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LMX2324TM

LMX2324TM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP-16

  • 描述:

    IC FREQ SYNTHESIZER 16-TSSOP

  • 数据手册
  • 价格&库存
LMX2324TM 数据手册
OBSOLETE LMX2324 www.ti.com SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 LMX2324 PLLatinum™ 2.0 GHz Frequency Synthesizer for RF Personal Communications Check for Samples: LMX2324 FEATURES DESCRIPTION • • • The LMX2324 is a high performance frequency synthesizer with integrated 32/33 dual modulus prescaler designed for RF operation up to 2.0 GHz. Using a proprietary digital phase locked loop technique, the LMX2324's linear phase detector characteristics can generate very stable, low noise control signals for UHF and VHF voltage controlled oscillators. 1 23 • • RF Operation up to 2.0 GHz 2.7V to 5.5V Operation Low Current Consumption: ICC = 3.5 mA (typ) at VCC = 3.0V Dual Modulus Prescaler: 32/33 Internal Balanced, Low Leakage Charge Pump APPLICATIONS • • • • Cellular Telephone Systems (GSM, NADC, CDMA, PDC) Personal Wireless Communications (DCS1800, DECT, CT-1+) Wireless Local Area Networks (WLANs) Other Wireless Communication Systems Serial data is transferred into the LMX2324 via a three-line MICROWIRE interface (Data, LE, Clock). Supply voltage range is from 2.7V to 5.5V. The LMX2324 features very low current consumption, typically 3.5 mA at 3V. The charge pump provides 4 mA output current. The LMX2324 is manufactured using TI's ABiC V BiCMOS process and is packaged in a 16-pin TSSOP and a 16-pin PLGA package. Functional Block Diagram 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PLLatinum is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated OBSOLETE LMX2324 SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Connection Diagram Figure 1. TSSOP 16-Pin Package See Package Number PW0016A Figure 2. PLGA 16-Pin Package See Package Number NPG0016A PIN DESCRIPTIONS Pin No. Pin Name I/O 1 VP — Power supply for charge pump. Must be ≥ VCC 2 CPo O Internal charge pump output. For connection to a loop filter for driving the voltage control input of an external oscillator. 4 3 GND — Ground. 5 4 fINB I RF prescaler complimentary input. In single-ended mode, a bypass capacitor should be placed as close as possible to this pin and be connected directly to the ground plane. The LMX2324 can be driven differentially when the bypass capacitor is omitted. 6 5 fIN I RF prescaler input. Small signal input from the voltage controlled oscillator. 7 6 NC 8 7 NC 9 8 OSCin TSSOP16 PLGA16 2 3 Description No Connect No Connect I Oscillator input. A CMOS inverting gate input. The input has a VCC/2 input threshold and can be driven from an external CMOS or TTL logic gate. 10 9 NC 12 10 Clock I No Connect High impedance CMOS Clock input. Data is clocked in on the rising edge, for the various counters and registers. 13 11 Data I Binary serial data input. Data entered MSB first. LSB is control bit. High impedance CMOS input. 14 12 LE I Load Enable input. When Load Enable transitions HIGH, data is loaded into either the N or R register (control bit dependent). See Serial Data Input Timing. 15 13 NC 11 14 NC 16 15 CE I CHIP Enable. A LOW on CE powers down the device asynchronously and will TRISTATE the charge pump output. 1 16 VCC I Power supply voltage input. Input may range from 2.7V to 5.5V. Bypass capacitors should be placed as close as possible to this pin and be connected directly to the ground plane. No Connect No Connect These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 OBSOLETE LMX2324 www.ti.com SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) (3) −0.3V to 6.5V Power Supply Voltage (VCC) Power Supply for Charge Pump (VP) VCC to 6.5V Voltage on Any Pin with −0.3V to VCC + 0.3V GND = 0V (VI) −65°C to +150°C Storage Temperature Range (TS) Lead Temperature (solder, 4 sec.) (TL) (1) +260°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. This device is a high performance RF integrated circuit with an ESD rating < 2kV. and is ESD sensitive. Handling and assembly of this device should on be done on ESD protected workstations. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (2) (3) Recommended Operating Conditions (1) Power Supply Voltage (VCC) 2.7V to 5.5V Power Supply for Charge Pump (VP) VCC to 5.5V −40°C to +85°C Operating Temperature (TA) (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. Electrical Characteristics (VCC = 3V, VP = 3V; −40°C < TA < 85°C except as specified). All min/max specifications are ensured by design, or test, or statistical methods. Symbol Parameter Conditions Min Typ Max Units GENERAL ICC Power Supply Current ICC-PWDN Power Down Current fIN fIN Operating Frequency OSCin Oscillator Operating Frequency fPD Phase Detector Frequency PfIN Input Sensitivity fINB grounded through a 10 pF capacitor VOSC VCC = 2.7V to 5.5V 3.5 mA 10 µA 0.1 2.0 GHz 5 40 MHz 10 MHz VCC = 3.0V −15 0 VCC = 5.0V −10 0 Oscillator Sensitivity 0.4 1.0 VCC−0.3 dBm VPP CHARGE PUMP ICPo-source Charge Pump Output Current VCPo = VP/2 ICPo-sink −4.0 mA 4.0 mA ICPo-Tri Charge Pump TRI-STATE Current 0.5 ≤ VCPo ≤ VP - 0.5 T = 25°C 0.1 nA ICPo vs. VCPo Charge Pump Output Current Variation vs. Voltage (1) 0.5 ≤ VCPo ≤ VP - 0.5 T = 25°C 10 % ICPo-sink vs. ICPo-source Charge Pump Output Current Sink vs. Source Mismatch (1) VCPo = VP/2 T = 25°C 5 % ICPo vs. T Charge Pump Output Current Magnitude Variation vs. Temperature (1) VCPo = VP/2 −40°C ≤ T ≤ +85°C 10 % (1) See related equations in Charge Pump Current Specification Definitions Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 3 OBSOLETE LMX2324 SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Electrical Characteristics (continued) (VCC = 3V, VP = 3V; −40°C < TA < 85°C except as specified). All min/max specifications are ensured by design, or test, or statistical methods. Symbol Parameter Conditions Min Typ Max Units DIGITAL INTERFACE (DATA, CLK, LE, CE) VIH High-Level Input Voltage (2) VIL Low-Level Input Voltage (2) IIH High-Level Input Current VIH = VCC = 5.5V IIL Low-Level Input Current VIL = 0, VCC = 5.5V IIH Oscillator Input Current VIH = VCC = 5.5V IIL VIL = 0, VCC = 5.5V 0.8 VCC V 0.2 VCC V −1.0 1.0 µA −1.0 1.0 µA 100 µA −100 µA MICROWIRE TIMING tCS Data to Clock Set Up Time See Data Input Timing 50 ns tCH Data to Clock Hold Time See Data Input Timing 10 ns tCWH Clock Pulse Width High See Data Input Timing 50 ns tCWL Clock Pulse Width Low See Data Input Timing 50 ns tES Clock to Enable Set Up Time See Data Input Timing 50 ns tEW Enable Pulse Width See Data Input Timing 50 ns (2) Except fIN and OSCin Charge Pump Current Specification Definitions I1 = CP sink current at VCPo = VP − ΔV I2 = CP sink current at VCPo = VP/2 I3 = CP sink current at VCPo = ΔV I4 = CP source current at VCPo = VP − ΔV I5 = CP source current at VCPo = VP/2 I6 = CP source current at VCPo = ΔV ΔV = Voltage offset from positive and negative rails. Dependent on VCO tuning range relative to VP and ground. Typical values are between 0.5V and 1.0V. 1. ICPo vs. VCPo = Charge Pump Output Current magnitude variation vs. Voltage = [½ * {|I1| − |I3|}]/[½ * {|I1| + |I3|}] * 100% and [½ * {|I4| − |I6|}]/[½ * {|I4| + |I6|}] * 100% 2. ICPo-sink vs. ICPo-source = Charge Pump Output Current Sink vs. Source Mismatch = [|I2| − |I5|]/[½ * {|I2| + |I5|}] * 100% 3. ICPo vs. T = Charge Pump Output Current magnitude variation vs. Temperature = [|I2 @ temp| − |I2 @ 25°C|]/|I2 @ 25°C| * 100% and [|I5 @ temp| − |I5 @ 25°C|]/|I5 @ 25°C| * 100% 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 OBSOLETE LMX2324 www.ti.com SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 FUNCTIONAL DESCRIPTION The basic phase-lock-loop (PLL) configuration consists of a high-stability crystal reference oscillator, a frequency synthesizer such as the Texas Instruments LMX2324, a voltage controlled oscillator (VCO), and a passive loop filter. The frequency synthesizer includes a phase detector, current mode charge pump, as well as programmable reference [R] and feedback [N] frequency dividers. The VCO frequency is established by dividing the crystal reference signal down via the R counter to obtain a frequency that sets the comparison frequency. This reference signal, fr, is then presented to the input of a phase/frequency detector and compared with another signal, fp, the feedback signal, which was obtained by dividing the VCO frequency down by way of the N counter. The phase/frequency detector's current source outputs pump charge into the loop filter, which then converts the charge into the VCO's control voltage. The phase/frequency comparator's function is to adjust the voltage presented to the VCO until the feedback signal's frequency (and phase) match that of the reference signal. When this “phase-locked” condition exists, the RF VCO's frequency will be N times that of the comparison frequency, where N is the divider ratio. OSCILLATOR The reference oscillator frequency for the PLL is provided by an external reference TCXO through the OSCin pin. OSCin block can operate to 40 MHz with a minimum input sensitivity of 0.4VPP. The inputs have a VCC/2 input threshold and can be driven from an external CMOS or TTL logic gate. REFERENCE DIVIDERS (R COUNTER) The R Counter is clocked through the oscillator block. The maximum frequency is 40 MHz. The R Counter is a 10 bit CMOS binary counter with a divide range from 2 to 1,023. See 10-Bit Programmable Reference Divider Ratio (R Counter). PROGRAMMABLE DIVIDERS (N COUNTER) The N counter is clocked by the small signal fIN and fINB input pins. The LMX2324 RF N counter is 15 bit integer divider. The N counter is configured as a 5 bit A Counter and a 10 bit B Counter, offering a continuous integer divide range from 992 to 32,767. The LMX2324 is capable of operating from 100 MHz to 2.0 GHz with a 32/33 prescaler. Prescaler The RF inputs to the prescaler consist of the fIN and fINB pins which are the complimentary inputs of a differential pair amplifier. The differential fIN configuration can operate to 2 GHz with an input sensitivity of −15 dBm. The input buffer drives the N counter's ECL D-type flip flops in a dual modulus configuration. A 32/33 prescale ratio is provided for the LMX2324. The prescaler clocks the subsequent CMOS flip-flop chain comprising the fully programmable A and B counters. PHASE/FREQUENCY DETECTOR The phase(/frequency) detector is driven from the N and R counter outputs. The maximum frequency at the phase detector inputs is 10 MHz. The phase detector outputs control the charge pumps. The polarity of the pump-up or pump-down control is programmed using PD_POL, depending on whether RF VCO characteristics are positive or negative (see R Register Truth Table). The phase detector also receives a feedback signal from the charge pump, in order to eliminate dead zone. CHARGE PUMP The phase detector's current source output pumps charge into an external loop filter, which then converts the charge into the VCO's control voltage. The charge pumps steer the charge pump output, CPo, to VP (pump-up) or Ground (pump-down). When locked, CPo is primarily in a TRI-STATE mode with small corrections. The RF charge pump output current magnitude is set to 4.0 mA. The charge pump output can also be used to output divider signals as detailed in Test Mode Truth Table (R[13] = 1). Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 5 OBSOLETE LMX2324 SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com MICROWIRE SERIAL INTERFACE The programmable functions are accessed through the MICROWIRE serial interface. The interface is made of three functions: clock, data and latch enable (LE). Serial data for the various counters is clocked in from data on the rising edge of clock, into the 18-bit shift register. Data is entered MSB first. The last bit decodes the internal register address. On the rising edge of LE, data stored in the shift register is loaded into one of the two appropriate latches (selected by address bits). A complete programming description is included in the following sections. POWER CONTROL The PLL can be power controlled in two ways. The first method is by setting the CE pin LOW. This asynchronously powers down the PLL and TRI-STATE the charge pump output, regardless of the PWDN bit status. The second method is by programming through MICROWIRE, while keeping the CE HIGH. Programming the PWDN bit in the N register HIGH (CE=HIGH) will disable the N counter and de-bias the fIN input (to a high impedance state). The R counter functionality also becomes disabled. The reference oscillator block powers down when the power down bit is asserted. The OSCin pin reverts to a high impedance state when this condition exists. Power down forces the charge pump and phase comparator logic to a TRI-STATE condition. A power down counter reset function resets both N and R counters. Upon powering up the N counter resumes counting in “close” alignment with the R counter (The maximum error is one prescaler cycle). The MICROWIRE control register remains active and capable of loading and latching in data during all of the power down modes. Programming Description MICROWIRE INTERFACE The LMX2324 register set can be accessed through the MICROWIRE interface. A 18-bit shift register is used as a temporary register to indirectly program the on-chip registers. The shift register consists of a 17-bit DATA[16:0] field and a 1-bit address (ADDR) field as shown below. The address field is used to decode the internal register address. Data is clocked into the shift register in the direction from MSB to LSB, when the CLOCK signal goes high. On the rising edge of Load Enable (LE) signal, data stored in the shift register is loaded into the addressed latch. MSB LSB DATA[16:0] ADDR 17 1 0 Registers' Address Map When Load Enable (LE) is transitioned high, data is transferred from the 18-bit shift register into the appropriate latch depending on the state of the ADDRESS bit. A multiplexing circuit decodes the address bit and writes the data field to the corresponding internal register. REGISTER ADDRESSED ADDRESS BIT ADDR R Register 1 N Register 0 Register Content Truth Table MSB 17 SHIFT REGISTER BIT LOCATION 16 15 14 13 12 11 10 9 8 7 6 LSB 5 4 3 1 Data Field Register NB_CNTR[9:0] NA_CNTR[4:0] N16 N15 N14 N13 N12 N11 N10 X X X TES T RS PD_ POL CP_ TRI R16 R15 R14 R13 R12 R11 R10 R N9 N8 0 ADDR Field CTL_WORD[1:0 ] N 6 2 N7 N6 N5 N4 N3 N2 N1 N0 R3 R2 R1 R0 0 R_CNTR[9:0] 1 R9 R8 R7 R6 Submit Documentation Feedback R5 R4 Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 OBSOLETE LMX2324 www.ti.com SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 R REGISTER If the Address Bit (ADDR) is 1, when LE is transitioned high data is transferred from the 18-bit shift register into the 14-bit R register. The R register contains a latch which sets the PLL 10-bit R counter divide ratio. The divide ratio is programmed using the bits R_CNTR as shown in 10-Bit Programmable Reference Divider Ratio (R Counter). The ratio must be ≥ 2. The PD_POL, CP_TRI and TEST bits control the phase detector polarity, charge pump TRI-STATE, and test mode respectively, as shown in R Register Truth Table. The RS bit is reserved and should always be set to zero. X denotes a don't care condition. Data is clocked into the shift register MSB first. MSB SHIFT REGISTER BIT LOCATION 17 16 15 14 13 12 11 10 Register 9 8 7 LSB 6 5 4 3 2 1 Data Field X X X TES T RS PD_ POL CP_ TRI R16 R15 R14 R13 R12 R11 R10 R 0 ADDR Field R_CNTR[9:0] 1 R9 R8 R7 R6 R5 R4 R3 R2 R1 R0 10-Bit Programmable Reference Divider Ratio (R Counter) (1) R_CNTR[9:0] (1) Divide Ratio R9 R8 R7 R6 R5 R4 R3 R2 R1 R0 2 0 0 0 0 0 0 0 0 1 0 3 0 0 0 0 0 0 0 0 1 1 • • • • • • • • • • • 1,023 1 1 1 1 1 1 1 1 1 1 Notes: Divide ratio: 2 to 1,023 (Divide ratios less than 2 are prohibited) R_CNTR—These bits select the divide ratio of the programmable reference dividers. R Register Truth Table Bit Location Function 0 1 CP_TRI R[10] Charge Pump TRI-STATE Normal Operation TRI-STATE PD_POL R[11] Phase Detector Polarity Negative Positive TEST R[13] Test Mode Bit Normal Operation Test Mode If the test mode is NOT activated (R[13]=0), the charge pump is active when CP_TRI is set LOW. When CP_TRI is set HIGH, the charge pump output and phase comparator are forced to a TRI-STATE condition. This bit must be set HIGH if the test mode is ACTIVATED (R[13]=1). If the test mode is NOT activated (R[13]=0), PD_POL sets the VCO characteristics to positive when set HIGH. When PD_POL is set LOW, the VCO exhibits a negative characteristic where the VCO frequency decreases with increasing control voltage. If the test mode is ACTIVATED (R[13]=1), the outputs of the N and R counters are directed to the CPo output to allow for testing. The PD_POL bit selects which counter output according to Test Mode Truth Table (R[13] = 1). Test Mode Truth Table (R[13] = 1) CP_TRI R[10] PD_POL R[11] R Divider Output CPo Output 1 0 N Divider Output 1 1 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 7 OBSOLETE LMX2324 SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com N REGISTER If the address bit is LOW (ADDR=0) when LE is transitioned high, data is transferred from the 18-bit shift register into the 17-bit N register. The N register consists of the 5-bit swallow counter (A counter), the 10-bit programmable counter (B counter) and the control word. Serial data format is shown below in 5-Bit Swallow Counter Divide Ratio (A Counter) and 10-Bit Programmable Counter Divide Ratio (B Counter). The pulse swallow function which determines the divide ratio is described in Pulse Swallow Function. Data is clocked into the shift register MSB first. MSB SHIFT REGISTER BIT LOCATION 17 16 15 14 13 12 11 10 Register 9 8 7 LSB 6 5 4 3 2 1 0 Data Field ADDR Field NB_CNTR[9:0] NA_CNTR[4:0] CTL_WOR D[1:0] N N16 N15 N14 N13 N12 N11 N10 N9 N8 N7 N6 N5 N4 N3 N2 N1 0 N0 5-Bit Swallow Counter Divide Ratio (A Counter) (1) Swallow Count (1) NA_CNTR[4:0] (A) N6 N5 N4 N3 N2 0 0 0 0 0 0 1 0 0 0 0 1 • • • • • • 31 1 1 1 1 1 Notes: Swallow Counter Value: 0 to 31 NB_CNTR ≥ NA_CNTR 10-Bit Programmable Counter Divide Ratio (B Counter) (1) NB_CNTR[10:0] (1) Divide Ratio N16 N15 N14 N13 N12 N11 N10 N9 N8 N7 3 0 0 0 0 0 0 0 0 1 1 4 0 0 0 0 0 0 0 1 0 0 • • • • • • • • • • • 1023 1 1 1 1 1 1 1 1 1 1 Notes: Divide ratio: 3 to 1,023 (Divide ratios less than 3 are prohibited) NB_CNTR ≥ NA_CNTR Pulse Swallow Function The N divider counts such that it divides the VCO RF frequency by (P+1) A times, and then divides by P (B - A) times. The B value (NB_CNTR) must be ≥ 3. The continuous divider ratio is from 992 to 32,767. Divider ratios less than 992 are achievable as long as the binary counter value is greater than the swallow counter value (NB_CNTR ≥ NA_CNTR). fVCO = N x (fOSC/R) N = (P x B) + A fVCO: Output frequency of external voltage controlled oscillator (VCO) fOSC: Output frequency of the external reference frequency oscillator R: Preset divide ratio of binary 10-bit programmable reference counter (2 to 1023) N: Preset divide ratio of main 15-bit programmable integer N counter (992 to 32,767) 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 OBSOLETE LMX2324 www.ti.com SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 B: Preset divide ratio of binary 10-bit programmable B counter (3 to 1023) A: Preset value of binary 5-bit swallow A counter (0 ≤ A ≤ 31, A ≤ B) P: Preset modulus of dual modulus prescaler (P=32) CTL_WORD MSB LSB N1 N0 CNT_RST PWDN Control Word Truth Table (1) (1) CE CNT_RST PWDN Function 1 0 0 Normal Operation 1 0 1 Synchronous Powerdown 1 1 0 Counter Reset 1 1 1 Asynchronous Powerdown 0 X X Asynchronous Powerdown Notes: X denotes don't care. The Counter Reset enable bit when activated allows the reset of both N and R counters. Upon powering up the N counter resumes counting in “close” alignment with the R counter. (The maximum error is one prescaler cycle). Both synchronous and asynchronous power down modes are available with the LMX2324 to be able to adapt to different types of applications. The MICROWIRE control register remains active and capable of loading and latching in data during all of the powerdown modes. Synchronous Power down Mode The PLL loops can be synchronously powered down by setting the counter reset mode bit to LOW (N[1] = 0) and its power down mode bit to HIGH (N[0] = 1). The power down function is gated by the charge pump. Once the power down mode and counter reset mode bits are loaded, the part will go into power down mode upon the completion of a charge pump pulse event. Asynchronous Power down Mode The PLL loops can be asynchronously powered down by setting the counter reset mode bit to HIGH (N[1] = 1) and its power down mode bit to HIGH (N[0] = 1), or by setting CE pin LOW. The power down function is NOT gated by the charge pump. Once the power down and counter reset mode bits are loaded, the part will go into power down mode immediately. The R and N counters are disabled and held at load point during the synchronous and asynchronous power down modes. This will allow a smooth acquisition of the RF signal when the PLL is programmed to power up. Upon powering up, both R and N counters will start at the ‘zero' state, and the relationship between R and N will not be random. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 9 OBSOLETE LMX2324 SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 www.ti.com Serial Data Input Timing Notes: Parenthesis data indicates programmable reference divider data. Data shifted into register on clock rising edge. Data is shifted in MSB first. Test Conditions: The Serial Data Input Timing is tested using a symmetrical waveform around VCC/2. The test waveform has an edge rate of 0.6 V/ns with amplitudes of 1.6V @ VCC = 2.7V and 3.3V @ VCC = 5.5V. Phase Comparator and Internal Charge Pump Characteristics Notes: Phase difference detection range: −2π to +2π The minimum width pump up and pump down current pulses occur at the CPo pin when the loop is locked. PD_POL = 1 fR: Phase comparator input from the R Divider fN: Phase comparator input from the N divider CPo: Charge pump output 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 OBSOLETE LMX2324 www.ti.com SNAS038D – NOVEMBER 1999 – REVISED MARCH 2013 REVISION HISTORY Changes from Revision C (March 2013) to Revision D • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LMX2324 11 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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