LM49155TLX/NOPB

LM49155 www.ti.com SNAS492 – JULY 2010 LM49155 PRODUCT BRIEF Uplink Noise Suppression & Downlink SNR Enhancement Analog Audio Subsystem Check for Samples: LM49155 FEATURES 1 • 2 • • Noise cancellation for uplink and downlink without DSP-type artifacts, distortions or delays Adapting AGC on ambient noise level & downlink signal strength for earpiece Downlink adjustable noise-reducing high pass filter • • • E2S Class D Amplifier with ALC Ground Referenced Headphone Outputs with Advanced Click Pop Suppression Micro-power shutdown APPLICATIONS • • Mobile Phones Portable Electronic Devices DESCRIPTION The LM49155 is a fully integrated audio subsystem designed for portable handheld applications such as cellular phones. The LM49155 combines a Noise Suppression microphone amplifier, a 1.35W mono class D amplifier with ALC, class AB earpiece driver with AGC, a high efficiency, stereo, ground referenced headphone amplifier with click pop suppression and I2C modes select and volume control. The LM49155 features analog fully differential input, and differential output microphone amplifier designed to reduce background acoustic noise, while delivering superb speech clarity in voice communication applications. Downlink SNR enhancement with an advanced acoustic AGC technology to adjust output levels. The LM49155 speaker amplifier features National’s unique output limiter that provides both a no-clip feature and speaker protection. The E2S class D amplifier features a patented, ultra low EMI PWM architecture that significantly reduces RF emissions while preserving audio quality and efficiency. The headphone drivers feature National’s ground referenced architecture that creates a ground-referenced output from a single, low-voltage supply. The LM49155 is available in an ultra-small 36-bump micro SMD package (3.434mm x 3.459mm x 0.6mm). Notice: This document is not a full datasheet. For more information regarding this product or to order samples please contact your local National Semiconductor sales office or visit http://www.national.com/support/dir.html These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Table 1. Key Specifications Uplink Far Field Noise Suppression Electrical FFNSE at f = 1kHz Downlink SNR Enhancement Earpiece Amplifier VALUE UNIT 34 dB (typ) Near-Field SNR Enhancement 6 to 18 Downlink SNRIE 16 dB (typ) Class D Loudspeaker Amplifier RL = 15μH+8Ω+15μH POUT, THD+N ≤ %, VDD = 5.0V 1.35 W (typ) Headphone Amplifier RL = 32Ω POUT, THD+N ≤ %, HPVDD = 1.8V 19 mW (typ) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated LM49155 SNAS492 – JULY 2010 www.ti.com Simplified Block Diagram UPLINK NOISE SUPPRESSION COMMUNICATIONS PROCESSOR SNR ENHANCER AGC EARPIECE AMPLIFIER MONO VOLUME MIXER ALC STEREO VOLUME 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Links: LM49155 LM49155 www.ti.com SNAS492 – JULY 2010 Typical Application 2.7V to 5.5V CS1 1 µF 2.7V to 5.5V CS2 1 µF VDD LSVDD 4.7 µF CT1 MIC_BIAS VOLTAGE 4.7 µF CT2 CT3 4.7 µF Ci1 PRE-AMP 470 nF MIC1+ DCAP MIC1- ANALOG UPLINK/ DOWNLINK NOISE CANCELLING PROCESSOR and SNR ENHANCER Ci2 470 nF Ci3 470 nF MIC2+ MIC2Ci4 470 nF POST-AMP 4.7 µF LPF+ CLP1 MICOUT+ MICOUT- To Uplink Signal Path CLP2 6 dB/12 dB 12 dB to 36 dB LPF- AGC AMP MIC_GND EPOUT+ OUTPUT POWER LIMITER EPOUT- Ci5 68 nF INM + Audio Differential Input INM - VOLUME -80 dB to +18 dB Ci6 68 nF INL Audio Single-Ended Inputs Ci7 0.22 µF Class D +12 dB, +18 dB AUTOMATIC LEVEL CONTROL -6 dB Mixer and Output Mode VOLUME -80 dB to +18 dB Ci8 0.22 µF BYPASS CB 2.2 µF LSOUTSET CSET 0.1 µF -18 dB to 0 dB INR LSOUT+ VOLUME -80 dB to +18 dB RSET (Optional) HPL -18 dB to 0 dB HPR 1.7V to 2.7V BIAS HPVDD CS3 1 µF 2 I CVDD SDA SCL CHARGE PUMP I2C INTERFACE MIC_GND GND CPVSS CIP CIN CPGND 2.2 µF C1 2.2 µF Figure 1. Typical Application Circuit Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Links: LM49155 3 LM49155 SNAS492 – JULY 2010 www.ti.com Connection Diagrams TL Package (3.434mm x 3.459mm x 0.6mm) Top View 6 5 4 3 2 1 A B C D E F Figure 2. Top View (Bump Side Down) spacer spacer 36 Bump micro SMD Marking XXYY GN7 Bump A1 Figure 3. Top View XX — Date Code YY — Die Traceability G — Boomer N7 — LM49155TL 4 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Links: LM49155 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM49155TL/NOPB ACTIVE DSBGA YZR 36 250 RoHS & Green SNAGCU Level-1-260C-UNLIM GN7 LM49155TLX/NOPB ACTIVE DSBGA YZR 36 1000 RoHS & Green SNAGCU Level-1-260C-UNLIM GN7 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of