User's Guide
SNIU027A – March 2015 – Revised October 2015
LMT01EVM
The LMT01EVM allows users to evaluate the performance of the LMT01 2-pin digital temperature sensor.
The EVM comes in a USB stick form factor package with an onboard MSP430F5528 microcontroller that
interfaces with both the host computer and the LMT01 device. The EVM also comes with perforation at
two locations on the EVM board. The first perforation allows the user to connect wires, cable, or header to
both ends for remote temperature measurements. The second perforation allows the user to remove the
level shifter transistor (Q1) from the EVM board.
1
2
3
4
5
6
7
Contents
LMT01EVM Components ................................................................................................... 2
Software Installation ......................................................................................................... 3
LMT01 Setup and Operation ............................................................................................... 7
Troubleshooting ............................................................................................................ 14
Board Layout ................................................................................................................ 17
Schematic ................................................................................................................... 19
Bill of Materials ............................................................................................................. 20
List of Figures
1
LMT01EVM Evaluation Board .............................................................................................. 2
2
LMT01EVM Installation Directory .......................................................................................... 3
3
LMT01EVM Installation Finish ............................................................................................. 4
4
Firmware Revision Number
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
................................................................................................ 5
USB Firmware Upgrade Window .......................................................................................... 6
LMT01EVM Successful Connection with PC............................................................................. 7
LMT01EVM COM Port ...................................................................................................... 8
GRAPH Tab Page ........................................................................................................... 9
Comparator Threshold .................................................................................................... 10
SETUP Tab page........................................................................................................... 11
Temperature Change by Pressing Finger on LMT01 .................................................................. 12
Breakout Slots and Exposed Pads....................................................................................... 13
LMT01EVM with LMT01 Device and Microcontroller Connected with Wires ....................................... 14
Device Manager with COM Port Name .................................................................................. 15
Short a Wire at these Locations .......................................................................................... 16
USB Firmware Upgrade Window ......................................................................................... 16
Top Assembly Layer ....................................................................................................... 17
Top Layer Routing ......................................................................................................... 17
Power Layer Routing ...................................................................................................... 17
Ground Layer Routing ..................................................................................................... 18
Bottom Layer Routing...................................................................................................... 18
Bottom Assembly Layer ................................................................................................... 18
LMT01EVM Schematic .................................................................................................... 19
List of Tables
1
Device and Package Configurations ...................................................................................... 2
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1
LMT01EVM Components
2
1
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LMT01EVM Bill of Materials .............................................................................................. 20
LMT01EVM Components
Figure 1. LMT01EVM Evaluation Board
Table 1. Device and Package Configurations
2
Device
IC
Package
U4
LMT01
TO-92S
LMT01EVM
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Software Installation
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2
Software Installation
2.1
Graphical User Interface (GUI)
Install the LMT01EVM Software:
1. Go to the LMT01EVM webpage on the TI website: http://www.ti.com/tool/LMT01EVM. Scroll down to
the “Software” section and download the latest evaluation software.
2. Unzip the downloaded file into a known directory, and run the “setup.exe” file located in [Unzip
location]\LMT01EVM Installer-vx.x.x.xx\LMT01EVM Installer\Volume. Follow the pop-screen
instructions by clicking the “Next” button to install the software and accept the license agreement.
Figure 2. LMT01EVM Installation Directory
3. When the installation is finished, click “Finish” button.
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Software Installation
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Figure 3. LMT01EVM Installation Finish
4
LMT01EVM
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Software Installation
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2.2
2.2.1
Firmware
Firmware Check
Connect the LMT01EVM to a PC. Run the aforementioned LMT01EVM GUI. The version number of the
current firmware is shown on the upper right hand corner. A pop-up window will appear if the current
firmware on the EVM needs to be upgraded. If the pop-up window appears proceed to Section 2.2.2,
otherwise proceed to Section 4 .
Figure 4. Firmware Revision Number
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Software Installation
2.2.2
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Firmware Installation
1. Open the LMT01EVM GUI and go to the “Setup” tab. Click on the “Update Firmware” button. The
MSP430 USB Firmware Upgrade program will launch.
2. Click “Next” to proceed on the first prompt; read and accept the license agreement and click “Next” to
continue.
Figure 5. USB Firmware Upgrade Window
3. Make sure the MSP430 USB Firmware Upgrade Example window shows “Found 1 device”.
4. Enable the Select Firmware button and browse to open the downloaded firmware The firmware is
located at C:\\Program Files (x86)\Texas Instruments\LMT01EVM\Firmware\LMT01EVM-vx.xx.txt.
5. Click on the Upgrade Firmware button to program the LMT01EVM. Close and relaunch the application
when done.
6
LMT01EVM
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LMT01 Setup and Operation
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3
LMT01 Setup and Operation
3.1
Quickstart Guide
1. Connect the LMT01EVM to a USB port on a PC.
2. One red and one green LED should turn on and not blink when the EVM is initially plugged into the
PC. The red LED will blink if the power on reset tests on the MSP430 microcontroller fails on startup or
if the Test LED button is toggled. The green LED will blink when the Start Graph button is pressed.
3. Launch the LMT01EVM software by clicking on Start >> All Program >> Texas Instruments >>
LMT01EVM >> LMT01EVM. The LMT01EVM GUI should automatically connect to the appropriate
COM port. A successful connection will show “Connect Successful!” on the bottom of the GUI. If there
is a connection problem check in the Control Panel >> Device Manager >> Ports and verify if the
LMT01EVM has an established connection with the PC.
Figure 6. LMT01EVM Successful Connection with PC
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LMT01 Setup and Operation
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Figure 7. LMT01EVM COM Port
8
LMT01EVM
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LMT01 Setup and Operation
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4. GUI Descriptions
• GRAPH Tab
– Start Graph: Graph displays temperature or pulse count. One data point on the graph
corresponds to one temperature reading or pulse count in the time interval specified in the
“Graph Measure Period (ms)
– Stop Graph: Stops the graph from updating temperature or pulse count
– Current Value: Shows the current temperature or pulse count value
– Save Graph Data to File: Saves the pulse count data to a .csv file
– Y-Axis in °C: Toggle between the Y-Axis to be in temperature or # of pulse counts
– Graph Measure Period (ms): One measurement will be made every period specified in the box
Figure 8. GRAPH Tab Page
– LMT01 Silicon: Select between Pre-Final and Final silicon
– Comparator Reference: Select voltage reference for comparator threshold settings, default is
1.5V
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LMT01 Setup and Operation
•
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SETUP Tab
– Serial Port: Manually select which serial port the LMT01EVM is connected to
– Firmware Revision: Check the firmware revision on the MSP430F5528 microcontroller
– Test LED: Toggle the red LED (D2) on and off
– One Shot Pulse Train Data: Single read shown in either pulse counts or temperature
– Select Pulse Train Measurement Method: Select from 12 methods of counting pulse with a
microcontroller. More details in Section 4.2
– Comparator Low to High Threshold: Set the comparator threshold to determine a logic high
level
– Comparator High to Low Threshold: Set the comparator threshold to determine a logic low
level
Figure 9. Comparator Threshold
10
LMT01EVM
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Figure 10. SETUP Tab page
5. Start the GUI by pressing the “Start Graph” button on the GRAPH tab. The graph should show updated
temperature readings from the LMT01. Press a finger against the LMT01 part and observe the
temperature change.
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LMT01 Setup and Operation
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Figure 11. Temperature Change by Pressing Finger on LMT01
3.2
Pulse Train Measurement Methods
The LMT01EVM GUI comes with 12 methods of measuring the output pulse train from the LMT01. The
user can select which measurement method to use for their application. The nomenclatures of these
methods are described below:
• Transistor Mode: The LMT01 output is level shifted with a transistor to valid logic levels for the
MSP430
• Comparator Mode: The LMT01 output is fed into the integrate comparator of the MSP430 and
compared to a programmable voltage level to determine logic high and low
• Synchronous Mode: Power is applied to the LMT01 before a temperature measurement is taken and
removed immediately afterwards
• Asynchronous Mode: The MSP430 is turned on and temperature measurements can be taken any time
More informational about the 12 different modes and their implementations can be found in the LMT01
installation directory in the Firmware folder.
12
LMT01EVM
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3.3
Remote Temperature Sensing with the LMT01EVM
The LMT01EVM comes with perforated slots where the user can snap apart the LMT01 device board,
transistor level shifter board, and microcontroller side of the EVM. The snapped off LMT01 device board
and transistor level shifter board can either be soldered with wires or headers back onto the LMT01EVM
for remote temperature measurements or the user can solder the boards onto their own PCB board.
Figure 12. Breakout Slots and Exposed Pads
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Troubleshooting
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Figure 13. LMT01EVM with LMT01 Device and Microcontroller Connected with Wires
4
Troubleshooting
4.1
LMT01EVM Driver Installation
The LMT01EVM Driver automatically installs during the GUI installation. However, the LMT01EVM board
may have been inserted into the USB port before the GUI installation. In such cases the EVM board could
be associated with another driver. Complete the following steps if you do not see LMT01EVM and instead
see MSP430-USB Example in the Device Manager window:
14
LMT01EVM
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Figure 14. Device Manager with COM Port Name
1. Open the Device Manager and find the MSP430-USB Example device
2. Right click it and choose Update Driver Software
3. Select Browse my Computer for driver installation. Navigate to the installation directory, select the
Firmware folder, and select the LMT01EVM_DRIVER.inf file
4. Close the setup window when the installation is complete. The Device Manager should now display
LMT01EVM followed by a COM port number.
4.2
LMT01EVM Hard Firmware Installation
During firmware flashing, the installation process could have been halted or quit unexpectedly. This
process could put the EVM board into an unknown state and the EVM cannot be found in the Device
Manager. To restore access to the EVM board complete the following steps:
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Troubleshooting
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Figure 15. Short a Wire at these Locations
Figure 16. USB Firmware Upgrade Window
1. Short the two points as shown in Figure 15
16
LMT01EVM
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2. Connect the LMT01EVM board to the USB port and disconnect the short
3. Start the LMT01EVM GUI. Press OK to the pop up error message “Auto Connect Failed! Check port
number.”
4. Go to the “SETUP” tan and select “Update Firmware”. Select OK to the message “Update MSP430
Firmware?” Accept the license and the message “Found 1 device” should appear as in Figure 16.
5. Choose “Select Firmware” and browse to the installation directory and go to the Firmware folder.
Select “LMT01EVM_Firmware-vx.xx.txt”. Click “Upgrade Firmware” and close when done.
6. Exit the GUI. Disconnect and reconnect the EVM board.
7. Relaunch the GUI. The EVM board should now be connected and the board should work properly with
the latest firmware.
5
Board Layout
Figure 17. Top Assembly Layer
Figure 18. Top Layer Routing
Figure 19. Power Layer Routing
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Board Layout
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Figure 20. Ground Layer Routing
Figure 21. Bottom Layer Routing
Figure 22. Bottom Assembly Layer
18
LMT01EVM
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GND
2
2
1
1
R7
1K
R6
1K
3
GND
C10
220pF
CSTCR4M00G15L99-R0
Super Red
Green
D2
D1
J1
1
GND
C17
0.47µF
3
VN_NOT
4
GND
C11
0.1uF
VIO
GND
VIO
VBUS
51
PUR
C19
0.1uF
11
15
40
53
54
55
17
50
52
9
10
57
58
12
13
34
35
36
37
38
18
19
20
21
22
23
24
25
DP
DM
COMP_MODE
COMP_MODE
VUSB
C6
220PF
1
48037-2200
GND
2
GND
Y1
GND
5
2
GND
MSP430F5528IRGC
AVCC1
DVCC1
DVCC2
VBUS
VUSB
V18
VCORE
PUR
PU.0/DP
PU.1/DM
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
U3
6
PCB
LOGO
4
R2
DM
GND
GND
R20
1M
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
33
QFN PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
RST/NMI/SBWTDIO
TEST/SBWTCK
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
65
49
14
56
16
39
64
59
60
61
62
63
1
2
3
4
5
6
7
8
41
42
43
44
45
46
47
48
26
27
28
29
30
31
32
33
R40
1.5K
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
C5
0.1uF
U2
TPD4E004DRY
R1
33
PUR
Te xas Instruments
Te xas Instruments
VBUS
PCB
LOGO
PCB
LOGO
IO3
6
VCC
IO1
1
5
IO4
IO2
2
GND
3
Te xas Instruments
GND
C7
2200pF
R5
33k
GND
SBWTDIO
SBWTCK
VIO
LMT01_VN
LMT01_VP
VN_NOT
COMP_MODE
DP
Pb-Free Symbol
PCB
LOGO
GND
GND
SBWTCK
SBWTDIO
GND
Q1
GND
C2
10µF
GND
4
3
1
C4
0.01µF
LMT01_VN
LMT01_VP
C3
0.1uF
+5V
850-10-003-10-001000
1
2
DNP
3
J4
GND
R4
7.50k
1 MMBT3904
R3
100k
GND
VLS201610ET-100M
L1
VN_NOT
D21
5.6V
VBUS
FCC disclaimer
PCB
LOGO
3
2
GND
VOUT
LP2985AIM5-3.3/NOPB
BYPASS
ON/OFF
VIN
U1
GND
2
5
VIO
GND
U4
LMT01LP
C1
2.2µF
1
VP
VN
6
2
PCB Number: SV601165
PCB Rev: A
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Schematic
Schematic
Figure 23. LMT01EVM Schematic
LMT01EVM
19
Bill of Materials
7
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Bill of Materials
Table 2. LMT01EVM Bill of Materials
Designator
Qty. Value
Description
Part Number
Manufacturer
Printed Circuit Board
SV601165
Any
2.2 µF
CAP, CERM, 2.2 µF, 10V, ±10%, X5R, 0603
C0603C225K8PACTU
Kemet
1
10 µF
CAP, CERM, 10 µF, 10 V, ± 20%, X5R, 0603
C1608X5R1A106M
TDK
C3, C5,
C11, C19
4
0.1 µF
CAP CER 0.1UF 16 V 5% X7R 0402
GRM155R71C104JA88D
Murata Electronics North
America
C4
1
0.01 µF
CAP, CERM, 0.01 µF, 25V, ±5%, C0G/NP0, 0603
C1608C0G1E103J
TDK
C6
1
220 pF
CAP CER 220PF 50V 1% NP0 0402
C1005C0G1H221F050BA
TDK Corporation
C7
1
2200 pF
CAP, CERM, 2200 pF, 50V, ±10%, X7R, 0603
C0603X222K5RACTU
Kemet
C10
1
220 pF
CAP, CERM, 220 pF, 50V, ±1%, C0G/NP0, 0603
06035A221FAT2A
AVX
C17
1
0.47 µF
CAP, CERM, 0.47 µF, 10V, ±10%, X7R, 0603
C0603C474K8RACTU
Kemet
D1
1
Green
LED, Green, SMD
LG L29K-G2J1-24-Z
OSRAM
D2
1
Super Red
LED, Super Red, SMD
SML-LX0603SRW-TR
Lumex
D21
1
5.6V
Diode, Zener, 5.6V, 500 mW, SOD-123
MMSZ5232B-7-F
Diodes Inc.
J1
1
Connector, Plug, USB Type A, R/A, Top Mount SMT
48037-2200
Molex
L1
1
10 µH
Inductor, Shielded, Ferrite, 10 µH, 0.4 A, 1.38 Ω, SMD
VLS201610ET-100M
TDK
Q1
1
40 V
Transistor, NPN, 40 V, 0.2 A, SOT-23
MMBT3904
Fairchild Semiconductor
R1, R2
2
33
RES, 33 ohm, 5%, 0.063W, 0402
CRCW040233R0JNED
Vishay-Dale
R3
1
100k
RES, 100 k, 5%, 0.063 W, 0402
CRCW0402100KJNED
Vishay-Dale
R4
1
7.50k
RES, 7.50 k, 1%, 0.063 W, 0402
CRCW04027K50FKED
Vishay-Dale
R5
1
33k
RES, 33k ohm, 5%, 0.063W, 0402
CRCW040233K0JNED
Vishay-Dale
R6, R7
2
1K
RES 1K OHM 1/10W 5% 0402 SMD
ERJ-2GEJ102X
Panasonic Electronic
Components
R20
1
1M
RES,1M ohm, 5%, 0.063W, 0402
RC0402JR-071ML
Yageo
R40
1
1.5K
RES 1.5K OHM 1/16W 5% 0402 SMD
CRCW04021K50JNED
Vishay Dale
U1
1
Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator
in SOT-23 Package, DBV0005A
LP2985AIM5-3.3/NOPB
Texas Instruments
U2
1
4-ChanneL ESD-Protection Array for High-speed Data
Interfaces, DRY006A
TPD4E004DRY
Texas Instruments
U3
1
Mixed Signal MicroController, RGC0064B
MSP430F5528IRGC
Texas Instruments
U4
1
High-Accuracy 2-pin Temperature Sensor with a PulsedCurrent Interface, LP0002A
LMT01LP
Texas Instruments
Y1
1
Resonator, 4MHz, 39pF SMD
CSTCR4M00G15L99-R0
Murata
J4
0
Header, 50mil, 3x1, Gold, TH
850-10-003-10-001000
Mill-Max
PCB
1
C1
1
C2
20
LMT01EVM
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Revision History
Changes from Original (March 2015) to A Revision ....................................................................................................... Page
•
Added Troubleshooting section. ....................................................................................................... 14
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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21
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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