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LMR36015SBRNXR

LMR36015SBRNXR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    VFQFN12

  • 描述:

    4.2-V TO 60-V, 1.5-A ULTRA-SMALL

  • 数据手册
  • 价格&库存
LMR36015SBRNXR 数据手册
LMR36015S SNVSBV9 – LMR36015S JANUARY 2021 SNVSBV9 – JANUARY 2021 www.ti.com LMR36015S 4.2-V to 60-V, 1.5-A Buck Converter with -55°C Junction Temperature 1 Features 2 Applications • • • • • • • • • • • • • Functional Safety-Capable – Documentation available to aid functional safety system design Designed for reliable and rugged applications – Input transient protection up to 66 V – Junction temperature range –55°C to +150°C – 0.4-V dropout with 1.5-A load (typical) Suited for scalable industrial power supplies – Pin compatible with: • LMR36006 (60 V, 0.6 A) • LMR33620/LMR33630 (36 V, 2 A, or 3 A) – 400-kHz, 1-MHz frequency options Small, 2-mm × 3-mm HotRod™ package Low power dissipation across load spectrum – 90% efficiency at 400 kHz (24 VIN, 5 VOUT, 1 A) – 93% efficiency at 400 kHz (12 VIN, 5 VOUT, 1 A) – Increased light load efficiency in PFM – Low operating quiescent current of 26 µA Solution with few external components Optimized for ultra low EMI requirements – Meets CISPR25 class 5 standard – HotRod package minimizes switch node ringing – Parallel input path minimizes parasitic inductance – Spread spectrum reduces peak emissions Create a custom design using the LMR36015S with the WEBENCH® Power Designer Aerospace and defense Field transmitters and sensors, PLC modules Thermostats, video surveillance, HVAC systems AC and servo drives, rotary encoders Industrial transport, asset tracking 3 Description The LMR36015S regulator is an easy-to-use, synchronous, step-down DC/DC converter. With integrated high-side and low-side power MOSFETs, up to 1.5 A of output current is delivered over a wide input voltage range of 4.2 V to 60 V. Tolerance goes up to 66 V. The transient tolerance reduces the necessary design effort to protect against overvoltages and meets the surge immunity requirements of IEC 61000-4-5. The LMR36015S uses peak-current-mode control to provide optimal efficiency and output voltage accuracy. Load transient performance is improved with FPWM feature in the 1-MHz regulator. Precision enable gives flexibility by enabling a direct connection to the wide input voltage or precise control over device start-up and shutdown. The power-good flag, with built-in filtering and delay, offers a true indication of system status eliminating the requirement for an external supervisor. Device Information PART NUMBER PACKAGE(1) BODY SIZE (NOM) LMR36015S VQFN-HR (12) 2.00 mm × 3.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. BOOT VIN VIN CIN CBOOT EN VOUT SW L1 COUT PGND LMR36015S PG VCC RFBT CVCC FB RFBB AGND VOUT = 5 V 400 kHz Efficiency Simplified Schematic An©IMPORTANT NOTICEIncorporated at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, Copyright 2021 Texas Instruments Submit Document Feedback intellectual property matters and other important disclaimers. PRODUCTION DATA. Product Folder Links: LMR36015S 1 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Description (continued).................................................. 2 6 Device Comparison Table...............................................3 7 Pin Configuration and Functions...................................4 8 Specifications.................................................................. 5 8.1 Absolute Maximum Ratings ....................................... 5 8.2 ESD Ratings .............................................................. 5 8.3 Recommended Operating Conditions ........................5 8.4 Thermal Information ...................................................6 8.5 Electrical Characteristics ............................................6 8.6 Timing Requirements ................................................. 7 8.7 System Characteristics .............................................. 8 8.8 Typical Characteristics................................................ 9 9 Detailed Description......................................................10 9.1 Overview................................................................... 10 9.2 Functional Block Diagram......................................... 11 9.3 Feature Description...................................................11 9.4 Device Functional Modes..........................................16 10 Application and Implementation................................ 18 10.1 Application Information........................................... 18 10.2 Typical Application.................................................. 18 10.3 What to Do and What Not to Do............................. 32 11 Power Supply Recommendations..............................33 12 Layout...........................................................................34 12.1 Layout Guidelines................................................... 34 12.2 Layout Example...................................................... 36 13 Device and Documentation Support..........................37 13.1 Device Support....................................................... 37 13.2 Documentation Support.......................................... 37 13.3 Receiving Notification of Documentation Updates..37 13.4 Support Resources................................................. 37 13.5 Trademarks............................................................. 38 13.6 Electrostatic Discharge Caution..............................38 13.7 Glossary..................................................................38 14 Mechanical, Packaging, and Orderable Information.................................................................... 38 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES January 2021 * Initial release 5 Description (continued) The LMR36015S is in a HotRod package which enables low noise, higher efficiency, and the smallest package to die ratio. The device requires few external components and has a pinout designed for simple PCB layout. The small solution size and feature set of the LMR36015S are designed to simplify implementation for a wide range of end equipment, including space critical applications of ultra-small field transmitters and vision sensors. 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 6 Device Comparison Table ORDERABLE PART NUMBER OUTPUT VOLTAGE FPWM fSW PACKAGE QUANTITY LMR36015SARNXR Adjustable No 400 kHz 3000 LMR36015SFBRNXR Adjustable Yes 1 MHz 3000 LMR36015SBRNXR Adjustable No 1 MHz 3000 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 3 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 7 Pin Configuration and Functions SW 12 5 PGND 1 11 PGND 10 VIN VIN 2 NC 3 9 EN BOOT 4 8 PG 5 6 7 VCC AGND FB Figure 7-1. 12-Pin VQFN-HR RNX Package (Top View) Table 7-1. Pin Functions NO. NAME TYPE DESCRIPTION 1, 11 PGND G Power ground terminal. Connect to system ground and AGND. Connect to CIN with short wide traces. 2, 10 VIN P Input supply to regulator. Connect to CIN with short wide traces. 3 NC — Connect the SW pin to NC on the PCB. This simplifies the connection from the CBOOT capacitor to the SW pin. This pin has no internal connection to the regulator. 4 BOOT P Bootstrap supply voltage for internal high-side driver. Connect a high-quality 100-nF capacitor from this pin to the SW pin. Connect the SW pin to NC on the PCB. This simplifies the connection from the CBOOT capacitor to the SW pin. 5 VCC P Internal 5-V LDO output. Used as supply to internal control circuits. Do not connect to external loads. Can be used as logic supply for power-good flag. Connect a high-quality 1-µF capacitor from this pin to GND. 6 AGND G Analog ground for regulator and system. Ground reference for internal references and logic. All electrical parameters are measured with respect to this pin. Connect to system ground on PCB. 7 FB A Feedback input to regulator. Connect to tap point of feedback voltage divider. Do not float. Do not ground. 8 PG A Open-drain power-good flag output. Connect to suitable voltage supply through a current limiting resistor. High = power OK, low = power bad. Goes low when EN = Low. Can be open or grounded when not used. 9 EN A Enable input to regulator. High = ON, low = OFF. Can be connected directly to VIN; Do not float. 12 SW P Regulator switch node. Connect to power inductor. Connect the SW pin to NC on the PCB. This simplifies the connection from the CBOOT capacitor to the SW pin. A = Analog, P = Power, G = Ground 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 8 Specifications 8.1 Absolute Maximum Ratings Over operating junction temperature range of -55°C to 150°C (unless otherwise noted)(1) MIN MAX UNIT Input voltage VIN to PGND –0.3 66 V Input voltage EN to AGND –0.3 66.3 V Input voltage FB to AGND –0.3 5.5 V Input voltage PG to AGND –0.3 22 V Input voltage AGND to PGND –0.3 0.3 V Output voltage SW to PGND –0.3 66.3 V Output voltage SW to PGND less than 10-ns transients –3.5 66.3 V Output voltage CBOOT to SW –0.3 5.5 V Output voltage VCC to AGND –0.3 5.5 V Junction Temperature TJ -55 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings V(ESD) Electrostatic discharge V(ESD) Electrostatic discharge (1) (2) VALUE UNIT Human-body model (HBM) per ANSI/ESDA/JEDEC JS-001(1) ±2500 V Charged-device model (CDM) per JEDEC specification JESD22-C101(2) ±750 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions Over the recommended operating junction temperature range of –55℃ to 150℃ (unless otherwise noted)(1) MIN MAX 4.2 60 V PGND(2) 0 60 V PG to PGND(2) 0 18 V IOUT 0 1.5 A VIN to PGND Input voltage Output current (1) (2) EN to UNIT Recommended operating conditions indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical Characteristics. The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 5 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 8.4 Thermal Information LMR36015S THERMAL METRIC(1) RNX (VQFN-HR) UNIT 12 PINS RθJA Junction-to-ambient thermal resistance 72.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 35.9 °C/W RθJB Junction-to-board thermal resistance 23.3 °C/W ψJT Junction-to-top characterization parameter 0.8 °C/W ψJB Junction-to-board characterization parameter 23.5 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 8.5 Electrical Characteristics Limits apply over operating junction temperature (TJ ) range of –55°C to +150°C, unless otherwise stated. Minimum and Maximum limits(1) are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply: VIN = 24 V. PARAMETER TEST CONDITIONS MIN TYP MAX 18 26 36 UNIT SUPPLY VOLTAGE (VIN PIN) IQ-nonSW Operating quiescent current (nonswitching)(2) VEN = 3.3 V (PFM variant only) ISD Shutdown quiescent current; measured at VIN pin VEN = 0 V 5 µA µA ENABLE (EN PIN) VEN-VCC-H Enable input high level for VCC output VENABLE rising VEN-VCC-L Enable input low level for VCC output VENABLE falling 0.3 1.14 VEN-VOUT-H Enable input high level for VOUT VENABLE rising 1.157 V V 1.231 1.3 V VEN-VOUT-HYS Enable input hysteresis for VOUT Hysteresis below VENABLE-H; falling 110 mV ILKG-EN VEN = 3.3V 0.2 nA Enable input leakage current INTERNAL LDO (VCC PIN) VCC VCC-UVLORising VCC-UVLOFalling Internal VCC voltage 6 V ≤ VIN ≤ 60 V 4.75 5 5.25 V Internal VCC undervoltage lockout VCC rising 3.6 3.8 4.0 V Internal VCC undervoltage lockout VCC falling 3.1 3.3 3.5 V 1 1.015 VOLTAGE REFERENCE (FB PIN) VFB Feedback voltage ILKG-FB Feedback leakage current 0.985 FB = 1 V 0.2 V nA CURRENT LIMITS AND HICCUP ISC High-side current limit(3) 2 2.4 2.8 A ILS-LIMIT Low-side current limit(3) 1.55 1.8 2.07 A IL-ZC Zero cross detector threshold IPEAK-MIN Minimum inductor peak current(3) IL-NEG 6 Negative current limit(3) PFM variants only FPWM variant only Submit Document Feedback –1.8 0.02 A 0.45 A –1.4 –0.9 A Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 Limits apply over operating junction temperature (TJ ) range of –55°C to +150°C, unless otherwise stated. Minimum and Maximum limits(1) are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply: VIN = 24 V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER GOOD (PGOOD PIN) VPG-HIGH-UP Power-Good upper threshold - rising % of FB voltage 105% 107% 110% VPG-LOW-DN Power-Good lower threshold - falling % of FB voltage 90% 93% 95% VPG-HYS Power-Good hysteresis (rising & falling) % of FB voltage TPG Power-Good rising/falling edge deglitch delay VPG-VALID Minimum input voltage for proper Power-Good function RPG Power-Good on-resistance VEN = 2.5 V RPG Power-Good on-resistance VEN = 0 V FOSC Internal oscillator frequency 1-MHz variant FOSC Internal oscillator frequency 400-kHz variant RDS-ON-HS High-side MOSFET ON-resistance RDS-ON-LS Low-side MOSFET ON-resistance 2% 80 140 200 µs 2 V 80 165 Ω 35 90 Ω 0.85 1 1.15 MHz 340 400 460 kHz IOUT = 0.5 A 225 435 mΩ IOUT = 0.5 A 150 280 mΩ OSCILLATOR MOSFETS (1) (2) (3) MIN and MAX limits are 100% production tested at 25℃. Limits over the operating temperature range verified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). This is the current used by the device open loop. It does not represent the total input current of the system when in regulation. The current limit values in this table are tested, open loop, in production. They may differ from those found in a closed loop application. 8.6 Timing Requirements Limits apply over operating junction temperature (TJ ) range of –55°C to +150°C, unless otherwise stated. Minimum and Maximum limits(1) are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply: VIN = 24 V. MIN NOM MAX UNIT tON-MIN Minimum switch on-time 55 83 ns tOFF-MIN Minimum switch off-time 53 73 ns 7 12 µs 4.5 6 ms tON-MAX Maximum switch on-time tSS Internal soft-start time (1) 3 MIN and MAX limits are 100% production tested at 25℃. Limits over the operating temperature range verified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL). Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 7 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 8.7 System Characteristics The following specifications apply to a typical application circuit with nominal component values. Specifications in the typical (TYP) column apply to TJ = 25℃ only. Specifications in the minimum (MIN) and maximum (MAX) columns apply to the case of typical components over the temperature range of TJ = –55℃ to 150℃. These specifications are not ensured by production testing. PARAMETER VIN Operating input voltage range VOUT Adjustable output voltage regulation(1) VOUT MIN TYP MAX UNIT 4.2 60 PFM operation –1.5% 2.5% Adjustable output voltage regulation(1) FPWM operation –1.5% 1.5% ISUPPLY Input supply current when in regulation VIN = 24 V, VOUT = 3.3 V, IOUT = 0 A, RFBT = 1 MΩ, PFM variant DMAX Maximum switch duty cycle(2) VHC FB pin voltage required to trip shortcircuit hiccup mode 0.4 V tHC Time between current-limit hiccup burst 94 ms tD Switch voltage dead time 2 ns TSD Thermal shutdown temperature Shutdown temperature 170 °C TSD Thermal shutdown temperature Recovery temperature 158 °C (1) (2) 8 TEST CONDITIONS 26 V µA 98% Deviation in VOUT from nominal output voltage value at VIN = 24 V, IOUT = 0 A to 1.5 A In dropout the switching frequency drops to increase the effective duty cycle. The lowest frequency is clamped at approximately: FMIN = 1 / (tON-MAX + tOFF-MIN). DMAX = tON-MAX /(tON-MAX + tOFF-MIN). Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 8.8 Typical Characteristics Unless otherwise specified the following conditions apply: TA = 25°C. VIN = 24 V. VFB = 1 V EN = 0 V Figure 8-1. Non-Switching Input Supply Current Figure 8-2. Shutdown Supply Current VIN = 24 V VIN = 24 V Figure 8-3. High Side Current Limit Figure 8-4. Low Side Current Limit IOUT = 0 A Figure 8-5. Reference Voltage Drift VOUT = 3.3 V ƒSW = 400 kHz Figure 8-6. IPEAK-MIN Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 9 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 9 Detailed Description 9.1 Overview The LMR36015S is a synchronous peak-current-mode buck regulator designed for a wide variety of industrial applications. The regulator automatically switches modes between PFM and PWM, depending on load. At heavy loads, the device operates in PWM at a constant switching frequency. At light loads, the mode changes to PFM with diode emulation allowing DCM. This reduces the input supply current and keeps efficiency high. The device features internal loop compensation which reduces design time and requires fewer external components than externally compensated regulators. The LMR36015S is designed with a flip-chip or HotRod technology, greatly reducing the parasitic inductance of pins. In addition, the layout of the device allows for reduction in the radiated noise generated by the switching action through partial cancellation of the current generated magnetic field. As a result, the switch-node waveform exhibits less overshoot and ringing. 2V/div 50ns/div BW:500MHz Figure 9-1. Switch Node Waveform 10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 9.2 Functional Block Diagram VCC INT. REG. BIAS OSCILLATOR EN VIN ENABLE LOGIC BOOT HS CURRENT SENSE 1.0V Reference ERROR AMPLIFIER FB + - PG + - PWM COMP. CONTROL LOGIC PFM MODE CONTROL SW DRIVER LS CURRENT SENSE POWER GOOD CONTROL AGND PGND 9.3 Feature Description 9.3.1 Power-Good Flag Output The power-good flag function (PG output pin) of the LMR36015S can be used to reset a system microprocessor whenever the output voltage is out of regulation. This open-drain output goes low under fault conditions, such as current limit and thermal shutdown, as well as during normal start-up. A glitch filter prevents false flag operation for short excursions of the output voltage, such as during line and load transients. Output voltage excursions lasting less than tPG do not trip the power-good flag. Power-good operation can best be understood by reference to Figure 9-2 and Figure 9-3. Note that during initial power up, a delay of about 4 ms (typical) is inserted from the time that EN is asserted to the time that the power-good flag goes high. This delay only occurs during start-up and is not encountered during normal operation of the power-good function. The power-good output consists of an open-drain NMOS, requiring an external pullup resistor to a suitable logic supply. It can also be pulled up to either VCC or VOUT through an appropriate resistor as desired. If this function is not needed, the PG pin must be grounded. When EN is pulled low, the flag output is also forced low. With EN low, power good remains valid as long as the input voltage is ≥ 2 V (typical). Limit the current into this pin to ≤ 4 mA. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 11 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 VOUT VPG-HIGH_UP (107%) VPG-HIGH-DN (105%) VPG-LOW-UP (95%) VPG-LOW-DN (93%) PG High = Power Good Low = Fault Figure 9-2. Static Power-Good Operation 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 Glitches do not cause false operation nor reset timer VOUT VPG-LOW-UP (95%) VPG-LOW-DN (93%) 100 kΩ are used. Large values of RFBT, in combination with the parasitic capacitance at the FB pin, can create a small signal pole that interferes with the loop stability. A CFF can help to mitigate this effect. Equation 9 can be used to estimate the value of CFF. The value found with Equation 9 is a starting point; use lower values to determine if any advantage is gained by the use of a CFF capacitor. The Optimizing Transient Response of Internally Compensated DC-DC Converters with Feed-forward Capacitor Application Report is helpful when experimenting with a feedforward capacitor. CFF VOUT ˜ COUT 120 ˜ RFBT ˜ VREF VOUT (9) Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 23 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 10.2.1.2.9.1 External UVLO In some cases, an input UVLO level different than that provided internal to the device is needed. This can be accomplished by using the circuit shown in Figure 10-2 can be used. The input voltage at which the device turns on is designated VON while the turnoff voltage is VOFF. First, a value for RENB is chosen in the range of 10 kΩ to 100 kΩ and then Equation 10 is used to calculate RENT and VOFF. VIN RENT EN RENB Figure 10-2. Setup for External UVLO Application RENT § VON ¨¨ © VEN H VOFF § VEN HYS VON ˜ ¨¨1 VEN © · 1¸¸ ˜ RENB ¹ · ¸¸ ¹ (10) where • • VON = VIN turnon voltage VOFF = VIN turnoff voltage 24 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 10.2.1.2.10 Maximum Ambient Temperature As with any power conversion device, the LMR36015S dissipates internal power while operating. The effect of this power dissipation is to raise the internal temperature of the converter above ambient. The internal die temperature (TJ) is a function of the ambient temperature, the power loss and the effective thermal resistance, RθJA of the device, and PCB combination. The maximum internal die temperature for the LMR36015S must be limited to 150°C. This establishes a limit on the maximum device power dissipation and, therefore, the load current. Equation 11 shows the relationships between the important parameters. It is easy to see that larger ambient temperatures (TA) and larger values of RθJA reduce the maximum available output current. The converter efficiency can be estimated by using the curves provided in this data sheet. If the desired operating conditions cannot be found in one of the curves, then interpolation can be used to estimate the efficiency. Alternatively, the EVM can be adjusted to match the desired application requirements and the efficiency can be measured directly. The correct value of RθJA is more difficult to estimate. As stated in the Semiconductor and IC Package Thermal Metrics Application Report, the values given in Section 8.4 are not valid for design purposes and must not be used to estimate the thermal performance of the application. The values reported in that table were measured under a specific set of conditions that are rarely obtained in an actual application. IOUT MAX TJ TA 1 K ˜ ˜ R TJA 1 K VOUT (11) where • η = efficiency The effective RθJA is a critical parameter and depends on many factors such as power dissipation, air temperature/flow, PCB area, copper heat-sink area, number of thermal vias under the package, and adjacent component placement, to mention just a few. Due to the ultra-miniature size of the VQFN (RNX) package, a DAP is not available. This means that this package exhibits a somewhat greater RθJA. A typical example of RθJA versus copper board area can be found in Figure 10-3. Note that the data given in this graph is for illustration purposes only, and the actual performance in any given application depends on all of the factors mentioned above. 70 60 55 R JA (ƒC/w) 65 50 45 RNX, 4L 40 0 10 20 30 40 50 Copper Area (cm2) 60 70 C005 Figure 10-3. RθJA versus Copper Board Area for the VQFN (RNX) Package Use the following resources as guides to optimal thermal PCB design and estimating RθJA for a given application environment: • • • • Thermal Design by Insight not Hindsight Application Report Semiconductor and IC Package Thermal Metrics Application Report Thermal Design Made Simple with LM43603 and LM43602 Application Report Using New Thermal Metrics Application Report Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 25 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 10.2.2 Application Curves Unless otherwise specified the following conditions apply: VIN = 24 V, TA = 25°C. The circuit is shown in Figure 10-1, with the appropriate BOM from Table 10-3. 90% 80% 80% 70% 70% 60% 60% Efficiency 100% 90% Efficiency 100% 50% 40% 30% 10% 0 0.001 0.005 0.02 0.05 0.1 0.20.3 0.5 Output Current (A) VOUT = 5 V 1 40% 30% 8 VIN 12 VIN 24 VIN 48 VIN 60 VIN 20% 50% 6 VIN 12 VIN 24 VIN 48 VIN 60 VIN 20% 10% 0 0.001 2 0.005 400 kHz VOUT = 3.3 V Figure 10-4. Efficiency 1 2 LMR3 400 kHz Figure 10-5. Efficiency 3.37 5.08 5.04 5.02 5 6 VIN 12 VIN 24 VIN 48 VIN 60 VIN 3.36 3.35 Output Voltage (V) 8 VIN 12 VIN 24 VIN 48 VIN 60 VIN 5.06 Output Voltage (V) 0.02 0.05 0.1 0.20.3 0.5 Output Current (A) LMR3 3.34 3.33 3.32 3.31 4.98 3.3 4.96 3.29 0 0.25 0.5 0.75 1 Output Current (A) VOUT = 5 V 1.25 1.5 0 0.25 0.5 0.75 1 Output Current (A) LMR3 400 kHz VOUT = 3.3 V Figure 10-6. Load Regulation 1.25 1.5 LMR3 400 kHz Figure 10-7. Load Regulation 4 5.5 5 3.5 3 4 Output Voltage (V) Output Voltage (V) 4.5 3.5 3 2.5 2 1.5 2 1.5 1 1 IOUT = 0.0015 A IOUT = 0.75 A IOUT = 1.5 A 0.5 0 IOUT = 0.0015 A IOUT = 0.75 A IOUT = 1.5 A 0.5 0 0 5 10 15 20 25 30 35 40 Input Voltage (V) VOUT = 5 V 45 50 55 60 0 5 10 LMR3 400 kHz Figure 10-8. Line Regulation 26 2.5 VOUT = 3.3 V 15 20 25 30 35 40 Input Voltage (V) 45 50 55 60 LMR3 400 kHz Figure 10-9. Line Regulation Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 6 4.5E+5 4E+5 3.5E+5 Switching Frequency (Hz) Output Voltage (V) 5.5 5 4.5 4 3E+5 2.5E+5 2E+5 1.5E+5 1E+5 IOUT = 0.0015 A IOUT = 0.75 A IOUT = 1.5 A 3.5 IOUT = 0.75 A IOUT = 1.5 A 5E+4 3 0 4 4.2 4.4 4.6 4.8 5 5.2 Input Voltage (V) VOUT = 5 V 5.4 5.6 5.8 6 5 5.1 5.2 LMR3 400 kHz 5.3 5.4 5.5 5.6 Input Voltage (V) VOUT = 5 V Figure 10-10. Overall Dropout Characteristic 5.7 5.8 5.9 6 LMR3 400 kHz Figure 10-11. Frequency Dropout Characteristic 500 45 Output Current (mA) Input Supply Current (µA) 450 40 35 30 400 350 300 250 25 200 20 150 5 10 15 VOUT = 3.3 V 20 25 30 35 40 Input Voltage IOUT= 0 A 45 50 55 5 10 15 LMR3 RFBT= 100 kΩ Figure 10-12. Input Supply Current VOUT = 5 V 60 400 kHz Figure 10-14. Start-Up Waveform VOUT = 3.3 V 20 25 30 35 40 Input Voltage (V) 45 50 55 60 LMR3 400 kHz Figure 10-13. Mode Change Thresholds VOUT = 3.3 V 400 kHz Figure 10-15. Start-Up Waveform Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 27 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 VOUT = 5 V 400 kHz VOUT = 3.3 V 400 kHz ILOAD= 10 mA - 0.75 A Slew Rate = 1 µs/A ILOAD= 10 mA - 0.75 A Slew Rate = 1 µs/A Figure 10-16. Load Transient VIN = 13.5 V VOUT = 5 V IOUT = 1.5 A Figure 10-18. Conducted EMI vs. CISPR25 Limits (Yellow: Peak Signal, Blue: Average Signal) VOUT = 5 V IOUT = 1.5 A Frequency Tested: 150 kHz to 30 MHz VOUT = 5 V IOUT = 1.5 A Figure 10-19. Conducted EMI vs. CISPR25 Limits (Yellow: Peak Signal, Blue: Average Signal) VIN = 13.5 V VOUT = 5 V IOUT = 1.5 A Frequency Tested: 30 MHz to 200 MHz Figure 10-20. Radiated EMI Rod vs. CISPR25 Limits 28 VIN = 13.5 V Frequency Tested: 30 MHz to 108 MHz Frequency Tested: 150 kHz to 30 MHz VIN = 13.5 V Figure 10-17. Load Transient Figure 10-21. Radiated EMI Bicon Vertical vs. CISPR25 Limits Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 VIN = 13.5 V VOUT = 5 V IOUT = 1.5 A VIN = 13.5 V VOUT = 5 V IOUT = 1.5 A Figure 10-23. Radiated EMI Log Vertical vs. CISPR25 Limits Figure 10-22. Radiated EMI Bicon Horizontal vs. CISPR25 Limits VIN = 13.5 V VOUT = 5 V Frequency Tested: 200 MHz to 1 GHz Frequency Tested: 30 MHz to 200 MHz IOUT = 1.5 A VIN = 13.5 V Frequency Tested: 200 MHz to 1 GHz VOUT = 5 V IOUT = 1.5 A Frequency Tested: 1.83 GHz to 2.5 GHz Figure 10-24. Radiated EMI Log Horizontal vs. CISPR25 Limits Figure 10-25. Radiated EMI Horn Vertical vs. CISPR25 Limits 83H9652 VIN IN+ FB1 + CD = 100 uF GND IN± CF1 = 4.7 uF VIN = 13.5 V VOUT = 5 V CF2 = 0.1 uF CF3 = 4.7 uF IOUT = 1.5 A Frequency Tested: 1.8 GHz to 2.5 GHz Figure 10-26. Radiated EMI Horn Horizontal vs. CISPR25 Limits Figure 10-27. Recommended Input EMI Filter Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 29 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 10.2.3 Design 2: High Density 24-V, 1.5-A FPWM Converter 10.2.3.1 Design Requirements Example requirements for a typical 5-V application. The input voltages are here for illustration purposes only. See Section 8 for the operating input voltage range. Table 10-4. Detailed Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input voltage 8-V to 24-V steady state, 4.2-V to 60-V transients Output voltage 5V Maximum output current 0 A to 1.5 A Switching frequency 1000 kHz Current consumption at 0-A load Not critical: < 100 mA acceptable Switching frequency at 0-A load Critical: Need fixed frequency operation Table 10-5. List of Components for Design 2 VOUT FREQUENCY RFBB COUT L U1 5V 1000 KHz 24.9 kΩ 2 × 15 µF 8.5 µH, 30.5 mΩ LMR36015SFBRNXR 10.2.3.2 Detailed Design Procedure See Section 10.2.1.2. 30 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 10.2.3.3 Application Curves 5.08 100% 90% 5.06 80% Output Voltage (V) 70% Efficiency 60% 50% 40% 30% 6 VIN 12 VIN 24 VIN 48 VIN 60 VIN 20% 10% 0.25 0.5 0.75 1 Output Current (A) VOUT = 5 V 1.25 5.02 5 6 VIN 12 VIN 24 VIN 48 VIN 60 VIN 4.98 0 0 5.04 4.96 1.5 0 0.25 0.5 0.75 1 Output Current (A) LMR3 1000 kHz VOUT = 5 V Figure 10-28. Efficiency 1.25 1.5 LMR3 1000 kHz Figure 10-29. Load Regulation 6 1.2E+6 1.1E+6 1E+6 Switching Frequency (Hz) Output Voltage (V) 5.5 5 4.5 4 7E+5 6E+5 5E+5 4E+5 3E+5 IOUT = 0 A IOUT = 0.75 A IOUT = 1.5 A 1E+5 0 3 5 4 4.2 4.4 4.6 4.8 5 5.2 Input Voltage (V) VOUT = 5 V 5.4 5.6 5.8 5.1 5.2 6 LMR3 1000 kHz Figure 10-30. Overall Dropout Characteristic Input Supply Current (mA) 8E+5 2E+5 IOUT = 0.0015 A IOUT = 0.75 A IOUT = 1.5 A 3.5 9E+5 VOUT = 5 V 5.3 5.4 5.5 5.6 Input Voltage (V) 5.7 5.8 5.9 6 LMR3 1000 kHz Figure 10-31. Frequency Dropout Characteristic 22 21 20 19 18 17 16 15 14 13 12 11 10 9 5 10 VOUT = 5 V 15 20 25 30 35 40 Input Voltage (V) IOUT= 0 A 45 50 55 60 iq-v RFBT= 100 kΩ Figure 10-32. Input Supply Current VOUT = 5 V 1000 kHz Figure 10-33. Start-Up Waveform Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 31 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 VOUT = 5 V 1000 kHz ILOAD= 0 A – 0.75 A Slew Rate = 1 µs/A VOUT = 5 V Slew Rate = 1 µs/A 1000 kHz ILOAD= 0 A – 1.5 A Figure 10-34. Load Transient Figure 10-35. Load Transient 10.3 What to Do and What Not to Do • • • • • • 32 Don't: Exceed the Abolsute Maximum Ratings. Don't: Exceed the ESD Ratings. Don't: Allow the EN input to float. Don't: Allow the output voltage to exceed the input voltage, nor go below ground. Don't: Use the thermal data given in the Thermal Information table to design your application. Do: Follow all the guidelines and/or suggestions found in this data sheet before committing the design to production. TI application engineers are ready to help critique your design and PCB layout to help make your project a success (see Support Resources). Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 11 Power Supply Recommendations The characteristics of the input supply must be compatible with Section 8 found in this data sheet. In addition, the input supply must be capable of delivering the required input current to the loaded regulator. The average input current can be estimated with Equation 12. IIN VOUT ˜ IOUT VIN ˜ K (12) where • η is the efficiency If the regulator is connected to the input supply through long wires or PCB traces, special care is required to achieve good performance. The parasitic inductance and resistance of the input cables can have an adverse effect on the operation of the regulator. The parasitic inductance, in combination with the low-ESR, ceramic input capacitors, can form an underdamped resonant circuit, resulting in overvoltage transients at the input to the regulator. The parasitic resistance can cause the voltage at the VIN pin to dip whenever a load transient is applied to the output. If the application is operating close to the minimum input voltage, this dip can cause the regulator to momentarily shutdown, reset, or both. The best way to solve these kind of issues is to reduce the distance from the input supply to the regulator, use an aluminum or tantalum input capacitor in parallel with the ceramics, or both. The moderate ESR of these types of capacitors help to damp the input resonant circuit and reduce any overshoots. A value in the range of 20 µF to 100 µF is usually sufficient to provide input damping and help to hold the input voltage steady during large load transients. Sometimes, for other system considerations, an input filter is used in front of the regulator. This can lead to instability, as well as some of the effects mentioned above, unless it is designed carefully. The AN-2162 Simple Success With Conducted EMI From DCDC Converters User's Guide provides helpful suggestions when designing an input filter for any switching regulator. In some cases, a transient voltage suppressor (TVS) is used on the input of regulators. One class of this device has a snap-back characteristic (thyristor type). The use of a device with this type of characteristic is not recommended. When the TVS fires, the clamping voltage falls to a very low value. If this voltage is less than the output voltage of the regulator, the output capacitors discharge through the device back to the input. This uncontrolled current flow can damage the device. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 33 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 12 Layout 12.1 Layout Guidelines The PCB layout of any DC/DC converter is critical to the optimal performance of the design. Poor PCB layout can disrupt the operation of an otherwise good schematic design. Even if the converter regulates correctly, bad PCB layout can mean the difference between a robust design and one that cannot be mass produced. Furthermore, to a great extent, the EMI performance of the regulator is dependent on the PCB layout. In a buck converter, the most critical PCB feature is the loop formed by the input capacitor or capacitors and power ground, as shown in Figure 12-1. This loop carries large transient currents that can cause large transient voltages when reacting with the trace inductance. These unwanted transient voltages disrupt the proper operation of the converter. Because of this, the traces in this loop must be wide and short, and the loop area as small as possible to reduce the parasitic inductance. Figure 12-2 shows a recommended layout for the critical components of the LMR36015S. 1. Place the input capacitor or capacitors as close as possible to the VIN and GND terminals. VIN and GND pins are adjacent, simplifying the input capacitor placement. 2. Place bypass capacitor for VCC close to the VCC pin. This capacitor must be placed close to the device and routed with short, wide traces to the VCC and GND pins. 3. Use wide traces for the CBOOT capacitor. Place CBOOT close to the device with short/wide traces to the BOOT and SW pins. Route the SW pin to the N/C pin and used to connect the BOOT capacitor to SW. 4. Place the feedback divider as close as possible to the FB pin of the device. Place RFBB, RFBT, and CFF, if used, physically close to the device. The connections to FB and GND must be short and close to those pins on the device. The connection to VOUT can be somewhat longer. However, this latter trace must not be routed near any noise source (such as the SW node) that can capacitively couple into the feedback path of the regulator. 5. Use at least one ground plane in one of the middle layers. This plane acts as a noise shield and also act as a heat dissipation path. 6. Provide wide paths for VIN, VOUT, and GND. Making these paths as wide and direct as possible reduces any voltage drops on the input or output paths of the converter and maximizes efficiency. 7. Provide enough PCB area for proper heat-sinking. As stated in Section 10.2.1.2.10, enough copper area must be used to ensure a low RθJA, commensurate with the maximum load current and ambient temperature. The top and bottom PCB layers must be made with two ounce copper; and no less than one ounce. If the PCB design uses multiple copper layers (recommended), these thermal vias can also be connected to the inner layer heat-spreading ground planes. 8. Keep switch area small. Keep the copper area connecting the SW pin to the inductor as short and wide as possible. At the same time the total area of this node must be minimized to help reduce radiated EMI. See the following PCB layout resources for additional important guidelines: • • • • 34 Layout Guidelines for Switching Power Supplies Application Report Simple Switcher PCB Layout Guidelines Application Report Construction Your Power Supply- Layout Considerations Seminar Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 VIN CIN SW GND Figure 12-1. Current Loops with Fast Edges 12.1.1 Ground and Thermal Considerations As previously mentioned, TI recommends using one of the middle layers as a solid ground plane. A ground plane provides shielding for sensitive circuits and traces as well as a quiet reference potential for the control circuitry. Connect the AGND and PGND pins to the ground planes using vias next to the bypass capacitors. PGND pins are connected directly to the source of the low-side MOSFET switch and also connected directly to the grounds of the input and output capacitors. The PGND net contains noise at the switching frequency and can bounce due to load variations. The PGND trace, as well as the VIN and SW traces, must be constrained to one side of the ground planes. The other side of the ground plane contains much less noise; use for sensitive routes. Use as much copper as possible, for system ground plane, on the top and bottom layers for the best heat dissipation. Use a four-layer board with the copper thickness for the four layers, starting from the top as: 2 oz / 1 oz / 1 oz / 2 oz. A four-layer board with enough copper thickness, and proper layout, provides low current conduction impedance, proper shielding, and lower thermal resistance. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 35 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 12.2 Layout Example VOUT VOUT INDUCTOR COUT COUT COUT COUT GND GND CIN CIN CHF 12 11 2 10 3 9 EN 4 8 PGOOD VIN T 5 6 7 CVCC RFBB GND HEATSINK RFBT CBOO 1 VIN CHF GND HEATSINK INNER GND PLANE Top Trace/Plane Inner GND Plane VIN Strap on Inner Layer VIA to Signal Layer VIA to GND Planes VIA to VIN Strap Top Inner GND Plane VIN Strap and GND Plane Signal traces and GND Plane Trace on Signal Layer Figure 12-2. Example Layout 36 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 13 Device and Documentation Support 13.1 Device Support 13.1.1 Development Support • • • • • • • • • • Two-Stage Power Supply Reference Design for Field Transmitters Wide Vin Power Supply Reference Design for Space-Constrained Industrial Sensors Automotive ADAS camera power supply reference design optimized for solution size and low noise How a DC/DC converter package and pinout design can enhance automotive EMI performance Introduction to Buck Converters Features: UVLO, Enable, Soft Start, Power Good Introduction to Buck Converters: Understanding Mode Transitions Introduction to Buck Converters: Minimum On-time and Minimum Off-time Operation Introduction to Buck Converters: Understanding Quiescent Current Specifications Trade-offs between thermal performance and small solution size with DC/DC converters Reduce EMI and shrink solution size with Hot Rod packaging 13.1.1.1 Custom Design With WEBENCH® Tools Click here to create a custom design using the LMR36015S device with the WEBENCH® Power Designer. 1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements. 2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial. 3. Compare the generated design with other possible solutions from Texas Instruments. The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability. In most cases, these actions are available: • Run electrical simulations to see important waveforms and circuit performance • Run thermal simulations to understand board thermal performance • Export customized schematic and layout into popular CAD formats • Print PDF reports for the design, and share the design with colleagues Get more information about WEBENCH tools at www.ti.com/WEBENCH. 13.2 Documentation Support 13.2.1 Related Documentation For related documentation see the following: • Texas Instruments, Designing High-Performance, Low-EMI Automotive Power Supplies Application Report • Texas Instruments, Simple Switcher PCB Layout Guidelines Application Report • Texas Instruments, Construction Your Power Supply- Layout Considerations Application Report • Texas Instruments, Low Radiated EMI Layout Made Simple with LM4360x and LM4600x Application Report • Texas Instruments, Semiconductor and IC Package Thermal Metrics Application Report • Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 Application Report 13.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 13.4 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S 37 LMR36015S www.ti.com SNVSBV9 – JANUARY 2021 13.5 Trademarks HotRod™ is a trademark of TI. TI E2E™ is a trademark of Texas Instruments. WEBENCH® is a registered trademark of Texas Instruments. All trademarks are the property of their respective owners. 13.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 13.7 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 38 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: LMR36015S PACKAGE OPTION ADDENDUM www.ti.com 17-Jan-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LMR36015SARNXR ACTIVE VQFN-HR RNX 12 3000 RoHS & Green SN Level-2-260C-1 YEAR -55 to 150 ET15A LMR36015SBRNXR ACTIVE VQFN-HR RNX 12 3000 RoHS & Green SN Level-2-260C-1 YEAR -55 to 150 ET15B LMR36015SFBRNXR ACTIVE VQFN-HR RNX 12 3000 RoHS & Green SN Level-2-260C-1 YEAR -55 to 150 ET15FB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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