User's Guide
SNVA070B – May 2004 – Revised April 2013
AN-1292 LM5642 Evaluation Board
1
Introduction
The LM5642 IC is a dual channel, current-mode, synchronous buck converter controller. It can handle
input voltages of up to 36V and delivers two independent output voltages from 1.23V up to 90% of the
input voltage. Current sensing can be done using a dedicated resistor or using the RDS(ON) of the high-side
FET. This application note describes the dedicated evaluation PCBs that are available for both methods.
2
Resistor Sense PCB
The first, more common method of sensing current in current-mode controllers is with an external sense
resistor, placed in series with the high-side FET of each channel. Sense resistors provide an accurate
voltage as the load current passes through them, and have stable, linear resistance change with
temperature. As shipped the Resistor Sense PCB is designed to deliver 1.8V on Channel 1 at a maximum
current of 7A, and 3.3V on Channel 2 at a maximum current of 4A. The input voltage can vary anywhere
from 5.5 to 36V. The board has been designed to be flexible and allow many other circuit configurations
by replacing the original components with user selected ones. Figure 1 shows the circuit diagram
representing the standard BOM that comes with the PCB. Table 1 lists all the components that are used
for this standard configuration BOM. Figure 2 shows the complete circuit diagram with all extra footprints.
Two SPST switches, S1 and S2, are provided to turn the two channels of the converter on and off. The
standard BOM that comes with the LM5642 Resistor Sense evaluation board uses 10mΩ current sense
resistors (R7 for Channel 1 and R15 for Channel 2) to provide independent feedback signals to the IC.
The board provides additional resistor and capacitor footprints for noise filtering, ringing control, and to
enable operation at low input voltages.
3
Current Sense Filters
R-C filters have been added to the current sense amplifier inputs of the Resistor Sense evaluation board,
comprised of components C3, C4, C14, C15, R2, R6, and R16. These resistors and capacitors reduce the
sensitivity to switching noise, especially during high currents, load-transients, and circuits with short ontimes.
4
Parallel Operation
The two channels of the LM5642 Resistor Sense evaluation board can be paralleled to provide one high
current rail. At the nominal switching frequency of 200kHz the converter will run 180° out-of-phase. Care
must be taken when using this feature combined with the frequency synchronization, as the two channels
of the converter are no longer 180° out-of-phase when the frequency is above or below 200kHz. The two
feedback inputs FB1 and FB2 should be tied together by soldering a 0Ω resistor in the position marked J1
on the bottom side of the PCB. The two COMP pins should be tied together by soldering a 0Ω resistor in
the position J3. The ON/SS1 and ON/SS2 pins must also be connected using a 0Ω resistor in the position
J2. One of the two SPDT switches S1 and S2 should be left ‘ON’ and the other used to turn the converter
off and on. Finally, the two outputs VO1 and VO2 must be tied together by the user, external to the PCB.
Only one of the two resistor divider networks (R10/R11 or R19/R20) and only one of the compensation
networks should be used (C18/C19/R22/R23 or C20/C21R24/R25).
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VDS Sense PCB
5
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VDS Sense PCB
The LM5642 IC offers a second current sensing mechanism that uses the RDS(ON) of the high-side FET to
sense the load current. This method reduces the parts count on the BOM, however the RDS(ON) of a FET is
not as tightly controlled as a sense resistor, and suffers from non-linear changes in resistance with
temperature. As a result, the IC is more sensitive to noise in this mode, especially at input voltages above
30V. The maximum recommended current using VDS sensing is 5A per channel. The VDS Sense board
has been designed to deliver 1.8V on Channel 1 with a maximum current of 5A, and 3.3V on Channel 2
with a maximum current of 4A. Figure 3 shows the circuit diagram representing the standard BOM that
comes with the PCB. Table 2 lists all the components that are used for this standard configuration BOM.
Figure 4 shows the complete circuit diagram with all extra footprints.
6
Frequency Synchronization
A connection point labeled ‘SYNC’ is available on both versions of the LM5642 evaluation boards in order
to adjust the switching frequency of the IC between 150 and 250kHz. Both CMOS and TTL level square
wave signals can be used. The SYNC input has a minimum low-to-high transition threshold of 2.0V and a
maximum high-to-low threshold of 0.8V. The SYNC pin is grounded by a 220kΩ pull-down resistor.
7
Low Input Voltage Operation
When the input voltage is between 4.5V and 5.5 on either evaluation board, a 4.7Ω resistor should be
installed in position R26. This will ensure than VLIN5 does not fall below the UVLO threshold of the IC.
When R26 is in place the input voltage must not exceed 5.5V.
8
Gate Drive Current Limiting
The LM25642 IC includes powerful gate drivers which can drive small FETs at high speed, often inducing
noise or ringing into the board. Slowing the gate drivers can help reduce this noise by increasing the drain
current transition time. While slowing the gate drives can help suppress noise, it also increases switching
losses and gate-charge losses in the top FET. Slowing of the gate drives can be accomplished with
resistors in series with the CBOOT1 and CBOOT2 pins. (R9,R18) Placing resistors in series with the
CBOOT pins will slow the top FET rise time only. Generally the values for gate drive limiting resistors are
between 1 and 5Ω. R9 and R18 are 0Ω by default.
9
Parallel Low-Side Schottky Diode
The LM5642 evaluation boards include footprints for Schottky diodes D4 and D5 (SMB footprint or
smaller) in parallel to the low side FETs. Placing these diodes on the PCB can improve efficiency because
Schottky diodes have a lower forward voltage drop and lower reverse recovery charge than the parasitic
diode of the bottom FET.
10
Parallel Low-Side FET
Footprints Q3 and Q6 have been placed on both boards so that two SO-8 N-FETs can be placed in
parallel for the low-side of each channel. Paralleling FETs reduces the RDS(ON) of the system and spreads
the heat dissipated by the load current over two packages. This is especially important for converters with
high input voltage and low output voltage, where the low duty cycle forces the low side FET or FETs to
carry the load current for a much greater percentage than the high-side FET.
11
Additional Footprints
Additional footprints are provided to add more surface mount or through-hole capacitors (with 3.5 or 5mm
lead spacing) in parallel to the input and output capacitors.
2
AN-1292 LM5642 Evaluation Board
SNVA070B – May 2004 – Revised April 2013
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C2 10 nF
VIN
22
C1
VIN
ILIM1
KS1
1 PF
RSNS1
6
C34
UV_DELAY
100
nF
HDRV1
CBOOT1
SYNC
5
SYNC
SW1
R28
220
k:
9
S1
C11
ON/SS1
LDRV1
PGND
10 nF
FB1
10
S2
C12
24
VDD
19
R27
7
4.7 :
C27
C26
1 PF
4.7
PF
3
C19
8.2 nF
C20
R23
8.45
k:
R24
12
VDD1
ILIM2
KS2
VDD2
RSNS2
C4 100 pF
R6
26
25
27
C7
COMP1
COMP2
HDRV2
CBOOT2
SW2
LDRV2
SGND
FB2
VIN
R2 100 :
12 k:
Q1
100 :
D3A BAT54A
VDD
R7
C29
10
m:
1 PF
50V
L1
100 nF
23
R10
R11
2.26
k:
C13 10 nF C14 100 pF
R13
C16 100 pF
17
18
16 C25
20
11
C9
330 PF
6.3V
10 m:
VIN
R14 100 :
6.8 k:
14
15
+
4.99 k:
4
13
10 PF
50V
2.8Arms
Vo1 = 1.8V, 7A
4.2 P+
7 m:
Si4840DY
21
C6
Si4850EY
Q2
VLIN5
15 nF
13.7
k:
8
28
ON/SS2
10 nF
R1
2
1
C3 100 pF
R16
Q4
100 :
D3B BAT54A
VDD
100 nF
Q5
Si4840DY
R15
C31
10
m:
1 PF
50V
C6
10 PF
50V
2.8Arms
Si4850EY
L2
Vo2 = 3.3V, 4A
10 PH
12 m:
R19
R20
2.26
k:
+
C23
330 PF
6.3V
10 m:
4.99 k:
Figure 1. Standard Resistor Sense Circuit
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Additional Footprints
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Table 1. Standard Resistor Sense Bill of Materials
4
ID
Part Number
Type
Size
U1
LM5642
Dual Synchronous
Controller
TSSOP-28
Q1, Q4
Si4850EY
N-MOSFET
SO-8
Q2, Q5
Si4840DY
N-MOSFET
D3
BAT54A
Schottky Diode
L1
RLF12560T4R2N100
L2
Parameters
Qty
Vendor
1
Texas
Instruments
60V
2
Vishay
SO-8
40V
2
Vishay
SOT-23
30V
1
ON
Inductor
12.5 x 12.5 x 6mm
4.2µH, 7mΩ, 10A
1
TDK
RLF12545T100M5R1
Inductor
12.5 x 12.5 x
4.5mm
10µH, 12mΩ, 5.1A
1
TDK
C1, C29, C31
C3216X7R1H105K
Capacitor
1206
1µF, 50V
3
TDK
C3, C4, C14,
C15
VJ1206Y101KXXAT Capacitor
1206
100pF, 25V
3
Vishay
C27
C2012X5R1C105K
Capacitor
0805
1µF, 16V
1
TDK
C6, C16
C5750X5R1H106M
Capacitor
2220
10µF, 50V, 2.8A
2
TDK
C9, C23
6TPD330M
Capacitor
7.3 x 4.3 x 3.8mm
330µF, 6.3V, 10mΩ
2
Sanyo
C2, C11, C12,
C13
VJ1206Y103KXXAT Capacitor
1206
10nF, 25V
4
Vishay
C7, C25, C34
VJ1206Y104KXXAT Capacitor
1206
100nF, 25V
3
Vishay
C19
VJ1206Y822KXXAT Capacitor
1206
8.2nF, 10%
1
Vishay
C20
VJ1206Y153KXXAT Capacitor
1206
15nF, 10%
1
Vishay
C26
C3216X7R1C475K
Capacitor
1206
4.7µF, 25V
1
TDK
R1
CRCW1206123J
Resistor
1206
12kΩ, 5%
1
Vishay
R2, R6, R14,
R16
CRCW1206100J
Resistor
1206
100Ω, 5%
1
Vishay
R13
CRCW1206682J
Resistor
1206
6.8kΩ, 12%
1
Vishay
R7, R15
WSL-2512 .010 1%
Resistor
2512
10mΩ, 1W
2
Vishay
R18, R9
CRCW1206000Z
Resistor
1206
0Ω
2
Vishay
R10
CRCW12062261F
Resistor
1206
2.26kΩ, 1%
1
Vishay
R23
CRCW12068451F
Resistor
1206
8.45kΩ, 1%
1
Vishay
R24
CRCW12061372F
Resistor
1206
13.7kΩ, 1%
1
Vishay
R11, R20
CRCW12064991F
Resistor
1206
4.99kΩ, 1%
2
Vishay
R19
CRCW12068251F
Resistor
1206
8.25kΩ, 1%
1
Vishay
R27
CRCW12064R7J
Resistor
1206
4.7Ω, 5%
1
Vishay
R28
CRCW1206224J
Resistor
1206
220kΩ, 5%
1
Vishay
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VIN
+ C6
+ C16
+ C28
+ C30
C1
C2
C3
VIN
22
6
VLIN5
UV-DLY
C34
VIN
ILIM1
KS1
RSNS1
R1
2
R2
1
R7
C29
R6
28
C4
5
SYNC
R28
SYNC/PGOOD
HDRV1
9
ON/SS1
SW1
CBOOT1
10
ON/SS2
C12
S2
LDRV1
FB1
3
25
C8
+
C10
Q2 and
Q3
21
4
C14
VIN
ILIM2
KS2
RSNS2
R13
13
R14
14
R15
C31
R16
15
C15
VIN
J1
17
R26
12
HDRV2
COMP2
SW2
7
VDD
L2
16
C25
VLIN5
CBOOT2
24
19
18
LDRV2
R19
VDD
C22
+
C23
+
C24
D5
20
R20
Q5 and
Q6
C27
8
R18
VDD1
VDD2
Vo2
Q4
C21
C26
C9
R11
C13
R23
R27
+
D4
23
C19
R25
R10
VDD
R9
COMP1
J3
R24
L1
27
D3A
PGND
C20
Vo1
C7
J2
R22
Q1
C11
S1
C18
26
SGND
FB2
11
Figure 2. Complete Resistor Sense Evaluation Board Schematic
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Additional Footprints
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C2 10 nF
VIN
22
C1
VIN
ILIM1
KS1
1 PF
HDRV1
6
C34
UV_DELAY
100
nF
SYNC
5
RSNS1
CBOOT1
SW1
9
S1
C11
ON/SS1
LDRV1
PGND
10 nF
FB1
10
S2
C12
10 nF
24
VDD
19
R27
7
4.7 :
C27
C26
1 PF
4.7
PF
3
C19
8.2 nF
C20
R23
8.45
k:
R24
12
D3A
25
BAT54A
VDD
C7
100 nF
VDD1
Q2
23
Si4840DY
21
KS2
L1
4.2 PH
7 m:
R10
R11
2.26
k:
HDRV2
COMP1
RSNS2
COMP2
CBOOT2
14
22 k:
SGND
FB2
11
10 PF
50V
2.8Arms
Si4850EY
D3B
BAT54A
VDD
100 nF
SW2
LDRV2
1 PF
50V
Q4
15
18
C16
C31
17
20
330 PF
6.3V
10 m:
R13
16 C25
13.7
k:
C9
+
VIN
VDD2
VLIN5
Vo1 = 1.8V, 5A
4.99 k:
4
13
10 PF
50V
2.8Arms
Si4850EY
C13 10 nF
ILIM2
1 PF
50V
Q1
28
27
C6
C29
26
ON/SS2
15 nF
8
33 k:
SYNC
R28
220 k:
R1
2
1
VIN
Q5
Si4840DY
L2
Vo2 = 3.3V, 4A
10 PH
12 m:
R19
R20
2.26
k:
+
C23
330 PF
6.3V
10 m:
4.99 k:
Figure 3. Standard VDS Sense Circuit
6
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Table 2. Standard VDS Sense Bill of Materials
ID
Part Number
Type
Size
U1
LM5642
Dual Synchronous
Controller
TSSOP-28
Q1, Q4
Si4850EY
N-MOSFET
SO-8
Q2, Q5
Si4840DY
N-MOSFET
D3
BAT54A
Schottky Diode
L1
RLF12560T4R2N100
L2
Parameters
Qty
Vendor
1
Texas
Instruments
60V
2
Vishay
SO-8
40V
2
Vishay
SOT-23
30V
1
ON
Inductor
12.5 x 12.5 x 6mm
4.2µH, 7mΩ, 10A
1
TDK
RLF12545T100M5R1
Inductor
12.5 x 12.5 x
4.5mm
10µH, 12mΩ, 5.1A
1
TDK
C1, C29, C31
C3216X7R1H105K
Capacitor
1206
1µF, 50V
1
TDK
C27
C2012X5R1C105K
Capacitor
0805
1µF, 16V
1
TDK
C6, C16
C5750X5R1H106M
Capacitor
2220
10µF, 50V, 2.8A
2
TDK
C9, C23
6TPD330M
Capacitor
7.3 x 4.3 x 3.8mm
330µF, 6.3V, 10mΩ
2
Sanyo
C2, C11, C12,
C13
VJ1206Y103KXXAT Capacitor
1206
10nF, 25V
4
Vishay
C7, C25, C34
VJ1206Y104KXXAT Capacitor
1206
100nF, 25V
3
Vishay
C19
VJ1206Y822KXXAT Capacitor
1206
8.2nF, 10%
1
Vishay
C20
VJ1206Y153KXXAT Capacitor
1206
15nF, 10%
1
Vishay
C26
C3216X7R1C475K
Capacitor
1206
4.7µF, 25V
1
TDK
R1
CRCW1206333J
Resistor
1206
33kΩ, 5%
1
Vishay
R13
CRCW1206223J
Resistor
1206
22kΩ, 5%
1
Vishay
R10
CRCW12062261F
Resistor
1206
2.26kΩ, 1%
1
Vishay
R23
CRCW12068451F
Resistor
1206
8.45kΩ, 1%
1
Vishay
R24
CRCW12061372F
Resistor
1206
13.7kΩ, 1%
1
Vishay
R11, R20
CRCW12064991F
Resistor
1206
4.99kΩ, 1%
2
Vishay
R19
CRCW12068251F
Resistor
1206
8.25kΩ, 1%
1
Vishay
R27
CRCW12064R7J
Resistor
1206
4.7Ω, 5%
1
Vishay
R28
CRCW1206224J
Resistor
1206
220kΩ, 5%
1
Vishay
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Additional Footprints
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VIN
+ C6
+ C16 + C28
+ C30
C1
C2
VIN
22
6
VLIN5
UV-DLY
VIN
ILIM1
C34
R1
2
1
C29
KS1
5
SYNC
R28
SYNC/PGOOD
26
Q1
RSNS1 28
9
S1
HDRV1
ON/SS1
Vo1
L1
SW1 27
C11
C7
CBOOT1
10
S2
ON/SS2
25
R9
VDD
C8 + C9 + C10
D3A
LDRV1
R10
D4
23
R11
C12
Q2 and Q3
PGND
FB1
3
C18
4
C13
COMP1
VIN
C19
ILIM2
R22
21
R23
KS2
R13
13
C31
14
VIN
HDRV2
R26
12
RSNS2
COMP2
SW2
C20
R24
C21
7 VLIN5
VDD
17
Q4
15
Vo2
L2
27
C25
CBOOT2
18
R18
VDD
24 V
DD1
R25
R27
C26
19 V
DD2
C27
LDRV2
8 SGND
FB2
R19
C22
+
C23
+
C24
D5
20
Q5 and
Q6
R20
11
Figure 4. Complete VDS Sense Eval Board Schematic
8
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Figure 5. Resistor Sense PCB Top Layer
Figure 6. Resistor Sense PCB Bottom Layer
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Figure 7. Resistor Sense PCB Internal Planes
Figure 8. VDS Sense PCB Top Layer
10
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Figure 9. VDS Sense PCB Bottom Layer
Figure 10. VDS Sense PCB Internal Planes
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non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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