the integrated boost regulator features a soft start function that minimizes transient current during power-up. The LM48555 is unity-gain stable and uses external gain-setting resistors. The LM48555 Evaluation board (Figure 1) allows you to easily evaluate the performance and characteristics of the LM48555 device. It provides connectors for audio inputs, audio outputs, power supply, and shutdown control. The ceramic speaker load is not included on the demo board, an external ceramic speaker plus series resistor is needed for evaluation. 3 Operating Conditions • • Temperature Range -40°C ≤ TA ≤ +85°C Supply Voltage 2.7V < VDD < 6.5V All trademarks are the property of their respective owners. SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback AN-1611 LM48555 Evaluation Board Copyright © 2007–2013, Texas Instruments Incorporated 1 LM48555 Evaluation Board 4 www.ti.com LM48555 Evaluation Board Figure 1. LM48555 Evaluation Board 2 AN-1611 LM48555 Evaluation Board SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated Evaluation Board Schematic www.ti.com 5 Evaluation Board Schematic RIN20 k: Soft Start CSS 100 nF CIN470 nF INRSD SD JU1 1 k: JU4 CF82 pF RF200 k: CF+ 82 pF RF+ 200 k: VDD GND OUT+ L1 10 PH LM48555 GND INPUT JU2 CS 4.7 PF OUTPUT JU3 VDD OUT- SW D1 GND (SW) CO 10 PF IN+ RIN+ 20 k: Bootstrap VAMP CIN+ 470 nF Figure 2. Evaluation Board Schematic 6 Connectors The LM48555 evaluation boards features connectors for the audio inputs, audio outputs, power supply, and shutdown control. The functionality and designators of each connector are specified in Table 1. Table 1. Connectors 7 Designator Label JU1 Shutdown Function JU2 Audio Input JU3 Audio Output This connector provides a connection to the amplifier outputs. A ceramic speaker load, and series resistors, should be connected across these terminals. JU4 Power Supply This connector provides the power supply connection. Apply an external power supply’s positive voltage to the pin labeled VDD and the ground source to the pin labeled GND. This connector is used to control the Shutdown function: If JU1 is open, then the LM48555 is in Shutdown. If JU1 is shorted, then the LM48555 is active. This connector connects the audio input signal to the device inputs. Apply the positive signal source to the pin labeled “+” and the negative signal source to the pin labeled “-”. Bill of Materials Table 2. Bill of Materials Designator Part Description D2 Diode Schottky 20V 0.5A SOD123 L1 INDUCTOR 10μH 20% SMD CIN+, CIN- Capacitor Ceramic 0.47μF 10V X5R 0402 Manufacturer Part Number ON Semi MBR0520LT1G Taiyo Yuden NR3010T100M Murata GRM155R61A474KE15D CO Capacitor Ceramic 10μF 16V X5R 0805 Taiyo Yuden EMK212BJ106KG-T CSS Capacitor Ceramic 0.1μF 25V X5R 0402 Murata TMK105BJ104KV-F Capacitor Ceramic 82pF 50V 5% C0G 0402 Murata GRM1555C1H820JZ01D CF+, CFCS Capacitor Ceramic 4.7μF 16V X5R 0805 Taiyo Yuden SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback EMK212BJ475KG-T AN-1611 LM48555 Evaluation Board Copyright © 2007–2013, Texas Instruments Incorporated 3 Evaluation Board Components www.ti.com Table 2. Bill of Materials (continued) Designator 8 Part Description Manufacturer Part Number RF+, RF- Resistor 200kΩ 1/16W 1% 0402 SMD Panasonic ERJ-2RKF2003X RIN+, RIN- Resistor 20kΩ 1/16W 1% 0402 SMD Panasonic ERJ-2RKF2002X RSD Resistor 1.0kΩ 1/16W 1% 0402 SMD Panasonic ERJ-2RKF1001X Evaluation Board Components Part number and manufacturer information for the components on the LM48555 evaluation board can be found in the Bill of Materials (Table 2). For more information on component selection refer to the LM48555 datasheet. 9 PCB Layout Guidelines High frequency boost converters require very careful layout of components in order to get stable operation and low noise. All components must be as close as possible to the LM4962 device. It is recommended that a four-layer PCB be used so that internal ground planes are available. See Figure 3 through Figure 8 for demo board reference schematic and layout. Some additional guidelines to be observed: • Keep the path between L1, D1, and CO extremely short. Parasitic trace inductance in series with D1 and C0 will increase noise and ringing. • If internal ground planes are available (recommended) use vias to connect directly to ground at the GND (SW) and GND pins of U1, as well as the negative sides of capacitors CS and CO. 10 General Layout Recommendations This section provides practical guidelines for PCB layouts. Designers should note that these are only ruleof-thumb recommendations and the actual results will depend heavily on the final layout. 10.1 Power and Ground Circuits For multi-layer boards, it is important to isolate the switching power and ground trace paths from the amplifier power and ground trace paths. Star trace routing techniques (bringing individual traces back to a central point rather than daisy chaining traces together in a serial manner) can have a major impact on low level signal performance. Star trace routing refers to using individual traces to feed power and ground to each circuit or even device. This technique will require a greater amount of design time but will not increase the final price of the board. 10.2 Avoiding Typical Design / Layout Problems Avoid ground loops or running digital and analog traces parallel to each other (side-by-side) on the same PCB layer. When traces must cross over each other, do it at 90 degrees. Running digital and analog traces at 90 degrees to each other from the top to the bottom side as much as possible will minimize capacitive noise coupling and crosstalk. 11 Micro SMD Wafer Level Chip Scale Package: PCB, Layout, and Mounting Considerations Please refer to AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009) for possible updates to the μSMD package information. 4 AN-1611 LM48555 Evaluation Board SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated PCB Layout www.ti.com 12 PCB Layout Figure 3. Silkscreen Top Figure 4. Top Layer SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback AN-1611 LM48555 Evaluation Board Copyright © 2007–2013, Texas Instruments Incorporated 5 PCB Layout www.ti.com Figure 5. Layer 2 Figure 6. Layer 3 6 AN-1611 LM48555 Evaluation Board SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated PCB Layout www.ti.com Figure 7. Bottom Layer Figure 8. Silkscreen Bottom SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback AN-1611 LM48555 Evaluation Board Copyright © 2007–2013, Texas Instruments Incorporated 7 Revision Table 13 8 www.ti.com Revision Table Rev Date Description 1.0 04/03/07 Initial release. AN-1611 LM48555 Evaluation Board SNAA041A – April 2007 – Revised May 2013 Submit Documentation Feedback Copyright © 2007–2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
LM48555TLBD
物料型号:LM48555

器件简介: - LM48555是一款音频功率放大器,专为便携式应用中的陶瓷扬声器设计。 - 它能够在3.2V电源下输出15.5VP-P的音频信号,总谐波失真加噪声(THD + N)小于1%。 - 该器件具备差分输入以提高噪声抑制能力,并具有低功耗关闭模式。 - 还包括先进的点击和弹跳抑制功能,消除了开机和关机时的瞬态声音。 - 集成的升压调节器具有软启动功能,以减少上电时的瞬态电流。

引脚分配: - JU1:关闭控制 - JU2:音频输入 - JU3:音频输出 - JU4:电源供应

参数特性: - 工作温度范围:-40°C 至 +85°C - 供电电压:2.7V 至 6.5V

功能详解: - LM48555 Evaluation Board提供了音频输入、音频输出、电源供应和关闭控制的连接器。 - 该评估板允许用户轻松评估LM48555的性能和特性。 - 评估板不包括陶瓷扬声器负载,需要外部陶瓷扬声器和串联电阻进行评估。

应用信息: - 主要应用于便携式音频设备中的陶瓷扬声器驱动。

封装信息: - 封装类型未在文档中明确说明,但提到了评估板使用的是μSMD封装,并提供了相关的PCB布局和安装考虑。

物料清单: - 包括肖特基二极管、电感、陶瓷电容、电阻等元件的型号和制造商信息。

PCB布局指南: - 提供了高频升压转换器的PCB布局指南,强调了组件布局的重要性,以及如何避免设计和布局问题。
LM48555TLBD 价格&库存

很抱歉,暂时无法提供与“LM48555TLBD”相匹配的价格&库存,您可以联系我们找货

免费人工找货
LM48555TLBD
  •  国内价格 香港价格
  • 1+1647.245071+204.33999

库存:1