LMT70EVM Booster Pack
User's Guide
Literature Number: SNIU024B
January 2015 – Revised August 2015
Contents
1
Introduction ......................................................................................................................... 3
2
LMT70EVM Components ....................................................................................................... 4
3
Software Installation ............................................................................................................. 5
3.1
3.2
4
Quickstart Guide ............................................................................................................. 9
Remote Temperature Sensing with the LMT70EVM .................................................................. 14
Troubleshooting ................................................................................................................. 16
5.1
5.2
6
5
7
7
8
LMT70 Setup and Operation .................................................................................................. 9
4.1
4.2
5
Graphical User Interface (GUI).............................................................................................
Firmware ......................................................................................................................
3.2.1 Firmware Check ....................................................................................................
3.2.2 Firmware Installation ...............................................................................................
LMT70EVM Driver Installation ............................................................................................ 16
LMT70EVM Hard Firmware Installation ................................................................................. 17
Board Layout ..................................................................................................................... 19
......................................................................................................................... 21
8
Bill of Materials .................................................................................................................. 23
Revision History .......................................................................................................................... 24
7
Schematic
2
Contents
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Chapter 1
SNIU024B – January 2015 – Revised August 2015
Introduction
The LMT70EVM allows users to evaluate the performance of the LMT70 temperature sensor. The EVM
comes in a USB stick form factor package with an onboard MSP430F5528 microcontroller that interfaces
with both the USB host computer and the LMT70 device. The EVM also comes with perforated slots that
the user can break apart to separate the microcontroller and LMT70 device for remote temperature
measurements.
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Introduction
3
Chapter 2
SNIU024B – January 2015 – Revised August 2015
LMT70EVM Components
Figure 2-1. LMT70EVM Evaluation Board
Table 2-1. Device and Package Configurations
4
DEVICE
IC
PACKAGE
U4
LMT70
WLCSP
LMT70EVM Components
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Chapter 3
SNIU024B – January 2015 – Revised August 2015
Software Installation
3.1
Graphical User Interface (GUI)
Install the LMT70EVM Software:
1. Go to the LMT70EVM webpage available here on the TI website. Scroll down to the “Software” section
and download the latest evaluation software.
2. Unzip the downloaded file into a known directory, and run the “setup.exe” file located in [Unzip
location]\LMT70EVM Installer-vx.x.x.xx\LMT70EVM Installer\Volume. Follow the pop-screen
instructions by clicking the “Next” button to install the software and accept the license agreement.
Figure 3-1. LMT70EVM Installation Directory
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Software Installation
5
Graphical User Interface (GUI)
www.ti.com
3. When the installation is finished, please click the “Finish” button.
Figure 3-2. LMT70EVM Installation Finish
6
Software Installation
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Firmware
www.ti.com
3.2
Firmware
3.2.1 Firmware Check
1. Run the LMT70EVM and go to the SETUP tab and click “R” in the Firmware Revision box.
Figure 3-3. Firmware Revision Number
2. Check the firmware revision number in the Firmware Revision box if it is the same revision found in
C:\Program Files (x86)\Texas Instruments\LMT70EVM\Firmware\LMT70EVM-vx.xx.txt. If the firmware
revision numbers are different then proceed to Firmware Installation, otherwise proceed to Chapter 4.
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Software Installation
7
Firmware
www.ti.com
3.2.2 Firmware Installation
1. The firmware is located at C:\\Program Files (x86)\Texas
Instruments\LMT70EVM\Firmware\LMT70EVM-v0.xx.txt
2. Open the LMT70EVM GUI and go to the “Setup” tab. Click on the “Update Firmware” button. The
MSP430 USB Firmware Upgrade program will launch.
3. Click “Next” to proceed on the first prompt; read and accept the license agreement and click “Next” to
continue.
Figure 3-4. USB Firmware Upgrade Window
4. Make sure the MSP430 USB Firmware Upgrade Example window shows “Found 1 device”.
5. Enable the Select Firmware button and browse to open the downloaded firmware “LMT70EVMvx.xx.txt”.
6. Click on the Upgrade Firmware button to program the LMT70EVM. Close and relaunch the application
when done.
8
Software Installation
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Chapter 4
SNIU024B – January 2015 – Revised August 2015
LMT70 Setup and Operation
4.1
Quickstart Guide
1. Connect the LMT70EVM to a USB port on a PC.
2. One red and one green LED should turn on and not blink when the EVM is initially plugged into the
PC. The red LED will blink if the power on reset tests on the MSP430 microcontroller fails on startup or
if the Test LED button is toggled. The green LED will blink when the Start Graph button is pressed.
3. Launch the LMT70EVM software by clicking on Start >> All Program >> Texas Instruments >>
LMT70EVM >> LMT70EVM. The LMT70EVM GUI should automatically connect to the appropriate
COM port. If there is a connection problem please check in the Control Panel >> Device Manager >>
Ports and verify if the LMT70EVM has an established connection with the PC.
Figure 4-1. LMT70EVM Successful Connection with PC
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
LMT70 Setup and Operation
9
Quickstart Guide
www.ti.com
Figure 4-2. LMT70EVM COM Port
10
LMT70 Setup and Operation
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Quickstart Guide
www.ti.com
4. GRAPH Tab GUI Description
• Start Graph: Graph displays the running average data in degrees Celsius, millivolts, or ADC code
• Stop Graph: Graph stops updating
• Current Value: Shows the current value being read
• Average Value: Shows the running average value set by the Number of Avgs field
• Number of Avgs: Number of running average temperature readings before being displayed on the
graph and Average Value field
• Save Graph Data to File: Save the temperature data to a .csv file
• Y-axis: Y-axis is shown in degrees Celsius, millivolts, or ADC code
Figure 4-3. GRAPH Tab Page
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
LMT70 Setup and Operation
11
Quickstart Guide
www.ti.com
5. SETUP Tab GUI Description
• Serial Port: It allows user to select manually which serial port the LMT70EVM is connected to
• Firmware Revision: Check which firmware revision is on the MSP430F5528 microcontroller
• Update Firmware: Launches the MSP430 USB Firmware Upgrade Example software to manually
update the firmware
• Test LED: Toggles LED on the LMT70EVM board
• LMT70 Transfer Function: Choose method of converting LMT70 output voltage to temperature
Figure 4-4. SETUP Tab Page
12
LMT70 Setup and Operation
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Quickstart Guide
www.ti.com
6. Start the GUI by pressing the “Start Graph” button on the GRAPH tab. The graph should show
updated temperature readings from the LMT70 part. Press a finger against the LMT70 part at U4 and
observe the temperature change.
Figure 4-5. Temperature Change by Pressing Finger on LMT70
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
LMT70 Setup and Operation
13
Remote Temperature Sensing with the LMT70EVM
4.2
www.ti.com
Remote Temperature Sensing with the LMT70EVM
1. The LMT70EVM comes with perforated slots where the user can snap apart the LMT70 device side
and microcontroller side of the EVM. The user can either connect the LMT70 side to the
microcontroller side with wires/header or the user can connect the LMT70 side onto their own
device/board.
NOTE:
Do NOT use your hands to break apart the EVM. Instead use a pair of strong wire cutter or
tiny hand saws. This is to create a clean cut on the perforated slots and to prevent U4 from
popping off the PCB.
Figure 4-6. Breakout Slots and Exposed Pads
14
LMT70 Setup and Operation
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Remote Temperature Sensing with the LMT70EVM
www.ti.com
Figure 4-7. LMT70EVM with LMT70 Device and Microcontroller Connected with Wires
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
LMT70 Setup and Operation
15
Chapter 5
SNIU024B – January 2015 – Revised August 2015
Troubleshooting
5.1
LMT70EVM Driver Installation
The LMT70EVM Driver automatically installs during the GUI installation. However, the LMT70EVM board
may have been inserted into the USB port before the GUI installation. In such cases the EVM board could
be associated with another driver. Complete the following steps if you do not see LMT70EVM and instead
see MSP430-USB Example in the Device Manager window:
Figure 5-1. Device Manager with COM Port Name
1. Open the Device Manager and find the MSP430-USB Example device.
2. Right click it and choose Update Driver Software.
3. Select Browse my Computer for driver installation. Navigate to the installation directory, select the
Firmware folder, and select the LMT70EVM_DRIVER.inf file.
4. Close the setup window when the installation is complete. The Device Manager should now display
LMT70EVM followed by a COM port number.
16
Troubleshooting
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
LMT70EVM Hard Firmware Installation
www.ti.com
5.2
LMT70EVM Hard Firmware Installation
During firmware flashing, the installation process could have been halted or quit unexpectedly. This
process could put the EVM board into an unknown state and the EVM cannot be found in the Device
Manager. To restore access to the EVM board, complete the following steps:
1. Short the two points as shown in Figure 5-2.
Figure 5-2. Short a Wire at These Locations
2. Connect the LMT70EVM board to the USB port and disconnect the short.
3. Start the LMT70EVM GUI. Press OK to the pop up error message “Auto Connect Failed! Check port
number.”
4. Go to the “SETUP” tan and select “Update Firmware”. Select OK to the message “Update MSP430
Firmware?” Accept the license and the message “Found 1 device” should appear as in Figure 5-3.
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Troubleshooting
17
LMT70EVM Hard Firmware Installation
www.ti.com
Figure 5-3. USB Firmware Upgrade Window
5. Choose “Select Firmware” and browse to the installation directory and go to the Firmware folder.
Select “LMT70EVM_Firmware-vx.xx.txt”. Click “Upgrade Firmware” and close when done.
6. Exit the GUI. Disconnect and reconnect the EVM board.
7. Relaunch the GUI. The EVM board should now be connected and the board should work properly with
the latest firmware.
18
Troubleshooting
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Chapter 6
SNIU024B – January 2015 – Revised August 2015
Board Layout
Figure 6-1. Top Assembly Layer
Figure 6-2. Top Layer Routing
Figure 6-3. Power Layer Routing
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Layout
19
www.ti.com
Figure 6-4. Ground Layer Routing
Figure 6-5. Bottom Layer Routing
Figure 6-6. Bottom Assembly Layer
20
Board Layout
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Chapter 7
SNIU024B – January 2015 – Revised August 2015
Schematic
See next page for the graphic.
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Schematic
21
www.ti.com
J1
4
3
GND
2
6
1
5
PUR
48037-2200
GND
R40
1.5K
VBUS
R1
33
+5V
DM
DP
VBUS
1
VIO
VIN
VOUT
5
GND
IO3
4
VLS201610ET-100M
U2
TPD4E004DRY
C5
0.1uF
R20
1M
D21
5.6V
3
C2
10µF
C3
0.1uF
GND
4
GND
GND
ON/OFF
C1
2.2µF
BYPASS
GND
2
GND
GND
LP2985AIM5-3.3/NOPB
C4
0.01µF
3
6
VCC
IO4
IO2
IO1
1
5
33
2
U1
L1
R2
GND
GND
GND
U3
D1
18
19
20
21
22
23
24
25
R6
1K
GND
TP1
34
35
36
37
38
TP2
VREF+
VREF-
Y1
3
1
2
CSTCR4M00G15L99-R0
9
10
57
58
12
13
DP
DM
50
52
PUR
51
GND
55
17
C10
220pF
C17
0.47µF
C6
220PF VIO
GND
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
PU.0/DP
PU.1/DM
PUR
V18
VCORE
VBUS
VUSB
53
54
VBUS
VUSB
VIO
11
15
40
AVCC1
DVCC1
DVCC2
GND
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
26
27
28
29
30
31
32
33
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
41
42
43
44
45
46
47
48
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
RST/NMI/SBWTDIO
TEST/SBWTCK
QFN PAD
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
R7
D2
TP3
VIO
T_ON
GND
U4
GND
A2
A1
DNPC8
0.1µF
VDD
TA0
B1
GND
T_ON
B2
ADC
T_ON
LMT70YFQ
GND
GND
1
2
3
4
5
6
7
8
ADC
60
61
62
63
64
59
TP4
1K
VIO
R5
DNP
33k
SBWTDIO
SBWTCK
J4
SBWTCK
SBWTDIO
DNPC7
2200pF
65
49
14
56
16
39
1
2
DNP
3
850-10-003-10-001000
GND
GND
MSP430F5528IRGC
GND
GND
C11
0.1uF
GND
C19
0.1uF
GND
Figure 7-1. LMT70EVM Schematic
22
Schematic
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Chapter 8
SNIU024B – January 2015 – Revised August 2015
Bill of Materials
Designat
or
Qty
!PCB
1
C1
1
C2
Value
Description
Part Number
Manufacturer
Printed Circuit Board
SV601095
Any
2.2uF
CAP, CERM, 2.2uF, 10V, +/-10%, X5R,
0603
C0603C225K8PACTU
Kemet
1
10uF
CAP, CERM, 10 µF, 10 V, +/- 20%, X5R,
0603
C1608X5R1A106M
TDK
C3, C5,
C11, C19
4
0.1uF
CAP CER 0.1UF 16V 5% X7R 0402
GRM155R71C104JA88D
Murata Electronics North
America
C4
1
0.01uF
CAP, CERM, 0.01uF, 25V, +/-5%,
C0G/NP0, 0603
C1608C0G1E103J
TDK
C6
1
220PF
CAP CER 220PF 50V 1% NP0 0402
C1005C0G1H221F050BA TDK Corporation
C7
1
2200pF
CAP, CERM, 2200pF, 50V, +/-10%, X7R,
0603
C0603X222K5RACTU
Kemet
C10
1
220pF
CAP, CERM, 220 pF, 50 V, +/- 5%,
C0G/NP0, 0402
GRM1555C1H221JA01D
MuRata
C17
1
0.47uF
CAP, CERM, 0.47uF, 10V, +/-10%, X7R,
0603
C0603C474K8RACTU
Kemet
D1
1
LED SMARTLED GREEN 570NM 0603
LG L29K-G2J1-24-Z
OSRAM Opto
Semiconductors Inc
D2
1
LED 660NM SUPER RED DIFF 0603SMD
SML-LX0603SRW-TR
Lumex Opto/Components
Inc
D21
1
Diode, Zener, 5.6V, 500mW, SOD-123
MMSZ5232B-7-F
Diodes Inc.
J1
1
Connector, Plug, USB Type A, R/A, Top
Mount SMT
48037-2200
Molex
L1
1
10uH
Inductor, Shielded, Ferrite, 10 µH, 0.4 A,
1.38 ohm, SMD
VLS201610ET-100M
TDK
R1, R2
2
33
RES, 33 ohm, 5%, 0.063W, 0402
CRCW040233R0JNED
Vishay-Dale
R5
1
33k
RES, 33k ohm, 5%, 0.063W, 0402
CRCW040233K0JNED
Vishay-Dale
R6, R7
2
1K
RES 1K OHM 1/10W 5% 0402 SMD
ERJ-2GEJ102X
Panasonic Electronic
Components
R20
1
1M
RES,1M ohm, 5%, 0.063W, 0402
RC0402JR-071ML
Yageo
R40
1
1.5K
RES 1.5K OHM 1/16W 5% 0402 SMD
CRCW04021K50JNED
Vishay Dale
U1
1
Micropower 150 mA Low-Noise Ultra LowDropout Regulator in SOT-23 Package,
DBV0005A
LP2985AIM5-3.3/NOPB
Texas Instruments
U2
1
4-CHANNEL ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES,
DRY006A
TPD4E004DRY
Texas Instruments
U3
1
Mixed Signal MicroController, RGC0064B
MSP430F5528IRGC
Texas Instruments
U4
1
Precise Temperature Sensor with Output
Enable TEMPERATURE SENSOR,
YFQ0004ACAC
LMT70YFQ
Texas Instruments
Y1
1
Resonator, 4MHz, 39pF SMD
CSTCR4M00G15L99-R0
MuRata
C8
0
CAP, CERM, 0.1 µF, 10 V, +/- 10%, X5R,
0201
CL03A104KP3NNNC
Samsung
J4
0
Header, 50mil, 3x1, Gold, TH
850-10-003-10-001000
Mill-Max
5.6V
0.1uF
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Bill of Materials
23
Revision History
www.ti.com
Revision History
Changes from A Revision (February 2015) to B Revision ............................................................................................. Page
•
Added Chapter 5: Troubleshooting .................................................................................................... 16
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
24
Revision History
SNIU024B – January 2015 – Revised August 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
SPACER
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
spacer
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
