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LMS4684LDX

LMS4684LDX

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    WFDFN10

  • 描述:

    IC SWITCH DUAL SPDT 10WSON

  • 数据手册
  • 价格&库存
LMS4684LDX 数据手册
LMS4684 www.ti.com SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 LMS4684 0.5Ω Low-Voltage, Dual SPDT Analog Switch Check for Samples: LMS4684 FEATURES DESCRIPTION • • • • • • The LMS4684 is a low on-resistance, low voltage dual SPDT (Single-Pole/Double-Throw) analog switch that operates from a 1.8V to 5.5V supply. The LMS4684 features a 0.5Ω RON for its NC switch and 0.8Ω RON for its NO switch at a 2.7V supply. The digital logic inputs are 1.8V logic-compatible with a 2.7V to 3.3V supply and features break-before-make switching action. 1 2 NC Switch RON 0.5Ω max @ 2.7V NO Switch RON 0.8Ω max @ 2.7V 5 nA (typ) Supply Current TA = 25°C 1.8 to 5.5V Single Supply Operation 12-Bump DSBGA Package WSON-10 Package, 3x4mm The LMS4684 is available in the 12-bump DSBGA and the 10-lead WSON miniature packages. These PCB real estate saving packages offer extreme performance while saving money with small footprints. APPLICATIONS • • • • • Power Routing Battery-Operated Equipment Communications Circuits Modems Cell Phones Connection Diagram V + 1 NO1 2 COM1 3 IN1 4 10 NC1 5 9 COM2 8 IN2 7 NC2 6 COM1 IN1 NC1 A3 B3 C3 D3 A2 B2 C2 D2 A1 B1 C1 D1 NO2 COM2 IN2 NC2 NO2 + GND NO1 V GND GND Center Bumps B2 and C2 are Not Electrically Connected Exposed pad on back of package needs to be connected to pin 6 on the board Figure 1. 10-WSON Package-Top View Figure 2. 12-Bump DSBGA Package-Top View (Bumped Side Down) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2013, Texas Instruments Incorporated LMS4684 SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com SCHEMATIC DIAGRAM + 1 10 NO2 NO1 2 9 COM2 COM1 3 8 IN2 IN1 4 7 NC2 NC1 5 6 GND V IN NO NC 0 Off On 1 On Off Switches shown for Logic "0" input PIN DESCRIPTIONS Name Pin ID Description WSON DSBGA NC 5, 7 D3, D1 Analog switch normally closed terminal IN 4, 8 C3, C1 Digital control input COM 3, 9 B3, B1 Analog switch common terminal NO 2, 10 A3, A1 Analog switch normally open terminal V+ 1 A2 Positive supply voltage GND 6 D2 Ground B2, C2 Not electrically connected. Can be used to help dissipate heat by connecting to GND pin. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) V+ −0.3V to 6.0V −0.3V to 6.0V IN −0.3V to (V+ + 0.3V) COM, NO, NC Continuous Switch Current ESD Tolerance (4) ±400 mA Human Body Model Machine Model (1) (2) (3) (4) (5) 2 200V −65°C to 150°C Storage Temperature Range Junction Temperature 2000V (5) 150°C Max Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. All voltages are with respect to GND, unless otherwise specified. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Human body model: 1.5 kΩ in series with 100 pF. Machine model, 0Ω in series with 200 pF. The maximum power dissipation is a function of TJ(max), θJA and TA. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 LMS4684 www.ti.com SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 OPERATING RATINGS Nominal Supply Voltage 1.8V to 5.5V −0.3V to 5.5V IN Voltage (regardless of supply) −40°C to 85°C Temperature Range (1) (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. All voltages are with respect to GND, unless otherwise specified. PACKAGE THERMAL RESISTANCE Package θJ-A WSON-10 43°C / W DSBGA-12 57°C / W ELECTRICAL CHARACTERISTICS Unless otherwise specified, V+ = 2.7 to 3.3V, VIH = 1.4V, VIL = 0.5V. Typical values are measured at 3V, and TJ = 25°C. Boldface limits apply at temperature extremes. Symbol VNO, VNC, VCOM RON (NC) RON (NO) Parameter Conditions Analog Signal Range NC On-Resistance (1) On-Resistance Match Between Channels (1), RFLAT(NO) INO(OFF) or INC(OFF) ICOM (ON) Max Units + V V V+ = 2.7V, ICOM = 100 mA, VNC =0 to V+ 0.3 0.5 Ω V+ = 2.7V, ICOM = 100 mA, VNO =0 to V+ 0.45 0.8 Ω 1.11 60 mΩ WSON TJ = -40°C to 85°C 0.1 0.25 DSBGA TJ = -40°C to 85°C 0.1 0.25 0.18 0.35 + (2) V = 2.7V, ICOM = 100 mA, VNC or VNO =1.5V + RFLAT(NC) Typ 0 (1) NO On-Resistance ΔRON Min NC-On-Resistance Flatness (3) V = 2.7V, ICOM = 100 mA, VNC = 0 to V+ NO On-Resistance Flatness (3) V+ = 2.7V, ICOM = 100 mA, VNO = 0 to V+ NO or NC Off Leakage Current V+ = 3.3V, VNO or VNC = 3V, 0.3V; VCOM = 0.3V, 3V COM On Leakage Current V+ = 3.3V, VNO or VNC = 3V, 0.3V, or floating; VCOM = 3V, or floating Ω −1 0.014 1 −10 10 −2 2 −20 20 Ω nA nA Dynamic Characteristics tON Turn-On Time V+ = 2.7V, VNO or VNC = 1.5V; RL = 50Ω; CL = 35 pF; 38 tOFF Turn-Off Time V+ = 2.7V, VNO or VNC = 1.5V; RL = 50Ω; CL = 35 pF; 22 tBBM Break-Before-Make Delay V+ = 2.7V, VNO or VNC = 1.5V; RL = 50Ω; CL = 35 pF; Charge Injection Q VISO Off-Isolation VCT Crosstalk (4) 60 70 40 50 2 ns ns 15 ns COM = 0; RS = 0; CL= 1 nF; 200 pC RL = 50Ω; CL= 5 pF; f = 100 kHz -68 dB -72 dB Digital I/O (1) (2) (3) (4) VIH Input Logic High VIL Input Logic Low 1.4 V 0.5 V Guaranteed by design. ΔRON is equal to the difference between NC1/NC2 RON or NO1/NO2 RON at a specified voltage. Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over the specified analog signal ranges. Off-isolation = 20 log10(VCOM/ VNO), where VCOM = output, VNO = input switch off. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 3 LMS4684 SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Unless otherwise specified, V+ = 2.7 to 3.3V, VIH = 1.4V, VIL = 0.5V. Typical values are measured at 3V, and TJ = 25°C. Boldface limits apply at temperature extremes. Symbol IIN Parameter Conditions Min VIN = 0 or V+ IN Input Leakage Current Typ −1 Max Units 1 μA Power Supply V+ Power-Supply Range I+ Supply Current 1.8 5.5 V+ = 5.5V 5 V nA PARAMETRIC MEASUREMENT INFORMATION V + 0.047PF V + NO VIN LOGIC INPUT COM RL 50: 50% VIL VOUT or NC VIH tOFF CL 100pF VOUT IN 0.9 x VOUT SWITCH OUPUT GND 0.9 x VOUT 0 LOGIC INPUT tON CL INCLUDES FIXTURE AND STRAY CAPACITANCE Figure 3. tON / tOFF Time + V 0.047PF V+ LOGIC INPUT NC VIN COM VOUT VIH 50% VIL NO RL 50: CL 100pF IN GND LOGIC INPUT 0.9 x VOUT tD CL INCLUDES FIXTURE AND STRAY CAPACITANCE Figure 4. Break-Before Make Delay 4 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 LMS4684 www.ti.com SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 + V 0.047PF VOUT V+ VOUT RGEN COM VOUT NC or NO IN CL + OFF OFF VGEN ON GND IN ON OFF OFF IN VIL to VIH Q=( VOUT)(CL) Figure 5. Charge Injection 0.047 PF V + V + COM IN CAPACITANCE METER VIL or VIH NC or NO f = 1 MHz GND Figure 6. Channel Capacitance Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 5 LMS4684 SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS NO ON Resistance vs. COM Voltage 3.0 NC ON Resistance vs. COM Voltage 2.50 + V = 1.8V 2.5 2.00 + 1.75 1.5 RON (:) V = 2.0V 2.0 RON (:) VS = 1.8V 2.25 + V = 2.3V + 1.0 V = 5.0V + VS = 2.0V 1.50 1.25 0.75 V = 2.5V + V = 3.0V VS = 5.0V VS = 2.3V 1.00 VS = 2.5V VS = 3.0V 0.50 0.5 0.25 0.0 1 0 3 2 0.00 0.0 5 4 3.0 4.0 Figure 7. Figure 8. Logic Threshold Voltage vs. Supply Voltage Turn-on / Turn-off Times vs. Temperature 50 5.0 tON (ns) 45 40 1.5 35 VIN RISING tON , tOFF (ns) LOGIC THRESHOLD VOLTAGE (V) 2.0 VCOM (V) 2 1 VIN FALLING 30 tOFF (ns) 25 20 V+ = 3V 15 0.5 CL = 100 pF 10 RL = 50: 5 0 0 1 2 3 4 5 6 0 -40 -15 10 35 60 85 TEMPERATURE VSUPPLY (V) Figure 9. 6 1.0 VCOM (V) Figure 10. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 LMS4684 www.ti.com SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Charge Injection vs. COM Voltage NC On-Resistance vs. COM Voltage 0.30 500 + V = 5V 0.28 300 0.24 100 -100 TA = +25ºC 0.22 RON (:) Q (pC) TA = +85ºC 0.26 0.20 0.18 -300 0.16 0.14 -500 TA = -40ºC 0.12 0.10 -700 0 1 2 3 0 6 5 4 2 1 3 4 VCOM (V) VCOM (V) Figure 11. Figure 12. NC On-Resistance vs. COM Voltage NO On-Resistance vs. COM Voltage 0.35 0.60 + V = 3V + V = 3V TA = +85ºC 0.55 0.30 5 0.50 TA = +85ºC 0.20 TA = -40ºC 0.40 RON (:) RON (:) 0.45 TA = +25ºC 0.25 TA = +25ºC 0.35 0.30 TA = -40ºC 0.25 0.15 0.20 0.15 0.10 0.10 0 0.5 1 1.5 2 3 2.5 0 0.5 1 1.5 VCOM (V) VCOM (V) Figure 13. Figure 14. 2 2.5 3 NO On-Resistance vs. COM Voltage 0.40 0.35 TA = +85ºC RON (:) 0.30 TA = +25ºC 0.25 0.20 TA = -40ºC 0.15 + V = 5V 0.10 0 1 2 3 4 5 VCOM (V) Figure 15. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 7 LMS4684 SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com FUNCTIONAL DESCRIPTION The LMS4684 is a low voltage dual, extremely low On-Resistance analog switch that can operate over a supply voltage range of 1.8V to 5.5V. The LMS4684 has been fully characterized to operate in applications with 3V nominal supply voltage and features very low on resistance and fast Turn-Off and Turn-On times with breakbefore-make switching. The switch operates asymmetrically; one terminal is normally closed (NC) and the other terminal normally open (NO). Both NC and NO terminals are connected to a common terminal (COM). This configuration is ideal for applications with asymmetric loads such as speaker handsets and internal speakers. Applications Information ANALOG INPUT SIGNAL Analog input signals can range from GND to V+ and are passed through the switch with very little change. Each switch is bidirectional so any pin can be an input or output. Exercise care when making connection to an inductive load, such as a motor. As is true with any analog switch used with an inductive load, the back emf produced when the switch is turned off can damage the LMS4684 by electrical overstress. For such applications, a diode should be connected across the motor to prevent damage to the switch, as indicated in Figure 16. Be sure the diode has adequate current carrying capabilities. V + 0.047PF V + Protection Diode COM NC or NO Motor or inductive load + VIN GND VOUT IN VIL to VIH Figure 16. Inductive Load Over-Voltage Protection DIGITAL CONTROL INPUTS The IN pin can be driven to 5.5V regardless of the voltage level of the supply pin V+. For example, if the LMS4684 is operated with a supply of 2V, the digital control input could still be driven to 5V. Power consumption is increased when the control pin is driven rail-to-rail. SUPPLY VOLTAGE It is good general practice to first apply the supply voltage to a CMOS device before sriving any other pins. This is also true for the LMS4684 analog switch, which is a CMOS device. However, if it is necessary to have an analog signal applied before the supply voltage is applied and the analog signal source is not limited to 20 mA max, a diode connected between the supply voltage and the V+ pin as shown in Figure 17 will provide input protection. This will limit the max analog voltage to a diode drop below V+. This diode, D1, will also provide protection against some over voltage situations. 8 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 LMS4684 www.ti.com SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 It is also good practice to provide adequate supply bypassing to all analog circuits. We recommend a that minimum bypass capacitor value of 0.047µF be provided for the LMS4684. An inadequate bypass capacitor can lead to excessive supply current. SUPPLY VOLTAGE D1 0.047 PF NO COM ANALOG INPUT SIGNAL GND Figure 17. Input Over Voltage Protection Circuitry OFF-ISOLATION Analog switches are composed of FETs (field Effect Transistors). The channel resistance is low when the pass transistors are "on" and that resistance is high when the pass transistors are "off". However, when the pass transistors are "off", the source to drain capacitance of the pass transistors will pass some energy. This capacitance is inversely proportional to the switch "on" resistance, so a switch with a low "on" resistance may not be suitable for some high frequency applications. Figure 18 shows the equivalent circuit of an analog switch. Unless the load impedance after the switch is relatively low, the switch capacitance will couple excessive energy across the "open" switch at higher frequencies, degrading off isolation performance. Off Isolation of the LMS4684 is specified with a 50Ω load. Higher load impedances will degrade off isolation performance compared with what is specified. NO or NC RON COM CS Figure 18. Equivalent Circuit of an Analog Switch Off isolation may be improved by decreasing the LMS4684 load impedance below 50Ω. When doing this, be sure that the LMS4684 maximum current rating is not exceeded. Also, decreasing the load impedance too much can result in excessive signal distortion because the channel resistance variation with input signal voltage would then be a greater percentage of the load impedance. If it is desired to extend the usable bandwidth of the LMS4684 while maintaining reasonable off-isolation is through the use of the circuit of Figure 19. Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 9 LMS4684 SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 www.ti.com V + 0.047 PF + V NO VIN COM NC GND Figure 19. Using the LMS4684 at higher frequencies PCB LAYOUT AND THERMAL CONSIDERATIONS Both the WSON and DSBGA packages offer enhanced board real estate savings because of their small footprints. These tiny packages are capable of handling high continuous currents because of the advanced package thermal handling capabilities. The WSON package has the exposed die attach pad internally connected to the internal circuit GND. When this pad is soldered to copper on the PCB board according to Application Note AN-1187, the full thermal capability of the WSON package can be achieved without additional bulky heat sinks to dissipate the heat generated. The DSBGA package has a similar capability to dissipate heat through Bumps B2 and C2, which are not electrically connected. To enhance heat dissipation of the DSBGA package B2 and C2 could be connected to the GND pin through copper traces on the board. See Application Note AN-1112 for DSBGA package considerations. 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 LMS4684 www.ti.com SNOSAL0C – DECEMBER 2004 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Product Folder Links: LMS4684 11 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LMS4684ITL/NOPB ACTIVE DSBGA YZR 12 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 F09A LMS4684ITLX/NOPB ACTIVE DSBGA YZR 12 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 F09A LMS4684LD/NOPB ACTIVE WSON NGZ 10 1000 RoHS & Green SN Level-3-260C-168 HR -40 to 85 L4684 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
LMS4684LDX 价格&库存

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