LM62EVAL

LM62 www.ti.com SNIS105E – JUNE 1999 – REVISED MARCH 2013 LM62 2.7V, 15.6 mV/°C SOT-23 Temperature Sensor Check for Samples: LM62 FEATURES DESCRIPTION • • The LM62 is a precision integrated-circuit temperature sensor that can sense a 0°C to +90°C temperature range while operating from a single +3.0V supply. The LM62's output voltage is linearly proportional to Celsius (Centigrade) temperature (+15.6 mV/°C) and has a DC offset of +480 mV. The offset allows reading temperatures down to 0°C without the need for a negative supply. The nominal output voltage of the LM62 ranges from +480 mV to +1884 mV for a 0°C to +90°C temperature range. The LM62 is calibrated to provide accuracies of ±2.0°C at room temperature and +2.5°C/−2.0°C over the full 0°C to +90°C temperature range. 1 2 • Calibrated Linear Scale Factor of +15.6 mV/°C Rated for Full 0°C to +90°C Range with 3.0V Supply Suitable for Remote Applications APPLICATIONS • • • • • • • • • Cellular Phones Computers Power Supply Modules Battery Management FAX Machines Printers HVAC Disk Drives Appliances KEY SPECIFICATIONS • • • • • • Accuracy at 25°C ±2.0 or ±3.0°C (max) Temperature Slope +15.6 mV/°C Power Supply Voltage Range +2.7V to +10V Current Drain @ 25°C 130 μA (max) Nonlinearity ±0.8°C (max) Output Impedance 4.7 kΩ (max) Connection Diagram The LM62's linear output, +480 mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading temperatures down to 0°C is required. Because the LM62's quiescent current is less than 130 μA, selfheating is limited to a very low 0.2°C in still air. Shutdown capability for the LM62 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. Typical Application See Package Number DBZ VO = (+15.6 mV/°C × T°C) + 480 mV Figure 1. Full-Range Centigrade Temp. Sensor (0°C to +90°C) Stabilizing a Crystal Oscillator Temperature (T) Typical VO +90°C +1884 mV +70°C +1572 mV +25°C 870 mV 0°C +480 mV 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM62 SNIS105E – JUNE 1999 – REVISED MARCH 2013 www.ti.com Absolute Maximum Ratings (1) Supply Voltage +12V to −0.2V Output Voltage (+VS + 0.6V) to −0.6V Output Current 10 mA Input Current at any pin (2) 5 mA −65°C to +150°C Storage Temperature Junction Temperature, max (TJMAX) ESD Susceptibility (3) +125°C Human Body Model 2500V Machine Model (1) (2) (3) 250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Ratings (1) Specified Temperature Range TMIN ≤ TA ≤ TMAX LM62B, LM62C 0°C ≤ TA ≤ +90°C Supply Voltage Range (+VS) +2.7V to +10V Thermal Resistance, θJA (2) 450°C/W Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging (3) (1) (2) (3) 2 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air. Reflow temperature profiles are different for lead-free and non-lead-free packages. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E – JUNE 1999 – REVISED MARCH 2013 Electrical Characteristics Unless otherwise noted, these specifications apply for +VS = +3.0 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25°C. Parameter Conditions Typical (1) Accuracy (3) Output Voltage at 0°C Sensor Gain (Average Slope) +16 +3.0V ≤ +VS ≤ +10V 0°C ≤ TA ≤ +75°C, +VS= +2.7V Line Regulation (5) LM62C Limits (2) Units (Limit) ±2.0 ±3.0 °C (max) +2.5/−2.0 +4.0/−3.0 °C (max) ±0.8 ±1.0 °C (max) +16.1 +15.1 +16.3 +14.9 mV/°C (max) mV/°C (min) 4.7 4.7 kΩ (max) +480 Nonlinearity (4) Output Impedance LM62B Limits (2) mV 4.4 4.4 kΩ (max) +3.0V ≤ +VS ≤ +10V ±1.13 ±1.13 mV/V (max) +2.7V ≤ +VS ≤ +3.3V, 0°C ≤ TA ≤ +75°C ±9.7 ±9.7 mV (max) 130 165 130 165 μA (max) μA (max) Quiescent Current +2.7V ≤ +VS ≤ +10V 82 Change of Quiescent Current +2.7V ≤ +VS ≤ +10V ±5 μA 0.2 μA/°C ±0.2 °C Temperature Coefficient of Quiescent Current Long Term Stability (6) (1) (2) (3) (4) (5) (6) TJ=TMAX=+100°C, for 1000 hours Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Limits are ensured to Texas Instruments' AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and +15.6 mV/°C times the device's case temperature plus 480 mV, at specified conditions of voltage, current, and temperature (expressed in °C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 3 LM62 SNIS105E – JUNE 1999 – REVISED MARCH 2013 www.ti.com Typical Performance Characteristics To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12. 4 Thermal Resistance Junction to Air Thermal Time Constant Figure 2. Figure 3. Thermal Response in Still Air with Heat Sink Thermal Response in Stirred Oil Bath with Heat Sink Figure 4. Figure 5. Thermal Response in Still Air without a Heat Sink Quiescent Current vs. Temperature Figure 6. Figure 7. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E – JUNE 1999 – REVISED MARCH 2013 Typical Performance Characteristics (continued) To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12. Accuracy vs Temperature Noise Voltage Figure 8. Figure 9. Supply Voltage vs Supply Current Start-Up Response Figure 10. Figure 11. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 5 LM62 SNIS105E – JUNE 1999 – REVISED MARCH 2013 www.ti.com CIRCUIT BOARD ½″ Square Printed Circuit Board with 2 oz. Copper Foil or Similar. Figure 12. Printed Circuit Board Used for Heat Sink to Generate All Curves Mounting The LM62 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM62 is sensing will be within about +0.2°C of the surface temperature that LM62's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM62 die is directly attached to the GND pin. The lands and traces to the LM62 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. These printed circuit board lands and traces will not cause the LM62's temperature to deviate from the desired temperature. Alternatively, the LM62 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM62 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM62 or its connections. The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. For the LM62 the equation used to calculate the rise in the die temperature is as follows: TJ = TA + θJA [(+VS IQ) + (+VS − VO) IL] (1) where IQ is the quiescent current and ILis the load current on the output. Since the LM62's junction temperature is the actual temperature being measured care should be taken to minimize the load current that the LM62 is required to drive. The table shown in Table 1 summarizes the rise in die temperature of the LM62 without any loading, and the thermal resistance for different conditions. Table 1. Temperature Rise of LM62 Due to Self-Heating and Thermal Resistance (θJA) SOT-23 no heat sink (1) Still air SOT-23 small heat fin (2) θJA (°C/W) TJ − TA (°C) θJA (°C/W) 450 0.17 260 0.1 180 0.07 Moving air (1) (2) 6 TJ − TA (°C) Part soldered to 30 gauge wire. Heat sink used is ½″ square printed circuit board with 2 oz. foil with part attached as shown in Figure 12 . Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E – JUNE 1999 – REVISED MARCH 2013 Capacitive Loads The LM62 handles capacitive loading well. Without any special precautions, the LM62 can drive any capacitive load as shown in Figure 13. Over the specified temperature range the LM62 has a maximum output impedance of 4.7 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 μF be added from +VS to GND to bypass the power supply voltage, as shown in Figure 14. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 μF output capacitor with the 4.7 kΩ maximum output impedance will form a 34 Hz lowpass filter. Since the thermal time constant of the LM62 is much slower than the 30 ms time constant formed by the RC, the overall response time of the LM62 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM62. Figure 13. LM62 No Decoupling Required for Capacitive Load Figure 14. LM62 with Filter for Noisy Environment Figure 15. Simplified Schematic Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 7 LM62 SNIS105E – JUNE 1999 – REVISED MARCH 2013 www.ti.com Applications Circuits V+ VTEMP R3 VT1 R4 VT2 LM4040 V+ VT R1 4.1V U3 0.1 PF R2 (Low = overtemp alarm) + U1 - VOUT VOUT LM7211 VT1 = (4.1)R2 R2 + R1||R3 VT2 = (4.1)R2||R3 R1 + R2||R3 LM62 VTemp U2 Figure 16. Centigrade Thermostat Figure 17. Conserving Power Dissipation with Shutdown 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 LM62 www.ti.com SNIS105E – JUNE 1999 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision D (March 2013) to Revision E • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM62 9 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM62BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 90 T7B LM62BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM 0 to 90 T7B LM62CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 RoHS & Green SN Level-1-260C-UNLIM 0 to 90 T7C LM62CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM 0 to 90 T7C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of