LM61CIM3

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 LM61 2.7-V, SOT-23 or TO-92 Temperature Sensor 1 Features 3 Description • • The LM61 device is a precision, integrated-circuit temperature sensor that can sense a –30°C to 100°C temperature range while operating from a single 2.7‑V supply. The output voltage of the LM61 is linearly proportional to temperature (10 mV/°C) and has a DC offset of 600 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the LM61 ranges from 300 mV to 1600 mV for a –30°C to 100°C temperature range. The LM61 is calibrated to provide accuracies of ±2°C at room temperature and ±3°C over the full –25°C to 85°C temperature range. 1 • • • • • • • • • • Calibrated Linear Scale Factor of 10 mV/°C Rated for Full Temperature Range (–30° to 100°C) Suitable for Remote Applications UL Recognized Component ±2°C or ±3°C Accuracy at 25°C (Maximum) ±3°C Accuracy for –25°C to 85°C (Maximum) ±4°C Accuracy for –30°C to 100°C (Maximum) 10 mV/°C Temperature Slope (Maximum) 2.7-V to 10-V Power Supply Voltage Range 125-µA Current Drain at 25°C (Maximum) ±0.8°C Nonlinearity (Maximum) 800-Ω Output Impedance (Maximum) 2 Applications • • • • • • • • • Cellular Phones Computers Power Supply Modules Battery Management FAX Machines Printers HVAC Disk Drives Appliances The linear output of the LM61, 600-mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the quiescent current is less than 125 µA, self-heating is limited to a very low 0.2°C in still air. Shutdown capability for the LM61 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. Device Information(1) PART NUMBER PACKAGE LM61 BODY SIZE (NOM) SOT-23 (3) 1.30 mm × 2.92 mm TO-92 (3) 4.30 mm × 4.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Key Specifications Typical Application VALUE Accuracy at 25°C ±2°C or ±3°C Accuracy for –25°C to 85°C ±3°C Accuracy for –30°C to 100°C ±4°C Temperature slope 10 mV/°C Power supply voltage 2.7 V to 10 V Current drain at 25°C 125 µA Nonlinearity ±0.8°C Output impedance 800 Ω VO = (10 mV/°C × T°C) + 600 mV 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 3 3 3 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 7.1 7.2 7.3 7.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 7 7 7 7 8 Application and Implementation .......................... 8 8.1 Application Information.............................................. 8 8.2 Typical Applications .................................................. 8 9 Power Supply Recommendations...................... 11 10 Layout................................................................... 11 10.1 Layout Guidelines ................................................. 11 10.2 Layout Examples................................................... 11 10.3 Thermal Considerations ........................................ 12 11 Device and Documentation Support ................. 14 11.1 11.2 11.3 11.4 11.5 11.6 Related Documentation......................................... Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 14 14 14 14 14 14 12 Mechanical, Packaging, and Orderable Information ........................................................... 14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision I (February 2013) to Revision J Page • Added Device Information table, Device Comparison Table, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...................................................................................................................... 1 • Added Thermal Information table ........................................................................................................................................... 4 • Changed RθJA values for DBZ (SOT-23) From: 450°C/W To: 286.3°C/W and for LP (TO-92) From: 180°C/W To: 162.2°C/W .............................................................................................................................................................................. 4 Changes from Revision H (February 2013) to Revision I • 2 Page Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 1 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 5 Pin Configuration and Functions DBZ Package 3-Pin SOT-23 Top View LP Package 3-Pin TO-92 Pin Functions PIN NAME TYPE NO. DESCRIPTION +VS 1 Power Positive power supply pin. VOUT 2 Output Temperature sensor analog output. GND 3 Ground Device ground pin, connected to power supply negative terminal. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 12 –0.2 V Output voltage (+VS + 0.6) –0.6 V 10 mA Output current Input current at any pin (2) Maximum junction temperature, TJ Storage temperature, Tstg (1) (2) –65 5 mA 125 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > VS), the current at that pin must be limited to 5 mA. 6.2 ESD Ratings VALUE V(ESD) (1) (2) (3) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) ±2500 Machine Model (MM) (3) ±250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin. 6.3 Recommended Operating Conditions +VS Supply voltage T Operating temperature MIN MAX 2 10 LM61C –30 100 LM61B –25 85 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 UNIT V °C 3 LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com 6.4 Thermal Information LM61 THERMAL METRIC (1) DBZ (SOT-23) LP (TO-92) 3 PINS 3 PINS UNIT 286.3 162.2 °C/W RθJA Junction-to-ambient thermal resistance (2) RθJC(top) Junction-to-case (top) thermal resistance 96 85 °C/W RθJB Junction-to-board thermal resistance 57.1 — °C/W ψJT Junction-to-top characterization parameter 5.3 29.2 °C/W ψJB Junction-to-board characterization parameter 55.8 141.4 °C/W (1) (2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. The junction-to-ambient thermal resistance is specified without a heat sink in still air. 6.5 Electrical Characteristics +VS = 3 V (DC) (1) (2) PARAMETER TEST CONDITIONS TA = 25°C Accuracy (5) MIN (3) Sensor gain (average slope) Output impedance –2 2 LM61C –3 3 LM61B –3 3 LM61C –4 –0.6 0.6 LM61C –0.8 0.8 LM61B 9.7 10 10.3 LM61C 9.6 10 10.4 +VS = 3 V to 10 V 0.8 TA = –30°C to 85°C, +VS = 2.7 V 2.3 4 5 mV/V +VS = 2.7 V to 3.3 V –5.7 5.7 mV +VS = 2.7 V to 10 V (8) kΩ 0.7 TA = 25°C Temperature coefficient of quiescent current (7) mV/°C –0.7 Change of quiescent current (6) °C +VS = 3 V to 10 V +VS = 2.7 V to 10 V (1) (2) (3) (4) (5) °C mV LM61B Quiescent current Long term stability (8) UNIT 4 600 TA = 85°C to 100°C, +VS = 2.7 V Line regulation (7) MAX (3) LM61B Output voltage at 0°C Nonlinearity (6) TYP (4) TJ = TMAX = 100°C, for 1000 hours 82 125 155 µA ±5 µA 0.2 µA/°C ±0.2 °C Limits are specified to TI's AOQL (Average Outgoing Quality Level). Typical limits represent most likely parametric norm. Maximum and minimum limits apply for TA = TJ = TMIN to TMAX. Typical limits apply for TA = TJ = 25°C. Accuracy is defined as the error between the output voltage and 10 mV/°C multiplied by the device's case temperature plus 600 mV, at specified conditions of voltage, current, and temperature (expressed in °C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. For best long-term stability, any precision circuit gives best results if the unit is aged at a warm temperature, or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift occurs in the first 1000 hours at elevated temperatures. The drift after 1000 hours does not continue at the first 1000-hour rate. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 6.6 Typical Characteristics The LM61 in the SOT-23 package mounted to a printed-circuit board as shown in Figure 18 was used to generate the following thermal curves. Figure 1. Junction-to-Ambient Thermal Resistance Figure 2. Thermal Time Constant Figure 3. Thermal Response in Still Air with Heat Sink Figure 4. Thermal Response in Stirred Oil Bath with Heat Sink Figure 5. Thermal Response in Still Air without Heat Sink Figure 6. Quiescent Current vs Temperature Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 5 LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com Typical Characteristics (continued) The LM61 in the SOT-23 package mounted to a printed-circuit board as shown in Figure 18 was used to generate the following thermal curves. Figure 7. Accuracy vs Temperature Figure 8. Noise Voltage +VS 2 V/Div 0V 0.2 V/Div VO 0V 5 µs/Div Figure 9. Supply Voltage vs Supply Current Figure 10. Start-Up Response 6 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 7 Detailed Description 7.1 Overview The LM61 is a precision integrated-circuit temperature sensor that can sense a –30°C to 100°C temperature range using a single positive supply. The output voltage of the LM61 has a positive temperature slope of 10 mV/°C. A 600-mV offset is included, enabling negative temperature sensing when biased by a single supply. The temperature-sensing element is comprised of a delta-VBE architecture. The temperature-sensing element is then buffered by an amplifier and provided to the VOUT pin. The amplifier has a simple class A output stage as shown in Functional Block Diagram. 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 LM61 Transfer Function The LM61 follows a simple linear transfer function to achieve the accuracy as listed in Electrical Characteristics. Use Equation 1 to calculate the value of VO. VO = 10 mV/°C × T°C + 600 mV where • • T is the temperature in °C VO is the LM61 output voltage (1) 7.4 Device Functional Modes The only functional mode of the LM61 device is an analog output directly proportional to temperature. Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 7 LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LM61 has a wide supply range and a 10-mV/°C output slope with a 600-mV DC. Therefore, it can be easily applied in many temperature-sensing applications where a single supply is required for positive and negative temperatures. 8.2 Typical Applications 8.2.1 Typical Temperature Sensing Circuit VO = 10 mV/°C × T°C + 600 mV Figure 11. Typical Temperature Sensing Circuit Diagram 8.2.1.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters 8 PARAMETER VALUE Power supply voltage 2.7 V to 3.3 V Accuracy at 25°C ±2°C (maximum) Accuracy over –25°C to 85°C ±3°C (maximum) Temperature slope 10 mV/°C Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 8.2.1.2 Detailed Design Procedure The LM61 is a simple temperature sensor that provides an analog output. Therefore, design requirements related to layout outweigh other requirements in importance. See Layout for more information. 8.2.1.2.1 Capacitive Loads The LM61 handles capacitive loading well. Without any special precautions, the LM61 can drive any capacitive load as shown in Figure 12. Over the specified temperature range the LM61 has a maximum output impedance of 5 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1-µF capacitor be added between +VS and GND to bypass the power-supply voltage, as shown in Figure 13. In a noisy environment it may be necessary to add a capacitor from VOUT to ground. A 1-µF output capacitor with the 5-kΩ maximum output impedance forms a 32-Hz lowpass filter. Because the thermal time constant of the LM61 is much slower than the 5-ms time constant formed by the RC, the overall response time of the LM61 is not significantly affected. For much larger capacitors this additional time lag increases the overall response time of the LM61. Figure 12. LM61 No Decoupling Required for Capacitive Load Figure 13. LM61 with Filter for Noisy Environments Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 9 LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com 8.2.1.3 Application Curve Figure 14. Accuracy vs Temperature 8.2.2 Other Application Circuits Figure 15 shows an application circuit example using the LM61 device. Customers must fully validate and test any circuit before implementing a design based on an example in this section. Unless otherwise noted, the design procedures in Typical Temperature Sensing Circuit are applicable. V+ VTEMP R3 VT1 R4 VT2 LM4040 V+ VT R1 4.1V U3 0.1 PF LM61 R2 (Low = overtemp alarm) + U1 - VOUT VOUT LM7211 VTemp U2 VT1 = (4.1)R2 R2 + R1||R3 VT2 = (4.1)R2||R3 R1 + R2||R3 Copyright © 2016, Texas Instruments Incorporated Figure 15. Centigrade Thermostat Figure 16. Conserving Power Dissipation with Shutdown 10 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 9 Power Supply Recommendations In an extremely noisy environment, it may be necessary to add filtering to minimize noise pickup. TI recommends a 0.1-µF capacitor be added between +VS to GND to bypass the power-supply voltage, as shown in Figure 13. 10 Layout 10.1 Layout Guidelines 10.1.1 Mounting The LM61 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM61 senses is within about 0.2°C of the surface temperature that LM61's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature is much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperatures. To ensure good thermal conductivity the backside of the LM61 die is directly attached to the GND pin. The lands and traces to the LM61 are part of the printed-circuit board, which is the object whose temperature is being measured. Alternatively, the LM61 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM61 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the device or connections. 10.2 Layout Examples Figure 17. Recommended Solder Pads for SOT-23 Package Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 11 LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com Layout Examples (continued) A. 1/2 in.2 printed-circuit board with 2 oz copper foil or similar. Figure 18. Printed-Circuit Board Used for Heat Sink to Generate All Curves +VS 1 3 VO GND 2 Via to ground plane Via to power plane Figure 19. PCB Layout 10.3 Thermal Considerations The junction-to-ambient thermal resistance is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. For the LM61, Equation 2 is used to calculate the rise in the die temperature. TJ = TA + RθJA × ((+VS × IQ) + (+VS – VO) × IL) where • • IQ is the quiescent current ILis the load current on the output (2) Table 2 summarizes the rise in die temperature of the LM61 without any loading with a 3.3-V supply, and the thermal resistance for different conditions. 12 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 Table 2. Temperature Rise of LM61 Due to Self-Heating and Thermal Resistance (RθJA) Still air No heat sink (1) Moving air SOT-23 Small heat fin (2) No heat sink (1) TO-92 Small heat fin (3) (1) (2) (3) RθJA (°C/W) TJ – TA (°C) 450 0.26 — — Still air 260 0.13 Moving air 180 0.09 Still air 180 0.09 Moving air 90 0.05 Still air 140 0.07 Moving air 70 0.03 Part soldered to 30 gauge wire. Heat sink used is 1/2 in.2 printed -circuit board with 2-oz foil with part attached as shown in Figure 18. Part glued and leads soldered to 1 in.2 of 1/16 in. printed circuit board with 2-oz foil or similar. Table 3. Temperature and Typical VO Values TEMPERATURE VO(TYPICAL) 100°C 1600 mV 85°C 1450 mV 25°C 850 mV 0°C 600 mV –25°C 350 mV –30°C 300 mV Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 13 LM61 SNIS121J – JUNE 1999 – REVISED NOVEMBER 2016 www.ti.com 11 Device and Documentation Support 11.1 Related Documentation For related documentation see the following: • TO-92 Packing Options / Ordering Instructions (SNOA072) • Tiny Temperature Sensors for Remote Systems (SNIA009) 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 14 Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Product Folder Links: LM61 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM61BIM3 NRND SOT-23 DBZ 3 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -25 to 85 T1B LM61BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -25 to 85 T1B LM61BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -25 to 85 T1B LM61BIZ/LFT3 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM61BIZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type -25 to 85 LM61 BIZ LM61CIM3 NRND SOT-23 DBZ 3 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -30 to 100 T1C LM61CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM -30 to 100 T1C LM61CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -30 to 100 T1C LM61CIZ/LFT2 ACTIVE TO-92 LP 3 2000 RoHS & Green SN N / A for Pkg Type LM61CIZ/NOPB ACTIVE TO-92 LP 3 1800 RoHS & Green SN N / A for Pkg Type LM61 BIZ LM61 CIZ -30 to 100 LM61 CIZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of