LMZ13610EVAL/NOPB

User's Guide SNVA478C – April 2011 – Revised April 2013 AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board 1 Introduction The LMZ13610/8/6 and LMZ12010/8/6 SIMPLE SWITCHER® power modules are easy-to-use DC-DC solution capable of driving up to a 10, 8 or 6 ampere load. They are available in an innovative package that enhances thermal performance and allows for hand or machine soldering. The LMZ13610/8/6 can accept an input voltage rail between 6V and 36V and the LMZ12010/8/6 can accept an input voltage rail between 6V and 20V. The evaluation board is highly configurable. The output voltage can be adjusted to 5V, 3.3V, 2.5V or 1.2V with a jumper change. The external soft-start capacitor facilitates a controlled and adjustable startup rise time of the output. The board temperature can be measured with the onboard resistor and the UVLO can be adjusted by changing one resistor. In addition the board comes preconfigured with an LC input filter to pass CISPR-22 class B conducted and radiated emissions. The LMZ13610 and LMZ12010 family is a reliable and robust solution with the following features: loss-less cycle-by-cycle valley current limit to protect for over current or short-circuit fault, thermal shutdown, input under-voltage lockout, and will start up into a pre-biased output. 2 Board Specifications • • • • • • • VIN = 6V to 36V (LMZ13610/8/6) VIN = 6V to 20V (LMZ12010/8/6) VOUT = 1.2V, 2.5V, 3.3V or 5V (minimum input voltage of 7V required for 5V output) IOUT = 0 to 10, 8, or 6 Amps θJA = 9.9 °C / W, θJC = 1.0 °C/W Designed on four layers; Inner are 1 oz copper; Outer are 2 oz copper. Measures 2.95" x 3.54" (75 mm x 90 mm) and is 62 mils (1.57 mm) thick of FR4 laminate material For additional circuit considerations, including additional output voltage options, see the Applications section of the LMZ13610 10A SIMPLE SWITCHER® Power Module with 36V Maximum Input Voltage (SNVS709) or LMZ12010 10A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage (SNVS667) data sheets. For negative output voltage connections, see AN-2027 Inverting Application for the LMZ14203 SIMPLE SWITCHER Power Module (SNVA425) . SIMPLE SWITCHER is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners. SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 1 Test Connections www.ti.com CIN6 CIN5 + CIN2,3,4 VOUT SS FB PGND AGND L1 EN VIN VIN LMZ Module VOUT RENT CO3,4 CIN1 CO2 CO1 CSS (OPT) (OPT) RFBB RFB_LP CFF TEMP SENSE D1 5.1V (OPT) RENB CO5 (OPT) RFBT_5 RFBT_5b 5Vout RFBT_3.3 RFBT_3.3b 3.3Vout RFBT_2.5 RFBT_2.5b RFBT_1.2 RFBT_1.2b 2.5Vout RTS 1.2Vout VOUT SELECT (J1) Figure 1. Simplified Schematic 3 Test Connections The board should be connected to a power supply and load as shown below in Figure 2. The EN post is connected to the UVLO circuit on the back of the board. There is a resistive divider implemented on the board that can be used to establish a precision UVLO level for the board that is currently set to 5.7V. A common user change to this circuit is to adjust the value of RENT and RENB to adjust the operating UVLO to that of the target application. for calculations, see the device-specific data sheet. Note that if in the end application the EN pin voltage does not exceed 5.5V at maximum Vin, then the enable clamp zener D1 can be omitted. (On revision A of the board the overlay for the zener diode has the cathode and anode incorrectly labeled). Pull EN low to shutdown the module. 2 AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback Test Connections www.ti.com Oscilloscope J 1 ABC ENABLE VIN VOUT ELECTRONIC LOAD POWER SUPPLY Set from 0 to 10 Amperes Vin = 6 - 20 (36)V MULTI-METER MULTI-METER Vout = 5, 3.3, 2.5, 1.2V GND Figure 2. Board Connection Diagram SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 3 Test Connections www.ti.com I I I I I I 9 A B C D E F H J K TEMP SENSE 8 NC 7 AGND 6 VOUT SENSE - 5 VIN SENSE - 4 AGND 3 EN 2 10 10 L VOUT SENSE + I I 1 AGND I VOUT GND VIN VIN SENSE + I I I I I I I I I I I Figure 3. Edge Connector Diagram The evaluation board is also compatible with the 20-pin edge connector shown in Figure 3. Table 1 explains the functionality of the pins. Table 1. Functionality of the Pins Pin Name 1, 2, 3 VIN Input supply — Nominal operating range is from 6V to 20V for the LMZ12010/8/6 and from 6V to 36V for the LMZ13610/8/6. 4, 5, 6, 7 GND Power Ground — Electrical path for the power circuits within the module. 8, 9, 10 VOUT Output Voltage — Regulated 5, 3.3, 2.5 or 1.2V. A VIN SENSE + Positive Kelvin Sense of Input voltage — Tied to VIN pin of the LMZ module. E VIN SENSE - Negative Kelvin Sense of Input voltage — Tied to PGND (EP) of the LMZ module. L VOUT SENSE Positive Kelvin Sense of Output voltage — Tied to Vout banana jack. + F VOUT SENSE Negative Kelvin Sense of Output voltage — Tied to AGND of the LMZ module. - B, D, H AGND J NC No Connect — This pin must remain floating, do not ground. EN Enable — Input to the precision enable comparator of the LMZ Module. C K 4 Description AGND Ground — Tied to AGND pin of module. TEMP SENSE Connected to top of the Rts temperature sensing resistor. Temperature measurements can be made by measuring the temperature dependant resistance between TEMP SENSE and VIN SENSE -. Convert the resistance to temperature with the following equation: Temperature (C) ≊ 2.6245 x Resistance (Ω) - 262.7 AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback Adjusting the Output Voltage www.ti.com 4 Adjusting the Output Voltage The output voltage of the evaluation board is adjusted to either 5V, 3.3V, 2.5V, or 1.2V by moving jumper J1. For other voltage options see the data sheet for adjusting the feedback resistors. 5 Optional Components The evaluation board has many options for input and output filtering. CO1, CO2 and CO5 have been installed to decrease high frequency noise on the output. Their removal will not effect other performance parameters of the design. Similarly, CIN1 has been installed to provide a high frequency bypass for the input current. The second order filter consisting of L1 and CIN6 has been designed to provide enough attenuation of the conducted noise to comply with EN 55022. This filtering is not required for normal operation of the module. CIN6 CIN5 + CIN2,3,4 VOUT SS FB PGND AGND L1 EN VIN VIN LMZ Module VOUT RENT CO3,4 CIN1 CSS CO1 CO2 (OPT) (OPT) RFBB RFB_LP CFF TEMP SENSE D1 5.1V (OPT) RENB CO5 (OPT) RFBT_5 RFBT_5b 5Vout RFBT_3.3 RFBT_3.3b RFBT_2.5 RFBT_2.5b RFBT_1.2 RFBT_1.2b 3.3Vout RTS 2.5Vout 1.2Vout VOUT SELECT (J1) Figure 4. Evaluation Board Schematic SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 5 Bill of Materials 6 www.ti.com Bill of Materials Table 2. Evaluation Board Bill of Materials, VIN = 6V to 36V (20V), VOUT = 1.2 / 3.3V / 5V, IOUT (MAX) = 10/08/06A 6 Designator Description Case Size Manufacturer Manufacturer P/N Quantity U1 SIMPLE SWITCHER PFM-11 Texas Instruments LMZ13610/LMZ13608/LMZ1360 6 or LMZ12010/LMZ12008/LMZ1200 6 1 Cin1 Co1 Co5 0.047uF, X7R, 50V 0805 Kemet C0805C473K5RACTU 3 Cin2 Cin3 Cin4 Cin6 10 µF, X7S, 50V 1210 TDK C3225X7S1H106M 4 Cin5 150 µF, Aluminum Electrolytic, 50V G Panasonic EEE-FK1H151P 1 Co2 47uF, X5R, 10V 1210 Murata GRM32ER61A476KE20L 1 Co3 Co4 330µF, 6.3V, 0.015 ohm, 2917 Kemet T520D337M006ATE015 2 Cff 4700 pF, X7R, 50V 0805 Kemet C0805C472K5RACTU 1 Css 0.15uF, X7R, 10V 0603 Murata GRM188R71A154KA01D 2 L1 Shielded Drum Core, Powdered Iron, 3.3uH, 12A, 0.011 ohm Wurth 744314330 1 L1_alternate *used in conducted EMI measurement Shielded Drum Core, 3.3uH, 0.011 ohm Toko 892NAS-3R3M D1 4.7V, 500mW SOD-123 Vishay MMSZ4688-V-GS08 1 Rent 4.12k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08054K12FKEA 1 Renb 1.27k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08051K27FKEA 1 Rfbb 1.07k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08051K07FKEA 1 Rfbt_1.2 576 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW0805576RFKEA 1 Rfbt_1.2b 9.53 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08059R53FKEA 1 Rfbt_2.5 3.74k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08053K74FKEA 1 Rfbt_2.5b 84.5 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW080584R5FKEA 1 Rfbt_3.3 8.06k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08058K06FKEA 1 Rfbt_3.3b 169 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW0805169RFKEA 1 Rfbt_5 5.6k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08055K60FKEA 1 Rfbt_5b 73.2 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW080573R2FKEA 1 RFB_LP 20 Ω 0805 Vishay-Dale CRCW080520R0FKEA 1 Rts 100 ohm,Temp Sense Resistor 0805 Vishay PTS08051B100RP 100 1 EN Test Point, TH, Miniature, Red Keystone Electronics 5000 1 GND GND Test Point, TH, Miniature, Black Keystone Electronics 5001 2 GND GND VIN VOUT Banana Jack Connector Keystone Electronics 575-8 4 SH-1 Shunt, 100mil, Gold plated, Black Amp 382811-6 1 AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback Performance Characteristics www.ti.com Table 2. Evaluation Board Bill of Materials, VIN = 6V to 36V (20V), VOUT = 1.2 / 3.3V / 5V, IOUT (MAX) = 10/08/06A (continued) 7 Designator Description Manufacturer Manufacturer P/N Quantity H1 H2 H3 H4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead Case Size B and FFastener Supply NY PMS 440 0025 PH 4 H5 H6 H7 H8 Standoff, Hex, 0.5"L #440 Nylon Keystone 1902C 4 J1 Header, 4x2, Gold plated, 230 mil above insulator Samtec Inc. TSW-104-07-G-D 1 J2 20-Pin Dual Edge Connector, 0.156" pitch EDAC 305-020-500-202 0 TH, 100mil Performance Characteristics Thermal Derating, VOUT = 5.0V 100 12 90 10 OUTPUT CURRENT (A) EFFICIENCY (%) Efficiency, VOUT = 5.0V 80 70 60 10 Vin 12 Vin 16 Vin 20 Vin 50 40 0 1 2 3 4 5 6 7 8 OUTPUT CURRENT (A) SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback 10A 8A 8 6 4 2 0 9 10 -40 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 7 Performance Characteristics www.ti.com Radiated EMI (EN 55022) VIN = 12V, VOUT = 5.0V, IOUT = 10A Startup, VIN = 12V, VOUT = 3.3V 50 AMPLITUDE (db V/m) 45 Enable 3.3 Vout 1V/Div 40 35 30 25 20 15 Horizontal Peak Vertical Peak Class B Limit Class A Limit 10 5 0 0 100 200 300 400 500 600 700 800 9001000 FREQUENCY (MHz) TIME (1 ms/Div) Conducted EMI (EN 55022) *L1_alternate VIN = 12V, VOUT = 5.0V, IOUT = 10A 80 Conducted Emmisions Class A Limit Class B Limit AMPLITUDE (db V) 70 60 50 40 30 20 10 100m 8 1 10 FREQUENCY (MHz) AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 100 SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback PCB Layout Diagrams www.ti.com 8 PCB Layout Diagrams Gerber and CAD files can be downloaded from the associated product folder. Figure 5. Top Layer SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 9 PCB Layout Diagrams www.ti.com Figure 6. Internal Layer I (Ground) Heat Sinking Layer 10 AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback PCB Layout Diagrams www.ti.com Figure 7. Internal Layer II (Routing) Heat Sinking Layer SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 11 PCB Layout Diagrams www.ti.com Figure 8. Bottom Layer (Ground and Routing) Heat Sinking Layer 12 AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback PCB Layout Diagrams www.ti.com Figure 9. Top Silkscreen SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 13 PCB Layout Diagrams www.ti.com Figure 10. Bottom Silkscreen 14 AN-2134 LMZ13610/8/6 and LMZ12010/8/6 Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA478C – April 2011 – Revised April 2013 Submit Documentation Feedback IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated