LM48901SQ/NOPB

厂商：
BURR-BROWN(德州仪器)
封装：
WFQFN32_EP
描述：
IC AMP AUDIO 2.8W D QUAD 32WQFN

数据手册：

下载LM48901SQ/NOPB.pdf

立即购买

数据手册
价格&库存

LM48901SQ/NOPB 数据手册

LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 LM48901 Quad Class D Spatial Array Check for Samples: LM48901 FEATURES • • • • • APPLICATIONS 1 2 • • • • • Spatial Sound Processing I2S Compatible Input Differential-Input Stereo ADC Edge Rate Control Reduces EMI while Preserving Audio Quality and Efficiency Paralleled Output Mode Short Circuit and Thermal Overload Protection Minimum external components Click and Pop suppression Micro-power shutdown • • • • • • • Available in space-saving micro SMD and LLP packages Laptops Tablets Desktop Computers Sound Bars Multimedia Devices MP3 Player Accessories Docking Stations DESCRIPTION The LM48901 is a quad Class D amplifier that utilizes Texas Instruments’ proprietary spatial sound processor to create an enhanced sound stage for portable multimedia devices. The Class D output stages feature Texas Instruments’ edge rate control (ERC) PWM architecture that significantly reduces RF emissions while preserving audio quality and efficiency. The LM48901’s flexible I2S interface is compatible with standard serial audio interfaces. A stereo differential-input ADC gives the device the ability to process analog stereo audio signals. The LM48901 is configured through an I2C compatible interface and is capable of delivering 2.8W/channel of continuous output power into an 4Ω load with less than 10% THD+N. A 2.1 mode pairs two output drivers in parallel, increasing current drive for 4Ω loads. Output short circuit and thermal overload protection prevent the device from being damaged during fault conditions. Superior click and pop suppression eliminates audible transients on power-up/down and during shutdown. The LM48901 is available in space saving microSMD and LLP packages. Table 1. Key Specifications SNR (A-Weighted) Output Power/channel, PVDD = 5V THD+N VALUE UNIT 87 dBA (typ) RL = 8Ω, THD+N ≤10% 1.7 RL = 4Ω, THD+N ≤10% 2.8 W (typ) 0.06% (typ) Efficiency/Channel 89% (typ) PSRR at 217Hz 71 dB (typ) 1 µA (typ) Shutdown current 1 μA (typ) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2012, Texas Instruments Incorporated LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Typical Application 1.62V to 5.5V CS 2.7V to 5.5V CS 1.62V to 1.98V 2.7V to 5.5V CS CS CS IOVDD PLLVDD DVDD AVDD 2.7V to 5.5V CS PVDD PVDD OUT1+ HBRIDGE INL+ OUT1- INLINR+ INR- 18-BIT STEREO ADC REF OUT2+ 4.7 PF HBRIDGE PLL OUT2- MCLK SCLK WS 2 I S INTERFACE SPATIAL PROCESSOR SDIO OUT3+ HBRIDGE OUT3- I2C_EN I2C_EX SDA SCL 2 I C INTERFACE OUT4+ HBRIDGE SHDN IOGND DGND GND GND PGND OUT4- PGND Figure 1. Typical Audio Amplifier Application Circuit 2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 1.62V to 5.5V CS 2.7V to 5.5V CS 1.62V to 1.98V 2.7V to 5.5V CS CS CS IOVDD PLLVDD DVDD AVDD 2.7V to 5.5V CS PVDD PVDD OUT1+ HBRIDGE INL+ OUT1- INLINR+ INR- 18-BIT STEREO ADC REF OUT2+ 4.7 PF HBRIDGE PLL OUT2- MCLK SCLK WS I2S INTERFACE SPATIAL PROCESSOR SDIO OUT3+ HBRIDGE OUT3- I2C_EN I2C_EX SDA SCL I2C INTERFACE OUT4+ HBRIDGE SHDN IOGND DGND GND GND PGND OUT4- PGND Figure 2. Channel Audio Amplifier Application Circuit Only OUT2 and OUT3 can be configured in parallel. OUT1 and OUT4 cannot be configured in parallel. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 3 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Connection Diagram micro SMD Package A OUT4+ PVDD OUT3+ OUT2+ PVDD OUT1+ B OUT4- PGND OUT3- OUT2- PGND OUT1- C IOVDD DVDD DGND AGND AVDD AVDD D SHDN I C_EN IOGND AGND PLLVDD AVDD E I C_EX WS SDA INR- INL- REF F MCLK SCLK SDIO SCL INR+ INL+ 1 2 3 4 5 6 2 2 Figure 3. Top View 36–Bump micro SMD Marking XYTT G02 Pin 1 Figure 4. Top View XY = Date code TT = Die traceability G = Boomer Family 02 = LM48901RL 4 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 PGND OUT4- DGND IOVDD DVDD SHDN I2C_EN I2C_EX 32 31 30 29 28 27 26 25 SQ Package OUT4+ 1 24 MCLK PVDD 2 23 WS OUT3- 3 22 SCLK OUT3+ 4 21 SDIO OUT2+ 5 20 SDA OUT2- 6 19 SCL PVDD 7 18 INR- OUT1+ 8 17 INR+ 11 12 13 14 15 OUT1- GND AVDD1 AVDD2 REF INL- INL+ 10 PGND 16 9 Figure 5. Top View Table 2. Pin Descriptions BUMP PIN NAME A1 1 OUT4+ Channel 4 Non-Inverting Output DESCRIPTION A2, A5 2, 7 PVDD Class D Power Supply A3 4 OUT3+ Channel 3 Non-Inverting Output. Connect to OUT2+ in Parallel Mode. A4 5 OUT2+ Channel 2 Non-Inverting Output. Connect to OUT3+ in Parallel Mode. A6 8 OUT1+ Channel 1 Non-Inverting Output B1 31 OUT4- Channel 4 Inverting Output B2, B5 9, 32 PGND Power Ground B3 3 OUT3- Channel 3 Inverting Output. Connect to OUT2- in Parallel Mode. B4 6 OUT2- Channel 2 Inverting Output. Connect to OUT3- in Parallel Mode. B6 10 OUT1- Channel 1 Inverting Output C1 29 IOVDD Digital Interface Power Supply C2 28 DVDD Digital Power Supply C3 30 DGND Digital Ground C4 11 AGND1 Modulator Analog Ground C5 — AVDD3 ADC Reference Power Supply C6 12 AVDD1 Modulator Analog Power Supply. Set to same voltage as PVDD for maximum headroom. D1 27 SHDN Active Low Shutdown. Connect to VDD for normal operation. D2 26 I2C_EN I2C Enable Input D3 30 IOGND Digital Interface Ground D4 — AGND2 ADC Analog Ground Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 5 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Table 2. Pin Descriptions (continued) BUMP PIN NAME D5 — PLLVDD PLL Power Supply DESCRIPTION D6 13 AVDD2 ADC Analog Power Supply E1 25 I2C_EX I2C Enable Output E2 23 WS I2S Word Select Input E3 20 SDA I2C Serial Data Input E4 18 INR- Right Channel Inverting Analog Input E5 15 INL- Left Channel Inverting Analog Input E6 14 REF ADC Reference Bypass F1 24 MCLK Master Clock F2 22 SCLK Serial Clock Input F3 21 SDIO I2S Serial Data Input/Output F4 19 SCL I2C Clock Input F5 17 INR+ Right Channel Non-Inverting Analog Input F6 16 INL+ Left Channel Non-Inverting Analog Input These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage AVDD, PVDD, PLVDD, IOVDD (1) Supply Voltage, DVDD 6.0V (1) 2.2V −65°C to + 150°C Storage Temperature −0.3V to VDD + 0.3V Input Voltage Power Dissipation (3) Internally limited ESD Susceptibility (4) 2000V ESD Susceptibility (5) 150V Junction Temperature 150°C Thermal Resistance (1) (2) (3) (4) (5) θJA (microSMD) 26°C/W θJA (LLP) 26°C/W θJC (LLP) 2.6°C/W “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified. The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature, TA. The maximum allowable power dissipation is PDMAX = (TJMAX − TA) / θJA or the given in Absolute Maximum Ratings, whichever is lower. Human body model, applicable std. JESD22-A114C. Machine model, applicable std. JESD22-A115-A. Operating Ratings Temperature Range TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ +85°C Supply Voltage 2.7V ≤ AVDD ≤ 5.5V AVDD 6 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Operating Ratings (continued) 2.7V ≤ PVDD ≤ 5.5V PVDD 2.7V ≤ PLLVDD ≤ 5.5V PLLVDD IOVDD 1.62V ≤ IOVDD ≤ 5.5V DVDD 1.62V ≤ DVDD ≤ 1.98V Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 7 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Electrical Characteristics PVDD = AVDD = 5V, IOVDD = PLLVDD = 3.3V, DVDD = 1.8 (1) (2) The following specifications apply for AV = 0dB, CREF = 4.7µF, RL = 8Ω, f = 1kHz, unless otherwise specified. Limits apply for TA = 25°C. LM48901 Symbol Parameter Conditions Min (2) Typ (3) Max (2) Units (Limits) AVDD Analog Supply Voltage Range (4) 2.7 5.5 V PVDD Amplifier Supply Voltage Range (4) 2.7 5.5 V PLLVDD PLL Supply Voltage Range 2.7 5.5 V IOVDD Interface Supply Voltage Range 1.62 5.5 V DVDD Digital Supply Voltage Range 1.62 1.98 V LM48901RL 17.5 21 mA AIDD Analog Quiescent Supply Current LM48901SQ 19.2 22.3 mA PIDD Amplifier Quiescent Supply Current RL = 8Ω 5.25 8.25 mA PLLIDD PLL Quiescent Supply Current LM48901RL 1.5 DIDD Quiescent Digital Power Supply Current ISD Shutdown Current (Analog, Amplifier and PLL Supplies) DISTBY Digital Standby Current DISD Digital Shutdown Current Shutdown Enabled VOS Differential Output Offset Voltage VIN = 0 TWU Wake-up Time fSW Switching Frequency Shutdown Enabled mA 5.5 6.2 mA 1 5 μA μA 30 μA 2 –17 0 17 mV Power Up (Device Initialization) 150 From Shutdown 30 ms ms fS = 48kHz 384 kHz VDD = 5V 2.8 W VDD = 3.6V 1.4 W VDD = 5V 2.2 W VDD = 3.6V 1.2 W RL = 4Ω, THD+N = 10% f = 1kHz, 22kHz BW RL = 4Ω, THD+N = 1% f = 1kHz, 22kHz BW PO Output Power/Channel RL = 8Ω, THD+N = 10% f = 1kHz, 22kHz BW VDD = 5V 1.7 W VDD = 3.6V 825 mW RL = 8Ω, THD+N = 1% f = 1kHz, 22kHz BW VDD = 5V VDD = 3.6V (1) (2) (3) (4) 8 1.0 1.3 W 650 mW The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. RL is a resistive load in series with two inductors to simulate an actual speaker load. For RL = 8Ω, the load is 15μH+8Ω+15μH. For RL = 4Ω, the load is 15μH+4Ω+15μH. Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Maintain PVDD and AVDD at the same voltage potential. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Electrical Characteristics PVDD = AVDD = 5V, IOVDD = PLLVDD = 3.3V, DVDD = 1.8 (1) (2) (continued) The following specifications apply for AV = 0dB, CREF = 4.7µF, RL = 8Ω, f = 1kHz, unless otherwise specified. Limits apply for TA = 25°C. LM48901 Symbol Parameter Conditions Min Typ (2) (3) Max (2) Units (Limits) RL = 4Ω, THD+N = 10%, f = 1kHz, 22kHz BW PO Output Power (Parallel Mode) THD+N (5) Total Harmonic Distortion + Noise VDD = 5V 3.2 W VDD = 3.6V 1.6 W VDD = 5V 2.5 W VDD = 3.6V 1.2 W 0.06 % fRIPPLE = 217Hz, Applied to PVDD 67 dB fRIPPLE = 217Hz, Applied to DVDD 54 dB fRIPPLE = 1kHz, Applied to PVDD 66 dB fRIPPLE = 1kHz, Applied to DVDD 54 dB fRIPPLE = 10kHz, Applied to PVDD 57 dB fRIPPLE = 10kHz, Applied to DVDD 52 dB fRIPPLE = 217Hz, Applied to PVDD 71 dB fRIPPLE = 217Hz, Applied to DVDD 58 dB fRIPPLE = 1kHz, Applied to PVDD 69 dB fRIPPLE = 1kHz, Applied to DVDD 57 dB fRIPPLE = 10kHz, Applied to PVDD 70 dB fRIPPLE = 10kHz, Applied to DVDD 55 dB VRIPPLE = 1VP-P, fRIPPLE = 217Hz, AV = 0dB 60 dB VDD = 5V, PO = 1.1W 89 % VDD = 3.6V, PO = 400mW 87 % VDD = 5V, PO = 1.1W 87 % VDD = 3.6V, PO = 400mW 86 % ADC Input, PO = 1W 85 dB I2S Input, PO = 1W 87 dB 5 V Inputs AC GND, A-weighted, AV = 0dB 130 μV I2S Input 72 μV 75 dB RL = 4Ω, THD+N = 1%, f = 1kHz, 22kHz BW PO = 500mW, f = 1kHz, RL = 8Ω VRIPPLE = 200mVP-P sine, Inputs AC GND, CIN = 1μF PSRR Power Supply Rejection Ratio (ADC Path) VRIPPLE = 200mVP-P sine, Inputs –120dBFS PSRR Power Supply Rejection Ratio (I2S Path) CMRR Common Mode Rejection Ratio η Efficiency/Channel η Efficiency SNR Signal-to-Noise-Ratio CMVR Common Mode Input Voltage Range εOS Output Noise XTALK (5) Crosstalk Only OUT2 and OUT3 can be configured in Parallel Mode. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 9 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 I2C Interface Characteristics www.ti.com (1) (2) The following specifications apply for RPU = 1kΩ to IOVDD, unless otherwise specified. Limits apply for TA = 25°C. LM48901 Symbol Parameter Conditions Min (3) VIH Logic Input High Threshold SDA, SCL VIL Logic Input Low Threshold SDA, SCL VOL Logic Output Low Threshold SDA, ISDA = 3.6mA IOH Logic Output High Current SDA, SCL (1) (2) (3) (4) 10 Hold Time (repeated START Condition) 2 3 (4) Max Units (3) 0.7*IOVDD V 300 SCL Frequency 1 Typ mV 0.35 V 2 uA 400 kHz 0.6 µs Clock Low Time 1.3 µs Clock High Time 600 ns 4 Setup Time for Repeated START condition 600 ns 5 Data Hold Time 6 Data Setup Time 7 SDA Rise Time 300 ns 8 SDA Fall Time 300 ns 9 Setup Time for STOP Condition 600 ns 10 Bus Free Time Between STOP and START Condition 1.3 µs Output 300 900 100 ns ns “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions. All voltages are measured with respect to the ground pin, unless otherwise specified. The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 I2S Timing Characteristics (1) (2) The following specifications apply for DVDD = 1.8V, unless otherwise specified. Limits apply for TA = 25°C. LM48901 Symbol Parameter Conditions Min (3) (1) (2) (3) (4) Typ (4) Max (3) Units (Limits) tMCLKL MCLK Pulse Width Low 16 ns tMCLKH MCLK Pulse Width High 16 ns tMCLKY MCLK Period 27 tBCLKR SCLK rise time 3 ns tBCLKCF SCLK fall time 3 ns tBCLKDS SCLK Duty Cycle ns 50 % TDL LRC Propagation Delay from SCLK falling edge TDST DATA Setup Time to SCLK Rising Edge 10 ns TDHT DATA Hold Time from SCLK Rising Edge 10 ns 10 ns The Electrical Characteristics tables list guaranteed specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not guaranteed. RL is a resistive load in series with two inductors to simulate an actual speaker load. For RL = 8Ω, the load is 15μH+8Ω+15μH. For RL = 4Ω, the load is 15μH+4Ω+15μH. Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis. Typical values represent most likely parametric norms at TA = +25ºC, and at the Recommended Operation Conditions at the time of product characterization and are not guaranteed. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 11 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Typical Performance Characteristics THD+N vs FREQUENCY VDD = 5V, POUT = 925 mW, RL = 8Ω, ADC Input 100 100 10 10 THD+N (%) THD+N (%) THD+N vs FREQUENCY VDD = 3.6V, POUT = 500mW, RL = 8Ω, ADC Input 1 0.1 1 0.1 SINGLE CHANNEL 0.01 0.01 0.1 1 10 SINGLE CHANNEL 0.01 0.01 0.1 1 100 FREQUENCY (kHz) 100 100 10 10 1 0.1 1 0.1 SINGLE CHANNEL 0.01 0.01 0.1 1 10 SINGLE CHANNEL 0.01 0.01 0.1 1 100 10 100 FREQUENCY (kHz) FREQUENCY (kHz) THD+N vs FREQUENCY VDD = 3.6V, POUT = 900mW, RL = 4Ω, ADC Input THD+N vs FREQUENCY VDD = 3.6V, POUT = 450mW, RL = 8Ω, I2S Input 100 100 10 10 THD+N (%) THD+N (%) 100 THD+N vs FREQUENCY VDD = 5V, POUT = 1.3W, RL = 4Ω, ADC Input THD+N (%) THD+N (%) THD+N vs FREQUENCY VDD = 3.6V, POUT = 7505 mW, RL = 4Ω, ADC Input 1 0.1 1 0.1 PARALLEL MODE 0.01 0.01 0.1 1 10 100 FREQUENCY (kHz) 12 10 FREQUENCY (kHz) SINGLE CHANNEL 0.01 0.01 0.1 1 10 100 FREQUENCY (kHz) Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Typical Performance Characteristics (continued) THD+N vs FREQUENCY VDD = 3.6V, POUT = 750mW, RL = 4Ω, I2S Input 100 100 10 10 THD+N (%) THD+N (%) THD+N vs FREQUENCY VDD = 5V, POUT = 950mW, RL = 8Ω, I2S Input 1 0.1 1 0.1 SINGLE CHANNEL 0.01 0.01 0.1 1 10 SINGLE CHANNEL 0.01 0.01 0.1 1 100 FREQUENCY (kHz) THD+N vs FREQUENCY VDD = 5V, POUT = 1.65W, RL = 4Ω, I2S Input 100 THD+N vs FREQUENCY VDD = 3.6V, POUT = 850mW, RL = 4Ω, I2S Input 100 100 10 10 THD+N (%) THD+N (%) 10 FREQUENCY (kHz) 1 0.1 1 0.1 SINGLE CHANNEL 0.01 0.01 0.1 1 10 PARALLEL MODE 0.01 0.01 0.1 1 100 10 100 FREQUENCY (kHz) FREQUENCY (kHz) THD+N vs FREQUENCY VDD = 5V, POUT = 1.8W, RL = 4Ω, I2S Input THD+N vs OUTPUT POWER RL = 8Ω, f = 1kHz, ADC Input 100 100 10 10 VDD = 5V THD+N (%) THD+N (%) VDD = 3.6V 1 0.1 1 0.1 PARALLEL MODE 0.01 0.01 0.1 1 10 100 FREQUENCY (kHz) SINGLE CHANNEL 0.01 0.001 0.01 0.1 1 10 OUTPUT POWER (W) Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 13 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Typical Performance Characteristics (continued) THD+N vs OUTPUT POWER RL = 4Ω, f = 1kHz, ADC Input, Single channel THD+N vs OUTPUT POWER RL = 8Ω, f = 1kHz, ADC Input 100 100 VDD = 5V VDD = 3.6V 10 THD+N (%) 10 THD+N (%) VDD = 5V 1 0.1 VDD = 3.6V 1 0.1 SINGLE CHANNEL 0.01 0.001 0.01 0.1 ALL CHANNELS 1 0.01 0.001 10 OUTPUT POWER (W) 0.01 0.1 1 10 OUTPUT POWER (W) THD+N vs OUTPUT POWER RL = 4Ω, f = 1kHz, ADC Input, All channels THD+N vs OUTPUT POWER RL = 4Ω, f = 1kHz, ADC Input, Parallel mode 100 100 VDD = 5V VDD = 5V 10 VDD = 3.6V VDD = 3.6V THD+N (%) THD+N (%) 10 1 0.1 0.1 PARALLEL MODE 0.01 0.001 0.01 0.1 ALL CHANNELS 0.01 0.001 1 0.01 0.1 1 10 OUTPUT POWER (W) THD+N vs OUTPUT POWER RL = 8Ω, f = 1kHz, I2S Input, Single mode 100 VDD = 5V VDD = 3.6V 10 THD+N (%) THD+N (%) VDD = 5V 1 0.1 VDD = 3.6V 1 0.1 SINGLE CHANNEL 0.01 0.001 0.01 0.1 1 SINGLE CHANNEL 0.01 0.001 0.01 0.1 10 OUTPUT POWER (W) 14 10 THD+N vs OUTPUT POWER RL = 4Ω, f = 1kHz, I2S Input, Single channel 100 10 1 OUTPUT POWER (W) 1 10 OUTPUT POWER (W) Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Typical Performance Characteristics (continued) THD+N vs OUTPUT POWER RL = 8Ω, f = 1kHz, I2S Input, All channels THD+N vs OUTPUT POWER RL = 4Ω, f = 1kHz, I2S Input, All channels 100 100 VDD = 5V 10 VDD = 3.6V VDD = 3.6V THD+N (%) THD+N (%) 10 VDD = 5V 1 1 0.1 0.1 ALL CHANNELS 0.01 0.001 0.01 ALL CHANNELS 0.1 1 0.01 0.001 10 OUTPUT POWER (W) 0.01 0.1 1 10 OUTPUT POWER (W) THD+N vs OUTPUT POWER RL = 4Ω, f = 1kHz, I2S Input, All channels THD+N vs OUTPUT POWER RL = 4Ω, f = 1kHz, I2S Input, Parallel mode 100 100 VDD = 5V VDD = 5V 10 10 VDD = 3.6V THD+N (%) THD+N (%) VDD = 3.6V 1 1 0.1 0.1 PARALLEL MODE 0.01 0.001 0.01 0.1 ALL CHANNELS 0.01 0.001 0.01 0.1 1 10 OUTPUT POWER (W) EFFICIENCY vs OUTPUT POWER RL = 8Ω, f = 1kHz, ADC Input, All channels 100 100 PV DD = 3.6V PVDD = 5V 90 80 80 PVDD = 5V 70 EFFICIENCY (%) 70 EFFICIENCY (%) 10 EFFICIENCY vs OUTPUT POWER RL = 4Ω, f = 1kHz, ADC Input, All channels 90 60 50 40 50 40 30 20 20 10 10 0 500 1000 1500 2000 OUTPUT POWER (mW) PVDD = 3.6V 60 30 0 1 OUTPUT POWER (W) 0 0 500 1000 1500 2000 2500 OUTPUT POWER (mW) Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 15 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Typical Performance Characteristics (continued) POWER DISSIPATION vs OUTPUT POWER RL = 8Ω, f = 1kHz, ADC Input 1000 3000 VDD = 5V POWER DISSIPATION (mW) POWER DISSIPATION (mW) 900 800 700 600 500 400 300 VDD = 3.6V 200 POWER DISSIPATION vs OUTPUT POWER RL = 4Ω, f = 1kHz, ADC Input VDD = 5V 2500 2000 VDD = 3.6V 1500 1000 500 100 ALL CHANNELS ALL CHANNELS 0 0 0 500 1000 1500 2000 0 500 1000 1500 2000 2500 OUTPUT POWER (mW) OUTPUT POWER (mW) OUTPUT POWER vs SUPPLY VOLTAGE RL = 4Ω, f = 1kHz, ADC Input, Single mode OUTPUT POWER vs SUPPLY VOLTAGE RL = 4Ω, f = 1kHz, ADC Input, Parallel mode 4 4 SINGLE CHANNEL 3.5 3 2.5 THD + N = 10% 2 1.5 1 PARALLEL MODE 3 OUTPUT POWER (W) OUTPUT POWER (W) 3.5 2.5 THD + N = 10% 2 1.5 1 THD + N = 1% 0.5 0 2.5 THD + N = 1% 0.5 3 3.5 4 4.5 5 0 2.5 5.5 3 3.5 4 4.5 5 5.5 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) OUTPUT POWER vs SUPPLY VOLTAGE RL = 8Ω, f = 1kHz, ADC Input, Single channel PSRR vs FREQUENCY PVDD = 5V, VRIPPLE = 200mVP-P, RL = 8Ω, ADC Mode, ADC input = AC GND 0 2.5 SINGLE CHANNEL -10 -20 THD + N = 10% -30 PSRR (dB) OUTPUT POWER (W) 2 1.5 1 -40 -50 -60 0.5 -70 THD + N = 1% -80 0 2.5 3 3.5 4 4.5 5 5.5 SUPPLY VOLTAGE (V) 16 -90 0.01 0.1 1 10 100 FREQUENCY (kHz) Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Typical Performance Characteristics (continued) PSRR vs FREQUENCY DVDD = 1.8V, VRIPPLE = 200mVP-P, RL = 8Ω, ADC Mode, ADC input = AC GND PSRR vs FREQUENCY PVDD = 5V, VRIPPLE = 200mVP-P, RL = 8Ω, I2S mode, I2S input = –120dBFS 0 0 -10 -10 -20 -30 PSRR (dB) PSRR (dB) -20 -30 -40 -40 -50 -60 -70 -50 -80 -60 0.01 0.1 1 10 -90 0.01 100 0.1 1 10 100 FREQUENCY (kHz) FREQUENCY (kHz) PSRR vs FREQUENCY DVDD = 1.8V, VRIPPLE = 200mVP-P, RL = 8Ω, I2S mode, I2S input = –120dBFS PSRR vs FREQUENCY VRIPPLE = 200mVP-P, RL = 8Ω, ADC mode 0 0 -10 -10 -20 PSRR (dB) PSRR (dB) -20 -30 -40 -30 -40 -50 -50 -60 -60 0.01 0.1 1 10 -70 0.01 100 0.1 1 10 100 FREQUENCY (kHz) FREQUENCY (kHz) SUPPLY CURRENT vs SUPPLY VOLTAGE (PVDD) RL = Open, ADC mode, All channels enabled SUPPLY CURRENT vs SUPPLY VOLTAGE (AVDD) RL = Open 20 5 SUPPLY CURRENT (PA) SUPPLY CURRENT (PA) ADC MODE 4 3 2 15 2 I S MODE 10 5 1 0 2.5 3 3.5 4 4.5 5 5.5 0 2.5 3 3.5 4 4.5 5 5.5 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 17 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Typical Performance Characteristics (continued) SUPPLY CURRENT vs SUPPLY VOLTAGE (PLVDD) ADC mode, All channels enabled 20 4 SUPPLY CURRENT (PA) SUPPLY CURRENT (PA) 5 3 2 1 0 2.5 3 3.5 4 4.5 5 15 10 ADC MODE 2 I S MODE 5 0 1.6 5.5 1.7 1.8 1.9 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) SHUTDOWN CURRENT vs SUPPLY VOLTAGE SHUTDOWN CURRENT vs SUPPLY VOLTAGE (DVDD) 2 SUPPLY CURRENT (PA) 1 SUPPLY CURRENT (PA) SUPPLY CURRENT vs SUPPLY VOLTAGE (DVDD) RL = Open 0.8 0.6 0.4 2 1.5 1 0.5 0.2 3 3.5 4 4.5 5 0 1.6 5.5 1.8 1.9 2 SUPPLY VOLTAGE (V) OUTPUT NOISE VS FREQUENCY PVDD = 5V, RL = 8Ω, ADC mode, ADC Input = AC GND OUTPUT NOISE VS FREQUENCY DVDD = 1.8V, RL = 8Ω, I2S mode, I2S Input = –120dBFS 200 200 150 150 100 50 0 0.01 0.1 1 10 100 FREQUENCY (Hz) 18 1.7 SUPPLY VOLTAGE (V) OUTPUT NOISE ( PV ) OUTPUT NOISE ( PV ) 0 2.5 100 50 0 0.01 0.1 1 10 100 FREQUENCY (Hz) Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Application Information I2C COMPATIBLE INTERFACE The LM48901 is controlled through an I2C compatible serial interface that consists of a serial data line (SDA) and a serial clock (SCL). The clock and data lines are bi-directional (open drain). The LM48901 can communicate at clock rates up to 400kHz. Figure 6 shows the I2C interface timing diagram. Data on the SDA line must be stable during the HIGH period of SCL. The LM48901 is a transmit/receive device, and can act as the I2C master, generating the SCL signal. Each transmission sequence is framed by a START condition and a STOP condition Figure 7. Due to the number of data registers, the LM48901 employs a page mode scheme. Each data write consists of 7, 8 bit data bytes, device address (1 byte), 16 bit register address (2 bytes), and 32 bit register data (4 bytes). Each byte is followed by an acknowledge pulse Figure 8. Single byte read and write commands are ignored. The LM48901 device address is 0110000X. Figure 6. I2C Timing Diagram SDA SCL S P START condition STOP condition Figure 7. Start and Stop Diagram WRITE SEQUENCE The example write sequence is shown in Figure 8. The START signal, the transition of SDA from HIGH to LOW while SDA is HIGH, is generated, altering all devices on the bus that a device address is being written to the bus. The 7-bit device address is written to the bus, most significant bit (MSB) first, followed by the R/W bit (R/W = 0 indicating the master is writing to the LM48901). The data is latched in on the rising edge of the clock. Each address bit must be stable while SDA is HIGH. After the R/W\ bit is transmitted, the master device releases SDA, during which time, an acknowledge clock pulse is generated by the slave device. If the LM48901 receives the correct address, the device pulls the SDA line low, generating and acknowledge bit (ACK). Once the master device registers the ACK bit, the first 8-bit register address word is sent, MSB first [15:8]. Each data bit should be stable while SCL is HIGH. After the first 8-bit register address is sent, the LM48901 sends another ACK bit. Upon receipt of acknowledge, the second 8-bit register address word is sent [7:0], followed by another ACK bit. The register data is sent, 8-bits at a time, MSB first in the following order [7:0], [15:8], [23:16], [31:24]. Each 8-bit word is followed by an ACK, upon receipt of which the successive 8-bit word is sent. Following the acknowledgement of the last register data word [31:24], the master issues a STOP bit, allowing SDA to go high while SDA is high. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 19 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com SCL SDA START MSB ACK REGISTER ADDRESS [15:8] ACK REGISTER ADDRESS [7:0] ACK REGISTER DATA [7:0] ACK REGISTER DATA [15:8] ACK REGISTER DATA [23:16] ACK REGISTER DATA [31:24] ACK DEVICE ADDRESS W LSB SCL SDA SCL SDA STOP Figure 8. Example I2C Write Sequence READ SEQUENCE The example read sequence is shown in Figure 9. The START signal, the transition of SDA from HIGH to LOW while SDA is HIGH, is generated, altering all devices on the bus that a device address is being written to the bus. The 7-bit device address is written to the bus, followed by the R/W = 0. After the R/W bit is transmitted, the master device releases SDA, during which time, an acknowledge clock pulse is generated by the slave device. If the LM48901 receives the correct address, the device pulls the SDA line low, generating and acknowledge bit (ACK). Once the master device registers the ACK bit, the first 8-bit register address word is sent, MSB first [15:8], followed by and ACK from the LM48901. Upon receipt of the acknowledge, the second 8-bit register address word is sent [7:0], followed by another ACK bit. Following the acknowledgement of the last register address, the master initiates a REPEATED START, followed by the 7-bit device address, followed by R/W = 1 (R/W = 1 indicating the master wants to read data from the LM48901). The LM48901 sends an ACK, followed by the selected register data. The register data is sent, 8-bits at a time, MSB first in the following order [7:0], [15:8], [23:16], [31:24]. Each 8-bit word is followed by an ACK, upon receipt of which the successive 8-bit word is sent. Following the acknowledgement of the last register data word [31:24], the master issues a STOP bit, allowing SDA to go high while SDA is high. SCL SDA START MSB DEVICE ADDRESS LSB W ACK REGISTER ADDRESS [15:8] ACK REGISTER ADDRESS [7:0] ACK START MSB DEVICE ADDRESS LSB R ACK REGISTER DATA [7:0] ACK REGISTER DATA [15:8] ACK ACK REGISTER DATA [31:24] ACK SCL SDA SCL SDA REGISTER DATA [23:16] STOP Figure 9. Example I2C Read Sequence I2S DATA FORMAT The LM48901 supports three I2S formats: Normal Mode Figure 10, Left Justified Mode Figure 11, and Right Justified Mode Figure 12. In Normal Mode, the audio data is transmitted MSB first, with the unused bits following the LSB. In Left Justified Mode, the audio data format is similar to the Normal Mode, without the delay between the LSB and the change in I2S_WS. In Right Justified Mode, the audio data MSB is transmitted after a delay of a preset number of bits. 20 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 I2S_CLK I2S_WS X I2S_DATA 23 22 21 1 0 X X 23 LEFT CHANNEL DATA WORD 22 21 1 0 X X RIGHT CHANNEL DATA WORD 2 Figure 10. I S Normal Input Format I2S_CLK I2S_WS I2S_DATA 23 22 21 20 2 1 0 X 23 22 21 LEFT CHANNEL DATA WORD 20 3 2 1 0 X RIGHT CHANNEL DATA WORD Figure 11. I2S Left Justified Input Format I2S_CLK I2S_WS I2S_DATA X X 23 22 2 1 0 X LEFT CHANNEL DATA WORD X 23 22 2 1 0 RIGHT CHANNEL DATA WORD 2 Figure 12. I S Right Justified Input Format MEMORY ORGANIZATION The LM48901 memory is organized into three main regions: a 32-bit wide Coefficient Space that holds the spatial coefficients, a 32-bit wide Register Space that holds the device configuration settings, and a 48-bit wide Audio Sample Space that holds the current audio data sampled from either the ADCs or the I2S interface, organized as shown in Figure 13. 0X7FFh INPUT SAMPLE MEMORY (48-BIT) 0x700h - 0x7FFh: Array Filter Sample Memory 0x600h - 0x67Fh: Pre-Filter Sample Memory 0X600h REGISTER SPACE (32-BIT) 0x520h - 0x527h: Analog Control Registers 0x510h - 0x51Fh: System Control Registers 0x500h - 0x50Fh: Filter Control Registers 0X500h COEFFICIENT SPACE (32-BIT) 0x400h - 0x4FFh: Pre-Filter Coefficients 0x000h - 0x3FFh: Array Coefficients 0X000h Figure 13. LM48901 Memory Organization Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 21 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com COEFFICIENT MEMORY The device must be in Debug mode in order to write to the Coefficient memory. Set Bit 7 (DBG_ENABLE) in Filter Debug Register 1 (0x504h) = 1 to enable Debug mode. The Coefficient Memory Space is organized as follows. Table 3. Coefficient Memory Space REGISTER ADDRESS REGISTER CONTENTS 0x000h - 0x0FFh 0x100h - 0x1FFh 0x200h - 0x2FFh 0x300h - 0x3FFh 0x400h - 0x47Eh (EVEN) 0x441h - 0x47Fh (ODD) (31:16) (15:0) 256x16 bit Array Taps 256x16 bit Array Taps (Right Input to OUT4) (Left Input to OUT4) 256x16 bit Array Taps 256x16 bit Array Taps (Right Input to OUT3) (Left Input to OUT3) 256x16 bit Array Taps 256x16 bit Array Taps (Right Input to OUT2) (Left Input to OUT2) 256x16 bit Array Taps 256x16 bit Array Taps (Right Input to OUT1) (Left Input to OUT1) C2 128x16 bit Prefilter Taps C0 128x16 bit Prefilter FIR Taps (Right to Right) (Left to Left) C3 128x16 bit Prefilter Taps C1 128x16 bit Prefilter FIR Taps (Right to Left) (Left to Right) CONTROL REGISTERS Table 4. Register Map Register Name FILTER CONTROL FILTER COMP1 FILTER COMP2 FILTER DEBUG0 FILTER DEBUG1 22 Register Address Default Value 0x500h [7:0] 0xFFh 0x500h [15:8] 0xFFh 0x500h [23:16] 0xE4h 0x500h [31:24] 0x31h 0x501h [7:0] 0x00h 7 6 5 4 3 2 1 0 ARRAY_TAP UNUSED PRE_TAP CH4_SEL CH3_SEL CH2_SEL ARRAY_ PRE_ ARRAY_ PRE_ ENABLE ENABLE BYPASS BYPASS UNUSED G1_GAIN UNUSED COMP_TH 0x501h [15:8] 0x00h 0x501h [23:16] 0x00h POST_GAIN ARRAY_COMP_SELECT 0x501h [31:24] 0x00h UNUSED 0x502h [7:0] 0x00h UNUSED 0x502h [15:8] 0x00h 0x502h [23:16] 0x00h 0x502h [31:24] 0x00h 0x503h [7:0] 0xFFh G1_GAIN UNUSED COMP_RATIO COMP_TH POST_GAIN UNUSED POST_GAIN UNUSED G1_GAIN UNUSED CH1_SEL COMP_RATIO COMP_TH COMP_RATIO DBG_DATA [7:0] 0x503h [15:8] 0xFFh DBG_DATA [15:8] 0x503h [23:16] 0xFFh DBG_DATA [23:16] 0x503h [31:24] 0xFFh 0x504h [7:0] 0xFFh DBG_ UNUSED STEP DBG_ STEP_ ENABLE ENABLE UNUSED FILTER_ ACC_ADDR SELECT 0x504h [15:8] 0xFFh UNUSED 0x504h [23:16] 0xFFh UNUSED 0x504h [31:24] 0xFFh UNUSED Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Table 4. Register Map (continued) Register Name FILTER STATS FILTER TAP (READONLY) ACCUML DEBUG (READONLY) ACCUMH DEBUG (READONLY) DBG SAT (READONLY) STAT PCNT1 (READONLY) STAT PCNT2 (READONLY) STAT ACNT1 (READONLY) STAT ACNT2 (READONLY) Register Address Default Value 0x505h [7:0] 0x00h 7 6 5 4 3 2 COUNT1_MODE CLEAR 0 CH_SEL 0x505h [15:8] 0x80h 0x505h [23:16] 0x00h UNUSED COUNT2_MODE 0x505h [31:24] 0x80h 0x508h [7:0] 0x7Fh TAP_LENGTH COUNT1_MODE CLEAR 1 CH_SEL UNUSED COUNT2_MODE 0x508h [15:8] 0x00h UNUSED 0x508h [23:16] 0x00h UNUSED 0x508h [31:24] 0x00h UNUSED 0x509h [7:0] 0x00h DBG_ACCL [7:0] 0x509h [15:8] 0x00h DBG_ACCL [15:8] 0x509h [23:16] 0x00h DBG_ACCL [23:16] 0x509h [31:24] 0x00h DBG_ACCL [31:24] 0x50Ah [7:0] 0x00h DBG_ACCH 0x50Ah [15:8] 0x00h BDG_ACCH 0x50Ah [23:16] 0x00h UNUSED 0x50Ah [31:24] 0x00h UNUSED 0x50Bh [7:0] 0x00h DBG_SAT [7:0] 0x50Bh [15:8] 0x00h DBG_SAT [15:8] 0x50Bh [23:16] 0x00h DBG_SAT [23:16] 0x50Bh [31:24] 0x00h UNUSED 0x50Ch [7:0] 0x00h COUNT [7:0] 0x50Ch [15:8] 0x00h COUNT [15:8] 0x50Ch [23:16] 0x00h COUNT [23:16] 0x50Ch [31:24] 0x00h 0x50Dh [7:0] 0x00h OVF COUNT [30:24] COUNT [7:0] 0x50Dh [15:8] 0x00h COUNT [15:8] 0x50Dh [23:16] 0x00h COUNT [23:16] 0x50Dh [31:24] 0x00h 0x50Eh [7:0] 0x00h OVF COUNT [30:24] COUNT [7:0] 0x50Eh [15:8] 0x00h COUNT [15:8] 0x50Eh [23:16] 0x00h COUNT [23:16] 0x50Eh [31:24] 0x00h 0x50Fh [7:0] 0x00h OVF COUNT [30:24] COUNT [7:0] 0x50Fh [15:8] 0x00h COUNT [15:8] 0x50Fh [23:16] 0x00h COUNT [23:16] 0x50Fh [31:24] 0x00h OVF COUNT [30:24] CONFIG 0x530h [7:0] 0x30h _CLK_ DEVICE_ID ENABLE SYS CONFIG 0x530h [15:8] 0x00h 0x530h [23:16] 0x8Ch 0x530h [31:24] 0x00h ALTID_ ALT_DEVICE_ID ENABLE CL_ ENABLE UNUSED CL_PAGE UNUSED CL_W CL_REQ MBIST1_ MBIST0_ ENABLE ENABLE Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 23 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Table 4. Register Map (continued) Register Name CL REG0 CL REG1 E2_ OFFSET I2C_EnXT MBIST STAT (READONLY) DELAY Register Address Default Value 0x531h [7:0] 0x00h 7 6 5 4 DIGITAL MIXER ANALOG 24 2 0x531h [15:8] 0x10h TRANS_LENGTH [15:8] 0x531h [23:16] 0x00h REG_START_ADDR [7:0] 0x531h [31:24] 0x00h REG_START_ADDR [16:8] 0x532h [7:0] 0x00h E2_START_ADDR [7:0] 0x532h [15:8] 0x00h E2_START_ADDR [15:8] 0x532h [23:16] 0x00h UNUSED 0x532h [31:24] 0x00h UNUSED 0x533h [7:0] 0x00h UNUSED 0x533h [15:8] 0x00h UNUSED 0x00h UNUSED 0x533h [31:24] 0x00h 0x00h 0 E2_OFFSET 0x533h [23:16] 0x534h [7:0] 1 TRANS_LENGTH [7:0] UNUSED I2C _EnXT UNUSED E2NXT_OFFSET 0x534h [15:8] 0x00h UNUSED 0x534h [23:16] 0x00h UNUSED 0x534h [31:24] 0x00h UNUSED 0x538h [7:0] 0x7Fh UNUSED MBIST_EN MBIST_GO 0x538h [15:8] 0x80h UNUSED 0x538h [23:16] 0x00h UNUSED 0x538h [31:24] 0x80h UNUSED 0x520h [7:0] 0x06h MBIST_DONE POWER_UP_DELAY [7:0] 0x520h [15:8] 0x00h POWER_UP_DELAY [15:8] 0x520h [23:16] 0x20h DEGLITCH_DELAY 0x520h [31:24] 0x09h STATE_DELAY 0x521h [7:0] 0x00h 0x521h [15:8] 0x00h 0x521h [23:16] 0x00h 0x521h [31:24] 0x00h VREF_ UNUSED UNUSED CLK_ STOP PULSE DELAY QSA_ ENABLE & CLOCKS 3 FORCE ENABLE PCM_ HIFI CLK_SEL I2S_CLK MCLK_RATE ADC_ UNUSED SYNC UNUSED ZERO_ 0x522h [7:0] 0x33h 0x522h [15:8] 0x33h 0x522h [23:16] 0x00h 0x522h [31:24] 0x00h 0x523h [7:0] 0x00h 0x523h [15:8] 0x00h 0x523h [23:16] 0x00h UNUSED 0x523h [31:24] 0x00h UNUSED CROSS MUTE ADC_LVL I2S_LVL UNUSED I2SB_ON I2SA_ON OUT4_SEL BYPASS_ MOD AUTO _SD UNUSED I2SB_TX_SEL I2SA_TX_SEL OUT3_SEL OUT2_SEL ADC TRIM ZERO_ ZERO _DIG ANA SE_MOD Submit Documentation Feedback PMC_ TEST PARALLEL TSD_DIS ADC_DSP I2S_DSP OUT1_SEL ANA_LVL SCKT _DIS TST_SHT Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Table 4. Register Map (continued) Register Name I2S PORT ADC TRIM CO-EF FICIENT READBACK (READONLY) READBACK (READONLY) Register Address Default Value 0x524h [7:0] 0x01h 0x524h [15:8] 0x00h 0x524h [23:14] 0x00h 0x524h [31:24] 0x00h UNUSED MONO_SYNC_WIDTH SYNC_RATE 0x525h [7:0] 0x00h TX_BIT TX_WIDTH RX_WIDTH 0x525h [15:8] 0x02h 0x525h [23:16] 0x02h 0x525h [31:24] 0x00h UNUSED 0x526h [7:0] 0x00h ADC_COMP_COEFF_C0 [7:0] ADC_COMP_COEFF_C0 [15:8] 7 6 5 4 3 SYNC_ STEREO_S YNC_ CLOCK_ CLK_MS MODE PHASE PHASE SYNC _MS UNUSED 2 1 TX_ RX_ ENABLE ENABLE 0 STEREO HALF_CYCLE_DIVIDER SYNTH_ UNUSED RX_ RX_ A/µLAW COMPAND TX_ TX_ A/µLAW COMPAND SYNTH_NUM DENOM RX_MSB_POSITION RX _MODE TX_MSB_POSITION TX _MODE 0x526h [15:8] 0x00h 0x526h [23:14] 0x00h ADC_COMP_COEFF_C1 [7:0] 0x526h [31:24] 0x00h ADC_COMP_COEFF_C1 [15:8] 0x527h [7:0] 0x00h ADC_COMP_COEFF_C2 [7:0] 0x527h [15:8] 0x00h ADC_COMP_COEFF_C2 [15:8] I2SL _LVL I2SR _LVL ADCL _LVL 0x528h [7:0] 0x00h 0x528h [15:8] 0x00h 0x528h [23:14] 0x00h SPARE 0x528h [31:24] 0x00h UNUSED 0x529h [7:0] 0x00h UNUSED CLIP UNUSED ADCR _LVL ADCL_ ADCR_ CLIP CLIP CLIP CLIP CLIP THERMAL SHORT4 SHORT3 SHORT2 SHORT1 UNUSED CE_STATE 0x529h [15:8] 0x00h SPARE 0x529h [23:14] 0x00h UNUSED 0x529h [31:24] 0x00h UNUSED FILTER CONTROL REGISTER (0x500h) Configures the LM48901 Array and Pre-Array filters (Spatial Engine). The Filter Control Register sets the length of the Array and Pre-Array filter taps, and selects the filter channel source for each audio output. Set PRE_BYPASS and ARRAY_BYPASS to 1 to bypass the Spatial Engine, disabling the spatial effect without modifying the coefficients. Set PRE_ENABLE and ARRAY_ENABLE to 1 to enable the Spatial Engine. Set PRE_ENABLE and ARRAY_ENABLE to 0 to disable the spatial engine. Disabling the Spatial Engine does not affect the register contents. Disable the Spatial Engine during coefficient programming. Table 5. Filter Control Register BIT NAME 7:0 ARRAY_TAP 14:8 PRE_TAP 15 UNUSED VALUE DESCRIPTION Array Filter Tap Length Pre-filter Tap Length. Pre-filter tap length should be less than or equal to the Array filter tap length Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 25 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Table 5. Filter Control Register (continued) BIT NAME VALUE DESCRIPTION Channel 1 Output Routing Selection 17:16 CH1_SEL 00 Array Filter Channel 0 Output Select 01 Array Filter Channel 1 Output Select 10 Array Filter Channel 2 Output Select 11 Array Filter Channel 3 Output Select Channel 2 Output Routing Selection 19:18 CH2_SEL 00 Array Filter Channel 0 Output Select 01 Array Filter Channel 1 Output Select 10 Array Filter Channel 2 Output Select 11 Array Filter Channel 3 Output Select Channel 3 Output Routing Selection 21:20 CH3_SEL 00 Array Filter Channel 0 Output Select 01 Array Filter Channel 1 Output Select 10 Array Filter Channel 2 Output Select 11 Array Filter Channel 3 Output Select Channel 4 Output Routing Selection 23:22 CH4_SEL 27:24 UNUSED 28 PRE_BYPASS 29 30 31 00 Array Filter Channel 0 Output Select 01 Array Filter Channel 1 Output Select 10 Array Filter Channel 2 Output Select 11 Array Filter Channel 3 Output Select 0 Pre-Array filter not bypassed 1 Pre-Array filter bypassed 0 Array filter not bypassed 1 Array filter bypassed 0 Pre-Array filter disabled. Disable the Pre-Array Filter during filter and coefficient programming. Disabling the Pre-Array Filter does not affect the device memory contents. 1 Pre-Array filter enabled 0 Array filter disabled. Disable the Array Filter during filter and coefficient programming. Disabling the Array Filter does not affect the device memory contents. 1 Array filter enabled ARRAY_BYPASS PRE_ENABLE ARRAY_ENABLE COMPRESSOR CONTROL REGISTER 1 (FILTER COMP1) (0x501h) Table 6. Compressor Control Register BIT NAME VALUE DESCRIPTION Pre-Filter Compressor Threshold 4:0 26 COMP_TH 00000 0 00001 0.3125 00010 0.0625 - - 10000 0.5 - - 11000 0.75 - - 11111 0.96875 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Table 6. Compressor Control Register (continued) BIT NAME VALUE DESCRIPTION Pre-Compression Gain (V/V) 7:5 G1_GAIN 000 2 001 4 010 8 011 16 100 32 101 64 110 128 111 256 Compression Ratio 000 10:8 11 COMP_RATIO 1:1 001 2:1 010 2.66:1 011 4:1 100 5.33:1 101 8:1 110 10.66:1 111 16:1 UNUSED Post Compression Gain (V/V) 14:12 15 23:16 POST_GAIN 000 1 001 1.25 010 1.5 011 2 100 2.5 101 3 110 4 111 8 UNUSED Array Filter Compression Control Register Select. The Array Filter has four channels, each channel can choose one of two Array Filter Compression Threshold, Pre-Compression Gain, Compression Ratio, and Post Compression Gain settings from the FILTER_COMP2 register Table 4. ARRAY_COMP_SELECT 0000 31:24 Select Setting 0 - - 1111 Select Setting 1 UNUSED Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 27 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com COMPRESSOR CONTROL REGISTER 2 (FILTER COMP2) (0x502h) Table 7. Compressor Control Register 2 BIT NAME VALUE DESCRIPTION Array Filter Compressor Threshold (Setting 0) 4:0 COMP_TH 00000 0 00001 0.03125 00010 0.0325 10000 11000 11111 0.5 0.75 0.96875 Pre-Compression Gain (V/V) (Setting 0) 7:5 G1_GAIN 000 2 001 4 010 8 011 16 100 32 101 64 110 128 111 256 Compression Ratio (Setting 0) 000 10:8 11 COMP_RATIO 1:1 001 2:1 010 2.66:1 011 4:1 100 5.33:1 101 8:1 110 10.66:1 111 16:1 UNUSED Post Compression Gain (V/V) (Setting 0) 14:12 15 28 POST_GAIN 000 1 001 1.25 010 1.5 011 2 100 2.5 101 3 110 4 111 8 UNUSED Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Table 7. Compressor Control Register 2 (continued) BIT NAME VALUE DESCRIPTION Pre-Filter Compressor Threshold (Setting 1) 20:16 00000 0 00001 0.03125 00010 0.0325 - COMP_TH - 10000 - 0.5 - 11000 - 0.75 - 11111 0.96875 Pre-Compression Gain (V/V) (Setting 1) 23:21 G1_GAIN 000 2 001 4 010 8 011 16 100 32 101 64 110 128 111 256 Compression Ratio (Setting 1) 000 24:26 27 COMP_RATIO 1:1 001 2:1 010 2.66:1 011 4:1 100 5.33:1 101 8:1 110 10.66:1 111 16:1 UNUSED Post Compression Gain (V/V) (Setting 1) 30:28 31 POST_GAIN 000 1 001 1.25 010 1.5 011 2 100 2.5 101 3 110 4 111 8 UNUSED FILTER DEBUG REGISTER 1 (FILT_DBG1) (0x504h) Table 8. Filter Debug Register 1 BIT NAME 3:0 ACC_ADDR 4 FILTER_SELECT VALUE DESCRIPTION Accumulator Address. Selects which accumulator is read during debug mode 0 Selects Pre-Filter Accumulators 1 Selects Array Filter Accumulators Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 29 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Table 8. Filter Debug Register 1 (continued) BIT NAME 5 UNUSED 6 STEP_ENABLE 7 31:8 VALUE DESCRIPTION 0 Single Step Disabled 1 Single Step Enabled 0 Debug Mode Disabled. Coefficient memory is inaccessible with Debug mode is disabled. 1 Debug Mode Enabled. Coefficient memory is accessible when Debug mode is enabled. DBG_ENABLE UNUSED FILTER STATISTICS CONTROL REGISTER (FILT_STC) (0x505h) Table 9. Filter Statistics Control Register BIT NAME VALUE DESCRIPTION PRE-FILTER Counter Channel Select 3:0 CH_SEL 000 Channel 0 001 Channel 1 010 Channel 2 011 Channel 3 100 Channel 4 101 Channel 5 110 Channel 6 111 Channel 7 Counter 1 Mode Select. Specifies input of Counter 1 7:4 COUNT1_MODE 0000 Sample Count Mode. Every audio sample is counted 0001 Overflow. Overflow events counted 0010 Frequency Error. Indicates input frequency not sufficient for given filter length 1000 MAGN[7} 1001 MAGN[7:6] 1010 MAGN[7:5} 1011 MAGN[7:4} 1100 MAGN[7:3} 1101 MAGN[7:2] 1110 MAGN[7:1} 1111 MAGN[7:0] Counter 2 Mode Select. Specifies input of Counter 2 11:8 30 COUNT2_MODE 0000 Sample Count Mode. Every audio sample is counted 0001 Overflow. Overflow events counted 0010 Frequency Error. Indicates input frequency not sufficient for given filter length 1000 MAGN[7} 1001 MAGN[7:6] 1010 MAGN[7:5} 1011 MAGN[7:4} 1100 MAGN[7:3} 1101 MAGN[7:2] 1110 MAGN[7:1} 1111 MAGN[7:0] Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Table 9. Filter Statistics Control Register (continued) BIT NAME 14:12 UNUSED 15 CLEAR VALUE DESCRIPTION 0 Counter Enabled 1 Counter Cleared ARRAY-FILTER Counter Channel Select 19:16 CH_SEL 000 Channel 0 001 Channel 1 010 Channel 2 011 Channel 3 100 Channel 4 101 Channel 5 110 Channel 6 111 Channel 7 Counter 1 Mode Select. Specifies input of Counter 1 23:20 COUNT1_MODE 0000 Sample Count Mode. Every audio sample is counted 0001 Overflow. Overflow events counted 0010 Frequency Error. Indicates input frequency not sufficient for given filter length 1000 MAGN[7} 1001 MAGN[7:6] 1010 MAGN[7:5} 1011 MAGN[7:4} 1100 MAGN[7:3} 1101 MAGN[7:2] 1110 MAGN[7:1} 1111 MAGN[7:0] Counter 2 Mode Select. Specifies input of Counter 2 27:24 COUNT2_MODE 30:28 UNUSED 31 CLEAR 0000 Sample Count Mode. Every audio sample is counted 0001 Overflow. Overflow events counted 0010 Frequency Error. Indicates input frequency not sufficient for given filter length 1000 MAGN[7} 1001 MAGN[7:6] 1010 MAGN[7:5} 1011 MAGN[7:4} 1100 MAGN[7:3} 1101 MAGN[7:2] 1110 MAGN[7:1} 1111 MAGN[7:0] 0 Counter Enabled 1 Counter Cleared DELAY REGISTER (DELAY) (0x520h) Table 10. Delay Register BIT NAME 15:0 POWER_UP_DELAY VALUE DESCRIPTION Sets I2C Delay Time. Default 10ms delay. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 31 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Table 10. Delay Register (continued) BIT NAME 23:16 DEGLITCH_DELAY 31:24 STATE_DELAY VALUE DESCRIPTION Sets ENABLE Bit Polling Timeout. Default 32ms delay Sets Delay Between Power Up/Down States ENABLE AND CLOCK CONFIGURATION REGISTER (ENABLE & CLOCKS) (0x521h) Table 11. Enable and Clock Configuration Register BIT NAME 0 ENABLE 1 FORCE 2 PULSE 3 RELY_ON_VREF 7:4 VALUE DESCRIPTION 0 Device Disabled in I2C Mode 1 Device Enabled in I2C Mode 0 Device Enabled Via SHDN Pin 1 Device Enabled Via I2C 0 SHDN Requires a Stable Logic Level 1 SHDN Accepts a Pulse Input 0 Device waits for delay time determined by STATE_DELAY to enable. 1 Device waits for stable VREF UNUSED Selects PLL Input Divider 10:8 11 32 MCLK_RATE I2S_CLK 12 PMC_CLK_SEL 13 HIFI 14 QSA_CLK_STOP 15 UNUSED 16 ADC_SYNC_SEL 31:17 UNUSED 000 32fs (1.536MHz) 001 64fs (3.072MHz) 010 128fs (6.114MHz) 011 256fs (12.288MHz) 100 512fs (24.576MHz) 101 UNUSED 110 UNUSED 111 UNUSED 0 MCLK Input to PLL 1 I2S_CLK Input to PLL 0 Oscillator Clock Input to Power Management Circuitry 1 External Clock to Power Management Circuitry. Power management circuit uses MCLK or I2S_CLK. Clock source depends on the state of I2S_CLK. External Clock mode disables the internal oscillator. 0 HiFi Mode Disabled 1 HiFi Mode Enabled. PLL always produces a 4096fs clock. 0 QSA Clock Enabled 1 QSA Clock Disabled Following Device Configuration 0 Normal Operation 1 Reverse ADC SYNC Signal for additional timing margin at low supply voltages. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 DIGITAL MIXER CONTROL REGISTER (DIGITAL MIXER) (0x522h) Table 12. Digital Mixer Control Register BIT NAME VALUE DESCRIPTION Sets the Gain of the ADC Path (dB) 5:0 ADC_LVL 000000 -76.5 000001 -75 - 1.5dB steps 110010 -1.5 110011 0 110100 1.5 - 1.5dB Steps 111111 6 7 MUTE ZXD_DISABLE 18 0 Normal Operation 1 Mute 0 Zero Crossing Detection Enabled 1 Zero Crossing Detection Disabled Sets the Gain of the I2S Path (dB) 13:8 I2S_LVL 15:14 UNUSED 16 I2S_DSP 17 ADC_DSP 000000 -76.5 000001 -75 - 1.5dB steps 110010 -1.5 110011 0 (VOUT = 3.36VRMS with 0dBFS input) 110100 1.5 - 1.5dB Steps 111111 18 0 I2S Data Not Passed to DSP 1 I2S Data Passed to DSP 0 ADC Output Not Passed to DSP 1 ADC Output Passed to DSP Selects Input of Primary I2S Transmitter 19:18 ISA_TX_SEL 00 None 01 ADC 10 DSP1/2 11 DSP3/4 Selects Input of Secondary I2S Transmitter 21:20 ISB_TX_SEL 22 I2SA_ON 23 I2SB_ON 00 None 01 ADC 10 DSP1/2 11 DSP3/4 0 I2SA Data NOT Output on SHDN 1 I2SA Data Output on SHDN 0 I2SB Data NOT Output on SHDN 1 I2SB Data Output on SHDN Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 33 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com Table 12. Digital Mixer Control Register (continued) BIT NAME VALUE DESCRIPTION Selects OUT1 Amplifier Input Source 25:24 OUT1_SEL 00 OUT1 Disabled 01 DSP 10 I2S 11 ADC Selects OUT2 Amplifier Input Source 27:26 OUT2_SEL 00 OUT2 Disabled 01 DSP 10 I2S 11 ADC Selects OUT3 Amplifier Input Source 29:28 OUT3_SEL 00 OUT3 Disabled 01 DSP 10 I2S 11 ADC Selects OUT4 Amplifier Input Source 31:30 OUT4_SEL 00 OUT4 Disabled 01 DSP 10 I2S 11 ADC ANALOG CONFIGURATION REGISTER (ANALOG) (0x523h) Table 13. Analog Configuration Register BIT NAME VALUE DESCRIPTION Sets ADC Preamplifier Gain (dB) 1:0 2 00 0 01 2.4 10 3.5 11 6 0 Normal Operation. OUT2 and OUT3 operate as separate amplifiers. 1 Parallel Operation. OUT2 and OUT3 operate in parallel as a single amplifier. 0 Normal Operation 1 Auto-Shutdown Mode. Automatically disables the amplifiers when no analog input is detected. 0 Normal Operation 1 Auto-Shutdown Mode. Automatically disables the amplifiers when there is no I2S input. 0 ADC Trim Disabled 1 ADC Trim Enabled. Use ADC_COMP_COEFF_C0-C2 to trim ADC. 0 Normal Operation 1 Fault Conditions Disable the Amplifiers 0 Normal Operation 1 Pulse Correction Bypass. Amplifier output stages act as a buffer, passing PWM signal without correction to output. PARALLEL 3 ZERO_ANA 4 ZERO_DIG 5 ADCTRIM 6 AUTO_SD 7 34 ANA_LVL BYPASS_MOD Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 Table 13. Analog Configuration Register (continued) BIT NAME 8 TST_SHT 9 SCKT_DIS 10 TSD_DIS 11 PMC_TEST 12 SE_MOD 31:13 UNUSED VALUE DESCRIPTION 0 Normal Operation 1 Short Amplifier Inputs. Sets amplifier outputs to 50% duty cycle, minimizing click and pop during power up/down. 0 Normal Operation 1 Output Short Circuit Protection Disabled 0 Normal Operation 1 Thermal Shutdown Disabled 0 Normal Operation 1 PMC uses PLL Source Clock 0 Normal Operation 1 Single Edge Modulation Mode I2S PORT CONFIGURATION REGISTER (I2S PORT) (0x524h/0x525h) BIT NAME VALUE DESCRIPTION 0x524h 0 STEREO 1 RX_ENABLE 2 3 4 5 6 TX_ENABLE 0 Mono Mode 1 Stereo Mode 0 Receive Mode Disabled 1 Receive Mode Enabled 0 Transmit Mode Disabled 1 Transmit Mode Enabled 0 I2S Clock Slave. Device requires an external SCLK for proper operation. 1 I2S Clock Master. Device generates SCLK and transmits when either RX or TX mode are enabled. 0 I2S WS Slave. Device requires an external WS for proper operation. 1 I2S WS Master. Device generates WS and transmits when either RX or TX mode are enabled. 0 I2S Clock Phase. Transmit on falling edge, receive on rising edge. 1 PCM Clock Phase. Transmit on rising edge, receive on falling edge. 0 I2S Data Format: Left, Right 1 I2S Data Format: Right, Left CLK_MS SYNC_MS CLOCK_PHASE STEREO_SYNC _PHASE Mono 7 SYNC_MODE Rising edge indicates start of data word. 0 SYNC low = Left, SYNC high = Right 1 SYNC low = Right, SYNC high = left Configures the I2S port master clock half-cycle divider. Program the half-cycle divider by: (ReqDiv*2) 1 000000 13:8 HALF_CYCLE _DIVIDER BYPASS 000001 1 000010 1.5 000011 2 - - 111101 31 111110 31.5 111111 32 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 35 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 BIT NAME 15:14 UNUSED www.ti.com VALUE DESCRIPTION Sets the Clock Generator Numberator 18:16 SYNTH_NUM 000 SYNTH_DENOM (1/) 001 100/SYNTH_DENOM 010 96/SYNTH_DENOM 011 80/SYNTH_DENOM 100 72/SYNTH_DENOM 101 64/SYNTH_DENOM 110 48/SYNTH_DENOM 111 19 SYNTH_DENOM 23:20 UNUSED 0/SYNTH_DENOM 0 Clock Generator Denominator = 128 1 Clock Generator Denominator = 125 Sets number of clock cycles before SYNC pattern repeats. MONO MODE 26:24 SYNC_RATE 000 8 001 12 010 16 011 18 100 20 101 24 110 25 111 32 STEREO MODE 000 16 01 24 010 32 011 36 100 40 101 48 110 50 111 64 Sets SYNC symbol width in Mono Mode 29:27 31:30 MONO_SYNC_WIDTH 000 1 001 2 010 4 011 7 100 8 101 11 110 15 111 16 UNUSED 0x525h 36 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com BIT SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 NAME VALUE DESCRIPTION Sets number of valid RECEIVE bits. 2:0 RX_WIDTH 000 24 001 20 010 18 011 16 100 14 101 13 110 12 111 8 Sets number of TRANSMIT bits. 5:3 TX_WIDTH 000 24 001 20 010 18 011 16 100 14 101 13 110 12 111 8 Sets number of pad bits after the valid Transmit bits. 7:6 TX_BIT 00 0 01 1 10 High-Z 11 8 RX_MODE High-Z 0 MSB Justified Receive Mode 1 LSB Justified Receive Mode Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 37 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 BIT NAME www.ti.com VALUE DESCRIPTION MSB location from the frame start (MSB Justified) or LSB location from the frame end (LSB Justified) 13:9 RX_MSB_POSITION 00000 0 (DSP/PCM LONG) 00001 1 (I2S/PCM SHORT) 00010 2 00011 3 00100 4 00101 5 00110 6 00111 7 01000 8 01001 9 01010 10 01011 11 01100 12 01101 13 01110 14 01111 15 10000 16 10001 17 10010 18 10011 19 10100 20 10101 21 10110 22 10111 23 11000 24 11001 25 11010 26 11011 27 11100 28 11101 29 11110 30 11111 14 38 RX_COMPAND 15 RX_A/µLAW 16 TX_MODE 31 0 Normal Operation 1 Audio Data Companded 0 µLaw Compand Mode 1 A-Law Compand Mode 0 MSB Justified Transmit Mode 1 LSB Justified Transmit Mode Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com BIT SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 NAME VALUE DESCRIPTION MSB location from the frame start (MSB Justified) or LSB location from the frame end (LSB Justified) 21:17 TX_MSB_POSITION 00000 0 (DSP/PCM LONG) 00001 1 (I2S/PCM SHORT) 00010 2 00011 3 00100 4 00101 5 00110 6 00111 7 01000 8 01001 9 01010 10 01011 11 01100 12 01101 13 01110 14 01111 15 10000 16 10001 17 10010 18 10011 19 10100 20 10101 21 10110 22 10111 23 11000 24 11001 25 11010 26 11011 27 11100 28 11101 29 11110 30 11111 22 TX_COMPAND 23 TX_A/µLAW 31:24 UNUSED 31 0 Normal Operation 1 Audio Data Companded 0 µLaw Compand Mode 1 A-Law Compand Mode ADC TRIM COEFFICIENT REGISTER (ADC_TRIM) (0x526h/0x527) Table 14. ADC Trim Coefficient Register BIT NAME VALUE DESCRIPTION 15:0 ADC_COMP_COEFF_C0 Sets ADC Trim Coefficient C0 31:16 ADC_COMP_COEFF_C1 Sets ADC Trim Coefficient C1 15:0 ADC_COMP_COEFF_C2 0x526h 0x527h Sets ADC Trim Coefficient C2 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 39 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com READBACK REGISTER (READBACK) (0x528h) READ-ONLY Table 15. Readback Register BIT NAME VALUE DESCRIPTION 0 ADCR_CLIP 1 Right Channel ADC Input Clipped 1 ADCL_CLIP 1 Left Channel ADC Input Clipped 2 ADCR_LVLCLIP 1 Right Channel ADC Output Clipped 3 ADCL_LVLCLIP 1 Left Channel ADC Output Clipped 4 I2SR_LVLCLIP 1 Right Channel I2S Output Clipped 5 I2SL_LVLCLIP 1 Left Channel I2S Output Clipped 7:6 UNUSED 8 SHORT1 1 OUT1 Output Short Circuit 9 SHORT2 1 OUT2 Output Short Circuit 10 SHORT3 1 OUT3 Output Short Circuit 11 SHORT4 1 OUT4 Output Short Circuit 12 THERMAL 1 Thermal Shutdown Threshold Exceeded 23:13 SPARE 31:24 UNUSED SYSTEM CONFIGURATION REGISTER (SYS_CONFIG) (0x530h) Table 16. System Configuration Register BIT NAME 6:0 DEVICE_ID 7 CONFIG_CLK _ENABLE 14:8 ALT_DEVICE_ID 15 ALTID_ENABLE 16 CL_REQ 17 CL_W VALUE DESCRIPTION Sets LM48901 Device ID in slave mode 0 Configuration Loader Clock Disabled 1 Configuration Loader Clock Enabled Sets Alternate Device ID in Slave Mode. 0 Selects DEVICE_ID 1 Selects ALT_DEVICE_ID 0 Configuration Loader Access not Requested 1 Configuration Loader Access Requested. I2C Master Transaction Enabled 0 Configuration Loader Set to READ-ONLY 1 Configuration Loader Set to WRITE Sets I2C Page Mode Length 20:18 22:21 UNUSED 23 CL_ENABLE 24 40 CL_PAGE MBIST0_ENABLE 25 MBIST1_ENABLE 31:26 UNUSED 00 Single Byte 01 4 Bytes 10 8 Bytes 11 16 Bytes 0 Device Configured as I2C Slave 1 Device Configured as I2C Master 0 Memory BIST Controller 0 Disabled 1 Memory BIST Control 0 Enabled. 0 Memory BIST Controller 1 Disabled 1 Memory BIST Control 1 Enabled. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 I2C MASTER CONFIGURATION LOADER REGISTER 0 (CL_REG0) (0x531h) Table 17. Filter Debug Register 0 BIT NAME VALUE 15:0 TRANS_LENGTH 31:16 REG_START_ADDR DESCRIPTION Sets I2C Master Transaction Length Starting Address of LM48901 Memory I2C MASTER CONFIGURATION LOADER REGISTER 1 (CL_REG1) (0x532h) Table 18. Filter Debug Register 1 BIT NAME VALUE 15:0 E2_START_ADDR 31:16 UNUSED DESCRIPTION Sets EEPROM Address. Indicates EEPROM start address where data is stored EEPROM ADDRESS OFFSET REGISTER (E2_OFFSET) (0x533h) Table 19. EEPROM Address Offset Register BIT NAME 5:0 E2_OFFSET 31:6 UNUSED VALUE DESCRIPTION EEPROM Address Offset Value. I2C EnXT REGISTER (I2CEnXT) (0x534h) Table 20. I2C EnXT Register BIT NAME 5:0 E2NXT_OFFSET 6 UNUSED 7 I2C_EnXT 31:8 UNUSED VALUE DESCRIPTION Sets EEPROM Address Offset for Following LM48901 when devices are Daisy Chained. 0 Next Device in Daisy Chain Disabled. I2C_EX driven Low. 1 Next Device in Daisy Chain Enabled. I2C_EX driven HIGH. READ-ONLY MBIST STATUS REGISTER (MBIST_STAT) (0x538h) Table 21. MBIST Status Register BIT NAME 1:0 MBIST_DONE 3:2 BIST_GO 5:4 MBIST_EN 31:6 UNUSED VALUE DESCRIPTION Logic HIGH indicates memory test complete Logic Low indicates memory fault when MBIST_DONE is HIGH 0 MBIST Read-back Disabled 1 MBIST Read-back Enabled DAISY CHAINING I2C_EN/I2C_EX The LM48901 supports daisy chaining up to 127 devices from a single I2C bus utilizing I2C_EN and I2C_EX in a chain enable scheme. I2C_EX is a push/pull logic output that drives the I2C_EN of the following device in the chain Figure 14. At power up, I2C_EnXT (bit 8, I2C_EnXT Register [0x534h]) is set to 0, resulting in I2C_EN driven low, disabling the I2C interface of the following device. Once device configuration is complete, and I2C_EnXT is set to 1, I2C_EN is driven high, enabling the I2C interface of the following device. Driving I2C_EN high enables the device’s I2C interface, driving I2C_EN low disables the device’s I2C interface. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 41 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com DEVICE 0 2 I C_EN I2C_EX SDA FROM I2C MASTER SCL I 2C INTERFACE DEVICE 1 2 I C_EN I2C_EX SDA SCL I 2C INTERFACE DEVICE 2 2 I C_EN I2C_EX SDA SCL I 2C INTERFACE TO OTHER LM48901S Figure 14. I2C_EN/I2C_EX Daisy Chaining Example Device Address The 0110000X is the default LM48901 I2C address hard coded into the device. Two alternate device addresses can be programmed, via the SYS CONFIG (0x530h) Register. Use the default address during initial device configuration. GENERAL AMPLIFIER FUNCTION Class D Amplifier The LM48901 features four high-efficiency Class D audio power amplifiers that utilizes Texas Instruments’ filterless modulation scheme external component count, conserving board space and reducing system cost. The Class D outputs transition from VDD to GND with a 384kHz switching frequency. With no signal applied, the outputs switch with a 50% duty cycle, in phase, causing the two outputs to cancel. This cancellation results in no net voltage across the speaker, thus there is no current to the load in the idle state. With the input signal applied, the duty cycle (pulse width) of the LM48901 outputs changes. For increasing output voltage, the duty cycle of OUT_+ increases while the duty cycle of OUT_- decreases. For decreasing output voltages, the converse occurs. The difference between the two pulse widths yield the differential output voltage. Edge Rate Control (ERC) The LM48901 features Texas Instruments’ advanced edge rate control (ERC) that reduces EMI, while maintaining high quality audio reproduction and efficiency. The LM48901 ERC greatly reduces the high frequency components of the output square waves by controlling the output rise and fall times, slowing the transitions to reduce RF emissions, while maximizing THD+N and efficiency performance. The overall result of the E2S system is a filterless Class D amplifier that passes FCC Class B radiated emissions standards with 24in of twisted pair cable, with excellent 0.06% THD+N and high 89% efficiency. 42 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 POWER DISSIPATION AND EFFICIENCY The major benefit of a Class D amplifier is increased efficiency versus a Class AB. The efficiency of the LM48901 is attributed to the region of operation of the transistors in the output stage. The Class D output stage acts as current steering switches, consuming negligible amounts of power compared to their Class AB counterparts. Most of the power loss associated with the output stage is due to the IR loss of the MOSFET onresistance, along with switching losses due to gate charge. ANALOG INPUT The LM48901 features a differential input, stereo ADC for analog systems. A differential amplifier amplifies the difference between the two input signals. Traditional audio power amplifiers have typically offered only singleended inputs resulting in a 6dB reduction of SNR relative to differential inputs. The LM48901 also offers the possibility of DC input coupling which eliminates the input coupling capacitors. A major benefit of the fully differential amplifier is the improved common mode rejection ratio (CMRR) over single ended input amplifiers. The increased CMRR of the differential amplifier reduces sensitivity to ground offset related noise injection, especially important in noisy systems. PARALLEL MODE In Parallel mode, channels OUT2 and OUT3 are driven from the same audio source, allowing the two channels to be connected in parallel, increasing output power to 3.2W into 4Ω at 10% THD+N. Set bit 2 (PARALLEL) of the Analog Configuration Register (0x532h) = 1 to configured the device in Parallel mode. After the device is set to Parallel mode, make an external connection between OUT2+ and OUT3+, and a connection between OUT2and OUT3- (Figure 2). In Parallel mode, the combined channels are driven from the OUT2 source. OUT1 and OUT4 are unaffected. Signal routing, mixing, filtering, and equalization are done through the Spatial Engine. Make sure the device is configured in Parallel mode, before connecting OUT2 and OUT3 and enabling the outputs. Do not make a connection between OUT2 and OUT3 together while the outputs are enabled. Disable the outputs first, then make the connections between OUT2 and OUT3. GAIN SETTING The LM48901 has three gain stages, the ADC preamplifier, and two independent volume controls in the Digital Mixer, one for the ADC path and one for the I2S path. The ADC preamplifier has four gain settings (0dB, 2.4dB, 3.5dB, and 6dB). The preamplifier gain is set by bits 0 and 1 (ANA_LVL) of the Analog Configuration Register (0x523h). The Digital Mixer has two 64 step volume controls. The ADC path volume control is set by bits 5:0 (ADC_LVL) in the Digital Mixer Control Register (0x522h). The I2S path volume control is set by bits 13:8 (I2S_LVL) in the Digital Mixer Control Register (0x522h). Both volume controls have a range of -76.5dB to 18dB in 1.5dB increments. MODULATOR POWER SUPPLY (AVDD1) The AVDD1 (RL package: bump C2, SQ package: pin 12) powers the class D modulators. For maximum output swing, set AVDD1 and PVDD to the same voltage. Table 22 shows the output voltage for different AVDD1 levels. Table 22. Amplifier Output Voltage with Variable AVDD1 Voltage AVDD1 (V) VOUT (VRMS) @ PVDD = 5V, THD+N = 1% VOUT (VRMS) @ PVDD = 3.6V, THD+N = 1% 5 3.3 - 4.5 3.1 - 4.2 2.9 - 4 2.7 - 3.6 2.5 2.4 3.3 2.3 2.2 3 2.1 2.1 2.8 2 1.9 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 43 LM48901 SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 www.ti.com CLOCK REQUIREMENTS The LM48901 requires an external clock source for proper operation, regardless of input source or device configuration. The device derives the ADC, digital mixer, DSP, I2S port, and PWM clocks from the external clock. The clock can be derived from either MCLK or SCLK inputs. Set bit 11 (I2S_CLK) of the Enable and Clock configuration register (0x521h) to 0 to select MCLK, set I2S_CLK to 1 to select SCLK. The LM48901 accepts five different clock frequencies, 1.536, 3.072, 6.114, 12.288, and 24.576MHz. Set bits 10:8 (MCLK_RATE) of the Enable and Clock Configuration Register to the appropriate clock frequency. In systems where both MCLK and SCLK are available, choose the lower frequency clock for improved power consumption. SHUTDOWN FUNCTION There are two ways to shutdown the LM48901, hardware mode, and software mode. The default is hardware mode. Set bit 1 (FORCE) of the Enable and Clock Configuration Register (0x521h) to 0 to enable hardware shutdown mode. In hardware mode, the device is enabled and disabled through SHDN. Connect SHDN to VDD for normal operation. Connect SHDN to GND to disable the device. Hardware shutdown mode supports a one shot, or momentary switch SHDN input. When bit 2 (PULSE) of the Enable and Clock Configuration Register (0x521h) is set to 1, the LM48901 responds to a rising edge on SHDN to change the device state. When PULSE = 0, the device requires a stable logic level on SHDN. Set FORCE = 1 to enable software shutdown mode. In software shutdown mode, the device is enabled and disabled through bit 0 (ENABLE) of the Enable and Clock Configuration Register (0x512h). Set ENABLE = 0 to disable the LM48901. Set ENABLE = 1 to enable the LM48901. In either hardware or software mode, the content of the LM48901 memory registers is retained after the device is disabled, as long as power is still applied to the device. Minimize power consumption by disabling the PMC clock oscillator when the LM48901 is shutdown. Set bit 12 (PMC_CLK_SEL) and bit 14 (QSA_CLK_STOP) of the Enable and Clock configuration Register (0x521h) = 1 to disable the PMC clock oscillator. EXTERNAL CAPACITOR SELECTION Power Supply Bypassing and Filtering Proper power supply bypassing is critical for low noise performance and high PSRR. Place the supply bypass capacitors as close to the device as possible. Typical applications employ a voltage regulator with 10μF and 0.1μF bypass capacitors that increase supply stability. These capacitors do not eliminate the need for bypassing of the LM48901 supply pins. A 1μF capacitor is recommended for IOVDD, PLLVDD, DVDD, and AVDD. A 2.2μF capacitor is recommended for PVDD. REF and BYPASS Capacitor Selection For best performance, bypass REF with a 4.7μF ceramic capacitor. INPUT CAPACITOR SELECTION The LM48901 analog inputs require input coupling capacitors. Input capacitors block the DC component of the audio signal, eliminating any conflict between the DC component of the audio source and the bias voltage of the LM48901. The input capacitors create a high-pass filter with the input resistors RIN. The -3dB point of the high pass filter is found using Equation (1) below. f = 1 / 2πRINCIN (1) Where the value of RIN is 20kΩ. The input capacitors can also be used to remove low frequency content from the audio signal. Small speakers cannot reproduce, and may even be damaged by low frequencies. High pass filtering the audio signal helps protect the speakers. When the LM48901 is using a single-ended source, power supply noise on the ground is seen as an input signal. Setting the high-pass filter point above the power supply noise frequencies, 217Hz in a GSM phone, for example, filters out the noise such that it is not amplified and heard on the output. Capacitors with a tolerance of 10% or better are recommended for impedance matching and improved CMRR and PSRR. 44 Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 LM48901 www.ti.com SNAS520C – OCTOBER 2011 – REVISED JANUARY 2012 PCB LAYOUT GUIDELINES As output power increases, interconnect resistance (PCB traces and wires) between the amplifier, load, and power supply create a voltage drop. The voltage loss due to the traces between the LM48901 and the load results in lower output power and decreased efficiency. Higher trace resistance between the supply and the LM48901 has the same effect as a poorly regulated supply, increasing ripple on the supply line, and reducing peak output power. The effects of residual trace resistance increases as output current increases due to higher output power, decreased load impedance or both. To maintain the highest output voltage swing and corresponding peak output power, the PCB traces that connect the output pins to the load and the supply pins to the power supply should be as wide as possible to minimize trace resistance. The use of power and ground planes will give the best THD+N performance. In addition to reducing trace resistance, the use of power planes creates parasitic capacitors that help to filter the power supply line. The inductive nature of the transducer load can also result in overshoot on one of both edges, clamped by the parasitic diodes to GND and VDD in each case. From an EMI standpoint, this is an aggressive waveform that can radiate or conduct to other components in the system and cause interference. In is essential to keep the power and output traces short and well shielded if possible. Use of ground planes beads and micros-strip layout techniques are all useful in preventing unwanted interference. As the distance from the LM48901 and the speaker increases, the amount of EMI radiation increases due to the output wires or traces acting as antennas become more efficient with length. Ferrite chip inductors places close to the LM48901 outputs may be needed to reduce EMI radiation. Revision History Rev Date 1.0 10/31/11 Initial Web released. Description 1.01 12/02/11 Fixed a typo (LM488901 to LM48901) on page 45. 1.02 12/12/11 Added two sections “Modulator Power Supply” and Clock Requirements. 1.03 12/16/11 Changed National to Texas Instruments. Submit Documentation Feedback Copyright © 2011–2012, Texas Instruments Incorporated Product Folder Links: LM48901 45 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM48901RL/NOPB ACTIVE DSBGA YPG 36 250 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM -40 to 85 GO2 LM48901RLX/NOPB ACTIVE DSBGA YPG 36 1000 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM -40 to 85 GO2 LM48901SQ/NOPB ACTIVE WQFN RTV 32 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L48901 LM48901SQE/NOPB ACTIVE WQFN RTV 32 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L48901 LM48901SQX/NOPB ACTIVE WQFN RTV 32 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L48901 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM48901RL/NOPB DSBGA YPG 36 250 178.0 12.4 LM48901RLX/NOPB DSBGA YPG 36 1000 178.0 LM48901SQ/NOPB WQFN RTV 32 1000 178.0 LM48901SQE/NOPB WQFN RTV 32 250 LM48901SQX/NOPB WQFN RTV 32 4500 3.43 3.59 0.76 8.0 12.0 Q1 12.4 3.43 3.59 0.76 8.0 12.0 Q1 12.4 5.3 5.3 1.3 8.0 12.0 Q1 178.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1 330.0 12.4 5.3 5.3 1.3 8.0 12.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 21-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM48901RL/NOPB DSBGA YPG 36 250 210.0 185.0 35.0 LM48901RLX/NOPB DSBGA YPG 36 1000 210.0 185.0 35.0 LM48901SQ/NOPB WQFN RTV 32 1000 210.0 185.0 35.0 LM48901SQE/NOPB WQFN RTV 32 250 210.0 185.0 35.0 LM48901SQX/NOPB WQFN RTV 32 4500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA RTV0032A SQA32A (Rev B) www.ti.com MECHANICAL DATA YPG0036xxx D 0.650±0.075 E RLA36XXX (Rev A) D: Max = 3.455 mm, Min =3.395 mm E: Max = 3.231 mm, Min =3.171 mm 4214895/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com 12/12 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated

下载 PDF

LM48901SQ/NOPB 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“LM48901SQ/NOPB”相匹配的价格&库存，您可以联系我们找货

免费人工找货

库存：23000

去购买

搜索历史

LM48901SQ/NOPB

相关技术文章