LMR36506MSCEVM

User's Guide SNVU670A – February 2020 – Revised June 2020 LMR36506MSCEVM User’s Guide The Texas Instruments LMR36506MSCEVM evaluation module help designers evaluate the operation and performance of the LMR36506-Q1 wide-input buck converters. The LMR36506-Q1 is an easy-to-use synchronous step-down DC/DC converter capable of driving up to 0.6 A of load current from an input voltage of up to 65 V. The LMR36506MSCEVM features an output voltage of 5 V and a switching frequency of 2.2 MHz. See the LMR36506-Q1 3-V–65-V, 0.6-A Synchronous Buck Converter Optimized for Size and Light Load Efficiency data sheet for additional features, detailed descriptions, and available options. Table 1. Device and Package Configurations EVM U1 FREQUENCY SPREAD SPECTRUM CURRENT PIN 1 TRIM LMR36506MSCEVM LMR36506MSCQRPETQ1 2200 kHz Enabled 0.6 A MODE/SYNC Figure 1. LMR36506MSCEVM Board SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated LMR36506MSCEVM User’s Guide 1 www.ti.com 1 2 3 4 5 6 Contents Setup .......................................................................................................................... 3 Operation ..................................................................................................................... 5 Schematic ..................................................................................................................... 6 Board Layout ................................................................................................................. 7 Bill of Materials ............................................................................................................. 10 Test Results ................................................................................................................ 11 1 LMR36506MSCEVM Board ................................................................................................ 1 2 EVM Board Connections.................................................................................................... 3 3 Jumper Locations ............................................................................................................ 4 4 LMR36506MSCEVM Schematic ........................................................................................... 6 5 Top View of EVM ............................................................................................................ 7 6 EVM Top Copper Layer ..................................................................................................... 7 7 EVM Mid Layer One ......................................................................................................... 8 8 EVM Mid Layer Two ......................................................................................................... 8 9 EVM Bottom Copper Layer ................................................................................................. 9 10 LMR36506MSCEVM 5 VOUT Efficiency .................................................................................. 11 11 LMR36506MSCEVM 5 VOUT Load Regulation .......................................................................... 11 12 LMR36506MSCEVM Load Transient 12 VIN, 5 VOUT, IOUT = 0.3 A to 0.6 A, TR = TF = 1 µs CH1 = VOUT, CH4 = IOUT ................................................................................................................. 11 13 LMR36506MSCEVM Output Ripple 12 VIN, 5 VOUT, IOUT = 0 A ........................................................ 11 14 LMR36506MSCEVM 5 VOUT Thermal Capture, 12 VIN, 0.6 A Load, 2.2 MHz List of Figures 15 ...................................... LMR36506MSCEVM 5 VOUT Thermal Capture, 24 VIN, 0.6 A Load, 2.2 MHz ...................................... 12 12 16 LMR36506MSCEVM CISPR25 Conducted EMI Results 13.5 VIN, 5 VOUT, IOUT = 0.6 A (Blue-Average and Yellow-Peak) ............................................................................................................... 12 17 LMR36506MSCEVM CISPR25 Conducted EMI Results 13.5 VIN, 5 VOUT, IOUT = 0.6 A (Blue-Average and Yellow-Peak) ................................................................................................................ 12 List of Tables 1 Device and Package Configurations ...................................................................................... 1 2 Bill of Materials ............................................................................................................. 10 Trademarks All trademarks are the property of their respective owners. 2 LMR36506MSCEVM User’s Guide SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Setup www.ti.com 1 Setup This section describes the test points and connectors on the EVM and how to properly connect, set up, and use the LMR36506MSCEVM. 1.1 Test Points The test points on the top of the board can be used for connecting to the input and output of the EVM. See Figure 2 for typical test setup. The functions of the test points connections are: • VIN_EMI — Input supply to EVM including an EMI filter. Connect to a suitable input supply. Connect at this point for conducted EMI test. • GND_EMI — Ground connection for the input supply • VIN — Input supply to the IC. Can be connected to DMM to measure input voltage after EMI filter • VOUT — Output voltage test point of EVM. Can be connected to a desired load • GND — Ground test points • EN — This test point is connected to the EN pin. By default, there is a pullup resistor R2 (RENT) to VIN to enable the IC. • PGOOD — This test point is connected to the PGOOD pin from the IC. It is an open-drain output of the PGOOD pin. Can be tied to external supply through a pullup resistor or left open • SYNC — In a MODE/SYNC trim part, this test point is connected to the SYNC pin of the IC. Can be connected to an external clock to synchronize the IC. Make sure R4 (RMODE) is installed and R5 (RT) is not installed. In a RT trim part, this test point is connected to the RT pin of the IC when the R4 (RMODE) is installed. (+) Input Supply (-) (+) (+) DMM DMM (-) (-) (+) Load (-) Figure 2. EVM Board Connections SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated LMR36506MSCEVM User’s Guide 3 Setup 1.2 www.ti.com Jumpers See Figure 3 for jumper locations. • JEN - This jumper allows the ENABLE input to be connected to GND in order to disable the IC. By default, this jumper is left open since there is a pullup resistor R2 (RENT) to VIN to enable the IC. • JPGOOD - Use this jumper to select how the PGOOD pin can be connected. A jumper can be used to connect pin 2 and 3. In this configuration, the PGOOD pin will be pulled up to VOUT through R9 (RPGOOD) with a value of 100 kΩ. By default, this jumper is left open. • JMODE/RT - Use this jumper to select the mode of operation in a MODE/SYNC trim part. Connecting a jumper between pin 1 and 2 cause the IC to operate in PFM (Pulse Frequency Modulation) mode for a higher efficiency at light load. A jumper between pin 2 and pin 3 causes the IC to operate in FPWM mode (Forced Pulse Width Modulation) mode. By default, the jumper is connected between pin 1 and 2. In an RT trim part, connecting this jumper from pin 1 and 2 sets the switching frequency to 2.2 MHz and connecting this jumper from pin 2 and 3 sets the switching frequency to 1 MHz. See the LMR36506-Q1 3-V–65-V, 0.6-A Synchronous Buck Converter Optimized for Size and Light Load Efficiency data sheet for more information on switching frequency configuration. ENABLE OFF JUMPER PGOOD SELECTION JUMPER MODE SELECTION JUMPER Figure 3. Jumper Locations 4 LMR36506MSCEVM User’s Guide SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Operation www.ti.com 2 Operation 2.1 Quick Start 1. Connect the voltage supply between the VIN_EMI and GND_EMI test points. 2. Connect the load between the VOUT and GND test points. 3. Set the supply voltage at an appropriate level between 5.5 V to 65 V. Set the current limit of the supply to an appropriate level. 4. Turn on the power supply. With the default configuration, the EVM powers up and provides VOUT = 5 V. 5. Monitor the output voltage. The maximum load current must be 0.6 A with the LMR36506 device. SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated LMR36506MSCEVM User’s Guide 5 Schematic 3 www.ti.com Schematic TP5 VIN VIN = 5.5V - 65V TP6 L3 VINF C3 VIN_EMI TP1 U1 DNP C7 Cfilt 0.1uF C6 Cd 1uF C9 CIN3 2.2uF C11 Cfilt1 0.1uF C8 CBulk 22uF C12 Cfilt2 0.1uF C1 CIN1 2.2uF C2 CIN2 0.1uF R8 Rd 4.99 TP7 R2 RENT 100k GND 4 VIN EN 3 EN/UVLO VCC 7 VCC RT 1 MODE/SYNC BOOT C4 CVCC 1uF PGOOD 2 R5 DNP RT 0 GND SW FB PGOOD GND VOUT VOUT = 5V 5 SW VOUT 6.8µH C5 DNP C10 COUT1 COUT2 22uF 22uF B R6 RINJ 49.9 GND TP4 VOUT 8 FB 9 LMR36506MSCQRPETQ1 TP8 C14 COUTHF 1nF TP3 GND GND A GND R3 RFBT 100k GND PGOOD 6 BOOT L1 R1 DNP RENB 100k GND_EMI VIN CB 0.1uF RT TP9 DNP C13 CFF 10pF TP10 SYNC R9 RPGOOD 100k PGOOD R7 RFBB 24.9k R4 RMODE 0 TP11 TP2 VOUT VCC EN EN 3 2 1 3 2 1 GND GND J3 2 1 GND J1 JPGOOD J2 JMODE/RT JEN GND Figure 4. LMR36506MSCEVM Schematic 6 LMR36506MSCEVM User’s Guide SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Board Layout www.ti.com 4 Board Layout Figure 5. Top View of EVM Figure 6. EVM Top Copper Layer SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated LMR36506MSCEVM User’s Guide 7 Board Layout www.ti.com Figure 7. EVM Mid Layer One Figure 8. EVM Mid Layer Two 8 LMR36506MSCEVM User’s Guide SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Board Layout www.ti.com Figure 9. EVM Bottom Copper Layer SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated LMR36506MSCEVM User’s Guide 9 Bill of Materials 5 www.ti.com Bill of Materials Table 2. Bill of Materials DESIGNATOR COMMENT DESCRIPTION MANUFACTURER PART NUMBER QUANTITY C1, C9 CIN1, CIN3 CAP, CERM, 2.2 uF, 100 V, +/- 10%, X7S, AECQ200 Grade 1, 1206 TDK CGA5L3X7S2A225K160AB 2 C2 CIN2 CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, 0603 MuRata GRM188R72A104KA35D 1 C3 CB CAP, CERM, 0.1 uF, 25 V, +/- 20%, X7R, 0402 TDK C1005X7R1E104M050BB 1 C4 CVCC CAP, CERM, 1 uF, 16 V, +/- 10%, X7R, 0603 Wurth Elektronik 885012206052 1 C5 COUT1 CAP, CERM, 22 uF, 10 V, +/- 10%, X7R, AEC-Q200 Grade 1, 1206 MuRata GCM31CR71A226KE02 1 C6 Cd CAP, CERM, 1 uF, 100 V, +/- 10%, X7R, 1206 TDK C3216X7R2A105K160AA 1 Cfilt CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, AECQ200 Grade 1, 0805 TDK CGA4J2X7R2A104K125AA 0 C8 CBulk CAP, AL, 22 uF, 100 V, +/- 20%, 1.3 ohm, AEC-Q200 Grade 2, SMD Panasonic EEE-FK2A220P 1 C10 COUT2 CAP, CERM, 22 uF, 10 V, +/- 10%, X7R, AEC-Q200 Grade 1, 1206 MuRata GCM31CR71A226KE02 0 C11, C12 Cfilt1, Cfilt2 CAP, CERM, 0.1 uF, 100 V, +/- 10%, X7R, AECQ200 Grade 1, 0805 TDK CGA4J2X7R2A104K125AA 2 C13 CFF CAP, CERM, 10 pF, 50 V, +/- 5%, C0G/NP0, AECQ200 Grade 1, 0402 TDK CGA2B2C0G1H100D050BA 0 C7 10 C14 COUTHF CAP, CERM, 1000 pF, 100 V, +/- 10%, X7R, 0603 MuRata GRM188R72A102KA01D 1 FID1, FID2, FID3, FID4, FID5, FID6 Fiducial Fiducial mark. There is nothing to buy or mount. N/A N/A 0 J1, J2 JPGOOD, JMODE/RT Header, 100mil, 3x1, Gold, TH Samtec HTSW-103-07-G-S 2 J3 JEN Header, 100mil, 2x1, Gold, TH Samtec HTSW-102-07-G-S 1 L1 74438336068 FIXED IND 6.8UH 1.6A 193 MOHM Wurth Electronics 74438336068 1 L3 FBMH3225HM601N T Ferrite Bead, 600 ohm @ 100 MHz, 3 A, 1210 Taiyo Yuden FBMH3225HM601NT 1 R1 RENB RES, 100 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW0402100KFKED 0 R2, R3 RENT, RFBT RES, 100 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW0402100KFKED 2 R4 RMODE RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0, 0603 Vishay-Dale CRCW06030000Z0EA 1 R5 RT RES, 0, 0%, 0.2 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW04020000Z0EDHP 0 R6 RINJ RES, 49.9, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW040249R9FKED 1 R7 RFBB RES, 24.9 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 Vishay-Dale CRCW040224K9FKED 1 R8 Rd RES, 4.99, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 Vishay-Dale CRCW06034R99FKEA 1 R9 RPGOOD RES, 100 k, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 Vishay-Dale CRCW0603100KFKEA 1 SH-J1 SNT-100-BK-G Shunt, 100mil, Gold plated, Black Samtec SNT-100-BK-G 1 TP1, TP5 VOUT, VIN Test Point, Miniature, SMT Keystone 5015 2 TP2 GND Test Point, Miniature, Black, TH Keystone 5001 1 TP3, TP4, TP6, TP7, TP8 GND, VOUT, VIN_EMI, GND_EMI Terminal, Turret, TH, Double Keystone 1502-2 5 TP9, TP10, TP11 PGOOD, SYNC, EN Test Point, Miniature, White, TH Keystone 5002 3 U1 LMR36506MSCQR PETQ1 LMR36503/06-Q1 Wide Input 60-V Synchronous, DCDC Buck Converter, RPE0009A (VQFN-9) Texas Instruments LMR36506MSCQRPETQ1 1 LMR36506MSCEVM User’s Guide SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Test Results www.ti.com 6 Test Results Section 6.1 details the test results from the LMR36506MSCEVM variant. 6.1 LMR36506MSCEVM Test Results The LMR36506MSCEVM variant is used for all figures from Figure 10 to Figure 17 variant. 6.1.1 Efficiency and Load Regulation 5.2 100 90 VIN = 12V VIN = 24V 5.15 80 5.1 60 Vout (V) Efficiency (%) 70 50 40 30 5.05 5 4.95 20 0 0.001 0.002 4.85 0.005 0.01 0.02 0.05 0.1 Load Current (A) 0.2 0.3 0.5 1 0 0.1 LMR3 Figure 10. LMR36506MSCEVM 5 VOUT Efficiency 6.1.2 4.9 VIN = 12V VIN = 24V 10 0.2 0.3 0.4 Load Current (A) 0.5 0.6 LMR3 Figure 11. LMR36506MSCEVM 5 VOUT Load Regulation Load Transients Figure 12. LMR36506MSCEVM Load Transient 12 VIN, 5 VOUT, IOUT = 0.3 A to 0.6 A, TR = TF = 1 µs CH1 = VOUT, CH4 = IOUT Figure 13. LMR36506MSCEVM Output Ripple 12 VIN, 5 VOUT, IOUT = 0 A SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated LMR36506MSCEVM User’s Guide 11 Test Results 6.1.3 www.ti.com Thermal Picture Figure 14. LMR36506MSCEVM 5 VOUT Thermal Capture, 12 VIN, 0.6 A Load, 2.2 MHz 6.1.4 Conducted EMI Figure 16. LMR36506MSCEVM CISPR25 Conducted EMI Results 13.5 VIN, 5 VOUT, IOUT = 0.6 A (Blue-Average and Yellow-Peak) 12 Figure 15. LMR36506MSCEVM 5 VOUT Thermal Capture, 24 VIN, 0.6 A Load, 2.2 MHz LMR36506MSCEVM User’s Guide Figure 17. LMR36506MSCEVM CISPR25 Conducted EMI Results 13.5 VIN, 5 VOUT, IOUT = 0.6 A (Blue-Average and Yellow-Peak) SNVU670A – February 2020 – Revised June 2020 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Revision History www.ti.com Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (February 2020) to A Revision .................................................................................................. Page • • • • • • • • Updated EVM board image. ............................................................................................................. Updated EVM board connections image. .............................................................................................. Updated LMR36506MSCEVM schematic. ............................................................................................. Updated top PCB view image............................................................................................................ Updated top copper layer image. ....................................................................................................... Updated EVM mid-layer one image. .................................................................................................... Updated EVM mid-layer two image. .................................................................................................... Updated EVM bottom copper layer image. ............................................................................................ 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