LM5101AMR/NOPB

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 LM5100A/B/C, LM5101A/B/C 3-A, 2-A, and 1-A High-Voltage, High-Side and Low-Side Gate Drivers 1 Features • 1 • • • • • • • • Drives Both a High-Side and Low-Side N-Channel MOSFETs Independent High- and Low-Driver Logic Inputs Bootstrap Supply Voltage up to 118 V DC Fast Propagation Times (25-ns Typical) Drives 1000-pF Load With 8-ns Rise and Fall Times Excellent Propagation Delay Matching (3-ns Typical) Supply Rail Undervoltage Lockout Low Power Consumption Pin Compatible With HIP2100/HIP2101 An integrated high-voltage diode is provided to charge the high-side gate drive bootstrap capacitor. A robust level shifter operates at high speed while consuming low power and providing clean level transitions from the control logic to the high-side gate driver. Undervoltage lockout is provided on both the low-side and the high-side power rails. These devices are available in the standard SOIC-8 pin, SO PowerPAD-8 pin, and the WSON-10 pin packages. The LM5100C and LM5101C are also available in MSOP-PowerPAD-8 package. The LM5101A is also available in WSON-8 pin package. Device Information(1) PART NUMBER INPUT THRESHOLD PEAK OUTPUT CURRENT LM5100A CMOS 3A 2 Applications LM5101A TTL 3A • • • • • LM5100B CMOS 2A LM5101B TTL 2A LM5100C CMOS 1A LM5101C TTL 1A Current-Fed Push-Pull Converters Half and Full Bridge Power Converters Synchronous Buck Converters Two Switch Forward Power Converters Forward with Active Clamp Converters (1) For all available packages, see the orderable addendum at the end of the data sheet. 3 Description The LM5100A/B/C and LM5101A/B/C high-voltage gate drivers are designed to drive both the high-side and the low-side N-Channel MOSFETs in a synchronous buck or a half-bridge configuration. The floating high-side driver is capable of operating with supply voltages up to 100 V. The A versions provide a full 3-A of gate drive, while the B and C versions provide 2 A and 1 A, respectively. The outputs are independently controlled with CMOS input thresholds (LM5100A/B/C) or TTL input thresholds (LM5101A/B/C). Simplified Block Diagram HB UVLO LEVEL SHIFT DRIVER HO HS HI VDD UVLO LI DRIVER LO GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 1 1 1 2 3 3 5 Absolute Maximum Ratings ..................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 6 Electrical Characteristics ......................................... 6 Switching Characteristics......................................... 8 Typical Characteristics ............................................ 10 Detailed Description ............................................ 14 8.1 Overview ................................................................. 14 8.2 Functional Block Diagram ....................................... 14 8.3 Feature Description................................................. 14 8.4 Device Functional Modes........................................ 15 9 Application and Implementation ........................ 16 9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 16 10 Power Supply Recommendations ..................... 20 11 Layout................................................................... 21 11.1 Layout Guidelines ................................................. 21 11.2 Layout Example .................................................... 21 12 Device and Documentation Support ................. 22 12.1 12.2 12.3 12.4 12.5 12.6 Documentation Support ....................................... Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 22 22 22 22 22 22 13 Mechanical, Packaging, and Orderable Information ........................................................... 22 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision P (March 2013) to Revision Q • Page Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1 Changes from Revision O (March 2013) to Revision P • 2 Page Changed layout of National Data Sheet to TI format ........................................................................................................... 19 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 5 Device Comparison Table PART NUMBER PACKAGE LM5100A, LM5100C LM5100B, LM5101B LM5101A LM5101C BODY SIZE (NOM) WSON (10) 4.00 mm × 4.00 mm SO PowerPAD™ (8) 3.90 mm × 4.89 mm SOIC (8) 3.91 mm × 4.90 mm WSON (10) 4.00 mm × 4.00 mm SOIC (8) 3.91 mm × 4.90 mm WSON (8) 4.00 mm × 4.00 mm WSON (10) 4 .00mm × 4.00 mm SO PowerPAD (8) 3.90 mm × 4.89 mm SOIC (8) 3.91 mm × 4.90 mm MSOP PowerPAD (8) 3.00 mm × 3.00 mm WSON (10) 4.00 mm × 4.00 mm SOIC (8) 3.91 mm × 4.90 mm 6 Pin Configuration and Functions D Package 8-Pin SOIC Top View VDD 1 HB 2 DPR Package 10-Pin WSON With Exposed Thermal Pad Top View 8 LO 7 LO VDD 1 10 VSS HB 2 9 VSS HO 3 8 LI HS 4 7 HI NC 5 6 NC SOIC-8 HO 3 6 LI HS 4 5 HI NGT Package 8-Pin WSON With Exposed Thermal Pad Top View VDD 1 8 LO HB 2 7 VSS HO 3 6 LI WSON-10 DDA Package 8-Pin SO PowerPAD Top View VDD 1 HB 2 8 LO 7 VSS WSON-8 SO PowerPad-8 HS 4 5 HI HO 3 6 LI HS 4 5 HI Exposed Pad Connect to VSS Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 3 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com DGN Package 8-Pin MSOP-PowerPAD Top View VDD 1 HB 2 HO HS 8 LO 7 VSS 3 6 LI 4 5 HI MSOPPowerPad-8 Pin Functions PIN I/O DESCRIPTION 2 I High-side gate driver bootstrap supply. Connect the positive terminal of the bootstrap capacitor to HB and the negative terminal to HS. The bootstrap capacitor should be placed as close to the IC as possible. 5 7 I High-side driver control input. The LM5100A/B/C inputs have CMOS type thresholds. The LM5101A/B/C inputs have TTL type thresholds. Unused inputs should be tied to ground and not left open. HO 3 3 O High-side gate driver output. Connect to the gate of high-side MOSFET with a short, low inductance path. HS 4 4 — High-side MOSFET source connection. Connect to the bootstrap capacitor negative terminal and the source of the high-side MOSFET. LI 6 8 I Low-side driver control input. The LM5100A/B/C inputs have CMOS type thresholds. The LM5101A/B/C inputs have TTL type thresholds. Unused inputs should be tied to ground and not left open. LO 8 10 O Low-side gate driver output. Connect to the gate of the low-side MOSFET with a short, low inductance path. VDD 1 1 I Positive gate drive supply . Locally decouple to VSS using low ESR/ESL capacitor located as close to the IC as possible. VSS 7 9 — Ground return. All signals are referenced to this ground. — TI recommends that the exposed pad on the bottom of the package is soldered to ground plane on the PC board, and that ground plane should extend out from beneath the IC to help dissipate heat. 8 PINS 10 PINS (1) HB 2 HI NAME EP (2) (1) (2) 4 For WSON-10 package, pins 5 and 6 have no connection. Exposed pad is not available on the 8-pin SOIC package. Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings See (1) (2) MIN MAX UNIT VDD to VSS −0.3 18 V HB to HS −0.3 18 V LI or HI input −0.3 VDD + 0.3 V LO output −0.3 VDD + 0.3 V VHS − 0.3 VHB + 0.3 V −5 100 V 118 V 150 °C 150 °C HO output HS to VSS (3) HB to VSS Junction temperature −55 Storage temperature (1) (2) (3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military or Aerospace specified devices are required, contact the Texas Instruments Sales Office or Distributors for availability and specifications. In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS node will generally not exceed –1 V. However, in some applications, board resistance and inductance may result in the HS node exceeding this stated voltage transiently. If negative transients occur, the HS voltage must never be more negative than VDD – 15 V. For example if VDD = 10 V, the negative transients at HS must not exceed –5 V. 7.2 ESD Ratings VALUE Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) V(ESD) (1) (2) Electrostatic discharge Machine Model (MM) (2) UNIT ±2000 Option A 50 Option B and C 100 V The Human Body Model (HBM) is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. 2 kV for all pins except Pin 2, Pin 3 and Pin 4 which are rated at 1000 V for HBM. Machine Model (MM) ratings are: 100 V(MM) for Options B and C; 50 V(MM) for Option A. 7.3 Recommended Operating Conditions MIN VDD NOM MAX UNIT 9 14 V HS –1 100 V HB VHS + 8 VHS + 14 HS slew rate −40 Junction temperature Copyright © 2006–2015, Texas Instruments Incorporated V/ns 125 °C Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C V < 50 5 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com 7.4 Thermal Information LM5100A, LM5100C, LM5101A LM5101C LM5101A SO PowerPAD MSOPPowerPAD (2) WSON (2) WSON (2) SOIC THERMAL METRIC (1) LM5100x, LM5101x UNIT 8 PINS 8 PINS 8 PINS 10 PINS 8 PINS RθJA Junction-to-ambient thermal resistance (3) 40 80 37.8 40 170 °C/W RθJC(top) Junction-to-case (top) thermal resistance — — 36.7 — — °C/W RθJB Junction-to-board thermal resistance — — 14.9 — — °C/W ψJT Junction-to-top characterization parameter — — 0.3 — — °C/W ψJB Junction-to-board characterization parameter — — 15.2 — — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — 4.4 — — °C/W (1) (2) (3) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4-layer board with Cu finished thickness 1.5, 1, 1, 1.5 oz. Maximum die size used. 5× body length of Cu trace on PCB top. 50-mm × 50-mm ground and power planes embedded in PCB. See Application Note AN-1187 (SNOA401). The RθJA is not a given constant for the package and depends on the printed circuit board design and the operating environment. 7.5 Electrical Characteristics unless otherwise specified, limits are for TJ = 25°C, VDD = VHB = 12 V, VSS = VHS = 0 V, no load on LO or HO PARAMETER TEST CONDITIONS MIN (1) TYP . MAX UNIT SUPPLY CURRENTS TJ = 25°C 0.1 VDD quiescent current, LM5100A/B/C LI = HI = 0 V VDD quiescent current, LM5101A/B/C LI = HI = 0 V IDDO VDD operating current f = 500 kHz IHB Total HB quiescent current LI = HI = 0 V IHBO Total HB operating current f = 500 kHz IHBS HB to VSS current, quiescent HS = HB = 100 V IHBSO HB to VSS current, operating f = 500 kHz VIL Input voltage threshold LM5100A/B/C Rising Edge VIL Input voltage threshold LM5101A/B/C Rising Edge VIHYS Input voltage hysteresis LM5100A/B/C 500 mV VIHYS Input voltage hysteresis LM5101A/B/C 50 mV RI Input pulldown resistance IDD TJ = –40°C to 125°C 0.2 TJ = 25°C 0.25 TJ = –40°C to 125°C 0.4 TJ = 25°C 2 TJ = –40°C to 125°C 3 TJ = 25°C 0.06 TJ = –40°C to 125°C 0.2 TJ = 25°C 1.6 TJ = –40°C to 125°C 3 TJ = 25°C 0.1 TJ = –40°C to 125°C 10 0.4 mA mA mA mA mA µA mA INPUT PINS (1) 6 TJ = 25°C 5.4 TJ = –40°C to 125°C 4.5 TJ = 25°C 1.8 TJ = –40°C to 125°C 1.3 TJ = 25°C TJ = –40°C to 125°C 6.3 2.3 200 100 400 V V kΩ Minimum and maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 Electrical Characteristics (continued) unless otherwise specified, limits are for TJ = 25°C, VDD = VHB = 12 V, VSS = VHS = 0 V, no load on LO or HO (1). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT UNDER VOLTAGE PROTECTION VDDR VDD rising threshold VDDH VDD threshold hysteresis VHBR HB rising threshold VHBH HB threshold hysteresis TJ = 25°C 6.9 TJ = –40°C to 125°C 6 7.4 0.5 TJ = 25°C V 6.6 TJ = –40°C to 125°C 5.7 V 7.1 0.4 V V BOOT STRAP DIODE VDL Low-current forward voltage IVDD-HB = 100 µA VDH High-current forward voltage IVDD-HB = 100 mA RD Dynamic resistance LM5100A/B/C, LM5101A/B/C IVDD-HB = 100 mA TJ = 25°C 0.52 TJ = –40°C to 125°C TJ = 25°C 0.85 0.8 TJ = –40°C to 125°C TJ = 25°C 1 1.0 TJ = –40°C to 125°C 1.65 V V Ω LO AND HO GATE DRIVER TJ = 25°C Low-level output voltage LM5100A/LM5101A VOL VOH Low-level output voltage LM5100B/LM5101B IHO = ILO = 100 mA TJ = 25°C TJ = 25°C 0.16 High-level output voltage LM5100A/LM5101A TJ = 25°C 0.28 0.65 0.24 TJ = –40°C to 125°C IHO = ILO = 100 mA VOH = VDD– LO or VOH = HB - HO TJ = 25°C 0.45 0.28 TJ = –40°C to 125°C TJ = 25°C 0.60 0.6 TJ = –40°C to 125°C Peak pullup current LM5100A/LM5101A IOLL 0.4 TJ = –40°C to 125°C High-level output voltage LM5100C/LM5101C IOHL 0.25 TJ = –40°C to 125°C Low-level output voltage LM5100C/LM5101C High-level output voltage LM5100B/LM5101B 0.12 TJ = –40°C to 125°C 1.10 V V V V V V 3 A 2 A Peak pullup current LM5100C/LM5101C 1 A Peak pulldown current LM5100A/LM5101A 3 A 2 A 1 A Peak pullup current LM5100B/LM5101B Peak pulldown current LM5100B/LM5101B HO, LO = 0 V HO, LO = 12 V TJ = 25°C TJ = 25°C Peak pulldown current LM5100C/LM5101C Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 7 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 7.6 www.ti.com Switching Characteristics Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of –40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise specified, VDD = VHB = 12 V, VSS = VHS = 0 V, No Load on LO or HO (1). PARAMETER tLPHL tLPLH tHPHL tHPLH tMON tMOFF tRC, tFC TYP MAX 20 45 ns 22 56 ns 20 45 ns 26 56 ns 20 45 ns 22 56 ns 20 45 ns 26 56 ns Delay matching: LO on and HO off LM5100A/B/C 1 10 ns Delay matching: LO on and HO off LM5101A/B/C 4 10 ns Delay matching: LO off and HO on LM5100A/B/C 1 10 ns Delay matching: LO on and HO off LM5101A/B/C 4 10 ns LO turnoff propagation delay LM5100A/B/C LO turnoff propagation delay LM5101A/B/C LO turnon propagation delay LM5100A/B/C LO turnon propagation delay LM5101A/B/C HO turnoff propagation delay LM5100A/B/C HO turnoff propagation delay LM5101A/B/C LO turnon propagation delay LM5100A/B/C LO turnon propagation delay LM5101A/B/C Either output rise and fall time TEST CONDITIONS LI Falling to LO Falling LI Rising to LO Rising tF HI Rising to HO Rising CL = 1000 pF 8 ns 430 ns 570 ns Output rise time (3 V to 9 V) LM5100C/LM5101C 990 ns Output fall time (3 V to 9 V) LM5100A/LM5101A 260 ns 430 ns 715 ns 50 ns 37 ns Output rise time (3 V to 9 V) LM5100B/LM5101B Output fall time (3 V to 9 V) LM5100B/LM5101B CL = 0.1 µF CL = 0.1 µF Output fall time (3 V to 9 V) LM5100C/LM5101C tPW Minimum input pulse width that changes the output tBS Bootstrap diode reverse recovery time (1) 8 UNIT HI Falling to HO Falling Output rise time (3 V to 9 V) LM5100A/LM5101A tR MIN IF = 100 mA, IR = 100 mA Minimum and maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 LI LI HI HI tHPLH tLPLH tHPHL tLPHL LO LO HO HO tMON tMOFF Figure 1. Timing Diagram Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 9 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com 7.7 Typical Characteristics 5.0 5.0 4.5 4.5 4.0 4.0 LM5100A/LM5101A 3.5 CURRENT (A) CURRENT (A) 3.5 3.0 2.5 2.0 LM5100B/LM5101B 1.5 1.0 2.5 2.0 LM5100B/LM5101B 1.5 1.0 LM5100C/LM5101C 0.5 0.0 LM5100A/LM5101A 3.0 0.0 7 8 9 10 11 12 13 14 LM5100C/LM5101C 0.5 15 7 8 9 10 11 VDD (V) 13 14 15 Figure 3. Peak Sinking Current vs VDD Figure 2. Peak Sourcing Current vs VDD 3.5 3.5 VDD = 12 V VDD = 12 V 3.0 3.0 LM5100A/LM5101A LM5100A/LM5101A 2.5 CURRENT (A) 2.5 CURRENT (A) 12 VDD (V) 2.0 LM5100B/LM5101B 1.5 2.0 LM5100B/LM5101B 1.5 1.0 1.0 LM5100C/LM5101C 0.0 LM5100C/LM5101C 0.5 0.5 0 2 4 8 6 10 0.0 12 0 OUTPUT VOLTAGE (V) Figure 4. Sink Current vs Output Voltage 100000 2 4 8 10 6 OUTPUT VOLTAGE (V) Figure 5. Source Current vs Output Voltage 100000 VDD = 12 V VDD = 12 V CL = 4400 pF CL = 4400 pF CURRENT (μA) CURRENT (μA) 10000 CL = 1000 pF 1000 100 10 0.1 10000 CL = 1000 pF 1000 CL = 0 pF 1 10 100 CL = 0 pF 1000 FREQUENCY (kHz) Figure 6. LM5100A/B/C IDD vs Frequency 10 12 Submit Documentation Feedback 100 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 7. LM5101A/B/C IDD vs Frequency Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 Typical Characteristics (continued) 100000 2.3 2.1 HB = 12 V, HS = 0 V IDDO (LM5101A/B/C) 1.9 IDDO (LM5100A/B/C) 1.7 CURRENT (PA) CURRENT (mA) CL = 4400 pF 10000 IHBO 1.5 1.3 CL = 1000 pF 1000 CL = 0 pF 100 1.1 0.9 0.7 -50 -25 0 25 50 75 10 0.1 100 125 150 1 TEMPERATURE ( oC) Figure 8. Operating Current vs Temperature 1000 350 350 300 IDD (LM5101A/B/C) 300 IDD (LM5101A/B/C) 250 CURRENT (μA) CURRENT (μA) 100 Figure 9. IHB vs Frequency 400 250 200 IDD (LM5100A/B/C) 150 200 150 100 100 IHB 50 0 10 FREQUENCY (kHz) IDD (LM5100A/B/C) 50 IHB 8 9 10 11 12 13 14 15 0 -50 -25 16 VDD, VHB (V) 0 25 50 75 100 125 150 TEMPERATURE (°C) Figure 10. Quiescent Current vs Supply Voltage Figure 11. Quiescent Current vs Temperature 7.30 0.60 7.20 0.55 7.00 HYSTERESIS (V) THRESHOLD (V) 7.10 VDDR 6.90 6.80 6.70 6.60 VDDH 0.50 0.45 VHBH 0.40 VHBR 6.50 0.35 6.40 6.30 -50 -25 0 25 50 75 100 125 150 TEMPERATURE (°C) Figure 12. Undervoltage Rising Thresholds vs Temperature Copyright © 2006–2015, Texas Instruments Incorporated 0.30 -50 0 25 TEMPERATURE ( oC) Figure 13. Undervoltage Threshold Hysteresis vs Temperature Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 11 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com Typical Characteristics (continued) 50 1.00E-01 THRESHOLD VOLTAGE (%VDD) T = 150°C 1.00E-02 ID (A) 1.00E-03 T = 25°C 1.00E-04 T = -40°C 1.00E-05 1.00E-06 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VD (V) Rising 47 46 45 44 Falling 43 42 41 0 25 50 75 100 125 150 TEMPERATURE (°C) Figure 15. LM5100A/B/C Input Threshold vs Temperature 1.92 50 1.90 THRESHOLD VOLTAGE (%VDD) 1.91 THRESHOLD VOLTAGE (V) 48 40 -50 -25 0.9 Figure 14. Bootstrap Diode Forward Voltage 49 Rising 1.89 1.88 1.87 1.86 Falling 1.85 1.84 1.83 1.82 1.81 1.80 -50 -25 0 25 50 49 48 46 45 44 43 TEMPERATURE (°C) Falling 42 41 40 75 100 125 150 Rising 47 8 9 10 11 12 13 14 15 16 VDD (V) Figure 17. LM5100A/B/C Input Threshold vs VDD Figure 16. LM5101A/B/C Input Threshold vs Temperature 35 1.92 1.90 Rising 1.89 30 1.88 DELAY (ns) THRESHOLD VOLTAGE (V) 1.91 1.87 1.86 1.85 Falling 1.84 25 T_PLH 20 1.83 1.82 T_PHL 1.81 1.80 8 9 10 11 12 13 14 15 16 VDD (V) Figure 18. LM5101A/B/C Input Threshold vs VDD 12 Submit Documentation Feedback 15 -50 -25 0 25 50 75 100 125 150 TEMPERATURE (°C) Figure 19. LM5100A/B/C Propagation Delay vs Temperature Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 Typical Characteristics (continued) 1.0 40 VDD = 12 V 0.9 0.8 35 LM5100C/LM5101C 30 VOH (V) DELAY (ns) 0.7 T_PLH 25 T_PHL 0.6 0.5 LM5100B/LM5101B 0.4 0.3 0.2 20 LM5100A/LM5101A 0.1 15 -50 -25 0 25 50 0.0 -50 -25 75 100 125 150 25 50 75 100 125 150 TEMPERATURE (°C) TEMPERATURE (°C) Figure 21. LO and HO Gate Drive - High Level Output Voltage vs Temperature Figure 20. LM5101A/B/C Propagation Delay vs Temperature 0.50 0 0.8 VDD = 12 V IOUT = -100 mA 0.45 0.7 0.40 0.6 LM5100C/LM5101C 0.30 0.25 VOH (V) VOL (V) 0.35 LM5100B/LM5101B 0.20 0.15 LM5100C/LM5101C 0.5 0.4 0.3 0.10 LM5100B/LM5101B LM5100A/LM5101A 0.05 0.2 0.00 -50 -25 0.1 LM5100A/LM5101A 0 25 50 75 100 125 150 7 8 TEMPERATURE (°C) 9 10 11 12 13 14 15 VDD (V) Figure 22. LO and HO Gate Drive - Low Level Output Voltage vs Temperature Figure 23. LO and HO Gate Drive - Output High Voltage vs VDD 0.35 IOUT = 100 mA VOL (V) 0.30 LM5100C/LM5101C 0.25 0.20 LM5100B/LM5101B 0.15 LM5100A/LM5101A 0.10 7 8 9 10 11 12 13 14 15 VDD (V) Figure 24. LO and HO Gate Drive - Output Low Voltage vs VDD Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 13 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com 8 Detailed Description 8.1 Overview The LM5100A/B/C and LM5101A/B/C are designed to drive both the high-side and the low-side N-channel FETs in a synchronous buck or a half-bridge configuration. The outputs are independently controlled with CMOS input thresholds(LM5101A/B/C) or TTL input thresholds(LM5101A/B/C). The floating high-side driver is capable of working with supply voltages up to 100 V. An integrated high voltage diode is provided to charge high side gate drive bootstrap capacitor. A robust level shifter operates at high speed while consuming low power and providing clean level transitions from the control logic to the high side gate driver. Under-voltage lockout is provided on both the low side and the high side power rails. 8.2 Functional Block Diagram HB UVLO LEVEL SHIFT DRIVER HO HS HI VDD UVLO LI DRIVER LO GND 8.3 Feature Description 8.3.1 Start-up and UVLO Both high and low-side drivers include under voltage lockout (UVLO) protection circuitry which monitors the supply voltage (VDD) and bootstrap capacitor voltage (VHB–HS) independently. The UVLO circuit inhibits each driver until sufficient supply voltage is available to turn on the external MOSFETs, and the built-in UVLO hysteresis prevents chattering during supply voltage transitions. When the supply voltage is applied to the VDD pin of the LM5100A/B/C and LM5101A/B/C, the outputs of the low-side and high-side are held low until VDD exceeds the UVLO threshold, typically about 6.6 V. Any UVLO condition on the bootstrap capacitor will disable only the high-side output (HO). 8.3.2 Level Shift The level shift circuit is the interface from the high-side input to the high-side driver stage which is referenced to the switch node (HS). The level shift allows control of the HO output referenced to the HS pin and provides excellent delay matching with the low-side driver. 14 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 Feature Description (continued) 8.3.3 Bootstrap Diode The bootstrap diode necessary to generate the high-side bias is included in the LM5100/1 family. The diode anode is connected to VDD and cathode connected to VHB. With the VHB capacitor connected to HB and the HS pins, the VHB capacitor charge is refreshed every switching cycle when HS transitions to ground. The boot diode provides fast recovery times, low diode resistance, and voltage rating margin to allow for efficient and reliable operation. 8.3.4 Output Stages The output stages are the interface to the power MOSFETs in the power train. High slew rate, low resistance, and high peak current capability of both output drivers allow for efficient switching of the power MOSFETs. The low-side output stage is referenced from VDD to VSS and the high-side is referenced from VHB to VHS. 8.4 Device Functional Modes The device operates in normal mode and UVLO mode. See Start-up and UVLO for more information on UVLO operation mode. In normal mode, the output stage is dependent on the states of the HI and LI pins. Table 1. Input/Output Logic Table LI HO (1) L L L L L H L H H L H L H H H H x (3) x L L HI (1) (2) (3) LO (2) HO is measured with respect to the HS. LO is measured with the respect to the VSS. x is floating condition Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 15 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information To affect fast switching of power devices and reduce associated switching power losses, a powerful gate driver is employed between the PWM output of controllers and the gates of the power semiconductor devices. Also, gate drivers are indispensable when it is impossible for the PWM controller to directly drive the gates of the switching devices. With the advent of digital power, this situation will be often encountered because the PWM signal from the digital controller is often a 3.3-V logic signal which cannot effectively turn on a power switch. Level shifting circuitry is needed to boost the 3.3-V signal to the gate-drive voltage (such as 12 V) in order to fully turn on the power device and minimize conduction losses. Traditional buffer drive circuits based on NPN/PNP bipolar transistors in totem-pole arrangement, being emitter follower configurations, prove inadequate with digital power because they lack level-shifting capability. Gate drivers effectively combine both the level-shifting and buffer-drive functions. Gate drivers also find other needs such as minimizing the effect of high-frequency switching noise by locating the high-current driver physically close to the power switch, driving gate-drive transformers and controlling floating power-device gates, reducing power dissipation and thermal stress in controllers by moving gate charge power losses from the controller into the driver. The LM5100A/B/C and LM5101A/B/C are the high voltage gate drivers that are designed to drive both the highside and low-side N-Channel MOSFETs in a half-bridge/full bridge configuration or in a synchronous buck circuit. The floating high side driver is capable of operating with supply voltages up to 100 V. This allows for N-Channel MOSFET control in half-bridge, full-bridge, push-pull, two switch forward and active clamp topologies. The outputs are independently controlled. Each channel is controlled by its respective input pins (HI and LI), allowing full and independent flexibility to control on and off state of the output. 9.2 Typical Application Optional external fast recovery diode VIN VCC RBOOT DBOOT HB RGATE HO VDD VDD CBOOT PWM Controller 0.1 µF HI OUT1 HS T1 LM5101A LI OUT2 LO RGATE 1.0 µF VSS Figure 25. LM5101A Driving MOSFETs in Half-Bridge Configuration 16 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 Typical Application (continued) 9.2.1 Design Requirements See Table 2 for the parameter and values. Table 2. Operating Parameters PARAMETER VALUE Gate Driver LM5101A MOSFET CSD18531Q5A VDD 10 V Qgmax 43 nC Fsw 100 kHz Dmax 95% IHBS 10 µA VDH 1.0 V VHBR 7.1 V VHBH 0.4 V 9.2.2 Detailed Design Procedure 9.2.2.1 Select Bootstrap and VDD capacitor The bootstrap capacitor must maintain the HB pin voltage above the UVLO voltage for the HB circuit in any circumstances during normal operation. Calculate the maximum allowable drop across the bootstrap capacitor with Equation 1. ΔVHB = VDD – VDH – VHBL= 10 V – 1.0 V – 6.7 V = 2.3 V where • • • VDD = Supply voltage of the gate drive IC VDH = Bootstrap diode forward voltage drop VHBL = VHBR – VHBH = 6.7 V, HB falling threshold (1) The quiescent current of the bootstrap circuit is 10 µA, which is negligible compared to the Qgs of the MOSFET (see Equation 2 and Equation 3). D 0.95 QTOTAL = Qgmax + IHBS   MAX = 43 nC + 10 µA  = 43.01nC FSW 100 kHz (2) CBOOT =   QTOTAL 43.01nC = =1   8.7 nF DVHB 2.3 V (3) In practice the value for the CBOOT capacitor should be greater than that calculated to allow for situations where the power stage may skip pulse due to load transients. It is recommended to place the bootstrap capacitor as close to the HB and HS pins as possible. CBOOT = 100 nF (4) As a general rule the local VDD bypass capacitor should be 10 times greater than the value of CBOOT. CVDD = 10 × CBOOT = 1 µF (5) The bootstrap and bias capacitors should be ceramic types with X7R dielectric. The voltage rating should be twice that of the maximum VDD to allow for loss of capacitance once the devices have a DC bias voltage across them and to ensure long-term reliability of the devices. Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 17 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com 9.2.2.2 Select External Bootstrap Diode and Resistor The bootstrap capacitor is charged by the VDD through the internal bootstrap diode every cycle when low side MOSFET turns on. The charging of the capacitor involves high peak currents, and therefore transient power dissipation in the internal bootstrap diode may be significant and dependent on its forward voltage drop. Both the diode conduction losses and reverse recovery losses contribute to the total losses in the gate driver and need to be considered in the gate driver IC power dissipation. For high frequency and high capacitive loads, it may be necessary to consider using an external bootstrap diode placed in parallel with internal bootstrap diode to reduce power dissipation of the driver. For the selection of external bootstrap diodes for LM510x device, please refer to the application note SNVA083. Bootstrap resistor RBOOT is selected to reduce the inrush current in DBOOT and limit the ramp up slew rate of voltage of HB-HS. It is recommended that RBOOT is between 2 Ω and 10 Ω. For this design, a current limiting resistor of 2.2 Ω is selected to limit inrush current of bootstrap diode. V - VDBOOT 10 V - 0.6 V IDBOOT(pk ) =   DD = =   4.27 A RBOOT 2.2 W (6) 9.2.2.3 Select Gate driver Resistor Resistor RGATE is sized to reduce ringing caused by parasitic inductances and capacitances and also to limit the current coming out of the gate driver. For this design 4.7-Ω resistors were selected for this design. Maximum HO and LO drive current are calculated by Equation 7 through Equation 10. V - VDH - VOH 10 V - 1.0 V - 0.45 V IHOH =   DD =  = 1.819 A RGATE 4.7 W (7) ILOH =   IHOL =   ILOL VDD - VOH 10 V - 0.45 V =  = 2.032 A RGATE 4.7 W (8) VDD - VDH - VOL 10 V - 1.0 V - 0.25 V =  = 1.862 A RGATE 4.7 W (9) V - VOH 10 V - 0.25 V =   DD =  = 2.074 A RGATE 4.7 W where • • • • • • IHOH = Maximum HO source current ILOH = Maximum LO source current IHOL = Maximum HO sink current ILOH = Maximum HO sink current VOH = High-Level output voltage drop across HB to HO or VDD to LO VOL = Low-Level output voltage drop across HO to HS or LO to GND (10) 9.2.2.4 Estimate the Driver Power Losses The total IC power dissipation is the sum of the gate driver losses and the bootstrap diode losses. The gate driver losses are related to the switching frequency (fsw), output load capacitance on LO and HO (CL), and supply voltage (VDD). The gate charge losses can be calculated by Equation 11. 2 PDGATES = 2 ´ VDD ´ CL ´ fsw There are some additional losses in the gate drivers due to HO outputs. The following plot shows the measured gate capacitance. At higher frequencies and load capacitance power losses driving the output loads and agrees well with the power losses due to the gate drivers. 18 Submit Documentation Feedback (11) the internal CMOS stages used to buffer the LO and driver power dissipation versus frequency and load values, the power dissipation is dominated by the Equation 11. Figure 26 can be used to approximate Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 1.000 POWER (W) CL = 4400 pF 0.100 CL = 1000 pF 0.010 CL = 0 pF 0.001 0.1 1.0 10.0 100.0 1000.0 SWITCHING FREQUENCY (kHz) Figure 26. Gate Driver Power Dissipation (LO + HO) VDD = 12 V, Neglecting Diode Losses The internal bootstrap diode power loss is the sum of the forward bias power loss that occurs while charging the bootstrap capacitor and the reverse bias power loss that occurs during reverse recovery. Since each of these events happens once per cycle, the diode power loss is proportional to frequency. Larger capacitive loads require more energy to recharge the bootstrap capacitor resulting in more losses. Higher input voltages (VIN) to the half bridge result in higher reverse recovery losses. The following plot was generated based on calculation and lab measurements of the diode recovery time and current under several operating conditions. This can be useful for approximating the internal diode power dissipation. If the diode losses can be significant, an external diode placed in parallel with the internal bootstrap diode can be helpful to reduce power dissipation within the IC. 0.100 POWER (W) CL = 4400 pF CL = 0 pF 0.010 0.001 1 10 100 1000 SWITCHING FREQUENCY (kHz) Figure 27. Diode Power Dissipation VIN = 50 V The total IC power dissipation can be estimated from the plots shown in Figure 26 and Figure 27 by summing the gate drive losses with the internal bootstrap diode losses for the intended application. For a given ambient temperature, the maximum allowable power loss of the IC can be defined as equation Equation 12. T - TA Ploss =   J RqJA where • • • • Ploss = The total power dissipation of the driver TJ = Junction temperature TA = Ambient temperature RθJA = Junction-to-ambient thermal resistance Copyright © 2006–2015, Texas Instruments Incorporated (12) Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 19 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com The thermal metrics for the driver package is summarized in the Thermal Information table. For detailed information regarding the thermal information table, refer to the Application Note from Texas Instruments entitled Semiconductor and IC Package Thermal Metrics SPRA953. 9.2.3 Application Curves Figure 28. HI/LI to HO/LO Turnon Propagation Delay Figure 29. HI/LI to HO/LO Turnoff Propagation Delay 10 Power Supply Recommendations The bias supply voltage range for which the device is rated to operate is from 9 V to 14 V. The lower end of this range is governed by the internal under voltage-lockout (UVLO) protection feature on the VDD pin supply circuit blocks. Whenever the driver is in UVLO condition when the VDD pin voltage is below the VDDR supply start threshold, this feature holds the output low, regardless of the status of the inputs. The upper end of this range is driven by the 18-V absolute maximum voltage rating of the VDD pin of the device (which is a stress rating). Keeping a 4-V margin to allow for transient voltage spikes, the maximum recommended voltage for the VDD pin is 14 V. The UVLO protection feature also involves a hysteresis function. This means that when the VDD pin bias voltage has exceeded the threshold voltage and device begins to operate, and if the voltage drops, then the device continues to deliver normal functionality unless the voltage drop exceeds the hysteresis specification VDDH. Therefore, ensuring that, while operating at or near the 9-V range, the voltage ripple on the auxiliary power supply output is smaller than the hysteresis specification of the device is important to avoid triggering device shutdown. During system shutdown, the device operation continues until the VDD pin voltage has dropped below the threshold (VDDR – VDDH), which must be accounted for while evaluating system shutdown timing design requirements. Likewise, at system start up, the device does not begin operation until the VDD pin voltage has exceeded above the VDDR threshold. The quiescent current consumed by the internal circuit blocks of the device is supplied through the VDD pin. Keep in mind that the charge for source current pulses delivered by the LO pin is also supplied through the same VDD pin. As a result, every time a current is sourced out of the LO pin a corresponding current pulse is delivered into the device through the VDD pin. Thus ensuring that a local bypass capacitor is provided between the VDD and GND pins and located as close as possible to the device for the purpose of decoupling is important. A low ESR, ceramic surface mount capacitor is necessary. TI recommends using two capacitors between VDD and GND: a 100-nF ceramic surface-mount capacitor that can be nudged very close to the pins of the device and another surface-mount capacitor in the range 0.22 µF to 10 µF added in parallel. In a similar manner, the current pulses delivered by the HO pin are sourced from the HB pin. Therefore, a 0.022-µF to 1-µF local decoupling capacitor is recommended between the HB and HS pins. 20 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C www.ti.com SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 11 Layout 11.1 Layout Guidelines The optimum performance of high and low-side gate drivers cannot be achieved without taking due considerations during circuit board layout. Following points are emphasized. 1. Low-ESR/ESL capacitors must be connected close to the IC, between VDD and VSS pins and between the HB and HS pins to support the high peak currents being drawn from VDD during turnon of the external MOSFET. 2. To prevent large voltage transients at the drain of the top MOSFET, a low ESR electrolytic capacitor must be connected between MOSFET drain and ground (VSS). 3. In order to avoid large negative transients on the switch node (HS pin), the parasitic inductances in the source of top MOSFET and in the drain of the bottom MOSFET (synchronous rectifier) must be minimized. 4. Grounding Considerations: – The first priority in designing grounding connections is to confine the high peak currents that charge and discharge the MOSFET gate into a minimal physical area. This will decrease the loop inductance and minimize noise issues on the gate terminal of the MOSFET. The MOSFETs should be placed as close as possible to the gate driver. – The second high current path includes the bootstrap capacitor, the bootstrap diode, the local ground referenced bypass capacitor and low-side MOSFET body diode. The bootstrap capacitor is recharged on a cycle-by-cycle basis through the bootstrap diode from the ground referenced VDD bypass capacitor. The recharging occurs in a short time interval and involves high peak current. Minimizing this loop length and area on the circuit board is important to ensure reliable operation. A recommended layout pattern for the driver is shown in Figure 30. If possible a single layer placement is preferred. 11.2 Layout Example Recommended Layout for Driver IC and Passives VDD LO HB VSS SO PowerPAD-8 LI HS HI D LO N To Hi-Side FET Multi Layer Option G HO HS HO Single Layer Option HO To Low-Side FET Figure 30. PCB Layout Recommendation Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C 21 LM5100A, LM5100B, LM5100C LM5101A, LM5101B, LM5101C SNOSAW2Q – SEPTEMBER 2006 – REVISED NOVEMBER 2015 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation For related documentation, see the following: • AN-1187 Leadless Leadframe Package (LLP) (SNOA401) • AN-1317 Selection of External Bootstrap Diode for LM510X Devices (SNVA083) • Semiconductor and IC Package Thermal Metrics (SPRA953) 12.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM5100A Click here Click here Click here Click here Click here LM5100B Click here Click here Click here Click here Click here LM5100C Click here Click here Click here Click here Click here LM5101A Click here Click here Click here Click here Click here LM5101B Click here Click here Click here Click here Click here LM5101C Click here Click here Click here Click here Click here 12.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.4 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.5 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 22 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LM5100A LM5100B LM5100C LM5101A LM5101B LM5101C PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM5100AM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L5100 AM LM5100AMR/NOPB ACTIVE SO PowerPAD DDA 8 95 RoHS & Green SN Level-3-260C-168 HR L5100 AMR LM5100AMRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green Call TI | SN Level-3-260C-168 HR L5100 AMR LM5100AMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L5100 AM LM5100ASD/NOPB ACTIVE WSON DPR 10 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5100ASD LM5100BMA/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L5100 BMA LM5100BMAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L5100 BMA LM5100BSD/NOPB ACTIVE WSON DPR 10 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5100BSD LM5100CMAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L5100 CMA LM5101AM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L5101 AM LM5101AMR/NOPB ACTIVE SO PowerPAD DDA 8 95 RoHS & Green SN Level-3-260C-168 HR L5101 AMR LM5101AMRX/NOPB ACTIVE SO PowerPAD DDA 8 2500 RoHS & Green SN Level-3-260C-168 HR L5101 AMR LM5101AMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L5101 AM LM5101ASD NRND WSON DPR 10 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 125 5101ASD LM5101ASD-1/NOPB ACTIVE WSON NGT 8 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM LM5101ASD/NOPB ACTIVE WSON DPR 10 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 5101ASD LM5101ASDX NRND WSON DPR 10 4500 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 125 5101ASD Addendum-Page 1 5101A-1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 30-Sep-2021 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM5101ASDX-1/NOPB ACTIVE WSON NGT 8 4500 RoHS & Green SN Level-1-260C-UNLIM 5101A-1 LM5101ASDX/NOPB ACTIVE WSON DPR 10 4500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 5101ASD LM5101BMA/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 L5101 BMA LM5101BMAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 L5101 BMA LM5101BSD/NOPB ACTIVE WSON DPR 10 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 5101BSD LM5101BSDX/NOPB ACTIVE WSON DPR 10 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 5101BSD LM5101CMA/NOPB ACTIVE SOIC D 8 95 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 L5101 CMA LM5101CMAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green Call TI | SN Level-1-260C-UNLIM -40 to 125 L5101 CMA LM5101CMY/NOPB ACTIVE HVSSOP DGN 8 1000 RoHS & Green SN Level-1-260C-UNLIM SXDB LM5101CMYE/NOPB ACTIVE HVSSOP DGN 8 250 RoHS & Green SN Level-1-260C-UNLIM SXDB LM5101CMYX/NOPB ACTIVE HVSSOP DGN 8 3500 RoHS & Green SN Level-1-260C-UNLIM SXDB LM5101CSD/NOPB ACTIVE WSON DPR 10 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 5101CSD (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of