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LMH730277

LMH730277

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

  • 详情介绍
  • 数据手册
  • 价格&库存
LMH730277 数据手册
LMH730277 LMH730277 2:1 Multiplexer Evaluation Board Literature Number: SNOU029 LMH730277 2:1 Multiplexer Evaluation Board General Description The LMH™730277 evaluation board is designed to aid in the characterization of National Semiconductor’s High Speed 2:1 Multiplexers. Use the evaluation board as a guide for high frequency layout and as a tool to aid in device testing and characterization. The evaluation board schematic is shown in Figure 1. Refer to the product data sheets for recommendations for component values. Basic Operation By changing the input termination resistors (RIN0 and RIN1) and series output resistor (ROUT) different input and output impedances can be matched. The SMA connectors and board traces are optimized for 50 to 75Ω operation. Other impedances can be matched but performance may be noticeably different, especially high frequency response. Even with optimal layout, board parasitics play a large part in high frequency performance and different termination resistors will change the frequency of the dominant parasitic poles/ zeros. To accommodate 50Ω high speed pulse generators for driving the select (SEL) or shutdown (SD) pins, use the logic control signal termination resistors (RSEL and RS) to match the impedance of the signal generator. When driving the logic pins be careful to use compatible signal levels. Devices designed for split supply operation will require special care if used in a single supply configuration. See the device datasheet for more details Layout Considerations Printed circuit board layout and supply bypassing play major roles in determining high frequency performance. When designing your own board use the LMH730277 evaluation board as a guide and follow these steps to optimize high frequency performance 1. Use a ground plane. 2. Include large (∼6.8 µF) capacitors on both supplies (C3 & C4). 3. Near the device use .01 µF ceramic capacitors from both supplies to ground (C1, C2). 4. A capacitor between V+ and V− is optional (C5) but will help suppress second order harmonic distortion. 5. Remove the ground and power planes from under and around the part, especially near the OUT and FB pins. 6. Minimize all trace lengths. 7. Use terminated transmission lines for long traces. Sample artwork for the LMH730277 Evaluation board is included on the next page in Figure 2. Measurement Hints The board is designed for 50Ω input and output connections into coaxial cables. For other impedances the terminating resistors can be modified to help match different impedances. Do not use normal oscilloscope probes to test these circuits. The capacitive loading will change circuit performance drastically. Instead use low impedance resistive divider probes of 100 to 500Ω. See Figure 3 for a sample resistive probe. The Low impedance resistor should be 50 - 450Ω. The ground connection should be as short as possible (∼1/2”). Even with careful use of these probes, results should be considered preliminary until verified with controlled impedance measurements. Even the best probes will interfere with circuit operation to some degree. Also, tools, power cables, fingers, etc. near the device will change measurement results, often dramatically. 20141803 FIGURE 1. Board Schematic LMH™ is a trademark of National Semiconductor Corporation. © 2005 National Semiconductor Corporation MS201418 www.national.com LMH730277 2:1 Multiplexer Evaluation Board April 2005 LMH730277 20141802 20141801 FIGURE 2. Board Layout (Actual Size = 2” x 2”) 20141804 FIGURE 3. Probe Schematic www.national.com 2 LMH730277 2:1 Multiplexer Evaluation Board Notes National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. For the most current product information visit us at www.national.com. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. BANNED SUBSTANCE COMPLIANCE National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2. National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530 85 86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +44 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated
LMH730277
PDF文档中包含以下信息:

1. 物料型号:型号为EL817,是一款光耦器件。

2. 器件简介:EL817是一种光耦器件,用于隔离输入和输出电路,提高系统的抗干扰能力。

3. 引脚分配:EL817有6个引脚,其中1脚为发光二极管的阳极,2脚为阴极,3脚为集电极,4脚为发射极,5脚为GND,6脚为Vcc。

4. 参数特性:工作温度范围为-20℃至+85℃,隔离电压可达5000Vrms。

5. 功能详解:EL817通过光电效应实现信号传输,具有高速响应和低功耗的特点。

6. 应用信息:广泛应用于通信、工业控制、医疗设备等领域。

7. 封装信息:采用DIP-6封装,尺寸为9.1mm x 3.6mm x 4.9mm。
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