LMZ10503EVAL/NOPB

User's Guide SNVA421D – January 2010 – Revised April 2013 AN-2022 LMZ1050x Evaluation Board 1 Introduction The LMZ1050x can accept an input voltage rail between 2.95V and 5.5V and deliver an adjustable and highly accurate output voltage as low as 0.8V. One megahertz fixed frequency PWM switching provides a predictable EMI characteristic. Two external compensation components can be adjusted to set the fastest response time, while allowing the option to use ceramic and/or electrolytic output capacitors. Externally programmable soft-start capacitor facilitates controlled startup. The LMZ1050x is a reliable and robust solution with the following features: lossless cycle-by-cycle peak current limit to protect for over current or short-circuit fault, thermal shutdown, input under-voltage lock-out, and pre-biased startup. 2 Board Specifications • • • • • • • • 3 VIN = 2.95V to 5.5V VOUT = 2.5V (default output voltage setting; for other output settings, see Table 2) ±2.5% feedback voltage accuracy at 2.5V output (Including line and load regulation from TJ = -40°C to 125°C) ±1.63% feedback voltage accuracy over temperature IOUT = 0A to 3A, 4A, and 5A θJA = 20°C / W, θJC = 1.9°C / W Designed on four layers, the top and bottom layers are 1oz. copper and the two inner layers are 1/2 oz. copper weight Measures 2.25 in. x 2.25 in. (5.8 cm x 5.8 cm) and is 62mil (.062”) thick on a FR4 laminate Evaluation Board Design Concept The evaluation board is designed to demonstrate low conducted noise on the input and output lines, as seen in Figure 11 and Figure 14. Four input capacitors (Cin1 - C in4) and three output capacitors (Co1 - Co3) are populated for this purpose. All the input and output filter capacitors are not necessary to comply with radiation standards. For a circuit example that passes radiated emissions standards (EN55022, class B), see Figure 19. Additionally, Cin5 is present to reduce the resonance of the input line produced by the inductance and resistance in the cables connecting the bench power supply to the evaluation board and the input capacitors. 4 Additional Component Footprints When the tracking feature of the LMZ1050x is used, remove the soft-start capacitor CSS and use a resistor divider on designators Rtrkb and Rtrkt. The ground and Vtrk post have been provided for easy connection. The LMZ1050x eval board incorporates a precision enable circuit which is pulled high by a 100 kΩ pull up resistor to VIN. This allows the user to pull low on the enable pin to ground. The top enable resistor is Rent and the bottom enable resistor is Renb. For detailed design implementation, see the Design Guideline and Operating Description section of the LMZ1050x data sheet. Select FPGAs specify input inrush currents for particular power-up sequences and others require sequencing rails to avoid start-up or latch-up problems. To prevent early turn-on of the LMZ1050x in systems with multiple power rails, precision enable and tracking are useful as the main input voltage rail rises at power-up. All trademarks are the property of their respective owners. SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 1 Component Circuit Schematic 5 www.ti.com Component Circuit Schematic Figure 1. Component Schematic for Evaluation Board Table 1. Bill of Materials for Evaluation Board, VIN = 3.3V to 5V, VOUT = 2.5V Designator Description Case Size Manufacturer Manufacturer P/N Quantity U1 SIMPLE SWITCHER TO-PMOD-7 Texas Instruments LMZ1050xTZ-ADJ 1 Cin1 1 µF, X7R, 16V 0805 TDK C2012X7R1C105K 1 Cin2, CO1 4.7 µF, X5R, 6.3V 0805 TDK C2012X5R0J475K 2 Cin3, CO2 22 µF, X5R, 16V 1210 TDK C3225X5R1C226M 2 Cin4 47 µF, X5R, 6.3V 1210 TDK C3225X5R0J476M 1 Cin5 220 µF, 10V, AL-Elec E Panasonic EEE1AA221AP 1 CO3 100 µF, X5R, 6.3V 1812 TDK C4532X5R0J107M 1 Rfbt 75 kΩ 0805 Vishay Dale CRCW080575K0FKEA 1 Rfbb 34.8 kΩ 0805 Vishay Dale CRCW080534K8FKEA 1 Rcomp 1.1 kΩ 0805 Vishay Dale CRCW08051K10FKEA 1 Ccomp 180 pF, ±5%, C0G, 50V 0603 TDK C1608C0G1H181J 1 Ren1 100 kΩ 0805 Vishay Dale CRCW0805100KFKEA 1 CSS 10 nF, ±5%, C0G, 50V 0805 TDK C2012C0G1H103J 1 Table 2. Output Voltage Setting (Rfbt = 75 kΩ) 2 VOUT Rfbb 3.3 V 23.7 kΩ 2.5 V 34.8 kΩ 1.8 V 59 kΩ 1.5 V 84.5 kΩ 1.2 V 150 kΩ 0.9 V 590 kΩ AN-2022 LMZ1050x Evaluation Board SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Complete Circuit Schematic www.ti.com 6 Complete Circuit Schematic Figure 2. Complete Evaluation Board Schematic SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 3 Connection Diagram 7 www.ti.com Connection Diagram Figure 3. Efficiency Measurement Setup Oscilloscope Vo GND Co1 Figure 4. Output Voltage Ripple Measurement Setup 4 AN-2022 LMZ1050x Evaluation Board SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Performance Characteristics www.ti.com Efficiency vs. Load Current LMZ10504 & LMZ10505, VOUT = 2.5V, TAMB = 25°C 8 Efficiency vs. Load Current LMZ10503, VOUT = 2.5V, TAMB = 25°C Performance Characteristics Figure 5. Current Derating vs. Ambient Temperature LMZ10503, VIN = 5.0V, θJA = 20°C/W SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 5 Performance Characteristics www.ti.com Figure 6. Current Derating vs. Ambient Temperature LMZ10504, VIN = 5.0V, θJA = 20°C/W Figure 7. Current Derating vs. Ambient Temperature LMZ10505, VIN = 5.0V, θJA = 20°C/W Figure 8. Current Derating vs. Ambient Temperature LMZ10503, VIN = 3.3V, θJA = 20°C/W 6 AN-2022 LMZ1050x Evaluation Board SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Performance Characteristics www.ti.com Figure 9. Current Derating vs. Ambient Temperature LMZ10504, VIN = 3.3V, θJA = 20°C/W Figure 10. Current Derating vs. Ambient Temperature LMZ10505, VIN = 3.3V, θJA = 20°C/W SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 7 Performance Characteristics www.ti.com Figure 11. Output Voltage Ripple VIN = 5V, VOUT = 2.5V, IOUT = 3A, 4A, & 5A LMZ10503 / LMZ10504 / LMZ10505 Figure 12. Load Transient Response VIN = 5.0V, VOUT = 2.5V LMZ10503, IOUT = 400 mA to 2.7A, 20 MHz Bandwidth Limit 8 AN-2022 LMZ1050x Evaluation Board SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Performance Characteristics www.ti.com Figure 13. Load Transient Response VIN = 5V, VOUT = 2.5V LMZ10504, IOUT = 400 mA to 3.6A, 20 MHz Bandwidth Limit Figure 14. Output Voltage Ripple VIN = 3.3V, VOUT = 2.5V, IOUT = 3A, 4A, & 5A LMZ10503 / LMZ10504 / LMZ10505 SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 9 Performance Characteristics www.ti.com Figure 15. Load Transient Response VIN = 3.3V, VOUT = 2.5V LMZ10503, IOUT = 300 mA to 2.7A, 20 MHz Bandwidth Limit Figure 16. Load Transient Response VIN = 3.3V, VOUT = 2.5V LMZ10504, IOUT = 400 mA to 3.6A, 20 MHz Bandwidth Limit 10 AN-2022 LMZ1050x Evaluation Board SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Circuit Example: Complies with EN55022 Class B Radiated Emissions www.ti.com Figure 17. Load Transient Response VIN = 5.0V, VOUT = 2.5V LMZ10505, IOUT = 500 mA to 4.5A, 20 MHz Bandwidth Limit Figure 18. Load Transient Response VIN = 3.3V, VOUT = 2.5V LMZ10505, IOUT = 500 mA to 4.5A, 20 MHz Bandwidth Limit 9 Circuit Example: Complies with EN55022 Class B Radiated Emissions Figure 19. Component Schematic, VIN = 5V, VOUT = 2.5V, Complies with EN55022 Class B Radiated Emissions SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 11 Circuit Example: Complies with EN55022 Class B Radiated Emissions www.ti.com Table 3. Bill of Materials Designator Description Case Size Manufacturer Manufacturer P/N Quantity U1 SIMPLE SWITCHER TO-PMOD-7 Texas Instruments LMZ10503/4/05TZ-ADJ 1 Cin1 1 µF, X7R, 16V 0805 TDK C2012X7R1C105K 1 Cin2 4.7 µF, X5R, 6.3V 0805 TDK C2012X5R0J475K 1 Cin3 47 µF, X5R, 6.3V 1210 TDK C3225X5R0J476M 1 CO1 100 µF, X5R, 6.3V 1812 TDK C4532X5R0J107M 1 Rfbt 75 kΩ 0805 Vishay Dale CRCW080575K0FKEA 1 Rfbb 34.8 kΩ 0805 Vishay Dale CRCW080534K8FKEA 1 Rcomp 1.1 kΩ 0805 Vishay Dale CRCW08051K10FKEA 1 Ccomp 180 pF, ±5%, C0G, 50V 0603 TDK C1608C0G1H181J 1 CSS 10 nF, ±5%, C0G, 50V 0805 TDK C2012C0G1H103J 1 Figure 20. Radiated Emissions (EN55022, Class B) VIN = 5V, VOUT = 2.5V, IOUT = 3A Tested on LMZ10503 Evaluation Board Figure 21. Radiated Emissions (EN55022, Class B) VIN = 5V, VOUT = 2.5V, IOUT = 4A Tested on LMZ10504 Evaluation Board 12 AN-2022 LMZ1050x Evaluation Board SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated PCB Layout Diagram www.ti.com Figure 22. Radiated Emissions (EN55022, Class B) VIN = 5V, VOUT = 2.5V, IOUT = 5A Tested on LMZ10505 Evaluation Board 10 PCB Layout Diagram Figure 23. Top Layer SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 13 PCB Layout Diagram www.ti.com Figure 24. Internal Layer I (Ground) Figure 25. Internal Layer II (Ground) 14 AN-2022 LMZ1050x Evaluation Board SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated PCB Layout Diagram www.ti.com Figure 26. Bottom Layer SNVA421D – January 2010 – Revised April 2013 Submit Documentation Feedback AN-2022 LMZ1050x Evaluation Board Copyright © 2010–2013, Texas Instruments Incorporated 15 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated