LM4980SD/NOPB

LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 LM4980 Boomer™ Audio Power Amplifier Series 2 Cell Battery, 1mA, 42mW Per Channel High Fidelity Stereo Headphone Audio Amplifier for MP3 players Check for Samples: LM4980 FEATURES DESCRIPTION • • • The LM4980 is a stereo headphone audio amplifier, which when connected to a 3.0V supply, delivers 42mW to a 16Ω load with less than 1% THD+N. With the LM4980 packaged in the SON package, the customer benefits include low profile and small size. This package minimizes PCB area and maximizes output power. 1 23 • • 2-Cell 1.5V to 3.3V Battery Operation Unity-Gain Stable “Click and Pop” Suppression Circuitry for Shutdown and Power On/Off Transient with Headphone Loads Active Low Micro-Power Shutdown Thermal Shutdown Protection Circuitry APPLICATIONS • • • Portable Two-Cell Audio Products Portable Two-Cell Electronic Devices Portable MP3 Player/Recorders KEY SPECIFICATIONS • • • • • • The LM4980 features circuitry that significantly reduces output transients (“clicks” and “pops”) while driving headphones during device turn-on and turn-off without costly external additional circuitry. The LM4980 also includes an externally controlled lowpower consumption active-low shutdown mode, and thermal shutdown. Boomer audio power amplifiers are designed specifically to use few external components and provide high quality output power in a surface mount package. Output Power (RL = 16Ω, VDD = 3.0V, THD+N = 1%), 42mW (Typ) Quiescent current (VDD = 3V), 1mA (Typ) Micropower Shutdown Current, 0.1µA (Typ) Supply Voltage Operating Range. 1.5V < VDD < 3.3V PSRR @ 1kHz, VDD = 3.0V, 90dB (Typ) PSRR @ 217Hz, VDD = 3.0V, 100 (Typ) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Boomer is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2013, Texas Instruments Incorporated LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com Typical Application VDD R R IN A- - OUT A + R VMID RL R MID CAP SHDN Click/Pop Suppression RL + OUT B R IN B- - R Figure 1. Block Diagram Connection Diagram INA 1 10 VDD SHDN 2 9 OUTA NC 3 8 MID CAP VMID 4 7 OUTB INB 5 6 GND Figure 2. SON Package Top View See Package Number DSC0010A 2 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Typical Connection VDD Signal Source Channel A R R IN A0.68 PF Generator OUT A 100 PF + R VMID VMID CCOUPLING - CIN 32: CBYPASS R 4.7 PF MID CAP CMIDCAP SHDN 4.7 PF Click/Pop Suppression 32: + Channel B OUT B R IN B- CCOUPLING - CIN 100 PF 0.68 PF R Figure 3. Typical Application Circuit These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 3.6V −65°C to +150°C Storage Temperature −0.3V to VDD +0.3V Input Voltage Power Dissipation (3) Internally limited ESD Susceptibility (4) 2000V ESD Susceptibility (5) 200V Junction Temperature Solder Information Thermal Resistance (1) (2) (3) (4) (5) 150°C Small Outline Package Vapor Phase (60sec) 215°C Infrared (15 sec) 220°C θJA (typ) DSC0010A 73°C/W Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum power dissipation is dictated by TJMAX, θJA, and the ambient temperature TA must be derated at elevated temperatures. The maximum allowable power dissipation is PDMAX = (TJMAX − TA) / θJA. For the LM4980, TJMAX = 150°C. For the θJAs, please see the Application Information section or the Absolute Maximum Ratings section. Human body model, 100pF discharged through a 1.5kΩ resistor. Machine model, 200pF – 220pF discharged through all pins. Operating Ratings Temperature Range TMIN ≤ TA ≤ TMAX −40°C ≤ TA ≤ +85°C 1.5V ≤ VDD ≤ 3.3V Supply Voltage Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 3 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com Electrical Characteristics VDD = 3.0V (1) (2) The following specifications apply for the circuit shown in Figure 3, unless otherwise specified. AV = 0dB, RL = 32Ω. Limits apply for TA = 25°C. Symbol Parameter Conditions LM4980 Typical (3) Limit (4) Units (Limits) IDD Quiescent Power Supply Current VIN = 0V, IO = 0A, RL = ∞ (5) 1.0 1.5 mA (max) ISD Shutdown Current VSHDN = GND 0.1 1 μA (max) VOS Output Offset Voltage 1 5 mV RL = 16Ω, THD+N = 1%, f = 1kHz, per channel 42 35 mW (min) RL = 32Ω, THD+N = 1%, f = 1kHz, per channel 28 mW (min) µVRMS Output Power (6) PO VNO Output Voltage Noise 20Hz to 20kHz, A-weighted, Fig. 2 10 THD+N Total Harmonic Distortion + Noise RL = 32Ω, POUT = 10mW, f = 1kHz 0.02 % Freq = 1kHz, POUT = 28mW, RL = 32Ω 77 dB VRIPPLE = 200mVP-P sine wave fRIPPLE = 1kHz, CMIDCAP = 4.7µF, VMID Voltage is Ripple-Free 90 dB VRIPPLE = 200mVP-P sine wave fRIPPLE = 217Hz, CMIDCAP = 4.7µF, VMID Voltage is Ripple-Free 100 dB dB Crosstalk PSRR Power Supply Rejection Ratio CMRR Common-Mode Rejection Ratio Input coupling capacitors with 5% tolerance, VIN = VMID, fRIPPLE = 1kHz 47 TWAKE-UP Wake-up Time CMIDCAP = 4.7µF, Fig 2. 250 VIH Control Logic High 1.5V ≤ VDD ≤ 3.3V 1.4V V (min) VIL Control Logic Low 1.5V ≤ VDD ≤ 3.3V 0.4V V (max) (1) (2) (3) (4) (5) (6) 4 ms Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. All voltages are measured with respect to the ground (GND) pins unless otherwise specified. Typicals are measured at 25°C and represent the parametric norm. Datasheet min/max specification limits are specified by design, test, or statistical analysis. The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier. Output power is measured at the device terminals. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Electrical Characteristics VDD = 1.8V (1) (2) The following specifications apply for the circuit shown in Figure 3, unless otherwise specified. AV = 0dB, RL = 32Ω. Limits apply for TA = 25°C. Symbol Parameter Conditions LM4980 Typical (3) Limit (4) Units (Limits) IDD Quiescent Power Supply Current VIN = 0V, IO = 0A, RL = ∞ (5) 0.9 ISD Shutdown Current VSHDN = GND 0.1 μA VOS Output Offset Voltage 1 mV RL = 16Ω, THD+N = 1%, f = 1kHz, per channel 11 mW (min) RL = 32Ω, THD+N = 1%, f = 1kHz, per channel 9 mW (min) µVRMS Output Power (6) PO mA VNO Output Voltage Noise 20Hz to 20kHz, A-weighted, Fig. 2 9 THD+N Total Harmonic Distortion + Noise RL = 32Ω, POUT = 10mW, f = 1kHz 0.03 % Freq = 1kHz, POUT = 9mW, RL = 32Ω 79 dB VRIPPLE = 200mVP-P sine wave fRIPPLE = 1kHz, CMIDCAP = 4.7µF, VMID Voltage is Ripple-Free 78 dB VRIPPLE = 200mVP-P sine wave fRIPPLE = 217Hz, CMIDCAP = 4.7µF, VMID Voltage is Ripple-Free 85 dB dB Crosstalk PSRR Power Supply Rejection Ratio CMRR Common-Mode Rejection Ratio Input coupling capacitors with 5% tolerance, VIN = VMID, fRIPPLE = 1kHz 47 TWAKE-UP Wake-up Time CMIDCAP = 4.7μF, Fig 2. 320 VIH Control Logic High 1.5V ≤ VDD ≤ 3.3V 1.4V V (min) VIL Control Logic Low 1.5V ≤ VDD ≤ 3.3V 0.4V V (max) (1) (2) (3) (4) (5) (6) ms Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication of device performance. All voltages are measured with respect to the ground (GND) pins unless otherwise specified. Typicals are measured at 25°C and represent the parametric norm. Datasheet min/max specification limits are specified by design, test, or statistical analysis. The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier. Output power is measured at the device terminals. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 5 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (TA = 25°C) THD+N vs Frequency VDD = 2.4V, RL = 32Ω, POUT = 14mW 10 5 2 1 2 1 0.5 0.5 THD+N (%) THD+N (%) 10 5 THD+N vs Frequency VDD = 1.8V, RL = 32Ω, PO = 7.3mW 0.2 0.1 0.05 0.2 0.1 0.05 0.02 0.01 0.005 0.02 0.01 0.005 0.002 0.001 20 0.002 0.001 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) THD+N vs Frequency VDD = 1.8V, RL = 16Ω, POUT = 9.3mW 10 5 2 1 2 1 0.5 0.5 THD+N (%) THD+N (%) Figure 5. THD+N vs Frequency VDD = 3V, RL = 32Ω, POUT = 23mW 0.2 0.1 0.05 0.2 0.1 0.05 0.02 0.01 0.005 0.02 0.01 0.005 0.002 0.001 20 0.002 0.001 20 50 100 200 500 1k 2k 5k 10k 20k 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) Figure 6. Figure 7. THD+N vs Frequency VDD = 2.4V, RL = 16Ω, POUT = 20mW THD+N vs Frequency VDD = 3V, RL = 16Ω, POUT = 27mW 10 5 10 5 2 1 2 1 0.5 0.5 THD+N (%) THD+N (%) FREQUENCY (Hz) 0.2 0.1 0.05 0.2 0.1 0.05 0.02 0.01 0.005 0.02 0.01 0.005 0.002 0.001 20 0.002 0.001 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) Figure 8. 6 5k 10k 20k FREQUENCY (Hz) Figure 4. 10 5 50 100 200 500 1k 2k Figure 9. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Typical Performance Characteristics (TA = 25°C) (continued) 20 10 10 5 5 2 2 THD+N (%) THD+N (%) 20 THD+N vs Output Power VDD = 1.8V, RL = 32Ω 1 0.5 0.2 1 0.5 0.2 0.1 0.1 0.05 0.05 0.02 0.02 0.01 1m 0.01 1m 2m 5m 10m 20m 50m 100m THD+N vs Output Power VDD = 2.4V, RL = 32Ω 2m OUTPUT POWER (W) 20 10m 20m 50m 100m Figure 10. Figure 11. THD+N vs Output Power VDD = 3V, RL = 32Ω THD+N vs Output Power VDD = 1.8V, RL = 16Ω 10 10 5 5 2 2 1 THD+N (%) THD+N (%) 5m OUTPUT POWER (W) 1 0.5 0.2 0.5 0.2 0.1 0.1 0.05 0.05 0.02 0.02 0.01 10m 30m 20m 0.01 1m 50m 70m 100m 40m 60m 80m 2m 5m 10m 20m 50m 100m OUTPUT POWER (W) OUTPUT POWER (W) Figure 13. THD+N vs Output Power VDD = 2.4V, RL = 16Ω THD+N vs Output Power VDD = 3V, RL = 16Ω 20 10 10 5 5 2 2 THD+N (%) THD+N (%) 20 Figure 12. 1 0.5 0.2 1 0.5 0.2 0.1 0.1 0.05 0.05 0.02 0.02 0.01 10m 30m 20m 40m 50m 70m 100m 60m 80m OUTPUT POWER (W) 0.01 10m 30m 20m 40m 50m 70m 100m 60m 80m OUTPUT POWER (W) Figure 14. Figure 15. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 7 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com POWER SUPPLY REJECTION RATIO (dB) 20 +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 POWER SUPPLY REJECTION RATIO (dB) 20 +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 20 8 POWER SUPPLY REJECTION RATIO (dB) PSRR vs Frequency VDD = 1.8V, RL = 32Ω, 4.7μ 50 100 200 500 1k 2k 5k 10k 20k PSRR vs Frequency VDD = 2.4V, RL = 32Ω, 4.7μ +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 20 50 100 200 500 1k 2k FREQUENCY (Hz) FREQUENCY (Hz) Figure 16. Figure 17. PSRR vs Frequency VDD = 3V, RL = 32Ω, 4.7μ POWER SUPPLY REJECTION RATIO (dB) +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 50 100 200 500 1k 2k 5k 10k 20k 20 50 100 200 500 1k 2k FREQUENCY (Hz) Figure 18. Figure 19. PSRR vs Frequency VDD = 2.4V, RL = 32Ω, 1μ 50 100 200 500 1k 2k 5k 10k 20k 5k 10k 20k PSRR vs Frequency VDD = 3V, RL = 32Ω, 1μ +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 20 50 100 200 500 1k 2k FREQUENCY (Hz) FREQUENCY (Hz) Figure 20. Figure 21. Submit Documentation Feedback 5k 10k 20k PSRR vs Frequency VDD = 1.8V, RL = 32Ω, 1μ +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 -105 -110 -115 -120 FREQUENCY (Hz) POWER SUPPLY REJECTION RATIO (dB) POWER SUPPLY REJECTION RATIO (dB) Typical Performance Characteristics (TA = 25°C) (continued) 5k 10k 20k Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Crosstalk vs Frequency VDD = 1.8V, RL = 32Ω,POUT = 9mW Channel B Driven, Channel A Measured +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 20 CROSSTALK (dB) CROSSTALK (dB) Typical Performance Characteristics (TA = 25°C) (continued) Crosstalk vs Frequency VDD = 1.8V, RL = 32Ω, POUT = 9mW Channel A Driven, Channel B Measured 50 100 200 500 1k 2k 5k 10k 20k 20 5k 10k 20k Figure 22. Figure 23. Crosstalk vs Frequency VDD = 2.4V, RL = 32Ω, POUT = 17mW Channel A Driven, Channel B Measured Crosstalk vs Frequency VDD = 2.4V, RL = 32Ω, POUT = 17mW Channel B Driven, Channel A Measured +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 20 50 100 200 500 1k 2k 5k 10k 20k 20 FREQUENCY (Hz) 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) Figure 24. Figure 25. Crosstalk vs Frequency VDD = 3V, RL = 32Ω, POUT = 27mW Channel A Driven, Channel B Measured Crosstalk vs Frequency VDD = 3V, RL = 32Ω, POUT = 27mW Channel B Driven, Channel A Measured +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 20 CROSSTALK (dB) CROSSTALK (dB) 50 100 200 500 1k 2k FREQUENCY (Hz) CROSSTALK (dB) CROSSTALK (dB) FREQUENCY (Hz) 50 100 200 500 1k 2k 5k 10k 20k +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) FREQUENCY (Hz) Figure 26. Figure 27. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 9 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com Crosstalk vs Frequency VDD = 1.8V, RL = 16Ω, POUT = 11mW Channel B Driven, Channel A Measured +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 20 CROSSTALK (dB) CROSSTALK (dB) Typical Performance Characteristics (TA = 25°C) (continued) Crosstalk vs Frequency VDD = 1.8V, RL = 16Ω, POUT = 11mW Channel A Driven, Channel B Measured 50 100 200 500 1k 2k 5k 10k 20k 20 Figure 29. Crosstalk vs Frequency VDD = 2.4V, RL = 16Ω, POUT = 24mW Channel A Driven, Channel B Measured Crosstalk vs Frequency VDD = 2.4V, RL = 16Ω, POUT = 24mW Channel B Driven, Channel A Measured +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 50 100 200 500 1k 2k 5k 10k 20k 20 FREQUENCY (Hz) 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) Figure 30. Figure 31. Crosstalk vs Frequency VDD = 3V, RL = 16Ω, POUT = 42mW Channel A Driven, Channel B Measured Crosstalk vs Frequency VDD = 3V, RL = 16Ω, POUT = 42mW Channel B Driven, Channel A Measured +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 +0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -95 -100 20 CROSSTALK (dB) CROSSTALK (dB) 5k 10k 20k Figure 28. 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) 20 50 100 200 500 1k 2k 5k 10k 20k FREQUENCY (Hz) Figure 32. 10 50 100 200 500 1k 2k FREQUENCY (Hz) CROSSTALK (dB) CROSSTALK (dB) FREQUENCY (Hz) Figure 33. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Typical Performance Characteristics (TA = 25°C) (continued) 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 Output Power vs Supply Voltage RL = 16Ω OUTPUT POWER (W) OUTPUT POWER (W) Output Power vs Supply Voltage RL = 32Ω THD + N = 10% THD + N = 1% 1.5 1.8 2.1 2.4 2.7 3 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 3.3 THD + N = 10% THD + N = 1% 1.5 1.8 POWER SUPPLY VOLTAGE (V) 3.3 Output Power vs Load Resistance VDD = 1.8V Output Power vs Load Resistance VDD = 2.4V 40 35 30 12 THD+N = 10% 10 8 THD+N = 1% 6 4 25 THD+N = 10% 20 15 THD+N = 1% 10 5 2 0 0 100 200 300 400 500 600 0 100 200 300 400 500 600 LOAD RESISTANCE (W) LOAD RESISTANCE (W) Figure 36. Figure 37. Output Power vs Load Resistance VDD = 3.0V Load Dissipation vs Amplifier Dissipation VDD = 1.8V 50 40 0.040 AMPLIFIER DISSIPATION (W) 60 OUTPUT POWER (W) 3 Figure 35. 14 70 2.7 POWER SUPPLY VOLTAGE (V) 16 0 2.4 Figure 34. OUTPUT POWER (W) OUTPUT POWER (W) 18 2.1 THD+N = 10% 30 THD+N = 1% 20 10 THD+N = 1% 0.035 0.030 RL = 16: 0.025 0.020 THD+N = 10% 0.015 RL = 32: 0.010 0.005 0 0 100 200 300 400 500 600 LOAD RESISTANCE (W) 0.000 0.000 0.004 0.008 0.012 0.016 LOAD DISSIPATION/CHANNEL (W) Figure 38. Figure 39. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 11 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (TA = 25°C) (continued) Amplifier Dissipation vs Load Dissipation VDD = 2.4V Amplifier Dissipation vs Load Dissipation VDD = 3.0V 0.120 AMPLIFIER DISSIPATION (W) AMPLIFIER DISSIPATION (W) 0.080 0.070 THD+N = 1% 0.060 RL = 16 0.050 THD+N = 10% 0.040 0.030 RL = 32 0.020 RL = 16: 0.080 THD+N = 10% 0.060 RL = 32: 0.040 0.020 0.010 0.000 0.000 THD+N = 1% 0.100 0.010 0.020 0.030 0.000 0.000 0.010 0.020 0.030 0.040 0.050 0.060 0.040 LOAD DISSIPATION/CHANNEL (W) LOAD DISSIPATION/CHANNEL (W) Figure 40. Figure 41. POWER SUPPLY CURRENT (mA) Power Supply Current vs Power Supply Voltage VIN = 0V 1.2 1 0.8 0.6 0.4 0.2 0 1.5 1.8 2.1 2.4 2.7 3 3.3 POWER SUPPLY VOLTAGE (V) Figure 42. 12 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 APPLICATION INFORMATION AMPLIFIER CONFIGURATION As shown in Figure 1, the LM4980 consists of a stereo pair of audio amplifiers. These amplifiers operate on a single supply and have single-ended inputs and outputs. The quiescent operating point of each amplifier input and output is equal to the voltage applied to the VMID pin (usually VDD/2). CMIDCAP VALUE SELECTION Careful consideration should be paid to value of CMIDCAP, the capacitor connected between the MIDCAP pin and ground. The value of CMIDCAP determines how fast the LM4980 settles to quiescent operation and determines the amount of output transient suppression. Choosing CMIDCAP equal to 4.7μF along with a small value of CIN (in the range of 0.1μF to 1.0μF), produces shutdown function that is essentially output-transient free. Choosing CIN no larger than necessary for the desired bandwidth helps minimize clicks and pops. This ensures that output transients are minimized when power is first applied or the LM4980 resumes operation after shutdown. The MIDCAP offers the following benefits: better linearity for reduced THD+N, reduced channel-to-channel crosstalk, and less susceptibility to ground noise. For the ultimate suppression of output transient when power is applied or removed, ensure that the voltage applied to the SHDN pin is a logic low. This will activate the micro-power shutdown. OPTIMIZING OUTPUT-GROUND NOISE REDUCTION In addition to the output-ground noise reduction afforded by CMIDCAP, further reduction can be achieved by the inclusion of a ferrite bead. The ferrite bead (FB) is placed between ground and common connection between the CMIDCAP and the headphone ground connection. This is shown in Figure 43. The ferrite bead is beneficial in environments where the headphone and CMIDCAP ground connection is shared with circuitry (such as video) that may inject noise on a common ground. LM4980 VMIDCAP FB Figure 43. Adding a ferrite bead improves ground-noise suppression OPTIMIZING OUTPUT TRANSIENT SUPPRESSION The LM4980 contains circuitry that eliminates turn-on and shutdown output transients ("clicks and pops"). For this discussion, turn-on refers to either applying the power supply voltage or when the micro-power shutdown mode is deactivated. The turn-on time delay is the time duration that occurs between the application of the power supply voltage or deactivating shutdown and when the applied input signal appears at the amplifier outputs. CMIDCAP's value plays a significant role in the suppression of output transients. The amount of suppression increases as CMIDCAP's value increases. However, changing the value of CMIDCAP alters the LM4980's turn-on time. There is a linear relationship between the value of CMIDCAP and the turn-on time. Here are some typical turn-on times for various values of CMIDCAP. Table 1. Typical turn-on time versus CMIDCAP value CMIDCAP VALUE (µF) Turn-On Time (ms) 4.7 250 6.8 360 10.0 530 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 13 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com STAND-ALONE VMID VOLTAGE GENERATION The LM4980 is designed to take advantage of audio DACs (digital-to-analog converters) and other signal sources that, in addition to generating an analog signal, also create an AC ground potential. This AC ground potential is typically VDD/2. This VDD/2 is applied to the LM4980’s VMID pin (pin 4). Using two external resistors allows the LM4980 to be easily used in applications where the VMID voltage is not internally generated and supplied to the LM4980 by other circuits. Figure 44 shows this configuration. VDD 51 k: LM4980 VMID 4.7 PF 51 k: Figure 44. Simple circuit generates LM4980's VMID voltage SELECTING THE OUTPUT COUPLING CAPACITOR VALUE To ensure that no performance degrading DC current flows through the load (something with which speakers would just as soon not have to tolerate), coupling capacitors are necessary between the amplifier output pins and the load. Besides blocking DC current, the output coupling capacitor value, together with the load resistance, produces a low frequency amplitude rolloff, whose cutoff frequency is found using Equation 1. f-3 dB = 1 2SRLOADCCOUPLING (1) When driving 32Ω headphones, the 220µF CCOUPLING capacitors shown in Figure 3 produce a cutoff frequency equal to 23Hz. The output coupling capacitors also influence the output transient behavior at power-up and when activating or deactivating shutdown. As CCOUPLING’s value increases, output transient magnitude can also increase. This increase can be mitigated by a corresponding increase in CMIDCAP’s value. A minimum starting point when selecting CMIDCAP’s value is 6.8µF when using 220µF output coupling capacitors. SELECTING THE INPUT CAPACITOR VALUE Amplifiying the lowest audio frequencies requires a relatively high value input coupling capacitor, (CIN in Figure 3). A high value capacitor can be expensive and may compromise space efficiency in portable designs. In many cases, however, the headphones used in portable systems have limited ability to reproduce signals below 60Hz. Applications using headphones with this limited frequency response reap little improvement by using a high value input capacitor. A small value of Ci (in the range of 0.1μF to 1.0μF), is recommended. DRIVING POWERED SPEAKERS Though the LM4980 is design primarily to drive headphones, in many cases, it may be called on to act as a line level driver when powered speakers or other devices may be connected to the amplifier outputs. For powered speakers or other devices with typical input resistances (10kΩ) that are significantly higher than the typical headphone resistance (32Ω), the output transients may not sufficiently suppressed when using the Figure 3 circuit. If this is anticipated, a minor modification of an additional resistor (a nominal value of 1kΩ) between each output and ground in the Figure 3 circuit is needed to ensure that the output transient suppression is not compromised. This reduces both the load resistance seen by the LM4980 and the magnitude of power-on and shutdown output transients. 14 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 POWER DISSIPATION Power dissipation has to be evaluated and considered when designing a successful amplifier. A direct consequence of the power delivered to a load an amplifier is internal power dissipation. The maximum peramplifier power dissipation for a given application can be derived from the power dissipation graphs or from Equation 2. PDMAX = VDD2/ 2πRLOAD (2) It is critical that the maximum junction temperature TJMAX of 150°C is not exceeded. Since the typical application is for headphone operation (16Ω impedance) using a 3.0V supply the maximum power dissipation is less than 29mW. Therefore, in the case of this headphone amplifier, the power dissipation is not a major concern. POWER SUPPLY BYPASSING As with any amplifier, proper supply bypassing is important for low noise performance and high power supply rejection. The capacitor location on the power supply pins should be as close to the device as possible. Typical applications employ a 3.0V regulator with 10µF tantalum or electrolytic capacitor and a ceramic bypass capacitor which aid in supply stability. This does not eliminate the need for local power supply bypassing connected as close as possible to the LM4980’s supply pin. A power supply bypass capacitor value in the range of 1.0µF to 10µF is recommended. MICRO POWER SHUTDOWN The voltage applied to the shutdown (SHDN) pin controls the LM4980’s shutdown function. Activate micro-power shutdown by applying a logic-low voltage to the SHDN pin. When active, the LM4980’s micro-power shutdown feature turns off the amplifier’s bias circuitry, reducing the supply current. The trigger point is 0.4V (max) for a logic-low level, and 1.4V (min) for a logic-high level. The low 0.1μA (typ) shutdown current is achieved by applying a voltage that is as near as ground as possible to the SHDN pin. A voltage that is higher than ground may increase the shutdown current. There are a few ways to control the micro-power shutdown. These include using a single-pole, single-throw switch, a microprocessor, or a microcontroller. When using a switch, connect an external 100kΩ pull-up resistor between the SHDN pin and GND. Connect the switch between the SHDN pin and VDD. Select normal amplifier operation by closing the switch. Opening the switch connects the SHDN pin to ground, activating micro-power shutdown. The switch and resistor ensure that the SHDN pin will not float. This prevents unwanted state changes. In a system with a microprocessor or microcontroller, use a digital output to apply the control voltage to the SHDN pin. Driving the SHDN pin with active circuitry eliminates the pull-up resistor. SUGGESTED PCB SCHEMATIC Figure 45 is the schematic for the suggested PCB Layout. This schematic and its associated PCB provide both a lean tested layout and platform that can be used to verify the LM4980's outstanding audio performance. Suggested PCB Design and Layout Figure 46 through Figure 49 show a suggested PCB layout for a headphone amplifier circuit using the LM4980 . PCB Layout Guidelines This section provides practical guidelines for mixed signal PCB layout that involves various digital/analog power and ground traces. Designers should note that these are only "rule-of-thumb" recommendations and the actual results will depend heavily on the final layout. MINIMIZING THD+N PCB trace impedance on the power, ground, and all output traces should be minimized to achieve optimal THD performance. Therefore, use PCB traces that are as wide as possible for these connections. As the gain of the amplifier is increased, the trace impedance will have an ever increasing adverse affect on THD performance. At unity-gain (0dB) the parasitic trace impedance effect on THD performance is reduced but still a negative factor in the THD performance of the LM4980 in a given application. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 15 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com GENERAL MIXED SIGNAL LAYOUT RECOMMENDATION Power and Ground Circuits For two layer mixed signal design, it is important to isolate the digital power and ground trace paths from the analog power and ground trace paths. Star trace routing techniques (bringing individual traces back to a central point rather than daisy chaining traces together in a serial manner) can greatly enhance low level signal performance. Star trace routing refers to using individual traces to feed power and ground to each circuit or even device. This technique will require a greater amount of design time but will not increase the final price of the board. The only extra parts required may be some jumpers. Single-Point Power and Ground Connections The analog power traces should be connected to the digital traces through a single point (link). A "PI-filter" can be helpful in minimizing high frequency noise coupling between the analog and digital sections. Further, place digital and analog power traces over the corresponding digital and analog ground traces to minimize noise coupling. Placement of Digital and Analog Components All digital components and high-speed digital signal traces should be located as far away as possible from analog components and circuit traces. Avoiding Typical Design / Layout Problems Avoid ground loops or running digital and analog traces parallel to each other (side-by-side) on the same PCB layer. When traces must cross over each other do it at 90 degrees. Running digital and analog traces at 90 degrees to each other from the top to the bottom side as much as possible will minimize capacitive noise coupling and cross talk. 16 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Schematic for the LM4980 Suggested PCB Layout Figure 45. Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 17 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com Suggested PCB Layout Figure 46. Top Layer 18 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Figure 47. Bottom Layer Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 19 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com Figure 48. Silkscreen Layer 20 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 LM4980 www.ti.com SNAS301C – JUNE 2005 – REVISED APRIL 2013 Figure 49. Top Layer Pads Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 21 LM4980 SNAS301C – JUNE 2005 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Rev Date 1.0 6/08/05 Initial release. 1.1 6/29/05 Correct typographical and schematic errors. Re-released D/S to the WEB. 1.2 7/18/05 Replaced curves 20142971 and 72 with 20142990 and 91 respectively, then rereleased D/S to the WEB. Changes from Revision B (April 2013) to Revision C • 22 Description Page Changed layout of National Data Sheet to TI format .......................................................................................................... 21 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4980 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM4980SD/NOPB ACTIVE WSON DSC 10 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L4980 LM4980SDX/NOPB ACTIVE WSON DSC 10 4500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 L4980 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM4980SD/NOPB WSON DSC 10 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 LM4980SDX/NOPB WSON DSC 10 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4980SD/NOPB WSON DSC 10 1000 203.0 190.0 41.0 LM4980SDX/NOPB WSON DSC 10 4500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA DSC0010A SDA10A (Rev A) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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