LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012
GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS
FEATURES
1
The LMV393 and LMV339 devices are low-voltage
(2.7 V to 5.5 V) versions of the dual and quad
comparators, LM393 and LM339, which operate from
5 V to 30 V. The LMV331 is the single-comparator
version.
The LMV331, LMV339, and LMV393 are the most
cost-effective solutions for applications where lowvoltage operation, low power, space saving, and price
are the primary specifications in circuit design for
portable consumer products. These devices offer
specifications that meet or exceed the familiar LM339
and LM393 devices at a fraction of the supply current.
1
14
2
13
3
12
4
11
5
10
6
9
7
8
3OUT
4OUT
GND
4IN+
4IN–
3IN+
3IN–
LMV339 . . . RUC PACKAGE
(TOP VIEW)
1OUT
1
VCC+
1IN–
3OUT
DESCRIPTION/
ORDERING INFORMATION
2OUT
1OUT
VCC+
1IN–
1IN+
2IN–
2IN+
14
13
12
4OUT
2
11
GND
3
10
4IN+
1IN+
4
9
4IN–
2IN–
5
8
3IN+
6
7
3IN–
•
•
LMV339 . . . D OR PW PACKAGE
(TOP VIEW)
2OUT
•
2.7-V and 5-V Performance
Low Supply Current
– LMV331 . . . 130 μA Typ
– LMV393 . . . 210 μA Typ
– LMV339 . . . 410 μA Typ
Input Common-Mode Voltage Range Includes
Ground
Low Output Saturation Voltage 200 mV Typical
Open-Collector Output for Maximum Flexibility
2IN+
•
•
LMV393 . . . D, DDU, DGK OR PW PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
GND
1
8
2
7
3
6
4
5
VCC+
2OUT
2IN–
2IN+
LMV331 . . . DBV OR DCK PACKAGE
(TOP VIEW)
1IN+
1
GND
2
1IN–
3
5
VCC+
4
OUT
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2012, Texas Instruments Incorporated
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
SC-70 – DCK
Single
SOT23-5 – DBV
MSOP/VSSOP – DGK
SOIC – D
–40°C to 125°C
Dual
TSSOP – PW
VSSOP – DDU
SOIC – D
Quad
TSSOP – PW
µQFN – RUC
(1)
(2)
(3)
TOP-SIDE
MARKING (3)
ORDERABLE PART NUMBER
Reel of 3000
LMV331IDCKR
Reel of 250
LMV331IDCKT
Reel of 3000
LMV331IDBVR
Reel of 250
LMV331IDBVT
Reel of 2500
LMV393IDGKR
Tube of 75
LMV393ID
Reel of 2500
LMV393IDR
Tube of 90
LMV393IPW
Reel of 2000
LMV393IPWR
Reel of 3000
LMV393IDDUR
Tube of 50
LMV339ID
Reel of 2500
LMV339IDR
Tube of 150
LMV339IPW
Reel of 2000
LMV339IPWR
Reel of 3000
LMV339IRUCR
R2_
R1I_
R9_
MV393I
MV393I
RABR
LM339I
MV339I
RT_
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
DBV/DCK/DGK/RUC : The actual top-side marking has one additional character that designates the wafer fab/assembly site.
SYMBOL (EACH COMPARATOR)
IN–
–
OUT
IN+
+
SIMPLIFIED SCHEMATIC
VCC+
Q6
Q7
Q8
OUT
IN+
Q1
Q2
Q3
Q4
Q5
Q9
IN−
R1
R3
R2
GND
2
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Copyright © 1999–2012, Texas Instruments Incorporated
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
(2)
VCC
Supply voltage
VID
Differential input voltage (3)
VI
Input voltage range (either input)
Duration of output short circuit (one amplifier) to ground (4)
0
At or below TA = 25°C,
VCC ≤ 5.5 V
D package
Package thermal impedance (5)
θJA
(6)
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(5)
(6)
5.5
V
±5.5
V
VCC+
V
8 pin
97
14 pin
86
DBV package
206
DCK package
252
DDU package
210
RUC package
216
PW package
UNIT
Unlimited
DGK package
TJ
MAX
°C/W
172
8 pin
149
14 pin
113
–65
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
Differential voltages are at IN+ with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
VCC
Supply voltage (single-supply operation)
VOUT
Output voltage
TA
Operating free-air temperature
Copyright © 1999–2012, Texas Instruments Incorporated
I temperature
MIN
MAX
2.7
5.5
V
VCC+ +
0.3
V
125
°C
–40
Submit Documentation Feedback
UNIT
3
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012
www.ti.com
Electrical Characteristics
VCC+ = 2.7 V, GND = 0 V, at specified free-air temperature (unless otherwise noted)
PARAMETER
VIO
Input offset voltage
αVIO
Average temperature
coefficient of input offset
voltage
IIB
Input bias current
IIO
Input offset current
IO
Output current (sinking)
TEST CONDITIONS
TA
MIN
25°C
Saturation voltage
ICC
Supply current
7
5
25°C
15
5
–40°C to
125°C
VO ≤ 1.5 V
5
mV
250
nA
50
150
25°C
UNIT
μV/°C
400
25°C
VSAT
1.7
–40°C to
125°C
Output Leakage Current
Common-mode input
voltage range
MAX
–40°C to
125°C
25°C
VICR
TYP
23
nA
mA
0.003
–40°C to
125°C
1
25°C
–0.1 to 2
IO ≤ 1.5 mA
25°C
200
LMV331
25°C
40
100
LMV393 (both comparators)
25°C
70
140
LMV339 (all four comparators)
25°C
140
200
µA
V
mV
μA
Switching Characteristics
TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
tPHL
Propagation delay high to low level output
switching
Input overdrive = 10 mV
1000
Input overdrive = 100 mV
350
tPLH
Propagation delay low to high level output
switching
Input overdrive = 10 mV
500
Input overdrive = 100 mV
400
4
Submit Documentation Feedback
UNIT
ns
ns
Copyright © 1999–2012, Texas Instruments Incorporated
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012
Electrical Characteristics
VCC+ = 5 V, GND = 0 V, at specified free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
25°C
VIO
Input offset voltage
αVIO
Average temperature
coefficient of input offset
voltage
IIB
Input bias current
–40°C to
125°C
IIO
Input offset current
–40°C to
125°C
IO
Output current (sinking)
1.7
7
VO ≤ 1.5 V
25°C
5
25°C
25
25°C
Output Leakage Current
Common-mode input
voltage range
25°C
AVD
Large-signal differential
voltage gain
25°C
VSAT
Saturation voltage
25°C
IO ≤ 4 mA
–40°C to
125°C
LMV331
–40°C to
125°C
LMV393 (both comparators)
–40°C to
125°C
LMV339 (all four comparators)
–40°C to
125°C
25°C
25°C
25°C
mV
μV/°C
250
nA
400
2
50
nA
150
10
84
mA
0.003
–40°C to
125°C
VICR
UNIT
9
25°C
Supply current
MAX
–40°C to
125°C
25°C
ICC
TYP
µA
1
–0.1 to 4.2
20
V
50
200
V/mV
400
mV
700
60
120
150
100
200
μA
250
170
300
350
Switching Characteristics
TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
tPHL
Propagation delay high to low level output
switching
Input overdrive = 10 mV
Input overdrive = 100 mV
200
tPLH
Propagation delay low to high level output
switching
Input overdrive = 10 mV
450
Input overdrive = 100 mV
300
Copyright © 1999–2012, Texas Instruments Incorporated
600
UNIT
Submit Documentation Feedback
ns
ns
5
LMV331 SINGLE
LMV393 DUAL
LMV339 QUAD
SLCS136S – AUGUST 1999 – REVISED OCTOBER 2012
www.ti.com
REVISION HISTORY
Changes from Revision M (November 2005) to Revision N
Page
•
Changed document format from Quicksilver to DocZone. .................................................................................................... 1
•
Added RUC package pin out and RUC package ordering information. ............................................................................... 1
Changes from Revision N (April 2011) to Revision O
•
Changed VI in the Absolute Maximum Ratings from 5.5 V to VCC+ ...................................................................................... 3
Changes from Revision O (February 2012) to Revision P
•
Page
Updated the Top Side Marking for RUC package, RT_. ...................................................................................................... 2
Changes from Revision Q (April 2012) to Revision R
•
Page
Updated Ordering Information Table for Top Side Marking, R9_. ........................................................................................ 2
Changes from Revision P (March 2012) to Revision Q
•
Page
Page
Added RUC to marking list ................................................................................................................................................... 2
Changes from Revision R (May 2012) to Revision S
Page
•
Updated Operating Temperature Range .............................................................................................................................. 2
•
Added thermal impedance data ............................................................................................................................................ 3
6
Submit Documentation Feedback
Copyright © 1999–2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV331IDBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R1I2 ~ R1IC ~
R1II)
LMV331IDBVRE4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R1I2 ~ R1IC ~
R1II)
LMV331IDBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R1I2 ~ R1IC ~
R1II)
LMV331IDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R1I2 ~ R1IC ~
R1II)
LMV331IDBVTE4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R1I2 ~ R1IC ~
R1II)
LMV331IDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R1I2 ~ R1IC ~
R1II)
LMV331IDCKR
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R2C ~ R2I ~ R2R)
LMV331IDCKRE4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R2C ~ R2I ~ R2R)
LMV331IDCKRG4
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R2C ~ R2I ~ R2R)
LMV331IDCKT
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R2C ~ R2I ~ R2R)
LMV331IDCKTE4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R2C ~ R2I ~ R2R)
LMV331IDCKTG4
ACTIVE
SC70
DCK
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R2C ~ R2I ~ R2R)
LMV339ID
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LMV339I
LMV339IDE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LMV339I
LMV339IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LMV339I
LMV339IDR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LMV339I
LMV339IDRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LMV339I
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV339IDRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LMV339I
LMV339IPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV339I
LMV339IPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV339I
LMV339IPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV339I
LMV339IPWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV339I
LMV339IPWRE4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV339I
LMV339IPWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV339I
LMV339IRUCR
ACTIVE
QFN
RUC
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
RT
LMV393ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IDDUR
ACTIVE
VSSOP
DDU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
RABR
LMV393IDDURE4
ACTIVE
VSSOP
DDU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
RABR
LMV393IDDURG4
ACTIVE
VSSOP
DDU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
RABR
LMV393IDE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
(R9B ~ R9Q ~ R9R)
LMV393IDGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(R9B ~ R9Q ~ R9R)
LMV393IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IDRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMV393IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IPWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IPWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
LMV393IPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
MV393I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2014
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV331, LMV393 :
• Automotive: LMV331-Q1, LMV393-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LMV331IDBVR
SOT-23
DBV
5
3000
178.0
9.0
LMV331IDBVR
SOT-23
DBV
5
3000
180.0
LMV331IDBVT
SOT-23
DBV
5
250
180.0
LMV331IDBVT
SOT-23
DBV
5
250
LMV331IDCKR
SC70
DCK
5
LMV331IDCKR
SC70
DCK
LMV331IDCKT
SC70
DCK
LMV331IDCKT
SC70
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
9.2
3.17
3.23
1.37
4.0
8.0
Q3
9.2
3.17
3.23
1.37
4.0
8.0
Q3
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
3000
180.0
9.2
2.3
2.55
1.2
4.0
8.0
Q3
5
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
5
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DCK
5
250
180.0
9.2
2.3
2.55
1.2
4.0
8.0
Q3
LMV339IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
LMV339IPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
LMV339IRUCR
QFN
RUC
14
3000
180.0
8.4
2.3
2.3
0.55
4.0
8.0
Q2
LMV393IDDUR
VSSOP
DDU
8
3000
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
LMV393IDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LMV393IDR
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LMV393IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LMV393IDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LMV393IPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMV331IDBVR
SOT-23
DBV
5
3000
180.0
180.0
18.0
LMV331IDBVR
SOT-23
DBV
5
3000
205.0
200.0
33.0
LMV331IDBVT
SOT-23
DBV
5
250
205.0
200.0
33.0
LMV331IDBVT
SOT-23
DBV
5
250
180.0
180.0
18.0
LMV331IDCKR
SC70
DCK
5
3000
205.0
200.0
33.0
LMV331IDCKR
SC70
DCK
5
3000
180.0
180.0
18.0
LMV331IDCKT
SC70
DCK
5
250
180.0
180.0
18.0
LMV331IDCKT
SC70
DCK
5
250
205.0
200.0
33.0
LMV339IDR
SOIC
D
14
2500
367.0
367.0
38.0
LMV339IPWR
TSSOP
PW
14
2000
367.0
367.0
35.0
LMV339IRUCR
QFN
RUC
14
3000
202.0
201.0
28.0
LMV393IDDUR
VSSOP
DDU
8
3000
202.0
201.0
28.0
LMV393IDGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LMV393IDR
SOIC
D
8
2500
364.0
364.0
27.0
LMV393IDR
SOIC
D
8
2500
340.5
338.1
20.6
LMV393IDRG4
SOIC
D
8
2500
340.5
338.1
20.6
LMV393IPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
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