www.ti.com
User’s Guide
LM62460RPHEVM EVM User’s Guide
ABSTRACT
The LM62460RPHEVM evaluation module (EVM) is designed to help customers evaluate the performance of the
LM62460-Q1 synchronous step-down voltage converter. The EVM contains one LM62460-Q1 device in a 16-pin
wettable flanks QFN (VQFN-HR) HotRod™ package. It is capable of delivering 5-V output voltage and up to 6-A
load current with exceptional efficiency and output accuracy in a very small solution size. The EVM provides
multiple power connectors, jumpers, resistors and capacitors to enable connection and configuration of output
voltage, spread spectrum, mode setting options, and more for customer convenience. It also provides a good
layout example which is optimized for EMI performance and passes CISPR 25 Class 5 standards. The layout is
also optimized for thermal performance, operating with ϴJA = 21.6°C/W on a 102 mm x 76 mm, 4-layer board
with 2 oz / 1 oz / 1 oz / 2 oz copper thickness stack.
Table 1-1. Device and Package Configurations
CONVERTER
U1
IC
PACKAGE
LM62460-Q1
16-pin wettable flanks HotRod QFN (VQFN-HR)
3.5 mm × 4.5 mm × 0.9 mm
Figure 1-1. LM62460RPHEVM Board Image
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
1
Table of Contents
www.ti.com
Table of Contents
1 Introduction.............................................................................................................................................................................3
1.1 LM62460RPHEVM Synchronous Step-Down Voltage Converter...................................................................................... 3
2 Quick Start...............................................................................................................................................................................4
3 Detailed Descriptions............................................................................................................................................................. 5
4 Schematic................................................................................................................................................................................6
5 Board Layout...........................................................................................................................................................................7
6 Board Curves.........................................................................................................................................................................11
7 Bill of Materials..................................................................................................................................................................... 14
Revision History.......................................................................................................................................................................15
List of Figures
Figure 1-1. LM62460RPHEVM Board Image.............................................................................................................................. 1
Figure 1-1. LM62460-Q1 Pin Configuration (16-Pin VQFN-HR Package Top View)................................................................... 3
Figure 4-1. LM62460RPHEVM Schematic.................................................................................................................................. 6
Figure 5-1. Top layer and top silkscreen......................................................................................................................................7
Figure 5-2. Top layer routing........................................................................................................................................................8
Figure 5-3. Mid-layer 1 ground plane...........................................................................................................................................8
Figure 5-4. Mid-layer 2 routing.....................................................................................................................................................9
Figure 5-5. Bottom layer routing.................................................................................................................................................. 9
Figure 5-6. Bottom layer and bottom silkscreen........................................................................................................................ 10
Figure 6-1. LM62460-Q1 5-V 2.2-MHz Efficiency in Auto Mode................................................................................................ 11
Figure 6-2. LM62460-Q1 5-V 2.2-MHz Efficiency in FPWM Mode............................................................................................ 11
Figure 6-3. LM62460-Q1 3.3-V 2.2-MHz Efficiency in Auto Mode............................................................................................. 11
Figure 6-4. LM62460-Q1 3.3-V 2.2-MHz Efficiency in FPWM Mode......................................................................................... 11
Figure 6-5. Conducted EMI versus CISPR25 Class 5 Limits (Green: Peak Signal, Blue: Average Signal)...............................11
Figure 6-6. Radiated EMI Bicon Horizontal versus CISPR25 Class 5 Limits.............................................................................11
Figure 6-7. Radiated EMI Bicon Vertical versus CISPR25 Class 5 Limits.................................................................................12
Figure 6-8. Radiated EMI Log Horizontal versus CISPR25 Class 5 Limits............................................................................... 12
Figure 6-9. Radiated EMI Log Vertical versus CISPR25 Class 5 Limits....................................................................................12
Figure 6-10. LM62460-Q1 EVM Thermal Performance with VIN = 12 V Providing ϴJA = 21.6°C/W........................................ 12
List of Tables
Table 1-1. Device and Package Configurations...........................................................................................................................1
Table 6-1. BOM for Board Curves..............................................................................................................................................13
Table 7-1. LM62460RPHEVM 6-A 2.2-MHz EVM Bill of Materials............................................................................................ 14
Trademarks
HotRod™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
2
LM62460RPHEVM EVM User’s Guide
SNVU774 – APRIL 2021
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
www.ti.com
Introduction
1 Introduction
1.1 LM62460RPHEVM Synchronous Step-Down Voltage Converter
The LM62460-Q1 is an easy-to-use synchronous step-down DC-DC converter capable of driving up to 6 A of
load current from a supply voltage ranging from 3 V to 36 V. The LM62460-Q1 provides exceptional efficiency
and output accuracy in a very small solution size. The LM62460-Q1 implements peak-current-mode control.
Additional features such as adjustable/synchronizable switching frequency, pin selectable dual-random spread
spectrum (DRSS), true slew rate control, FPWM/AUTO selection, power-good/RESET flag, and precision enable
provide both flexible and easy-to-use solutions for a wide range of applications. Automatic frequency foldback
(AUTO mode) at light load and optional external bias improve efficiency over the entire load range. The device
family requires few external components and has a pinout designed for simple PCB layout with excellent
EMI and thermal performance. Protection features include thermal shutdown, input undervoltage lockout, cycleby-cycle current limiting, and hiccup short-circuit protection. The LM62460-Q1 is pin-to-pin compatible with
LM61480-Q1 (8-A converter) and LM61495-Q1 (10-A converter) for easy current scaling.
The pin configuration of the LM62460-Q1 is shown in Figure 1-1.
3.5 mm
16
PGND2
2
VIN2
PGND1
15
VIN1
14
EN
13
4
CBOOT
SYNC/
MODE
12
5
BIAS
SPSP
11
6
VCC
RT
RBOOT
AGND
3
FB
4.5 mm
SW
1
7
8
9
RESET
10
Figure 1-1. LM62460-Q1 Pin Configuration (16-Pin VQFN-HR Package Top View)
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
3
Quick Start
www.ti.com
2 Quick Start
1. Connect the voltage supply between VIN_EMI and GND_EMI terminals using short, thick wires.
2. Connect the load of the converter between VOUT and GND (J2) terminals, using short, thick wires.
3. Set the supply voltage (VIN) at an appropriate level between 6 V to 36 V. Set the current limit of the supply to
an appropriate level depending on the connected load.
4. Turn on the power supply. With the default configuration, the EVM should power up and provide VOUT = 5 V.
5. Monitor the output voltage. The maximum rated load current is 6 A.
4
LM62460RPHEVM EVM User’s Guide
SNVU774 – APRIL 2021
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
www.ti.com
Detailed Descriptions
3 Detailed Descriptions
This section describes the connectors and the test points on the EVM.
VIN_EMI (J1) Input voltage to the converter connecting to VIN of the converter through an EMI filter.
VIN_EMI terminal connects to the input capacitors and the VIN pins of the LM62460-Q1 through
an input EMI filter. Connect the supply voltage (battery, bench-top supply, or other supply)
between VIN_EMI and GND_EMI connectors. The voltage range should be higher than 3.5 V
for the device to start up, and above 3V to continue operation. VIN higher than 6 V provides
regulated 5 V output voltage. VIN should be no higher than 36 V to avoid damaging the device.
The current limit on the supply must be high enough to provide the needed supply current,
otherwise the supply voltage may not maintain the desired voltage. The supply voltage should
be connected to the board with short, thick wires to handle the pulsing input current.
GND_EMI
(J1)
Ground connection near the input filter.
VOUT (J2)
Output voltage of the converter.
This is the current return path for the supply connected to VIN_EMI.
VOUT terminal connects to the power inductor and the output capacitors. Connect the loading
device between VOUT and GND connectors on J2 to load the converter output. Connect the
loading device to the board with short, thick wires to handle the large DC output current.
GND (J2)
Ground connection near the output.
This is the current return path for the output voltage connected to VOUT.
Input Filter
Prevents noise from contaminating supply voltage
The input filter consists of a ferrite bead, filter inductor, and filter capacitors, located on the
bottom side of the PCB. The output of the filter is connected to the VIN net, which is connected
to the VIN pins of the LM62460-Q1 and the input capacitors.
Conducted EMI arises from the normal operation of switching circuits. The ON and OFF actions
of the power switches generate large discontinuous currents. The discontinuous currents are
present at the input side of buck converters. Voltage ripple generated by discontinuous currents
can be conducted to the voltage supply of the buck converter via physical contact of the
conductors. Without control, excessive input voltage ripple can compromise operation of other
devices connected to the source. The input filter helps to smooth out the voltage perturbations
leading to the source.
VIN_S
Test point to monitor the input voltage of the device.
PGND
Test point for GND reference when measuring VIN_S.
VOUT_S
Test point to monitor the output voltage of the device.
PGND3
Test point for GND reference when measuring VOUT_S.
FB
Test point for measuring the voltage on the FB pin of the device.
AGND
Test point for AGND reference when measuring FB.
RT
Test point for measuring the voltage on the RT pin of the device.
RESET
Test point for measuring the voltage on the RESET (power good) pin of the device.
VCC
Test point for measuring the voltage on the VCC pin of the device.
SYNC/MODE Test point for measuring the voltage on the SYNC/MODE pin of the device or to apply a
synchronizing clock signal.
PGND2
Additional GND reference point for test point measurements.
FB jumper
(J4)
Place the shunt connecting FB and 5V to set VOUT = 5V. Place the shunt connecting FB and
3.3V to set VOUT = 3.3V.
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
5
Schematic
www.ti.com
4 Schematic
The LM62460RPHEVM schematic is shown in Figure 4-1.
Figure 4-1. LM62460RPHEVM Schematic
6
LM62460RPHEVM EVM User’s Guide
SNVU774 – APRIL 2021
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
www.ti.com
Board Layout
5 Board Layout
Figure 5-1 through Figure 5-6 show the board layout for the LM62460RPHEVM. The EVM offers resistors,
capacitors, test points, and a jumper to configure the output voltage and precision enable pin, and set frequency
and external clock synchronization among the other features of the LM62460-Q1.
The PCB is optimized for thermal performance. The board contains 4 layers. There are 2-oz copper layers on
the top and bottom and 1-oz copper mid-layers. The LM62460-Q1 does not have a thermal pad so the best path
to move the heat out of the IC is through the pins and into the board. The PGND pins connect to the large GND
plane which spreads the heat to the rest of the board. The GND plane also has thermal vias to spread the heat
more efficiently to other layers for additional improved thermal performance.
The PCB is also optimized for EMI performance. The layout minimizes the area of high dv/dt nodes like SW
and BOOT. The small high-frequency ceramic input capacitors are placed very close to the IC to minimize the
loop formed from VIN pins, through the capacitor, to the PGND pins. The board also features an EMI filter on
the back-side of the board with options for an inductor, ferrite bead, and filter capacitors to tune the desired EMI
performance. The full filter may not be necessary to pass particular EMI requirements but the components and
pads are available for flexibility.
The screw terminals J1 and J2 allow for high-current connections to the board. Jumper J3 allows the user to
select the output voltage, 5V or 3.3V. Pin voltages can be probed using the test points. The rest of the features
can be adjusted by modifying the appropriate resistor values.
Figure 5-1. Top layer and top silkscreen
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
7
Board Layout
www.ti.com
Figure 5-2. Top layer routing
Figure 5-3. Mid-layer 1 ground plane
8
LM62460RPHEVM EVM User’s Guide
SNVU774 – APRIL 2021
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
www.ti.com
Board Layout
Figure 5-4. Mid-layer 2 routing
Figure 5-5. Bottom layer routing
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
9
Board Layout
www.ti.com
Figure 5-6. Bottom layer and bottom silkscreen
10
LM62460RPHEVM EVM User’s Guide
SNVU774 – APRIL 2021
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
www.ti.com
Board Curves
6 Board Curves
100%
95%
90%
Efficiency (%)
85%
80%
75%
70%
65%
60%
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
55%
50%
0.0001
0.001
0.01
0.1
Output Current (A)
1
6
Figure 6-1. LM62460-Q1 5-V 2.2-MHz Efficiency in
Auto Mode
Figure 6-2. LM62460-Q1 5-V 2.2-MHz Efficiency in
FPWM Mode
100%
95%
90%
Efficiency (%)
85%
80%
75%
70%
65%
60%
VIN = 8 V
VIN = 13.5 V
VIN = 24 V
55%
50%
0.0001
0.001
0.01
0.1
Output Current (A)
1
6
Figure 6-3. LM62460-Q1 3.3-V 2.2-MHz Efficiency in Figure 6-4. LM62460-Q1 3.3-V 2.2-MHz Efficiency in
FPWM Mode
Auto Mode
VOUT = 5 V
FSW = 2.2 MHz
IOUT = 4 A
Frequency Tested: 0.15 MHz to 108 MHz
Figure 6-5. Conducted EMI versus CISPR25 Class
5 Limits (Green: Peak Signal, Blue: Average
Signal)
VOUT = 5 V
FSW = 2.2 MHz
IOUT = 4 A
Frequency Tested: 30 MHz to 300 MHz
Figure 6-6. Radiated EMI Bicon Horizontal versus
CISPR25 Class 5 Limits
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
11
Board Curves
www.ti.com
VOUT = 5 V
FSW = 2.2 MHz
IOUT = 4 A
Frequency Tested: 30 MHz to 300 MHz
Figure 6-7. Radiated EMI Bicon Vertical versus
CISPR25 Class 5 Limits
VOUT = 5 V
FSW = 2.2 MHz
IOUT = 4 A
Frequency Tested: 300 MHz to 1 GHz
Figure 6-9. Radiated EMI Log Vertical versus
CISPR25 Class 5 Limits
12
VOUT = 5 V
FSW = 2.2 MHz
IOUT = 4 A
Frequency Tested: 300 MHz to 1 GHz
Figure 6-8. Radiated EMI Log Horizontal versus
CISPR25 Class 5 Limits
VOUT = 5 V
FSW = 2.2 MHz
IOUT = 6 A
Figure 6-10. LM62460-Q1 EVM Thermal
Performance with VIN = 12 V Providing ϴJA =
21.6°C/W
LM62460RPHEVM EVM User’s Guide
SNVU774 – APRIL 2021
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
www.ti.com
Board Curves
Table 6-1. BOM for Board Curves
VOUT
FREQUENCY
RFBB
COUT
CIN + CHF
L
3.3 V
2200 kHz
43.2 kΩ
2 x 47 µF + 100 µF
electrolytic + 2 x 2.2 µF
2 × 10 µF + 2 × 470 nF + 100
µF electrolytic
0.68 µH
(744373460068)
5V
2200 kHz
24.9 kΩ
2 x 47 µF + 100 µF
electrolytic + 2 x 2.2 µF
2 × 10 µF + 2 × 470 nF + 100
µF electrolytic
0.68 µH
(744373460068)
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
13
Bill of Materials
www.ti.com
7 Bill of Materials
The bills of materials of the LM62460RPHEVM is shown in Table 7-1.
Table 7-1. LM62460RPHEVM 6-A 2.2-MHz EVM Bill of Materials
DESIGNATOR
DESCRIPTION
AGND, FB,
Test Point, SMT
PGND, PGND2,
PGND3, RESET,
RT, SYNC/
MODE, VCC,
VIN_S, VOUT_S
MANUFACTURER
PART NUMBER
QUANTITY
Harwin
S2751-46R
11
C1
CAP, AL, 100 uF, 63 V, +/- 20%, 0.35 ohm, AEC-Q200 Grade Panasonic
2, SMD
EEE-FK1J101P
1
C2, C3
CAP, CERM, 10 uF, 50 V, +/- 10%, X5R, 1210
C3225X5R1H106K250AB
2
C4, C5
CAP, CERM, 0.47 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade TDK
1, 0603
CGA3E3X7R1H474K080AB
2
C6
CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade
1, 0402
TDK
CGA2B3X7R1H104K050BB
1
C7, C11
CAP, CERM, 2.2 µF, 10 V,+/- 10%, X7R, AEC-Q200 Grade
1, 0603
MuRata
GRM188R71A225KE15J
2
C8, C9
CAP, CERM, 47 µF, 10 V,+/- 10%, X7S, AEC-Q200 Grade 1, MuRata
1210
GCM32EC71A476KE02K
2
C10
CAP, AL, 100 µF, 16 V, +/- 20%, AEC-Q200 Grade 3, SMD
Panasonic
EEE-1CA101AP
1
C12
CAP, CERM, 10 pF, 50 V, +/- 5%, C0G/NP0, AEC-Q200
Grade 1, 0603
TDK
CGA3E2C0G1H100D080AA
1
C13
CAP, CERM, 0.15 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade TDK
1, 0603
CGA3E3X7R1H154K080AB
1
C14
CAP, CERM, 1 uF, 16 V, +/- 20%, X7R, AEC-Q200 Grade 1,
0603
GCM188R71C105MA64D
1
C15, C16, C20,
C21
CAP, CERM, 0.47 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade TDK
1, 0603
CGA3E3X7R1H474K080AE
4
C17, C18, C19
CAP, CERM, 2.2 uF, 50 V, +/- 10%, X7R, AEC-Q200 Grade
1, 0805
CGA4J3X7R1H225K125AB
3
FB1
Chip Ferrite Bead, 1206, 120Ω @ 100MHz, 0.009Ω, 25%, 6A Murata
BLM31KN121SZ1L
1
H1, H2, H3, H4
Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead
B&F Fastener Supply
NY PMS 440 0025 PH
4
H5, H6, H7, H8
Standoff, Hex, 0.5"L #4-40 Nylon
Keystone
1902C
4
J1, J2
Terminal Block, 5 mm, 2x1, Tin, TH
Wurth Elektronik
691 101 710 002
2
J3
Header, 100mil, 3x1, Gold, TH
Sullins Connector
Solutions
PBC03SAAN
1
L1
680nH Shielded Molded Inductor 8A 12mOhm Max 2-SMD
Wurth Electronics
744373360068
1
L2
Inductor, Wirewound, 1 uH, 7.3 A, 0.013 ohm, SMD
Wurth Elektronik
74437336010
1
R1
RES, 49.9, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW060349R9FKEA
1
R2
RES, 187 k, 1%, 0.1 W, 0603
Yageo
RC0603FR-07187KL
1
R3
RES, 0, 5%, 0.063 W, AEC-Q200 Grade 0, 0402
Vishay-Dale
CRCW04020000Z0ED
1
R4
RES, 49.9 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW060349K9FKEA
1
R6, R11, R13
RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW0603100KFKEA
3
R7
RES, 0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Stackpole Electronics
Inc
RMCF0603ZT0R00
1
R8
RES, 4.99 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW06034K99FKEA
1
R9
RES, 21.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW060321K0FKEA
1
R12
RES, 6.81 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW06036K81FKEA
1
R14
RES, 43.2 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW060343K2FKEA
1
R15
RES, 59.0 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW060359K0FKEA
1
R16
RES, 1.00, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
Vishay-Dale
CRCW06031R00FKEA
1
SH-J3
Shunt, 100mil, Gold plated, Black
Samtec
SNT-100-BK-G
1
U1
LM62460QRPHTQ1, RPH0016A (VQFN-HR-16)
Texas Instruments
LM62460QRPHTQ1
1
14
TDK
MuRata
TDK
LM62460RPHEVM EVM User’s Guide
SNVU774 – APRIL 2021
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
www.ti.com
Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
NOTES
April 2021
*
Initial release
SNVU774 – APRIL 2021
Submit Document Feedback
LM62460RPHEVM EVM User’s Guide
Copyright © 2022 Texas Instruments Incorporated
15
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
