LMH730220/NOPB

REVISIONS NOTES: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. UNLESS OTHERWISE SPECIFIED MATERIAL: PER IPC-4101/24 1A. LAMINATE: HIGH-TEMPERATURE FR4 1B. FINISHED BOARD: .0020 +/-.0005 INCH OUTSIDE LAYERS, COPPER. 1C. ALL COPPER LAYERS MUST BE SPACED PER DETAIL "A". 1D. BOARD THICKNESS IS MEASURED INCLUDING TOP AND BOTTOM SIDES FINISHED COPPER. ANY TIN, TIN/LEAD OR GOLD PLATING, SOLDERMASK AND SILKSCREEN LEGEND MUST NOT BE INCLUDED IN FINISHED BOARD THICKNESS. THE CONDUCTOR PATTERN MUST BE ETCHED USING ARTWORK 880012993-002 REV A SUPPLIED WITHIN FABRICATION FILES' ARCHIVE 885012993-002 REV A OR GREATER. ALL CONDUCTOR LAYERS MUST BE REGISTERED WITHIN +/- .005 INCH FROM TRUE POSITION. ETCH TOLERANCES: 4A. ALL EXTERNAL LAYERS CONDUCTOR WIDTH MUST BE WITHIN +/- .0015 INCH OR +/- 15% OF GERBER DATA, WHICHEVER IS SMALLER. BOARD MUST BE NC DRILLED USING DRILL DATA SUPPLIED. DRILL TOLERANCES AND HOLE SIZES ARE FOR FINISHED BOARD: ALL PLATED THROUGH HOLES TO .080 INCH ARE +/- .003 INCH. ALL PLATED THROUGH HOLES OVER .081 INCH ARE +/- .005 INCH. ALL NON-PLATED THROUGH HOLES ARE +/- .005 INCH. ALL HOLES MUST BE REGISTERED WITHIN +/-.003 INCH FROM TRUE POSITION. MINIMUM ANNULAR RING MUST BE .002 INCH. PLATING: 9A. PER MIL-C-14550, PLATED THROUGH HOLES MUST BE PLATED WITH .0008 MIN. TO .0015 INCH MAX. THICK COPPER. 9B. FINISH: IMMERSION GOLD: 2 TO 8 MICROINCHES GOLD OVER 120-240 MICROINCHES OF ELECTROLESS NICKEL. WARP AND TWIST OF FINISHED BOARDS MUST NOT EXCEED .007 INCH PER INCH. SOLDERMASK: PER IPC-SM-840 11A. SOLDERMASK BOTH TOP AND BOTTOM SIDES. 11B. SOLDERMASK MUST CLEAR ALL LANDS SHOWN ON GERBER SOLDERMASK LAYERS. 11C. COLOR GREEN AND SOLVENT FREE. 11D. LIQUID PHOTO-IMAGEABLE MUST BE .0002 MIN. TO .0008 MAX. INCH THICK MEASURED OVER COPPER PLATING. SILKSCREEN TOP AND BOTTOM SIDES USING A GLOSSY WHITE, NONCONDUCTIVE, EPOXY BASED INK. NO SILKSCREEN ALLOWED ON TIN-LEAD OR GOLD AREAS, ON PADS OR IN HOLES. ROUTE BOARD OUTLINE, PER DRAWING DIMENSIONS. VENDOR MUST ENTER VENDOR'S IDENTITY, DATE CODE AND ANY OTHER IDENTIFICATION MARKS AS BOTTOM SIDE SOLDERMASK OPENINGS APPROXIMATELY WHERE SHOWN. OTHER VENDOR NOMENCLATURE OR MARKINGS SHOULD NOT BE ETCHED OR SILKSCREENED ON BOARD WITHOUT PRIOR PERMISSION. ALL VENDOR IN-PROCESS MARKINGS, QA STAMPS, ETC. MUST BE PLACED ON THE BOTTOM SIDE OF BOARD. REV A 17. 18. DESCRIPTION DATE Etch 002 Production Release APPD 08/13/07 FINISHED BOARD MUST MEET UL94V-0 RATING AND RoHS COMPLIANCE. DOCUMENTATION THAT MUST BE DELIVERED WITH BOARDS: 18A. CROSS SECTION REPORT (SPACING BETWEEN COPPER LAYERS AND COPPER THICKNESS) 18B. ELECTRICAL TEST CERTIFICATION OF COMPLIANCE (ACCORDANCE WITH IPC-ET-652 CLASS II) 18C. CERTIFICATION OF COMPLIANCE (BOARD HAS BEEN MANUFACTURED TO DRAWING REQUIREMENTS) 18D. RoHS CERTIFICATE OF COMPLIANCE. TopEtch BotEtch DETAIL A LAYER STACKUP SCALE: NONE Board Fabrication Information Smallest Feature 0.063 +/- 0.007 Air Gap .005 inch Trace Width .010 inch Hole Size .024 inch Pad Size .022 x .039 inch Surface Mount Top & Bottom UNLESS OTHERWISE SPECIFIED, ALL DIMENSIONS ARE IN INCHES MATERIAL: DRAWN: DATE: FINISH: CHECKED: DATE: ENGINEER: DATE: SEE NOTES SEE NOTES TOLERANCES 1 PL ± .02 2 PL ± .01 3 PL ± .005 Ernesto Rey BOARD & SYSTEM BUSINESS OPERATIONS 13-Aug-07 Gerrit Segers DO NOT COPY, DISPLAY, OR USE DRAWING WITHOUT AUTHORIZATION DO NOT SCALE DRAWING PCB FABRICATION DRAWING LMH730220 Eval B DRAWING: SCALE: 551012993-002 NONE SHEET 1 OF 2 A REV REVISIONS SEE SHEET #1 DRILL CHART 2.95 ALL UNITS ARE IN INCHES SYM 1.650 0 1.79 SIZE PLATED QTY 0.024 YES 11 0.032 YES 12 0.039 YES 11 0.055 YES 6 0.093 NO 4 0.126 NO 4 14 0.140 2.803 0.142 0 BOARD & SYSTEM BUSINESS OPERATIONS PCB FABRICATION DRAWING LMH730220 Eval DO NOT COPY, DISPLAY, OR USE DRAWING WITHOUT AUTHORIZATION DO NOT SCALE DRAWING B DRAWING: SCALE: 551012993-002 NONE SHEET 2 OF 2 A REV