0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
LMP2021MAEVAL

LMP2021MAEVAL

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    LMP2021 LMP® Series 1 - Single Channels per IC Instrumentation Amplifier Evaluation Board

  • 数据手册
  • 价格&库存
LMP2021MAEVAL 数据手册
User's Guide SNOA537A – December 2008 – Revised April 2013 AN–1932 LMP2021MAEVAL - Bridge Sensor Instrumentation Amplifier Evaluation Board 1 Introduction The LMP2021MAEVAL instrumentation amplifier evaluation board is configured as a differential-in, differential-out amplifier using the LMP2021. Also included is a precision reference and buffer to drive a bridge sensor. The board is set up to be used with the ADC141S626 evaluation board (part number: ADC141S626EB). 2 Power J3 J4 J5 J7 3 Connect to the positive supply. Connect to ground. If using dual supplies connect to the negative supply. If using a single supply short J5 to ground. Pin 1 of J2 can be used to power the ADC141S626EB evaluation board, which requires +5 V. If J3 is +5 V, JP3 can be shorted to provide +5 V to the ADC141S626EB evaluation board. If J3 is not +5 V, leave JP3 open and connect +5 V to J7. Input Signal and Bridge Excitation J1 is used to power the bridge sensor and input the signal from the bridge to the amplifier. The LM4120 (U4) provides a precision +5 V reference. This is buffered by the LMP7741 (U5) and supplied on pin 1 of J1 to power the bridge sensor. The bottom of the bridge sensor can be connected to pin 2, which is connected to ground. The outputs of the bridge sensor can be connected to pins 3 and 5 of J1. 4 Output Signal The output of the amplifier is available on pins 3 and 5 of J2. This connector is pin-to-pin compatible with the input connector of the ADC141S626EB evaluation board. 5 Amplifier Gain The gain of the amplifier is set using R1, R10, R11, and R12. If R11 = R12, the gain of the amplifier is 1 + (2R11)/(R1||R10). All trademarks are the property of their respective owners. SNOA537A – December 2008 – Revised April 2013 Submit Documentation Feedback AN–1932 LMP2021MAEVAL - Bridge Sensor Instrumentation Amplifier Evaluation Board Copyright © 2008–2013, Texas Instruments Incorporated 1 Amplifier Gain www.ti.com V- 0.1 PF Vref + V- 1k R2 6 LMP2021 C8 C9 0.1 PF 0.1 PF 2 OUT U4 IN 0.47 PF 0 7 LM4120AIM5-5.0 C7 4 C16 U2 V+ - 5 REF 0.1 PF 4 3 GND R6 EN 3 C17 0.1 PF 2 J6 SMA C6 1 V+ C5 0.1 PF V+ V+ R11 C1 J1 1 Vb 2 5 GND + V V +CM -CM 3 V+ - 10k C18 R10 150 J2 VADC 1 VADC 0.1 PF 2 C19 3 4 GND IN+ 1 4 LMP7741 U1 GND - R1 NC C2 0.1 PF 0.1 PF 5 V- + 3 2 6 R7 Vref 4 C12 NC 0.1 PF R12 GND 5 IN- 0 GND V+ 10k C4 0.1 PF C10 C24 6 J8 SMA LMP2021 R17 3 + + C20 0 6.8 PF C11 0.1 PF 0.1 PF 0.1 PF 0.1 PF C14 C22 0.1 PF 4 C21 C25 JP3 R3 U3 V- 1k C13 1 C23 0.1 PF J5 V- 6.8 PF C3 0.1 PF C15 + V+ 1 7 - J4 GND + 2 J3 V+ 1 J7 +5V 0.1 PF 1 V- 6.8 PF 0.1 PF VADC V- V+ V- Figure 1. Schematic 2 AN–1932 LMP2021MAEVAL - Bridge Sensor Instrumentation Amplifier Evaluation Board SNOA537A – December 2008 – Revised April 2013 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated Amplifier Gain www.ti.com Figure 2. PCB Top Figure 3. PCB Bottom SNOA537A – December 2008 – Revised April 2013 Submit Documentation Feedback AN–1932 LMP2021MAEVAL - Bridge Sensor Instrumentation Amplifier Evaluation Board Copyright © 2008–2013, Texas Instruments Incorporated 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
LMP2021MAEVAL 价格&库存

很抱歉,暂时无法提供与“LMP2021MAEVAL”相匹配的价格&库存,您可以联系我们找货

免费人工找货