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LMT84-Q1
SNIS178 – OCTOBER 2017
LMT84-Q1 1.5-V, SC70,
Analog Temperature Sensors
1 Features
3 Description
•
The LMT84-Q1 is a precision CMOS temperature
sensor with ±0.4°C typical accuracy (±2.7°C
maximum) and a linear analog output voltage that is
inversely proportional to temperature. The 1.5-V
supply voltage operation, 5.4-μA quiescent current,
and 0.7-ms power-on time enable effective powercycling architectures to minimize power consumption
for battery-powered applications such as drones and
sensor nodes.The LMT84-Q1 device is AEC-Q100
Grade 0 qualified and maintains ±2.7°C maximum
accuracy over the full operating temperature range
without calibration; this makes the LMT84-Q1 suitable
for automotive applications such as infotainment,
cluster, and powertrain systems. The accuracy over
the wide operating range and other features make the
LMT84-Q1 an excellent alternative to thermistors.
1
•
•
•
•
•
•
•
•
•
LMT84-Q1 is AEC-Q100 Qualified for Automotive
Applications:
– Device Temperature Grade 0: –40°C to
+150°C
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C6
Very Accurate: ±0.4°C Typical
Low 1.5-V Operation
Average Sensor Gain of -5.5 mV/°C
Low 5.4-µA Quiescent Current
Wide Temperature Range: –50°C to 150°C
Output is Short-Circuit Protected
Push-Pull Output With ±50-µA Drive Capability
Footprint Compatible With the Industry-Standard
LM20/19 and LM35 Temperature Sensors
Cost-Effective Alternative to Thermistors
For devices with different average sensor gains and
comparable
accuracy,
refer
to
Comparable
Alternative Devices for alternative devices in the
LMT8x family.
2 Applications
•
•
•
•
•
•
Device Information (1)
Automotive
Infotainment and Cluster
Powertrain Systems
Smoke and Heat Detectors
Drones
Appliances
PART NUMBER
LMT84-Q1
(1)
PACKAGE
SOT (5)
BODY SIZE (NOM)
2.00 mm x 1.25 mm
For all available packages, see the orderable addendum
addendum at the end of the data sheet.
Thermal Time Constant
Output Voltage vs Temperature
100%
VDD (+1.5V to +5.5V)
FINAL TEMPERATURE
90%
VDD
80%
70%
LMT84
60%
CBP
50%
OUT
40%
30%
GND
20%
LMT8xLPG
Thermistor
10%
0
0
20
40
60
TIME (s)
80
100
Copyright © 2016, Texas Instruments Incorporated
D003
* Fast thermal response NTC
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMT84-Q1
SNIS178 – OCTOBER 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Tables...................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
4
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Accuracy Characteristics...........................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
8.3 Feature Description................................................... 8
8.4 Device Functional Modes........................................ 10
9
Application and Implementation ........................ 12
9.1 Applications Information.......................................... 12
9.2 Typical Applications ................................................ 12
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 14
11.1 Layout Guidelines ................................................. 14
11.2 Layout Examples................................................... 14
12 Device and Documentation Support ................. 15
12.1
12.2
12.3
12.4
12.5
Detailed Description .............................................. 8
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
15
15
15
15
15
13 Mechanical, Packaging, and Orderable
Information ........................................................... 15
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
October 2017
2
REVISION
NOTES
*
Initial release. Moved the automotive device
from the SNIS167 to a standalone data
sheet.
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5 Device Comparison Tables
Table 1. Available Device Packages
ORDER NUMBER
(1)
PACKAGE
PIN
BODY SIZE (NOM)
MOUNTING TYPE
LMT84DCK
SOT (AKA (2): SC70, DCK)
5
2.00 mm × 1.25 mm
Surface Mount
LMT84LP
TO-92 (AKA (2): LP)
3
4.30 mm × 3.50 mm
Through-hole; straight leads
(2)
LMT84LPG
TO-92S (AKA
3
4.00 mm × 3.15 mm
Through-hole; straight leads
LMT84LPM
TO-92 (AKA (2): LPM)
3
4.30 mm × 3.50 mm
Through-hole; formed leads
LMT84DCK-Q1
SOT (AKA (2): SC70, DCK)
5
2.00 mm × 1.25 mm
Surface Mount
(1)
(2)
: LPG)
For all available packages and complete order numbers, see the Package Option addendum at the end of the data sheet.
AKA = Also Known As
Table 2. Comparable Alternative Devices
DEVICE NAME
AVERAGE OUTPUT SENSOR GAIN
POWER SUPPLY RANGE
LMT84-Q1
–5.5 mV/°C
1.5 V to 5.5 V
LMT85-Q1
–8.2 mV/°C
1.8 V to 5.5 V
LMT86-Q1
–10.9 mV/°C
2.2 V to 5.5 V
LMT87-Q1
–13.6 mV/°C
2.7 V to 5.5 V
6 Pin Configuration and Functions
DCK Package
5-Pin SOT (SC70)
(Top View)
1
5
GND
GND
2
GND
LMT84
3
4
OUT
VDD
Pin Functions
PIN
NAME
GND
SOT (SC70)
1, 2 (1) , 5
TYPE
Ground
DESCRIPTION
EQUIVALENT CIRCUIT
N/A
FUNCTION
Power Supply Ground
VDD
OUT
3
Analog
Output
VDD
4
Power
Outputs a voltage that is inversely
proportional to temperature
GND
(1)
N/A
Positive Supply Voltage
Direct connection to the back side of the die
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7 Specifications
7.1 Absolute Maximum Ratings
See
(1) (2)
MIN
MAX
UNIT
Supply voltage
–0.3
6
V
Voltage at output pin
–0.3
(VDD + 0.5)
V
Output current
–7
7
mA
Input current at any pin (3)
–5
5
mA
150
°C
150
°C
Maximum junction temperature (TJMAX)
Storage temperature Tstg
(1)
(2)
(3)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA.
7.2 ESD Ratings
VALUE
UNIT
LMT84DCK-Q1 in SC70 package
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002 (1)
±2500
Charged-device model (CDM), per AEC Q100-011
±1000
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
MIN
MAX
TMIN ≤ TA ≤ TMAX
Specified temperature
°C
−50 ≤ TA ≤ 150
Supply voltage (VDD)
1.5
UNIT
°C
5.5
V
7.4 Thermal Information (1)
LMT84-Q1
THERMAL METRIC (2)
DCK (SOT/SC70)
UNIT
5 PINS
(3) (4)
RθJA
Junction-to-ambient thermal resistance
275
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
84
°C/W
RθJB
Junction-to-board thermal resistance
56
°C/W
ψJT
Junction-to-top characterization parameter
1.2
°C/W
ψJB
Junction-to-board characterization parameter
55
°C/W
(1)
(2)
(3)
(4)
4
For information on self-heating and thermal response time, see section Mounting and Thermal Conductivity.
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High-K
board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are
included in the PCB, per JESD 51-5.
Changes in output due to self-heating can be computed by multiplying the internal dissipation by the thermal resistance.
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7.5 Accuracy Characteristics
These limits do not include DC load regulation. These stated accuracy limits are with reference to the values in Table 3.
MIN (1)
TYP (2)
MAX (1)
70°C to 150°C; VDD = 1.5 V to 5.5 V
–2.7
±0.6
2.7
°C
0°C to 70°C; VDD = 1.5 V to 5.5 V
–2.7
±0.9
2.7
°C
–50°C to +0°C; VDD = 1.6 V to 5.5 V
–2.7
±0.9
2.7
°C
PARAMETER
Temperature accuracy
(3)
TEST CONDITIONS
–50°C to +150°C; VDD = 2.3 V to 5.5 V
(1)
(2)
(3)
UNIT
±0.4
°C
Limits are specified to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Accuracy is defined as the error between the measured and reference output voltages, tabulated in Table 3 at the specified conditions of
supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the specified conditions.
Accuracy limits do not include load regulation; they assume no DC load.
7.6 Electrical Characteristics
Unless otherwise noted, these specifications apply for VDD = +1.5 V to +5.5 V. minimum and maximum limits apply for TA = TJ
= TMIN to TMAX; typical values apply for TA = TJ = 25°C.
PARAMETER
TEST CONDITIONS
MIN (1)
TYP (2)
–1
–0.22
Sensor gain
(3)
Source ≤ 50 μA, (VDD – VOUT) ≥ 200 mV
Sink ≤ 50 μA, VOUT ≥ 200 mV
(4)
IS
Supply current
CL
Output load capacitance
Power-on time
(5)
(5)
0.26
UNIT
mV/°C
mV
1
200
mV
μV/V
TA = 30°C to 150°C, (VDD – VOUT) ≥ 100 mV
5.4
8.1
μA
TA = –50°C to 150°C, (VDD – VOUT) ≥ 100 mV
5.4
9
μA
1.9
ms
1100
CL= 0 pF to 1100 pF
Output drive
(1)
(2)
(3)
(4)
(1)
–5.5
Load regulation
Line regulation
MAX
0.7
pF
±50
µA
Limits are specific to TI's AOQL (Average Outgoing Quality Level).
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Source currents are flowing out of the LMT84-xx. Sink currents are flowing into the LMT84-xx.
Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest
supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in Output Voltage Shift.
Specified by design and characterization.
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7.7 Typical Characteristics
4
TEMPERATURE ERROR (ºC)
3
2
1
0
-1
-2
-3
-4
-50
-25
0
25
50
75
100 125 150
TEMPERATURE (ºC)
Figure 1. Temperature Error vs Temperature
Figure 2. Minimum Operating Temperature vs
Supply Voltage
Figure 3. Supply Current vs Temperature
Figure 4. Supply Current vs Supply Voltage
100
Figure 5. Load Regulation, Sourcing Current
6
Figure 6. Load Regulation, Sinking Current
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Typical Characteristics (continued)
1000
Figure 7. Change in Vout vs Overhead Voltage
Figure 8. Supply-Noise Gain vs Frequency
Figure 9. Output Voltage vs Supply Voltage
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8 Detailed Description
8.1 Overview
The LMT84-Q1 is an analog output temperature sensor. The temperature-sensing element is comprised of a
simple base emitter junction that is forward biased by a current source. The temperature-sensing element is then
buffered by an amplifier and provided to the OUT pin. The amplifier has a simple push-pull output stage thus
providing a low impedance output source.
8.2 Functional Block Diagram
Full-Range Celsius Temperature Sensor (−50°C to +150°C)
VDD
OUT
Thermal Diodes
GND
8.3 Feature Description
8.3.1 LMT84 Transfer Function
The output voltage of the LMT84-Q1, across the complete operating temperature range, is shown in Table 3.
This table is the reference from which the LMT84-Q1 accuracy specifications (listed in the Accuracy
Characteristics section) are determined. This table can be used, for example, in a host processor look-up table. A
file containing this data is available for download at the LMT84-Q1 product folder under Tools and Software
Models.
Table 3. LMT84-Q1 Transfer Table
8
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
–50
1299
-10
1088
30
871
70
647
110
419
–49
1294
-9
1082
31
865
71
642
111
413
–48
1289
-8
1077
32
860
72
636
112
407
–47
1284
-7
1072
33
854
73
630
113
401
–46
1278
-6
1066
34
849
74
625
114
396
–45
1273
-5
1061
35
843
75
619
115
390
–44
1268
-4
1055
36
838
76
613
116
384
–43
1263
-3
1050
37
832
77
608
117
378
–42
1257
-2
1044
38
827
78
602
118
372
–41
1252
-1
1039
39
821
79
596
119
367
–40
1247
0
1034
40
816
80
591
120
361
–39
1242
1
1028
41
810
81
585
121
355
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Feature Description (continued)
Table 3. LMT84-Q1 Transfer Table (continued)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
TEMP
(°C)
VOUT
(mV)
–38
1236
2
1023
42
804
82
579
122
349
–37
1231
3
1017
43
799
83
574
123
343
–36
1226
4
1012
44
793
84
568
124
337
–35
1221
5
1007
45
788
85
562
125
332
–34
1215
6
1001
46
782
86
557
126
326
–33
1210
7
996
47
777
87
551
127
320
–32
1205
8
990
48
771
88
545
128
314
–31
1200
9
985
49
766
89
539
129
308
–30
1194
10
980
50
760
90
534
130
302
–29
1189
11
974
51
754
91
528
131
296
–28
1184
12
969
52
749
92
522
132
291
–27
1178
13
963
53
743
93
517
133
285
–26
1173
14
958
54
738
94
511
134
279
–25
1168
15
952
55
732
95
505
135
273
–24
1162
16
947
56
726
96
499
136
267
–23
1157
17
941
57
721
97
494
137
261
–22
1152
18
936
58
715
98
488
138
255
–21
1146
19
931
59
710
99
482
139
249
–20
1141
20
925
60
704
100
476
140
243
–19
1136
21
920
61
698
101
471
141
237
–18
1130
22
914
62
693
102
465
142
231
–17
1125
23
909
63
687
103
459
143
225
–16
1120
24
903
64
681
104
453
144
219
–15
1114
25
898
65
676
105
448
145
213
–14
1109
26
892
66
670
106
442
146
207
–13
1104
27
887
67
664
107
436
147
201
–12
1098
28
882
68
659
108
430
148
195
–11
1093
29
876
69
653
109
425
149
189
150
183
Although the LMT84-Q1 is very linear, the response does have a slight umbrella parabolic shape. This shape is
very accurately reflected in Table 3. The transfer table can be calculated by using the parabolic equation
(Equation 1).
VTEMP mV
870.6mV
mV
ª
º
«5.506 qC T 30qC »
¬
¼
mV
ª
2º
«0.00176 2 T 30qC »
q
C
¬
¼
(1)
The parabolic equation is an approximation of the transfer table and the accuracy of the equation degrades
slightly at the temperature range extremes. Equation 1 can be solved for T, resulting in:
T
5.506
5.506 2
4 u 0.00176 u 870.6
2 u ( 0.00176)
VTEMP mV
30
(2)
For an even less accurate linear approximation, a line can easily be calculated over the desired temperature
range from the table using the two-point equation (Equation 3):
·
¹
V - V1 =
V2 - V1
T2 - T1
· u (T - T1)
¹
where
•
•
•
V is in mV,
T is in °C,
T1 and V1 are the coordinates of the lowest temperature,
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and T2 and V2 are the coordinates of the highest temperature.
(3)
For example, if the user wanted to resolve this equation, over a temperature range of 20°C to 50°C, they would
proceed as follows:
760 mV - 925 mV ·
u (T - 20oC)
50oC - 20oC ¹
·
¹
V - 925 mV =
(4)
o
o
V - 925 mV = (-5.50 mV / C) u (T - 20 C)
(5)
o
V = (-5.50 mV / C) u T + 1035 mV
(6)
Using this method of linear approximation, the transfer function can be approximated for one or more
temperature ranges of interest.
8.4 Device Functional Modes
8.4.1 Mounting and Thermal Conductivity
The LMT84-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be
glued or cemented to a surface.
To ensure good thermal conductivity, the backside of the LMT84 die is directly attached to the GND pin. The
temperatures of the lands and traces to the other leads of the LMT84-Q1 will also affect the temperature reading.
Alternatively, the LMT84-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath
or screwed into a threaded hole in a tank. As with any IC, the LMT84 and accompanying wiring and circuits must
be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. If moisture creates a short circuit from the output to ground or VDD,
the output from the LMT84-Q1 will not be correct. Printed-circuit coatings are often used to ensure that moisture
cannot corrode the leads or circuit traces.
The thermal resistance junction to ambient (RθJA or θJA) is the parameter used to calculate the rise of a device
junction temperature due to its power dissipation. Use Equation 7 to calculate the rise in the LMT84-Q1 die
temperature:
TJ = TA + TJA ª¬(VDDIS ) + (VDD - VO ) IL º¼
where
•
•
•
•
TA is the ambient temperature,
IS is the supply current,
ILis the load current on the output,
and VO is the output voltage.
(7)
For example, in an application where TA = 30°C, VDD = 5 V, IS = 5.4 μA, VOUT = 871 mV, and IL = 2 μA, the
junction temperature would be 30.015°C, showing a self-heating error of only 0.015°C. Because the junction
temperature of the LMT84 device is the actual temperature being measured, take care to minimize the load
current that the LMT84 is required to drive. Thermal Information (1) shows the thermal resistance of the LMT84Q1.
8.4.2 Output Noise Considerations
A push-pull output gives the LMT84-Q1 the ability to sink and source significant current. This is beneficial when,
for example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC). In these
applications the source current is required to quickly charge the input capacitor of the ADC. The LMT84 is ideal
for this and other applications which require strong source or sink current.
The LMT84-Q1 supply-noise gain (the ratio of the AC signal on VOUT to the AC signal on VDD) was measured
during bench tests. The typical attenuation is shown in Figure 8 found in the Typical Characteristics section. A
load capacitor on the output can help to filter noise.
For operation in very noisy environments, some bypass capacitance should be present on the supply within
approximately 5 centimeters of the LMT84-Q1.
(1)
10
For information on self-heating and thermal response time, see section Mounting and Thermal Conductivity.
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Device Functional Modes (continued)
8.4.3 Capacitive Loads
The LMT84-Q1 handles capacitive loading well. In an extremely noisy environment, or when driving a switched
sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling. Without any
precautions, the LMT84-Q1 can drive a capacitive load less than or equal to 1100 pF as shown in Figure 10. For
capacitive loads greater than 1100 pF, a series resistor may be required on the output, as shown in Figure 11.
VDD
LMT84
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD ” 1100 pF
Figure 10. LMT84-Q1 No Decoupling Required for Capacitive Loads Less Than 1100 pF
VDD
RS
LMT84
OPTIONAL
BYPASS
CAPACITANCE
OUT
GND
CLOAD > 1100 pF
Figure 11. LMT84-Q1 With Series Resistor for Capacitive Loading Greater Than 1100 pF
Table 4. Recommended Series Resistor Values
CLOAD
MINIMUM RS
1.1 nF to 99 nF
3 kΩ
100 nF to 999 nF
1.5 kΩ
1 μF
800 Ω
8.4.4 Output Voltage Shift
The LMT84-Q1 is very linear over temperature and supply voltage range. Due to the intrinsic behavior of an
NMOS or PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is ramped over
the operating range of the device. The location of the shift is determined by the relative levels of VDD and VOUT.
The shift typically occurs when VDD – VOUT = 1 V.
This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VOUT.
Because the shift takes place over a wide temperature change of 5°C to 20°C, VOUT is always monotonic. The
accuracy specifications in the Accuracy Characteristics table already include this possible shift.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Applications Information
The LMT84-Q1 features make it suitable for many general temperature-sensing applications. It can operate down
to 1.5-V supply with 5.4-µA power consumption, making it ideal for battery-powered devices.
9.2 Typical Applications
9.2.1 Connection to an ADC
Simplified Input Circuit of
SAR Analog-to-Digital Converter
Reset
+1.5V to +5.5V
Input
Pin
LMT84
VDD
CBP
RMUX
RSS
Sample
OUT
GND
CFILTER
CMUX
CSAMPLE
Figure 12. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage
9.2.1.1 Design Requirements
Most CMOS ADCs found in microcontrollers and ASICs have a sampled data comparator input structure. When
the ADC charges the sampling cap, it requires instantaneous charge from the output of the analog source such
as the LMT84-Q1 temperature sensor and many op amps. This requirement is easily accommodated by the
addition of a capacitor (CFILTER).
9.2.1.2 Detailed Design Procedure
The size of CFILTER depends on the size of the sampling capacitor and the sampling frequency. Because not all
ADCs have identical input stages, the charge requirements will vary. This general ADC application is shown as
an example only.
9.2.1.3 Application Curve
Figure 13. Analog Output Transfer Function
12
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Typical Applications (continued)
9.2.2 Conserving Power Dissipation With Shutdown
VDD
SHUTDOWN
VOUT
LMT84
Any logic
device output
Figure 14. Simple Shutdown Connection of the LMT84-Q1
9.2.2.1 Design Requirements
Because the power consumption of the LMT84-Q1 is less than 9 µA, it can simply be powered directly from any
logic gate output and therefore not require a specific shutdown pin. The device can even be powered directly
from a microcontroller GPIO. In this way, it can easily be turned off for cases such as battery-powered systems
where power savings are critical.
9.2.2.2 Detailed Design Procedure
Simply connect the VDD pin of the LMT84-Q1 directly to the logic shutdown signal from a microcontroller.
9.2.2.3 Application Curves
Time: 500 µs/div; Top trace: VDD 1 V/div;
Bottom trace: OUT 1 V/div
Figure 15. Output Turnon Response Time Without a
Capacitive Load and VDD= 3.3 V
Time: 500 µs/div; Top trace: VDD 2 V/div;
Bottom trace: OUT 1 V/div
Figure 16. Output Turnon Response Time Without a
Capacitive Load and VDD= 5 V
Time: 500 µs/div; Top trace: VDD 1 V/div;
Bottom trace: OUT 1 V/div
Figure 17. Output Turnon Response Time With 1.1-Nf
Capacitive Load and VDD= 3.3 V
Time: 500 µs/div; Top trace: VDD 2 V/div;
Bottom trace: OUT 1 V/div
Figure 18. Output Turnon Response Time With 1.1-Nf
Capacitive Load and VDD= 5 V
10 Power Supply Recommendations
The low supply current and supply range (1.5 V to 5.5 V) of the LMT84-Q1 allow the device to easily be powered
from many sources. Power supply bypassing is optional and is mainly dependent on the noise on the power
supply used. In noisy systems, it may be necessary to add bypass capacitors to lower the noise that is coupled
to the output of the LMT84-Q1.
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11 Layout
11.1 Layout Guidelines
The LMT84-Q1 is extremely simple to layout. If a power-supply bypass capacitor is used, is should be connected
as shown in the Layout Examples.
11.2 Layout Examples
VIA to ground plane
VIA to power plane
GND
GND
GND
OUT
0.01µ F
VDD
Figure 19. SC70 Package Recommended Layout
14
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
LMT84QDCKRQ1
ACTIVE
SC70
DCK
5
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-50 to 150
BOA
LMT84QDCKTQ1
ACTIVE
SC70
DCK
5
250
RoHS & Green
SN
Level-1-260C-UNLIM
-50 to 150
BOA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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