LM56BIM/NOPB

LM56 www.ti.com SNIS120G – APRIL 2000 – REVISED FEBRUARY 2013 LM56 Dual Output Low Power Thermostat Check for Samples: LM56 FEATURES DESCRIPTION • • • • • The LM56 is a precision low power thermostat. Two stable temperature trip points (VT1 and VT2) are generated by dividing down the LM56 1.250V bandgap voltage reference using 3 external resistors. The LM56 has two digital outputs. OUT1 goes LOW when the temperature exceeds T1 and goes HIGH when the the temperature goes below (T1–THYST). Similarly, OUT2 goes LOW when the temperature exceeds T2 and goes HIGH when the temperature goes below (T2–THYST). THYST is an internally set 5°C typical hysteresis. 1 2 Digital Outputs Support TTL Logic Levels Internal Temperature Sensor 2 Internal Comparators with Hysteresis Internal Voltage Reference Available in 8-pin SOIC and VSSOP Packages APPLICATIONS • • • • • • • • Microprocessor Thermal Management Appliances Portable Battery Powered 3.0V or 5V Systems Fan Control Industrial Process Control HVAC Systems Remote Temperature Sensing Electronic System Protection The LM56 is available in an 8-lead VSSOP surface mount package and an 8-lead SOIC. Table 1. Key Specifications VALUE UNIT Power Supply Voltage 2.7V–10 V Power Supply Current 230 μA (max) 1.250 V ±1% (max) 5 °C (+6.20 mV/°C x T) + 395 mV mV VREF Hysteresis Temperature Internal Temperature Sensor Output Voltage Table 2. Temperature Trip Point Accuracy LM56BIM LM56CIM +25°C ±2°C (max) ±3°C (max) +25°C to +85°C ±2°C (max) ±3°C (max) −40°C to +125°C ±3°C (max) ±4°C (max) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM56 SNIS120G – APRIL 2000 – REVISED FEBRUARY 2013 www.ti.com Simplified Block Diagram and Connection Diagram Block Diagram Typical Application VT1 = 1.250V x (R1)/(R1 + R2 + R3) VT2 = 1.250V x (R1 + R2)/(R1 + R2 + R3) where: (R1 + R2 + R3) = 27 kΩ and VT1 or T2 = [6.20 mV/°C x T] + 395 mV therefore: R1 = VT1/(1.25V) x 27 kΩ R2 = (VT2/(1.25V) x 27 kΩ) − R1 R3 = 27 kΩ − R1 − R2 Figure 1. Microprocessor Thermal Management These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM56 LM56 www.ti.com SNIS120G – APRIL 2000 – REVISED FEBRUARY 2013 Absolute Maximum Ratings (1) Input Voltage 12V Input Current at any pin (2) 5 mA Package Input Current (2) 20 mA Package Dissipation at TA = 25°C (3) 900 mW Human Body Model - Pin 3 Only 800V All other pins ESD Susceptibility (4) 1000V Machine Model 125V −65°C to + 150°C Storage Temperature (1) (2) (3) (4) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the LM56 Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 125°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow: The human body model is a 100 pF capacitor discharge through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Ratings (1) (2) (3) TMIN ≤ TA ≤ TMAX Operating Temperature Range −40°C ≤ TA ≤ +125°C LM56BIM, LM56CIM Positive Supply Voltage (V+) +2.7V to +10V Maximum VOUT1 and VOUT2 (1) (2) (3) +10V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the LM56 Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages. Package Type θJA D0008A 110°C/W DGK0008A 250°C/W Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM56 3 LM56 SNIS120G – APRIL 2000 – REVISED FEBRUARY 2013 www.ti.com LM56 Electrical Characteristics The following specifications apply for V+ = 2.7 VDC, and VREF load current = 50 μA unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified. Symbol Parameter Conditions Typical (1) LM56BIM Limits (2) LM56CIM Limits (2) Units (Limits) Temperature Sensor Trip Point Accuracy (Includes VREF, Comparator Offset, and Temperature Sensitivity errors) Trip Point Hysteresis ±2 ±3 °C (max) +25°C ≤ TA ≤ +85°C ±2 ±3 °C (max) −40°C ≤ TA ≤ +125°C ±3 ±4 °C (max) 3 3 °C (min) 6 6 °C (max) 3.5 3.5 °C (min) 6.5 6.5 °C (max) 4.5 4.5 °C (min) 7.5 7.5 °C (max) 4 4 °C (min) 8 8 °C (max) ±2 ±3 °C (max) ±3 ±4 °C (max) 1500 1500 TA = −40°C 4 TA = +25°C 5 TA = +85°C 6 TA = +125°C Internal Temperature Sensitivity 6 +6.20 mV/°C Temperature Sensitivity Error Output Impedance −1 μA ≤ IL ≤ +40 μA Line Regulation +3.0V ≤ V+ ≤ +10V, +25 °C ≤ TA ≤ +85 °C –0.72/+0.3 –0.72/+0.3 6 6 mV/V (max) +3.0V ≤ V+ ≤ +10V, −40 °C ≤ TA