0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
LMV712IDGST

LMV712IDGST

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TFSOP10

  • 描述:

    IC GP OPAMP 2 CIRCUIT 10VSSOP

  • 数据手册
  • 价格&库存
LMV712IDGST 数据手册
www.ti.com LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN SLOS485 – JANUARY 2006 FEATURES • • • • • • • • • • APPLICATIONS 5-MHz Gain Bandwidth Product 5-V/μs Slew Rate Low Noise: 20 nV/√Hz 1.22-mA/Channel Supply Current VOS < 3 mV Max Low Supply Voltage: 2.7 V to 5 V Rail-to-Rail Inputs and Outputs Unity Gain Stable 1.5-μA Shutdown ICC 2.2-μs Turn On • • • • • • Power-Amplifier Control Loops Cellular Phones Portable Equipment Wireless LANs Radio Systems Cordless Phones DRC PACKAGE (TOP VIEW) DGS PACKAGE (TOP VIEW) 1OUT 1IN– 1IN+ VCC– 1SD 1 2 3 4 5 10 9 8 7 6 VCC+ 2OUT 2IN− 2IN+ 2SD 1OUT 1IN– 1IN+ VCC– 1SD 1 2 3 4 5 10 9 8 7 6 VCC+ 2OUT 2IN− 2IN+ 2SD DESCRIPTION/ORDERING INFORMATION The LMV712 dual operational amplifier is a high-performance BiCMOS operational amplifier intended for applications requiring rail-to-rail inputs, combined with speed and low noise. The device offers a bandwidth of 5 MHz, a slew rate of 5 V/μs, and operates with capacitive loads of up to 200 pF without oscillation. The LMV712 offers two independent shutdown (1SD, 2SD) pins. This feature allows disabling of each device separately and reduces the supply current to less than 1 μA typical. The output voltage rapidly and smoothly ramps up with no glitch as the amplifier comes out of the shutdown mode. The LMV712 is offered in the space-saving SON (DRC) package and in an MSOP (DGS) package. These packages are designed to meet the demands of small size, low power, and low cost required by cellular phones and similar battery-operated portable electronics. ORDERING INFORMATION PACKAGE (1) TA MSOP – DGS –40°C to 85°C SON – DRC (1) ORDERABLE PART NUMBER Reel of 2500 LMV712IDGSR Reel of 250 LMV712IDGST Reel of 3000 LMV712IDRCR Reel of 250 LMV712IDRCT TOP-SIDE MARKING RNB PREVIEW Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN SLOS485 – JANUARY 2006 www.ti.com SYMBOL (EACH AMPLIFIER) − IN− OUT IN+ + SIMPLIFIED SCHEMATIC (EACH AMPLIFIER) VCC+ VBIAS1 IP Class AB Control IN+ IN− VBIAS2 IN VCC− SD 2 BIAS Control OUT LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN www.ti.com SLOS485 – JANUARY 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC+ – VCC– MAX Supply voltage (2) UNIT 5.5 V ±Supply voltage V VID Differential input voltage (3) VI Input voltage range (any input) VCC– – 0.4 VCC+ + 0.4 V VO Output voltage range VCC– – 0.4 VCC+ + 0.4 V II Input current (4) ±10 mA IO Output current ±50 mA θJA Package thermal impedance (5) (6) TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) DGS package 165 DRC package TBD –65 °C/W 150 °C 150 °C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+ with respect to IN–. Excessive input current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some limiting resistance is used. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. ESD Protection Human-Body Model Machine Model TYP UNIT 1500 V 150 V Recommended Operating Conditions MIN MAX UNIT VCC+ – VCC– Supply voltage 2.7 5 V TA Operating free-air temperature –40 85 °C 3 LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN www.ti.com SLOS485 – JANUARY 2006 Electrical Characteristics VCC+ = 2.7 V, VCC– = GND, VCM = 1.35 V, and RL > 1 MΩ (unless otherwise noted) PARAMETER VIO Input offset voltage IIB Input bias current CMRR Common-mode rejection ratio PSRR CMVR Power-supply rejection ratio Common-mode voltage range Output short-circuit current (1) ISC TEST CONDITIONS VCM = 0.85 V and 1.85 V 0 ≤ VCM ≤ 2.7 V VCM = 0.85 V 2.7 V ≤ VCC+ ≤ 5 V VCM = 1.85 V CMRR ≥ 50 dB Sourcing VO = 0 Sinking VO = 2.7 V VOH RL = 600 Ω to 1.35 V VOL Output voltage level in shutdown mode AVOL Large-signal voltage gain 5.5 ON mode Shutdown mode –40°C to 85°C 45 25°C 70 –40°C to 85°C 68 25°C 70 –40°C to 85°C 68 25 25°C 15 12 25°C 25 2.62 –40°C to 85°C 2.6 dB –0.2 V mA 50 25°C 2.68 0.01 –40°C to 85°C 0.12 0.15 25°C 2.52 –40°C to 85°C 2.5 25°C 2.55 0.05 –40°C to 85°C V 0.23 0.3 25°C 10 200 25°C 1.22 1.7 –40°C to 85°C 1.9 25°C 0.12 –40°C to 85°C 1.5 2 80 76 Sinking RL = 10 kΩ, VO = 0.4 V to 1.35 V 25°C 80 –40°C to 85°C 76 25°C 80 –40°C to 85°C 76 25°C 80 –40°C to 85°C 76 mV mA μA 115 113 97 dB 100 2.4 to 2.7 2 to 2.7 0 to 0.8 0 to 1 VSD Shutdown pin voltage GBWP Gain bandwidth product 25°C 5 MHz SR (2) Slew rate 25°C 5 V/μs Φm Phase margin 25°C 60 ° Vn Input referred voltage noise 25°C 20 nV/√Hz (1) (2) 4 Shutdown mode f = 1 kHz Shorting the output to either supply rail adversely affects reliability. Number specified is the slower of the positive and negative slew rates. 25°C pA 22 25°C 25°C ON mode mV dB 90 3 –40°C to 85°C UNIT 90 –0.3 –40°C to 85°C Sinking RL = 600 Ω, VO = 0.5 V to 1.35 V 75 2.9 Sourcing RL = 10 kΩ, VO = 1.35 V to 2.3 V Sourcing RL = 600 Ω, VO = 1.35 V to 2.2 V 115 130 50 –40°C to 85°C 3 3.2 25°C 25°C Output voltage swing ICC 0.4 25°C VOL Supply current per channel TYP MAX –40°C to 85°C RL = 10 kΩ to 1.35 V VO(SD) MIN –40°C to 85°C VOH VO TA 25°C V www.ti.com LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN SLOS485 – JANUARY 2006 Electrical Characteristics (continued) VCC+ = 2.7 V, VCC– = GND, VCM = 1.35 V, and RL > 1 MΩ (unless otherwise noted) PARAMETER T(on) Turn-on time from shutdown TEST CONDITIONS TA 25°C MIN TYP MAX 2.2 4 4.6 UNIT μs 5 LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN www.ti.com SLOS485 – JANUARY 2006 Electrical Characteristics VCC+ = 5 V, VCC– = GND, VCM = 2.5 V, and RL > 1 MΩ (unless otherwise noted) PARAMETER VIO Input offset voltage IIB Input bias current CMRR Common-mode rejection ratio PSRR CMVR Power-supply rejection ratio Common-mode voltage range Output short-circuit current (1) ISC TEST CONDITIONS VCM = 0.85 V and 1.85 V 0 ≤ VCM ≤ 5 V VCM = 0.85 V 2.7 V ≤ VCC+ ≤ 5 V VCM = 1.85 V CMRR ≥ 50 dB Sourcing VO = 0 Sinking VO = 5 V VOH RL = 600 Ω to 2.5 V VOL Output voltage level in shutdown mode AVOL Large-signal voltage gain ON mode Shutdown mode Shutdown pin voltage –40°C to 85°C 45 25°C 70 –40°C to 85°C 68 25°C 70 –40°C to 85°C 68 35 25°C 20 18 25°C 25 4.92 –40°C to 85°C 4.9 dB –0.2 V mA 50 25°C 4.98 0.01 –40°C to 85°C 0.12 0.15 25°C 4.82 –40°C to 85°C 4.8 25°C 4.85 0.05 –40°C to 85°C V 0.23 0.3 25°C 10 200 25°C 1.17 1.7 –40°C to 85°C 1.9 25°C 0.12 –40°C to 85°C 1.5 2 80 76 Sinking RL = 10 kΩ, VO = 0.4 V to 2.5 V 25°C 80 –40°C to 85°C 76 25°C 80 –40°C to 85°C 76 25°C 80 –40°C to 85°C 76 Shutdown mode pA 21 25°C 25°C mV dB 90 5.3 –40°C to 85°C UNIT 90 –0.3 25°C ON mode 80 5.2 –40°C to 85°C Sourcing RL = 600 Ω, VO = 2.5 V to 4.6 V 115 130 Sourcing RL = 10 kΩ, VO = 2.5 V to 4.6 V Sinking RL = 600 Ω, VO = 0.4 V to 2.5 V VSD 3 5.5 50 –40°C to 85°C Output voltage swing ICC MAX 0.4 3.2 25°C 25°C VOL Supply current per channel TYP –40°C to 85°C 25°C RL = 10 kΩ to 2.5 V VO(SD) MIN –40°C to 85°C VOH VO TA 25°C mV mA μA 130 130 110 dB 107 4.5 to 5 3.5 to 5 0 to 0.8 0 to 1.5 V GBWP Gain bandwidth product 25°C 5 MHz SR (2) Slew rate 25°C 5 V/μs Φm Phase margin 25°C 60 ° Vn Input referred voltage noise 25°C 20 nV/√Hz (1) (2) 6 f = 1 kHz Shorting the output to either supply rail adversely affects reliability. Number specified is the slower of the positive and negative slew rates. www.ti.com LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN SLOS485 – JANUARY 2006 Electrical Characteristics (continued) VCC+ = 5 V, VCC– = GND, VCM = 2.5 V, and RL > 1 MΩ (unless otherwise noted) PARAMETER T(on) Turn-on time from shutdown TEST CONDITIONS TA 25°C MIN TYP MAX 1.6 4 4.6 UNIT μs 7 LMV712 LOW-POWER LOW-NOISE HIGH-OUTPUT RRIO DUAL OPERATIONAL AMPLIFIER WITH INDEPENDENT SHUTDOWN SLOS485 – JANUARY 2006 TYPICAL CHARACTERISTICS GRAPH PREVIEWS Supply Current per Channel vs Supply Voltage (ON Mode) Supply Current per Channel vs Supply Voltage (Shutdown Mode) Input Offset Voltage vs Common-Mode Voltage Bias Current vs Common-Mode Voltage Over Temperature Output Positive Swing vs Supply Voltage (RL = 600 Ω) Output Negative Swing vs Supply Voltage (RL = 600 Ω) Sourcing Current vs Output Voltage (VCC = 2.7 V) Sourcing Current vs Output Voltage (VCC = 5 V) Sinking Current vs Output Voltage (VCC = 2.7 V) Sinking Current vs Output Voltage (VCC = 5 V) PSRR vs Frequency (VCC = 2.7 V) PSRR vs Frequency (VCC = 5 V) CMRR vs Frequency (VCC = 2.7 V) CMRR vs Frequency (VCC = 5 V) Open-Loop Frequency Response vs RL (VCC± = 2.7 V) Open-Loop Frequency Response vs RL (VCC± = 5 V) Open-Loop Frequency Response vs CL (VCC± = 2.7 V) Open-Loop Frequency Response vs CL (VCC± = 5 V) Voltage Noise vs Frequency (VCC = 2.7 V) Voltage Noise vs Frequency (VCC = 5 V) Non-Inverting Large Signal Pulse Response (VCC = 2.7 V) Non-Inverting Large Signal Pulse Response (VCC = 5 V) Non-Inverting Small Signal Pulse Response (VCC = 2.7 V) Non-Inverting Small Signal Pulse Response (VCC = 5 V) Inverting Large Signal Pulse Response (VCC = 2.7 V) Inverting Large Signal Pulse Response (VCC = 5 V) Inverting Small Signal Pulse Response (VCC = 2.7 V) Inverting Small Signal Pulse Response (VCC = 5 V) Turn-On Response Time (VCC = 5 V) Input Common-Mode Capacitance vs Common-Mode Voltage (VCC = 5 V) 8 www.ti.com PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LMV712IDGSR OBSOLETE VSSOP DGS 10 TBD Call TI Call TI -40 to 85 LMV712IDGSRG4 OBSOLETE VSSOP DGS 10 TBD Call TI Call TI -40 to 85 LMV712IDGST OBSOLETE VSSOP DGS 10 TBD Call TI Call TI -40 to 85 LMV712IDGSTG4 OBSOLETE VSSOP DGS 10 TBD Call TI Call TI -40 to 85 RNB RNB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
LMV712IDGST 价格&库存

很抱歉,暂时无法提供与“LMV712IDGST”相匹配的价格&库存,您可以联系我们找货

免费人工找货