LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
LM9070 Low-Dropout System Voltage Regulator with Keep-Alive ON/OFF Control
Check for Samples: LM9070
FEATURES
DESCRIPTION
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The LM9070 is a 5V, 3% accurate, 250 mA lowdropout voltage regulator. The regulator features an
active low delayed reset output flag which can be
used to reset a microprocessor system on turn-ON
and in the event that the regulator output falls out of
regulation for any reason. An external capacitor
programs a delay time interval before the reset output
can return high.
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Automotive Application Reliability
3% Output Voltage Tolerance
Insensitive to Radiated RFI
Dropout Voltage Less than 800 mV with 250
mA Output Current
Externally Programmed Reset Delay Interval
Keep-Alive Feature with 2 Logic Control Inputs
60V Load Dump Transient Protection
Thermal Shutdown
Short Circuit Protection and Disable Safety
Features
Reverse Battery Protection
Low OFF Quiescent Current, 50 μA Maximum
Wide Operating Temperature Range −40°C to
+125°C
TO-263 and 20-Pin Power Surface Mount
Packages
Lead Form Compatible with TLE4267 TO-220
Regulator
Designed for automotive application the
contains a variety of protection features
reverse battery, over-voltage shutdown,
shutdown, input transient protection and
operating temperature range.
LM9070
such as
thermal
a wide
A unique two-input logic control scheme is used to
enable or disable the regulator output. An ON/OFF
input can be provided by an ignition switch derived
signal while a second, Keep-Alive input, is generated
by a system controller. This allows for a system to
remain ON after ignition has been switched OFF. The
system controller can then execute a power-down
routine and after which command the regulator OFF
to a low quiescent current state (60 μA max).
Design techniques have been employed to allow the
regulator to remain operational and not generate false
reset signals when subjected to high levels of RF
energy (300V/m from 2 MHz to 400 MHz).
Connection Diagrams and Ordering Information
Backside metal is internally connected to ground.
Figure 1. 7 Lead TO-263 (Top View)
Package Number KTW0007B
Figure 2. 20-Pin SOIC Package
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
Tab is internally connected to ground.
Tab is internally connected to ground.
Figure 3. 7-Lead TO-220 Package
(Odd numbered pins bent forward away from
package body)
Figure 4. 7-Lead TO-220 Package
(Even numbered pins bent forward away from
package body)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)
Input Voltage, DC
−26V to +40V
ON/OFF, Keep-Alive Inputs
(through 1kΩ)
−26V to +26V
Positive Input Transient (t 100 mA)
where the input voltage is applied through a long length of wire, which in effect adds a significant amount of
inductance in series with the input. The drop in input current may create a positive input voltage transient which
may take the PNP out of saturation. If the input voltage is held constant at the threshold where the PNP is going
in and out of saturation, an oscillation may be created.
This is only observed where significant series inductance is present in the input supply line and when the rise
and fall time of the input supply is very slow. If the application and removal of the input voltage changes at a rate
greater than 500 mV/μs, the input voltage moves through the dropout region of operation (VIN of 3V to 5.5V) too
quickly for an oscillation to be established.
MICROPROCESSOR SYSTEM REGULATOR WITH KEEP-ALIVE INTERVAL AT TURN-OFF
Figure 23 illustrates a system application circuit utilizing both of the logic control inputs of the LM9070. Closing
the ON/OFF switch powers ON the system. Once powered, the system controller sets the Keep-Alive line low.
The NPN transistor is used only to signal the controller that the ON/OFF switch has been opened and the system
is to be turned OFF. Upon detecting this high level at the ON/OFF Sense input line, the controller can then
perform a power down routine. The system will remain fully powered until the controller commands total shut
down by taking the Keep-Alive line high. The system then shuts OFF and reverts to a very low current drain
standby condition until switched back on.
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Product Folder Links: LM9070
LM9070
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SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
Figure 23. System Application Circuit and Control Waveforms
THERMAL MANAGEMENT
The LM9070 is packaged in both a TO-263 surface mount power package and a narrow lead-pitch TO-220
package. To obtain operation over the highest possible load current and input voltage ranges, care must be
taken to control the operating temperature of the device. Thermal shutdown protection is built in, with a threshold
above 150°C. Conventional heat-sinking techniques can be used with the TO-220 package. When applying the
TO-263 package, on board heat-sinking is important to prevent premature thermal shutdown. More copper foil
area under the tab of the device will directly improve the operating θJ-A of the TO-263 package, which will reduce
the junction temperature of the device.
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LM9070
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
www.ti.com
The θJ-A value for the TO-263 package (still air, no additional heat sink) is rated at 80°C/W. The effective θJ-A
value of the TO-263 package can be reduced by increasing the printed circuit board area that is connected
(soldered) to the package tab. Using 1 ounce (1.4 mils thick) copper clad with no solder mask, an area of 0.5
square inches will reduce θJ-A to 50°C/W, an area of 1.0 square inches will reduce θJ-Ato 37°C/W, and an area of
1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the copper clad area
under the solder mask should be increased by at least 50% to maintain a similar θJ-A rating.
The use of a double sided PC board with soldered filled vias between two planes of copper, as shown in
Figure 24, will improve thermal performance while optimizing the PC board surface area required. Using the
double sided PC board arrangement shown in Figure 24, with 1 ounce (1.4 mils thick) copper clad with no solder
mask and solder filled vias, an area of 0.5 square inches on both sides will reduce θJ-A to 43°C/W.
Figure 24. Typical TO-263 PC Board Heatsinking
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM9070
LM9070
www.ti.com
SNVS130E – DECEMBER 1999 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
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Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LM9070SX/NOPB
ACTIVE
DDPAK/
TO-263
KTW
7
500
RoHS-Exempt
& Green
SN
Level-3-245C-168 HR
-40 to 125
LM9070S
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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