User's Guide
SNVA290A – September 2007 – Revised May 2013
AN-1723 LM5067 Evaluation Board
1
Introduction
The LM5067EVAL evaluation board provides the design engineer with a fully functional hot swap
controller board designed for negative voltage systems. This board contains an LM5067-2, the auto restart
version of this IC. This document describes the various functions of the board, how to test and evaluate it,
and how to change the components for a specific application. The LM5067 data sheet is available from
www.ti.com.
The board’s specifications are:
• Input voltage range: -9V to -78V maximum, limited by the transient suppressor (Z1)
• Current limit: 5 Amps, ±12%
• Q1 Power limit: 40W
• UVLO Thresholds: 34.5V, ±5% and 32.4V, ±2%
• OVLO Thresholds: 77.7V, ±3% and 75.6V, ±5%
• Insertion delay: 1470 ms
• Fault timeout period: 104 ms
• Restart time: 21 seconds
• Size: 4.0” x 1.4”
2
Board Configuration
Figure 1. Evaluation Board - Top Side
The LM5067 evaluation board is shown in Figure 1, and the schematic is shown in Figure 2. The
“BACKPLANE” section, at the left end of the board, represents the backplane voltage source. The vertical
dashed line is the boundary between the backplane voltage source and the hot swap circuit input. In other
words, it represents the edge connector in a card cage system. The toggle switch (SW1) provides a
means to “connect” and “disconnect” the hot swap circuit from the backplane voltage source.
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1
Theory of Operation
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The circuitry to the right of the vertical dashed line is the hot swap circuit. The system voltage is to be
connected to the input terminal block (J1). The external load is to be connected to the output terminal
block (J2). Capacitors C3 and C4 represent capacitance, which is typically present on the input of the load
circuit, and are present on this evaluation board so the turn-on characteristics of the LM5067 can be
tested without having to connect a load.
For a hot swap circuit to function reliably, capacitance is needed on the supply side of the system
connector (C7). Its purpose is to minimize voltage transients that occur whenever the load current
changes or is shut off. If the capacitance is not present, wiring inductance in the supply lines generate a
voltage transient at shutoff, which can exceed the absolute maximum rating of the LM5067, resulting in its
destruction.
The LM5067EVB is supplied with pins 2-3 jumpered on JMP1, and pins 1-2 jumpered on JMP2.
C4
C3
C8
0.1 PF 100 PF 100 PF
100V 200V 200V
C7
100 PF
200V
GND
VIN
Z1
70V
-9V to
-78V
R1
95.3k
0.1 PF
JMP1
R2
4.64k
2
R4
NU
SW1
JMP2
1
9
OUT
LM5067
10
SENSE GATE
7
8
PWR VEE
4
5
C2
2.2 PF
3
R7
100k
PGD
OVLO
P1
VPGD
R8 0:
C6
NU
R6
56.2k
R9
0.01:
BACKPLANE
PGD
2
UVLO
TIMER
6
R3
3.32k
GND
VOUT
1
VCC
TP1
3
TP
VEE
C1
U2
1
2
3
R5
5.1 k:
1W
C5
0. 1 PF
100V
Q1
SUM40N 15- 38
LOAD
HOT SWAP CIRCUIT
Figure 2. Evaluation Board Schematic
3
Theory of Operation
The LM5067 provides intelligent control of the power supply connections of a load that is to be connected
to a live power source. The two primary functions of a hot swap circuit are in-rush current limiting during
turn-on, and monitoring of the load current for faults during normal operation. Additional functions include
under-voltage lock-out (UVLO) and over-voltage lock-out (OVLO) to ensure voltage is supplied to the load
only when the system input voltage is within a defined range, power limiting in the series pass FET (Q1)
during turn-on, and a power good logic output (PGD) to indicate the circuit status.
2
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Theory of Operation
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Upon applying the input voltage to the LM5067 (for example, SW1 is switched on), Q1 is initially held off
for the insertion delay (≊1470 ms) to allow ringing and transients at the input to subside. At the end of the
insertion delay, if the input voltage at VIN is between the UVLO and OVLO thresholds, Q1 is turned on in
a controlled manner to limit the in-rush current. If the in-rush current were not limited during turn-on, the
current would be high (very high!) as the load capacitors (C3, C4) charge up, limited only by the surge
current capability of the voltage source, C7’s characteristics, and the wiring resistance (a few milliohms).
That very high current could damage the edge connector, PC board traces, and possibly the load
capacitors receiving the high current. Additionally, the dV/dt at the load’s input is controlled to reduce
possible EMI problems.
The LM5067 limits in-rush current to a safe level using a two step process. In the first portion of the turnon cycle, when the voltage differential across Q1 is highest, Q1’s power dissipation is limited to a peak of
40W by monitoring its drain current (the voltage across R9) and its drain-to-source voltage. Their product
is maintained constant by controlling the drain current as the drain-to-source voltage decreases (as the
output voltage increases). This is shown in the constant power portion of Figure 3 where the drain current
is increasing to ILIM. When the drain current reaches the current limit threshold (5 Amps), it is then
maintained constant as the output voltage continues to increase. When the output voltage reaches the
input voltage (VDS decreases to near zero), the drain current then reduces to a value determined by the
load. Q1’s gate-to-source voltage then increases to ≊13V above VEE. The circuit is now in normal
operation mode.
Monitoring of the load current for faults during normal operation is accomplished using the current limit
circuit described above. If the load current increases to 5 Amps (50 mV across R9), Q1’s gate is controlled
to prevent the current from increasing further. When current limiting takes effect, the fault timer limits the
duration of the fault. At the end of the fault timeout period (≊104 ms) Q1 is shut off, denying current to the
load. The LM5067-2 then initiates a restart every 21 seconds. The restart consists of turning on Q1 and
monitoring the load current to determine if the fault is still present. After the fault is removed, the circuit
powers up to normal operation at the next restart.
In a sudden overload condition (the output is shorted to ground), it is possible the current could increase
faster than the response time of the current limit circuit. In this case, the circuit breaker sensor shuts off
Q1’s gate rapidly when the voltage across R9 reaches ≊100 mV. When the current reduces to the current
limit threshold, the current limit circuitry then takes over.
The PGD logic level output is low during turn-on, and switches high when the output voltage at OUT has
increased to within 1.23V of the input voltage, signifying the turn-on procedure is essentially complete. If
the OUT voltage magnitude decreases more than 2.5V with respect to VIN due to a fault, PGD switches
low. The high level voltage at PGD can be any appropriate voltage up to 80V above VEE, and can be
higher or lower than system ground.
The UVLO and OVLO thresholds are set by resistors R1-R3. The UVLO and OVLO thresholds are
reached when the voltage at the UVLO and OVLO pins each reach 2.5V, respectively. The internal 22 µA
current sources provide hysteresis for each of the thresholds.
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AN-1723 LM5067 Evaluation Board
3
Board Layout and Probing Cautions
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VIN
VDS
Drain Current
ILIM, 5A
Constant
Power
0
13V
Gate-to- Source Voltage
VGSL
Normal
Operation
VTH
Turn-on
0
0
Figure 3. Power Up Using Power Limit and Current Limit
4
Board Layout and Probing Cautions
Figure 1 shows the placement of the circuit components. The following should be kept in mind when the
board is powered:
• High voltage, equal to VIN, is present on C3, C4, C7, R9, Q1, and various points within the circuit. Use
CAUTION when probing the circuit to prevent injury, as well as possible damage to the circuit.
• At maximum load current (5A), the wire size and length used to connect the power source and the load
become important. The wires connecting this evaluation board to the power source SHOULD BE
TWISTED TOGETHER to minimize inductance in those leads. The same applies for the wires
connecting this board to the load. This recommendation is made in order to minimize high voltage
transients from occurring when the load current is shut off.
5
Board Connections/Startup
The input voltage source is connected to the J1 connector (ground to GND, negative supply voltage to
VIN). The load is connected to the J2 connector at the GND and OUT terminals. USE TWISTED WIRE. A
voltmeter should be connected to the input terminals, and one to the output terminals. The input current
can be monitored with an ammeter or current probe. To monitor the status of the PGD output, connect a
voltmeter from PGOOD to GND, or from PGOOD to the VEE test point (near Q1).
Put the toggle switch to the ON position. Increase the input voltage gradually. When the UVLO threshold
is reached (≊-34.5V) Q1 is switched on and the output voltage increases. If the input current is viewed on
an oscilloscope, the waveform will be similar to that shown in Figure 3, and will settle at the value
determined by the load and the input voltage. The turn-on timing depends on the input voltage, power limit
setting, current limit setting, load capacitance, and the final load current, and is between ≊3 ms with no
load current, and ≊16 ms with a 4A load current with Vin = -36V, see Figure 8 and Figure 9.
6
Circuit Parameter Changes
6.1
Current Limit
The current limit threshold is set by R9 according to Equation 1:
ILIM = 50 mV/R9
(1)
If the load current increases such that the voltage across R9 reaches 50 mV, the LM5067 then modulates
Q1’s gate to limit the current to that level. This evaluation board is supplied with a 10 mΩ resistor for R9,
resulting in a current limit of 5A. To change the current limit threshold replace R9 with a resistor of the
required value and power capability.
4
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Fault Detection and Restart
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6.2
Power Limit
The maximum power dissipated in Q1 during turn-on, or due to a fault, is limited by R9 and R6 according
to Equation 2:
PFET(LIM) =
R6
1.42 x 105 x R9
(2)
With the components supplied on the evaluation board, PFET(LIM) = 40W. During turn-on, when the voltage
across Q1 is high, its gate is modulated to limit its drain current so the power dissipated in Q1 does not
exceed 40W. As the drain-to-source voltage decreases, the drain current increases, maintaining the power
dissipation constant. When the drain current reaches the current limit threshold set by R9 (5A), the current
is then maintained constant until the output voltage reaches its final value. The current then decreases to
a value determined by the load, see Figure 3, Figure 8, and Figure 9.
Each time Q1 is subjected to the maximum power limit conditions it is internally stressed for a few
milliseconds. For this reason, the power limit threshold must be set lower than the limit indicated by the
FET’s SOA chart. In this evaluation board, the power limit threshold is set at 40W, compared to ≊150W
limit indicated in the Vishay SUM40N15-38 data sheet. The FET manufacturer should be contacted for
more information on this subject.
6.3
Insertion Time
The insertion time starts when the voltage across the LM5067 (VCC - VEE) reaches 7.7V, and its duration
is equal to:
tINSERTION = C2 x 6.67 x 105
(3)
During the insertion time, Q1 is held off regardless of the voltage at VIN. This delay allows ringing and
transients at VIN to subside before the input voltage is applied to the load via Q1. The insertion time on
this evaluation board is ≊1470 ms, see Figure 7.
7
Fault Detection and Restart
If the load current increases to the fault level (the current limit threshold, 5A), an internal current source
charges the timing capacitor at the TIMER pin. When the voltage at the TIMER pin reaches 4.0V above
VEE, the fault timeout period is complete, and the LM5067 shuts off Q1. The restart sequence then
begins, consisting of seven cycles at the TIMER pin between 4.0V and 1.25V, as shown in Figure 4.
When the voltage at the TIMER pin reaches 0.3V during the eighth high-to-low ramp, Q1 is turned on. If
the fault is still present, the fault timeout period and the restart sequence repeat.
Fault
Detection
I LIMIT
Load
Current
GATE
Pin
4V
TIMER
Pin
1.25V
1
Fault Timeout
Period
2
3
7
8
0.3V
t RESTART
NOTE: Voltages are with respect to VEE
Figure 4. Fault Timeout and Restart Sequence
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5
UVLO/OVLO Input Voltage Thresholds
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The fault timeout period and the restart timing are determined by the TIMER capacitor according to
Equation 4 and Equation 5:
tFAULT = C2 x 4.7 x 104
tRESTART = C2 x 9.4 x 106
(4)
(5)
The waveform at the TIMER pin can be monitored at the test pad located at the lower left corner of C2,
above TP2. In this evaluation board, the fault timeout period is ≊104 ms, and the restart time is ≊21
seconds, see Figure 10 and Figure 11.
8
UVLO/OVLO Input Voltage Thresholds
As supplied, the input voltage UVLO thresholds on this evaluation board are approximately 34.5V
increasing, and 32.4V decreasing. The OVLO thresholds are approximately 77.7V increasing, and 75.6V
decreasing. The four thresholds are determined by resistors R1-R4. The threshold voltage at each pin is
2.50V, and internal 22 µA current sources provide hysteresis for each threshold. For more details, see the
device-specific data sheet.
8.1
Option A
This evaluation board is supplied with the jumper at JMP1 on pins 2-3, resulting in the configuration shown
in Figure 5.
GND
Rin
R1
95.3k
2
TP1
1
VCC
UVLO
R2
4.64k
LM5067
3
OVLO
VEE
R3
3.32k
VIN
Note: R4 = open
Figure 5. UVLO, OVLO Inputs (Option A)
To change the thresholds in this configuration, resistors R1-R3 are calculated using the following
procedure:
• Choose the upper UVLO threshold (VUVH), and the lower UVLO threshold (VUVL).
• Choose the upper OVLO threshold (VOVH)
• The lower OVLO threshold (VOVL) cannot be chosen in advance in this case, but is determined after the
values for R1-R3 are determined. If VOVL must be accurately defined in addition to the other three
thresholds, see Section 8.2.
The resistors are calculated as follows:
R1 =
VUVH - VUVL
22 PA
(6)
(7)
(8)
The lower OVLO threshold is calculated from Equation 9:
VOVL = [(R1 + R2) x ((2.5V) - 22 PA)] + 2.5V
R3
6
AN-1723 LM5067 Evaluation Board
(9)
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Shutdown
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8.2
Option B
If all four thresholds must be determined accurately, move the jumper at JMP1 to pins 1-2, and add R4,
resulting in the configuration shown in Figure 6, see the caution below.
GND
Rin
R1
TP1
VCC
2
UVLO
LM5067
R2
R4
3
OVLO
VEE
R3
VIN
Figure 6. UVLO, OVLO Inputs (Option B)
The four resistor values are calculated as follows:
• Choose the upper and lower UVLO thresholds (VUVH) and (VUVL).
R1 =
VUVH - VUVL
22 PA
(10)
(11)
•
Choose the upper and lower OVLO threshold (VOVH) and (VOVL).
R2 =
VOVH - VOVL
22 PA
(12)
(13)
CAUTION
Before moving the jumper at JMP1 to pins 1-2 for Section 8.2, the resistor
values must be recalculated to avoid damaging the LM5067. The Absolute
Maximum Rating for the OVLO and UVLO pins is 17V above VEE. If R4 is not
installed, the maximum rating for the UVLO pin will be reached when Vin = 17V. With the supplied values for R2 and R3, the maximum rating for the OVLO
pin will be reached when Vin = -40V.
8.3
Option C
The OVLO function can be disabled by removing the jumper from JMP1. The UVLO thresholds are set by
R1 and R4 using the procedure in Section 8.2.
9
Shutdown
With the circuit in normal operation, the LM5067 can be shutdown by connecting the UVLO pin to VEE.
On this evaluation board, test point TP1 can be connected to the VEE test point for this purpose.
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Power Good Output
10
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Power Good Output
The PGOOD logic output provides an indication of the circuit’s condition. This output is high when the
circuit is in normal operation - the OUT voltage is within 1.25V of VIN. PGOOD is low when the circuit is
shutdown, either intentionally or due to a fault. PGOOD is also high when VIN is less than 2.
This EVB is supplied with pins 1-2 jumpered on JMP2, powering the PGD pin from ground through a 100
kΩ pull-up resistor. To change the high level PGOOD voltage, move the jumper on JMP2 to pins 2-3, and
supply the appropriate pull-up voltage wit respect to VEEto terminal P1 (located next to JMP2). If the
UVLO pin is taken low to disable the LM5067, PGOOD switches low within 10 µs without waiting for the
OUT voltage to change.
If a delay at the PGOOD output is desired, a resistor and capacitor can be added at positions R8 and C6.
11
LM5067-1 Latch Version
The LM5067-2 supplied on this evaluation board provides a restart attempt after a fault detection, as
described above. The companion Hot-Swap IC, the LM5067-1, latches off after a fault detection, with
external control required for restart. Restart is accomplished by momentarily taking the UVLO pin within
2.5V of VEE, or by removing and re-applying the input voltage at VIN. Contact the nearest Texas
Instruments sales office to obtain samples of the LM5067-1.
12
Performance Characteristics
Horizontal Resolution: 200 ms/div
Trace 2: TIMER Pin, 2V/div
Trace 1: Vin, 50V/div (shown inverted 0 to -48V)
Ct = 2.2 µF
Voltages are respect to VEE
Figure 7. Insertion Time Delay
8
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Performance Characteristics
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Horizontal Resolution: 0.5 ms/div
Trace 4: Input Current, 2A/div
Trace 2: PGD Pin, 50V/div
Trace 1: Vout, 20V/div
Vin = -36V
Voltages are respect to VEE
Figure 8. Turn-On Sequence With Zero Load Current
Horizontal Resolution: 5 ms/div
Trace 4: Input Current, 2A/div
Trace 2: PGD Pin, 50V/div
Trace 1: Vout, 20V/div
Vin = -36V
Voltages are respect to VEE
Figure 9. Turn-On Sequence With 4A Load Current
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9
Performance Characteristics
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Horizontal Resolution: 20 ms/div
Trace 4: Load Current 0 to 5A, 2A/div
Trace 2: PGD Pin, 50V/div
Trace 1: Vout, 20V/div
Vin = -48V, Ct = 2.2 µF
Voltages are respect to VEE
Figure 10. Fault Timeout
Horizontal Resolution: 2sec/div
Trace 2: TIMER Pin, 2V/div
Trace 1 Vout, 20V/div
Vin = -48V, Ct = 2.2 µF
Voltages are respect to VEE
Figure 11. Restart Timing
10
AN-1723 LM5067 Evaluation Board
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Bill of Materials (BOM)
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13
Bill of Materials (BOM)
Table 1. Bill of Materials
Description
Mfg, Part No.
C1, C5
Item
Ceramic Capacitor
TDK C3216X7R2A104M
C3, 4, 7
Alum. Electrolytic Capacitor Panasonic EEV-EB2D101M
Package
Value
1206
0.1 µF, 100V
Surf. Mount
100 µF, 200V
TDK C2012X7R2A104M
0805
0.1 µF, 100V
0805
2.2 µF, 16V or higher
C8
Ceramic Capacitor
C6
Unpopulated
C2
Ceramic Capacitor
TDK C2012X7R1C225K
Q1
N-Channel MOSFET
Vishay SUM40N15-38
R1
Resistor
Vishay CRCW12069532F
1206
95.3k, 1/4 W
R2
Resistor
Vishay CRCW08054641F
0805
4.64k
R3
Resistor
Vishay CRCW08053321F
0805
3.32k
R4
Unpopulated
R5
Resistor
Vishay CRCW25125101
2512
5.1k, 1W
R6
Resistor
Vishay CRCW08055622F
0805
56.2k
R7
Resistor
Vishay CRCW12061003F
1206
100k, 1/4 W
R8
Resistor
Vishay CRCW08050000Z
0805
Zero Ωs
R9
Resistor
Vishay WSL2010R0100F
2010
10 mΩ, 1/2 W
U2
Hot Swap IC
Texas Instruments LM5067
Z1
Trans. Suppressor
Diodes Inc. SMBJ70A
TO-263
150V, 40A
VSSOP-10
SMB
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70V
AN-1723 LM5067 Evaluation Board
11
PC Board Layout
14
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PC Board Layout
Figure 12. Board Silkscreen
Figure 13. Board Top Layer
Figure 14. Board Bottom Layer (viewed from top)
12
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