LM9071SX/NOPB

LM9071 www.ti.com SNVS131D – DECEMBER 1999 – REVISED APRIL 2013 LM9071 Low-Dropout System Voltage Regulator with Delayed Reset Check for Samples: LM9071 FEATURES DESCRIPTION • • • • The LM9071 is a 5V, 250 mA low-dropout voltage regulator. The regulator features an active low delayed reset output flag which can be used to reset a microprocessor system on turn-ON and in the event that the regulator output falls out of regulation for any reason. An external capacitor programs a delay time interval before the reset output can return high. 1 2 • • • • • • • Automotive Application Reliability 3% Output Voltage Tolerance Insensitive to Radiated RFI Dropout Voltage Less than 800 mV with 250 mA Output Current Externally Programmed Reset Delay Interval Thermal Shutdown Short Circuit Protection Reverse Battery Protection Wide Operating Temperature Range −40°C to +125°C TO-220 and TO-263 Power Surface Mount Power Packages Pin for Pin Compatible with the LM2927, L4947 and TLE4260 Designed for automotive application the contains a variety of protection features reverse battery, over-voltage shutdown, shutdown, input transient protection and operating temperature range. LM9071 such as thermal a wide Design techniques have been employed to allow the regulator to remain operational and not generate false reset signals when subjected to high levels of RF energy (300V/m from 2 MHz to 400 MHz). Typical Application and Connection Diagrams (Top View) Figure 1. Figure 2. 5-Lead TO-220 Package Package Number KC0005A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM9071 SNVS131D – DECEMBER 1999 – REVISED APRIL 2013 www.ti.com Tab and Backside metal on all packages internally connected to ground. Figure 3. 5-Lead TO-220 Package Package Number NDH0005D Figure 4. 5-Lead TO-263 Surface Mount Package Package Number KTT0005B These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) −26V to +40V DC Input Voltage Positive Input Transient (t 100 mA) where the input voltage is applied through a long length of wire, which in effect adds a significant amount of inductance in series with the input. The drop in input current may create a positive input voltage transient which may take the PNP out of saturation. If the input voltage is held constant at the threshold where the PNP is going in and out of saturation, an oscillation may be created. This is only observed where a large series inductance is present in the input supply line and when the rise and fall time of the input supply is very slow. If the application and removal of the input voltage changes at a rate greater than 500 mV/μs it will move through the dropout region of the regulator (VIN of 3V to 5.5V) too quickly for an oscillation to be established. THERMAL MANAGEMENT The LM9071 is packaged in both a TO-263 surface mount power package and a narrow lead-pitch TO-220 package. To obtain operation over the highest possible load current and input voltage ranges, care must be taken to control the operating temperature of the device. Thermal shutdown protection is built in, with a threshold above 150°C. Conventional heat-sinking techniques can be used with the TO-220 package. When applying the TO-263 package, on board heat-sinking is important to prevent premature thermal shutdown. More copper foil area under the tab of the device will directly improve the operating θJ-A of the TO-263 package, which will reduce the junction temperature of the device. The θJ-A value for the TO-263 package (still air, no additional heat sink) is rated at 80°C/W. The effective θJ-A value of the TO-263 package can be reduced by increasing the printed circuit board area that is connected (soldered) to the package tab. Using 1 ounce (1.4 mils thick) copper clad with no solder mask, an area of 0.5 square inches will reduce θJ-A to 50°C/W, an area of 1.0 square inches will reduce θJ-Ato 37°C/W, and an area of 1.6 square inches will reduce θJ-A to 32°C/W. If the printed circuit board uses a solder mask, the copper clad area under the solder mask should be increased by at least 50% to maintain a similar θJ-A rating. The use of a double sided PC board with soldered filled vias between two planes of copper, as shown in Figure 16, will improve thermal performance while optimizing the PC board surface area required. Using the double sided PC board arrangement shown in Figure 16, with 1 ounce (1.4 mils thick) copper clad with no solder mask and solder filled vias, an area of 0.5 square inches on both sides will reduce θJ-A to 43°C/W. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM9071 7 LM9071 SNVS131D – DECEMBER 1999 – REVISED APRIL 2013 www.ti.com Figure 16. Typical TO-263 PC Board Heatsinking 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM9071 LM9071 www.ti.com SNVS131D – DECEMBER 1999 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM9071 9 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LM9071S/NOPB ACTIVE DDPAK/ TO-263 KTT 5 45 RoHS-Exempt & Green SN Level-3-245C-168 HR -40 to 125 LM9071S LM9071SX/NOPB ACTIVE DDPAK/ TO-263 KTT 5 500 RoHS-Exempt & Green SN Level-3-245C-168 HR -40 to 125 LM9071S (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of