0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
LMH2190TMEVAL

LMH2190TMEVAL

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION LMH2190

  • 数据手册
  • 价格&库存
LMH2190TMEVAL 数据手册
User's Guide SNAA068B – July 2009 – Revised May 2013 AN-1966 LMH2190 Evaluation Board 1 General Description The evaluation board (Figure 1) is designed to help the evaluation of the LMH2190 Quad Channel 26 MHz Clock Tree Driver with I2C™ interface. The LMH2190 provides a digital system clock to peripheral devices in mobile handsets. It provides a solution to clocking issues such as limited drive capability for fanout or longer traces, protection of the master clock from varying loads and frequency pulling effects, isolation buffering from noisy modules, and crosstalk isolation. It has very low phase noise which enables it to drive sensitive modules such as Wireless LAN and Bluetooth. Figure 1. LMH2190 Evaluation Board I2C is a trademark of Philips Semiconductor Corp. All other trademarks are the property of their respective owners. SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback AN-1966 LMH2190 Evaluation Board Copyright © 2009–2013, Texas Instruments Incorporated 1 Basic Operation 2 www.ti.com Basic Operation The LMH2190 evaluation board is designed such that it gives maximum flexibility in evaluating the LMH2190 in various configurations. The schematic, Bill of material and board layout can be found at the end of this document. In the following sections a description will be given on how to setup the measurement bench. For the factory default jumper setting, refer to Section 3. 2.1 Supply The common ground of the evaluation board is connected via Connector CON3. The LMH2190 is powered via VBAT (CON2). The typical supply voltage for VBAT is 3.5V, but it may range from 2.5V to 5.5V. In the factory default configuration the ENABLE voltage is supplied externally via connector CON7 and should be 1.8V. Three on-board buffers are separately powered through Connector CON18 (+5V) and CON 19 (-5V). If they are not used for evaluation they can be left un-powered when jumper locations J7, J16 and J17 are open. 2.2 Applying Clock In factory default configuration the clock to the LMH2190 is supplied by the on-board TCXO. Alternatively the clock can be applied externally either in DC mode via CON12 or in AC mode via CON10. The clock source can be selected by J13. Note that for DC mode, the I2C registers also need to be changed. The LMH2190 distributes the clock to a maximum of 4 outputs, CLK1 to CLK4, that are accessible via CON1, CON5, CON6 and CON8. An additional capacitive load can be connected between CLK to GND to simulate the load in the actual application via J1, J2, J14 and J15. There is also a possibility to measure the clocks as well as the TCXO clock via a buffer. This buffer can drive 50 ohm making them excellent for connecting to measurement equipment, like a Signal Source Analyzer. This analyzer can for instance measure the Phase noise and Jitter. The three buffers can be connected to the clock's by J7, J16 and J17. When the buffers are not used it is recommended to disconnect them, since they increase the capacitive load on the clocks slightly. 2.3 Clock Request The CLK's can be enabled by their appropriate CLK_REQ's. The CLK_REQ pin can be connected to a logic Low or High level via J6, J8, J10 and J12. The level of the Logic High can be selected by J5, either VOUT, VBAT or VENABLE. Instead of via the jumpers, the CLK_REQ's can also be controlled via CON9, CON11, CON13 and CON14. Make sure that the jumpers are removed in this case. In factory default configuration only CLK1 is enabled. The other clocks can simply be enabled by placing the jumper on J8, J10 and J12 in the other position. 2.4 I2C Interface The LMH2190 can be controlled by an I2C host device that can be connected via J4. It can configure the registers inside the LMH2190 to change the default configuration. According to the I2C specification one set of pull-up resistors needs to be present on the I2C bus. If they are not present elsewhere in the system they can be connected on the evaluation board via J19. The evaluation board can be used without I2C host device connected. It will then work in its default configuration. 3 Configuration The LMH2190 evaluation board can be configured via jumper settings. An overview of the various jumper positions on the board is given in Figure 2. The settings of these jumpers and their functions are listed in Table 1. 2 AN-1966 LMH2190 Evaluation Board SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Configuration www.ti.com Figure 2. Jumper Positions Table 1. Jumper and Header Overview Jumper J1 J2 J3 (1) Function CLK1 Capacitive load CLK2 Capacitive load ENABLE J4 I2C Header J5 CLK_REQx Logic High Level Jumper Position (1) Desription 1-2 Connects 10 pF from CLK1 to GND 3-4 Connects 22 pF from CLK1 to GND 5-6 Connects 33 pF from CLK1 to GND 7-8 Connects 47 pF from CLK1 to GND 1-2 Connects 10 pF from CLK2 to GND 3-4 Connects 22 pF from CLK2 to GND 5-6 Connects 33 pF from CLK2 to GND 7-8 Connects 47 pF from CLK2 to GND 1-2 ENABLE = VOUT 3-4 ENABLE is supplied by CON7 5-6 ENABLE is supplied by I2C conector J4 pin 4 7-8 ENABLE = GND Header to connect I2C signals 1-2 CLK_REQxHIGH = VOUT 3-4 CLK_REQxHIGH = VBAT 5-6 CLK_REQxHIGH = VENABLE Bold face jumper settings refer to the factory default configuration. SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback AN-1966 LMH2190 Evaluation Board Copyright © 2009–2013, Texas Instruments Incorporated 3 Configuration www.ti.com Table 1. Jumper and Header Overview Jumper J6 J7 J8 Function CLK_REQ1 CLK_REQ1 = High. Level is determined by J5 Connects Buffer to TCXO OUT Open No buffer connected to measure TCXO Clock CLK_REQ2 Open CLK_REQ3 SCLK_REQ Pull Up / Pull Down CLK_REQ4 J13 SCLK_IN Source J14 CLK3 Capacitive load J16 J17 CLK4 Capacitive load Connects Buffer to CLK1/2 Connects Buffer to CLK3/4 J18 TCXO Supply Header J19 I2C Pull-up Resistors 1-2 Buffer LMH6559MA (U2) is connected to measure TCXO Clock. Buffer can drive 50 Ohm. CLK_REQ2 can be controlled externally via CON11 1-2 CLK_REQ2 = GND 2-3 CLK_REQ2 = High. Level is determined by J5 1-2 TCXO is supplied by VOUT Open CLK_REQ3 can be controlled externally via CON13 1-2 CLK_REQ3 = GND 2-3 CLK_REQ3 = High. Level is determined by J5 Open No Pull-up or Pull-down connected to SCLK_REQ 1-2 100 kΩ Pull-down resistor connected from SCLK_REQ to GND 2-3 100 kΩ Pull-up resistor connected from SCLK_REQ to VBAT Open CLK_REQ4 can be controlled externally via CON14 1-2 CLK_REQ4 = GND 2-3 CLK_REQ4 = High. Level is determined by J5 1-2 SCLK_IN is connected to External Source, either through CON10 (ACCoupled) or CON12 (DC-Coupled) 3-4 SCLK_IN is connected to on-board TCXO 1-2 Connects 10 pF from CLK3 to GND 3-4 Connects 22 pF from CLK3 to GND 5-6 Connects 33 pF from CLK3 to GND 7-8 Connects 47 pF from CLK3 to GND 1-2 Connects 10 pF from CLK4 to GND 3-4 Connects 22 pF from CLK4 to GND 5-6 Connects 33 pF from CLK4 to GND 7-8 Connects 47 pF from CLK4 to GND Open No buffer connected to CLK1/2 1-2 Buffer LMH6559MA (U3) is connected to measure CLK2. Buffer can drive 50 Ohm. 2-3 Buffer LMH6559MA (U3) is connected to measure CLK1. Buffer can drive 50 Ohm. Open No buffer connected to measure TCXO Clock 1-2 Buffer LMH6559MA (U4) is connected to measure CLK4. Buffer can drive 50 Ohm. 2-3 Buffer LMH6559MA (U4) is connected to measure CLK3. Buffer can drive 50 Ohm. Header can be used to provide an (external) TCXO supply instead of the on-board VOUT supply. Header J9 should be open in this case. Open 1-2 4 CLK_REQ1 can be controlled externally via CON9 CLK_REQ1 = GND J10 J15 Desription 2-3 TCXO Supply J12 Open (continued) 1-2 J9 J11 Jumper Position (1) No Pull-up resistor connected to SDA and SCL line. Elsewhere should be pull-up resistors present on SDA and SCL Pull-up resistors connected on SDA and SCL J20 SCLK_REQ Header Header to monitor SCLK_REQ. J21 Future purpose Not Assembled AN-1966 LMH2190 Evaluation Board SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Measurement Setup www.ti.com 4 Measurement Setup The performance of the LMH2190 can be measured with the setup shown in Figure 3. +3.5V Power Supply VBAT +1.8V ENABLE VOUT CON2 CON4 Volt Meter CON7 GND LMH2190TM Eval Board GND SCLK_IN J13-4 TP1 Power Supply (Optional) +5V V+ -5V V- CLK1 CLK2 TP5 CON18 TP9 CON19 TP11 CON3 CLK4 GND GND Oscilloscope CLK3 GND Figure 3. Measurement Setup The +5V and -5V to connector CON18 and CON19 don't need to be applied unless buffers U2, U3 and/or U4 are used for the measurements. In factory default configuration, only CLK1 is enabled. With an oscilloscope and Hi-impedance probes the TCXO (J13–4) and CLK1 (TP1) can be measured. This should result in a measurement as depicted in Figure 4. Other CLK's can be enabled by connecting the appropriate CLK_REQ to VBAT (J8, J10, J12). A schematic representation of the TCXO and all the CLKs is depicted in Figure 5. It can be seen that the CLK's are skewed from each other. SCLK_IN 0.5 V/DIV SCLK_IN CLK1 CLK1 CLK2 TIME (5 ns/DIV) CLK3 CLK4 Figure 4. CLK1 Response, CL = 22 pF Figure 5. Clock Outputs Skewed SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback AN-1966 LMH2190 Evaluation Board Copyright © 2009–2013, Texas Instruments Incorporated 5 Schematic 5 www.ti.com Schematic Figure 6. Evaluation Board Schematic 6 Bill of Material The Bill of Material (BOM) of the evaluation board is in Table 2. Table 2. Bill of Material 6 Designator Description Comment C1, C4, C11, C13 0603 Capacitor 10 pF C2, C5, C19, C22 0603 Capacitor 22 pF C3, C8, C20, C23 0603 Capacitor 33 pF C6 Case A Capacitor NC C7, C28, C31 Case A Capacitor 10 µF C9, C10, C25, C29, C30 0603 Capacitor 100 nF C12, C16 0603 Capacitor 10 nF C14, C15 0603 Capacitor 470 pF C17, C18, C21, C24 0603 Capacitor 47 pF C26, R9, R10, R13, R15 0603 Capacitor / Resistor NC C27 Case A Capacitor 2.2 µF CON1 Connector SMA AN-1966 LMH2190 Evaluation Board SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Board Layout www.ti.com Table 2. Bill of Material (continued) 7 Designator Description Comment CON2 Connector Banana CON3 Connector Banana CON4 Connector Banana CON5 Connector SMA CON6 Connector SMA CON7 Connector Banana CON8 Connector SMA CON9 Connector SMA CON10 Connector SMA CON11 Connector SMA CON12 Connector SMA CON13 Connector SMA CON14 Connector SMA CON15 Connector SMA CON16, CON17 Connector SMA CON18 Connector Banana CON19 Connector Banana J1, J2, J14, J15 Header 2x4 J3 Header 2x4 J4 Header 2x5 J21 Header 2x7 J5 Header 2x3 J6, J8, J10, J11, J12 Header 1x3 J7, J9, J19, J20 Header 1x2 J13 Header 2x2 J16, J17 Header 1x3 J18 Header 1x2 R1, R2, R3, R4, R5, R6, R12, R17, R18, R19 0603 Resistor 0Ω R7, R11, R14 0603 Resistor 100 kΩ R8 0603 Resistor 4.7 kΩ R16 0805 Resistor 4.7 kΩ R20, R21, R22 0603 Resistor 51Ω U1 DSBGA LMH2190 U2, U3, U4 SOIC LMH6559 X1 small TCXO 26.0MHz Board Layout As with any other device, careful attention must be paid to the board layout. If the board is not properly designed, the performance of the device can be less than might be expected. Especially the input clock trace (SCLK_IN) and output traces (CLK1/2/3/4) should be as short as possible to reduce the capacitive load observed by the clock outputs. Also proper decoupling close to the device is necessary. Beside a capacitor in the µF range, a capacitor of 100 nF on VBAT and VOUT is recommended close to device. The equivalent series resistance (ESR) of the capacitors should be sufficiently low. A standard capacitor is usually adequate. The copper layers of the evaluation board are depicted in Figure 9, Figure 10, and Figure 11. SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback AN-1966 LMH2190 Evaluation Board Copyright © 2009–2013, Texas Instruments Incorporated 7 Board Layout www.ti.com Figure 7. Component Locations Top Side 8 AN-1966 LMH2190 Evaluation Board SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Board Layout www.ti.com Figure 8. Component Locations Bottom Side (Bottom View) SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback AN-1966 LMH2190 Evaluation Board Copyright © 2009–2013, Texas Instruments Incorporated 9 Board Layout www.ti.com Figure 9. Top Layer of Evaluation Board Figure 10. Inner Layer of Evaluation Board Figure 11. Bottom Layer of Evaluation Board 10 AN-1966 LMH2190 Evaluation Board SNAA068B – July 2009 – Revised May 2013 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
LMH2190TMEVAL 价格&库存

很抱歉,暂时无法提供与“LMH2190TMEVAL”相匹配的价格&库存,您可以联系我们找货

免费人工找货