LMV951MK/NOPB

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents LMV951 SNOSAI3D – OCTOBER 2006 – REVISED SEPTEMBER 2015 LMV951 1-V, 2.7-MHz, Zero Crossover Rail-to-Rail Input and Output Amplifier With Shutdown 1 Features 3 Description • • • • • • • • The LMV951 amplifier is capable of operating at supply voltages from 0.9 V to 3 V with specified specs at 1-V and 1.8-V single supply. 1 • • (Typical 1-V Supply, Unless Otherwise Noted) Ensured 1-V, 380-µA Single-Supply Operation Shutdown to 50-nA Supply Current Wide 2.7-MHz Bandwidth Rail-to-Rail Input With Zero Crossover No Input IBIAS Current Reversal Over VCM Range 1000-pF Output Drive Capability High-Output Drive Capability – Sink Current: 35 mA – Source Current: 45 mA Rail-to-Rail Buffered Output – At 600-Ω Load, 32 mV from Either Rail – At 2-kΩ Load, 12 mV from Either Rail Temperature Range −40°C to 125°C Contrary to a conventional rail-to-rail output amplifier, the LMV951 has a buffered output stage, providing an open-loop gain which is relatively unaffected by resistive output loading. At 1-V supply voltage, the LMV951 is able to source and sink in excess of 35 mA and offers a gain bandwidth product of 2.7 MHz. In shutdown mode, the LMV951 consumes less than 50 nA of supply current. Device Information(1) 2 Applications • • • The input common-mode range extends to both power supply rails without the offset transition zone and input bias current reversal inherent to most railto-rail input amplifiers. PART NUMBER Battery Operated Systems Battery Monitoring Supply Current Monitoring PACKAGE LMV951 BODY SIZE (NOM) SOT (6) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. space space Simplified Schematic Offset Voltage Change vs Common Mode + ABOVE V GENERATOR 1.4 5 1.2 SHUTDOWN + INTERNAL GAIN STAGE IN- IN+ 125°C 6 1 OUTPUT 4 VOS ( mV) V 1 25°C 0.8 3 2 V - -40°C 0.6 + - BELOW V GENERATOR V = 3V 0.4 0 0.5 1 1.5 2 2.5 3 VCM (V) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMV951 SNOSAI3D – OCTOBER 2006 – REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6.1 6.2 6.3 6.4 6.5 6.6 6.7 3 3 4 4 4 5 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: 1 V ................................... Electrical Characteristics: 1.8 V ................................ Typical Characteristics .............................................. Detailed Description ............................................ 15 7.1 Overview ................................................................. 15 7.2 Functional Block Diagram ....................................... 15 7.3 Feature Description................................................. 15 7.4 Device Functional Modes........................................ 15 8 Application and Implementation ........................ 18 8.1 Application Information............................................ 18 8.2 Typical Applications ................................................ 18 9 Power Supply Recommendations...................... 21 10 Layout................................................................... 21 10.1 Layout Guidelines ................................................. 21 10.2 Layout Example .................................................... 21 11 Device and Documentation Support ................. 22 11.1 11.2 11.3 11.4 11.5 11.6 Device Support .................................................... Documentation Support ....................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 22 22 22 22 22 22 12 Mechanical, Packaging, and Orderable Information ........................................................... 22 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (April 2013) to Revision D • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Changes from Revision B (April 2013) to Revision C • 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 18 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LMV951 LMV951 www.ti.com SNOSAI3D – OCTOBER 2006 – REVISED SEPTEMBER 2015 5 Pin Configuration and Functions DDC Package 6-Pin SOT Top View 1 6 OUTPUT V 5 - 2 + SHUTDOWN - 3 +IN + V 4 -IN Pin Functions PIN NAME NO. I/O DESCRIPTION +IN 3 I Noninverting Input -IN 4 I Inverting Input Output 1 O Output Shutdown 5 I Shutdown Input V+ 6 P Positive Supply Voltage V- 2 P Negative Supply Voltage 6 Specifications 6.1 Absolute Maximum Ratings See (1) (2) MIN Supply Voltage (V+ – V−) VIN Differential (V+) + 0.3 Voltage at Input and Output Pin Current at Input Pin Junction Temperature (3) –40 Mounting Temperature, Infrared or Convection (20 s) Storage temperature (1) (2) (3) –60 MAX UNIT 3.1 V ±0.3 V (V−) − 0.3 V ±10 mA 150 °C 235 °C 150 °C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly onto a PC Board. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) ±2000 Machine model ±200 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LMV951 3 LMV951 SNOSAI3D – OCTOBER 2006 – REVISED SEPTEMBER 2015 www.ti.com 6.3 Recommended Operating Conditions Temperature Range (1) Supply Voltage (1) MIN MAX UNIT –40 125 °C 0.9 3 V The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly onto a PC Board. 6.4 Thermal Information LMV951 THERMAL METRIC (1) DDC (SOT) UNIT 6 PINS RθJA (1) (2) Junction-to-ambient thermal resistance (2) 170 °C/W For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is PD = TJ(MAX) - TA)/RθJA. All numbers apply for packages soldered directly onto a PC Board. 6.5 Electrical Characteristics: 1 V Unless otherwise specified, all limits specified for at TA = 25°C, V+ = 1, V− = 0 V, VCM = 0.5 V, Shutdown = 0 V, and RL = 1 MΩ. (1) PARAMETER VOS Input Offset Voltage TC VOS Input Offset Average Drift IB Input Bias Current IOS Input Offset Current TEST CONDITIONS TA = 25°C AV At the temperature extremes 0.2 67 At the temperature extremes 55 TA = 25°C 76 At the temperature extremes 73 1 V ≤ V ≤ 1.8 V, VCM = 0.5 V TA = 25°C 70 At the temperature extremes 67 1 V ≤ V+ ≤ 3 V, VCM = 0.5 V TA = 25°C 68 At the temperature extremes 65 Power Supply Rejection Ratio CMRR ≥ 67 dB 90 At the temperature extremes 85 VOUT = 0.1 V to 0.9 V RL = 2 kΩ to 0.5 V TA = 25°C 90 At the temperature extremes 86 TA = 25°C 50 At the temperature extremes 62 TA = 25°C 25 At the temperature extremes 36 TA = 25°C 70 At the temperature extremes 85 TA = 25°C 35 At the temperature extremes 40 Output Voltage Swing High RL = 2 kΩ to 0.5 V VOUT RL = 600 Ω to 0.5 V Output Voltage Swing Low RL = 2 kΩ to 0.5 V (2) (3) 4 92 dB 85 1.2 TA = 25°C Large Signal Voltage Gain dB 85 1.2 VOUT = 0.1 V to 0.9 V RL = 600 Ω to 0.5 V nA nA 0 At the temperature extremes mV 77 0 CMRR ≥ 55 dB UNIT μV/°C 80 85 TA = 25°C RL = 600 Ω to 0.5 V (1) 2.8 32 Common-Mode Rejection Ratio Input Common-Mode Voltage Range 1.5 0.15 + VCM MAX (2) 3 TA = 25°C 0.1 V ≤ VCM ≤ 1 V PSRR TYP (3) At the temperature extremes 0 V ≤ VCM ≤ 1 V CMRR MIN (2) V 106 112 dB 25 12 32 mV from rail 10 Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions is very limited selfheating of the device. All limits are specified by testing or statistical analysis. Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material. Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: LMV951 LMV951 www.ti.com SNOSAI3D – OCTOBER 2006 – REVISED SEPTEMBER 2015 Electrical Characteristics: 1 V (continued) Unless otherwise specified, all limits specified for at TA = 25°C, V+ = 1, V− = 0 V, VCM = 0.5 V, Shutdown = 0 V, and RL = 1 MΩ.(1) PARAMETER IOUT Output Short-Circuit Current TEST CONDITIONS (4) MIN (2) TYP (3) 45 Sourcing VO = 0 V, VIN(DIFF) = ±0.2 V TA = 25°C 20 At the temperature extremes 15 Sinking VO = 1 V, VIN(DIFF) = ±0.2 V TA = 25°C 20 At the temperature extremes 13 IS TA = 25°C Shutdown Mode VSD >0.6 V 0.01 At the temperature extremes Slew Rate GBWP Gain Bandwidth Product en Input-Referred Voltage Noise in Input-Referred Current Noise THD Total Harmonic Distortion f = 1 kHz, AV = 1, RL = 1 kΩ ISD Shutdown Pin Current VSD Shutdown Pin Voltage Range 1 μA 3 (5) SR (4) (5) See 480 520 Supply Current UNIT mA 35 370 Active Mode VSD