LMZ22010EVAL/NOPB

User's Guide SNVA460B – April 2011 – Revised April 2013 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board 1 Introduction The LMZ23610/8/6 and LMZ22010/8/6 SIMPLE SWITCHER® power modules are easy-to-use DC-DC solution capable of driving up to a 10, 8 or 6 ampere load. They are available in an innovative package that enhances thermal performance and allows for hand or machine soldering. The LMZ23610/8/6 can accept an input voltage rail between 6V and 36V and the LMZ22010/8/6 can accept an input voltage rail between 6V and 20V. The current sharing evaluation board is designed so that four modules can be easily connected to supply up to a 40 amp load. More can be connected as long as care is taken to not exceed the current capabilities of the banana plug connectors and the 5-amp per pin rating of the edge board connector. The current sharing evaluation board is highly configurable. The output voltage can be changed to 5V, 3.3V, 2.5V or 1.2V with a jumper change. The external soft-start capacitor facilitates a controlled and adjustable startup rise time of the output. The board temperature can be measured with the onboard resistor. The UVLO can be adjusted by adding one resistor. To simplify the synchronization of the modules an onboard 555 timer provides an adjustable frequency clock from 350 to 600 kHz. The LMZ23610 and LMZ22010 family is a reliable and robust solution with the following features: loss-less cycle-by-cycle valley current limit to protect for over current or short-circuit fault, thermal shutdown, input under-voltage lockout, and will start up into a pre-biased output. 2 Board Specifications • • • • • • • VIN = 6V to 36V (LMZ23610/8/6) VIN = 6V to 20V (LMZ22010/8/6) VOUT = 1.2V, 2.5V, 3.3V or 5V (minimum input voltage of 7V required for 5V output) IOUT = 0 to 10, 8, or 6 Amps θJA = 8.8 °C / W, θJC = 1.0 °C/W Designed on four layers; Inner are 2 oz copper; Outer are 2 oz copper. Measures 3.54" x 3.54" (90 mm x 90 mm) and is 62 mils (1.57 mm) thick of FR4 laminate material For additional circuit considerations, including additional output voltage options, refer to the Applications section of the LMZ23610 10A SIMPLE SWITCHER® Power Module with 36V Maximum Input Voltage and Current Sharing (SNVS707) or LMZ22010 10A SIMPLE SWITCHER® Power Module with 20V Maximum Input Voltage and Current Sharing (SNVS687) data sheets. For negative output voltage connections see AN-2027 Inverting Application for the LMZ14203 SIMPLE SWITCHER® Power Module (SNVA425). All trademarks are the property of their respective owners. SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 1 Test Connections www.ti.com Clk CIN VOUT Share CO RSYNC RENT VOUT SH SS FB PGND AGND EN SYNC VIN VIN LMZ Module CSS RFBB RFB_LP CFF D1 5.1V (OPT) RENB MASTER (J2) RFBT_5 RFBT_5b 5 Vout RFBT_3.3 RFBT_3.3b 3.3 Vout RFBT_2.5 RFBT_2.5b 2.5 Vout RFBT_1.2 RFBT_1.2b 1.2 Vout VOUT SELECT (J1) Figure 1. Simplified Schematic 3 Test Connections The board should be connected to a power supply and load as shown below in Figure 2. The EN post is connected to the UVLO circuit on the back of the board. There is a resistive divider implemented on the board, with the bottom resistor unpopulated, that can be used to establish a precision UVLO level of the board. A common user change to this circuit is to adjust the value of RENT and RENB to adjust the operating UVLO to that of the target application. Refer to the respective data sheet for calculation. Note that if in the end application the EN pin voltage does not exceed 5.5V at maximum Vin, then the enable clamp zener D1 can be omitted. Pull EN low to shutdown the module and clock circuitry. The SYNC post is connected to the output of a 555 timer on the back of the board and is fed to the SYNC pin of the device. This clock is provided to simplify the testing of the current sharing features of the device and is not required for stand alone operation. The frequency of the clock can be adjusted from 350kHz to 600kHz using the potentiometer labeled R_freq_adj. Jumper J3 (SLAVE) can be used to disable the 555 timer and allow the use of external clocks from 314 to 600 kHz. 2 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback Test Connections www.ti.com Oscilloscope ABC ENABLE J1 SYNC J2 VIN VOUT ELECTRONIC LOAD POWER SUPPLY Vin = 6 ± 20 (36)V Set from 0 to 10 Amperes MULTI-METER MULTI-METER GND Vout = 5, 3.3, 2.5, 1.2V Figure 2. Board Connection Diagram SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 3 Test Connections www.ti.com Edge Connector I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I Top View I Side View GND VIN VOUT 11 12 13 14 15 16 17 18 19 20 A B C D E F H J K L M N P R S T U V W X GND TEMP SENSE 10 VOUT SENSE + 9 SHARE - 8 SHARE + 7 VIN SENSE - 6 VOUT SENSE - 5 SYNC - 4 EN 3 SYNC + 2 VIN SENSE + 1 21 22 Y Z Bottom View VOUT Figure 3. Edge Connector Diagram The evaluation board is also compatible with the 44-pin edge connector shown in Figure 3. Table 1 explains the functionality of the pins. Table 1. Functionality of the Pins Pin Name 1, 2, 3, 4, 5, 7, 8 VIN Input supply — Nominal operating range is from 6V to 20V for the LMZLMZ22010/8/6 and from 6V to 36V for the LMZLMZ23610/8/6. 9, 10, 11, 12, 13, 14, A, B, C, D, E GND Power Ground — Electrical path for the power circuits within the module. 15, 16, 18, 19, 20, 21, 22, V, W, X, Y, Z VOUT Output Voltage — Regulated 5, 3.3, 2.5 or 1.2V. H VIN SENSE + Positive Kelvin Sense of Input voltage — Tied to VIN pin of the LMZ module. M VIN SENSE - Negative Kelvin Sense of Input voltage — Tied to PGND (EP) of the LMZ module. T VOUT SENSE Positive Kelvin Sense of Output voltage — Tied to Vout banana jack. + N VOUT SENSE Negative Kelvin Sense of Output voltage — Tied to AGND of the LMZ module. - J SYNC + Synchronization Positive Input — This is the positive probe point for viewing the clock generated by the 555 timer and is connected to the SYNC pin of the LMZ module. If the 555 timer is shutdown using J3 then an external clock can be used. The external clock must provide a CMOS logic level square wave whose frequency is between 314 kHz and 600 kHz. L SYNC - Synchronization Negative Input — Tied to AGND of the LMZ module. R SHARE + Share Positive Input — Connect this pin to the share pin of other LMZ modules to share the load between the devices. P SHARE - Share Negative Input — Tied to AGND of the LMZ module. K EN S 4 Description Enable — Input to the precision enable comparator of the LMZ Module. Also tied to a pull-up resistor to enable the 5v bias supply and the 555 timer. TEMP SENSE Connected to top of the Rts temperature sensing resistor. Temperature measurements can be made by measuring the temperature dependant resistance between TEMP SENSE and VIN SENSE -. Convert the resistance to temperature with the following equation: Temperature (C) ≊ 2.6245 x Resistance (Ω) - 262.7 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback Adjusting the Output Voltage www.ti.com 4 Adjusting the Output Voltage The output voltage of the evaluation board is adjusted to either 5V, 3.3V, 2.5V, or 1.2V by moving jumper J1. For other voltage options see the data sheet for adjusting the feedback resistors. 5 Current Sharing Current sharing is easy to evaluate. The next steps should be implemented only while the power to the device is off. Select which board will be the master. This is usually the board closer to the load. Connect the master board as described above in Test Connections. Insert the slave board into the socket on the master. If there is no socket, connect a 44-pin board-edge extender to the top of the master board and solder the pins. The board-edge connector will connect Vin, Gnd, Vout, Enable, Sync and the Share pin between the boards to split the current demand between multiple boards. On the slave board(s) remove the jumper J1 (MASTER) and move it to jumper J2 (SLAVE). This disconnects the FB pin of the slave converter(s) (J1) and disables the clock that is provided on the slave board (J2). The slave module's switching frequency will now be controlled by the clock on the master board. Turning the R_freq_adj pot counter clockwise lowers the clock frequency and turning the pot clockwise increases the frequency. By placing an additional jumper on J3 (SLAVE) of the master board, the 555 timer is disabled on both boards. With the clock disabled you can observe the parts performance when the devices are not synchronized, or you can supply an external clock through the SYNC post. J3 must be in place (555 disabled) on all boards to use an external clock on sync. The Sync pin of the slave can also be disconnected from the master board by removing the RSHORT resistor. This allows the user to provide a multiphase clock of their choosing to the boards. The advantage to running the clocks out of phase is to reduce the current stress on the input and output capacitors. For two modules the clocks should be run 180 degrees out of phase, for three modules the clocks should be run 120 degrees out of phase an so on. Although local input bypass capacitors are still required, the bulk capacitance required for a given ripple voltage can be greatly reduced. Figure 4. Output Voltage Ripple with Two Boards Synchronized to 350Khz Figure 5. Output Voltage Ripple with Two Boards Synchronized with 180° Phase Shift SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 5 Current Sharing www.ti.com SLAVE J3 J1 MASTER J2 POWER SUPPLY VOUT VIN ELECTRONIC LOAD Set from 0 to 20 Amperes Vin = 6 ± 20 (36)V MULTI-METER GND MULTI-METER Vout = 5, 3.3, 2.5, 1.2V Figure 6. Master Slave Connection 6 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback Current Sharing www.ti.com U1 VOUT SH SS FB PGND AGND EN VIN SYNC LMZ Module VOUT VIN Clk CIN6 + (OPT) Share CO3,4 CIN5 (OPT) CIN2,3,4 CSS CO1 RSYNC CIN1 (OPT) CO5 (OPT) CO2 (OPT) RFBB RENT RFB_LP CFF TEMP SENSE MASTER (J2) RENB D1 5.1V (OPT) RFBT_5 RFBT_5b 5 Vout RFBT_3.3 RFBT_3.3b RFBT_2.5 RFBT_2.5b RFBT_1.2 RFBT_1.2b 3.3 Vout 2.5 Vout RTS 1.2 Vout VOUT SELECT (J1) 5V Bias Supply Clock LM2841XMK-ADJ VIN 5 EN RST 4 VIN CB SHDN SW 6 3 FB Rrst_1 GND CINB Rrst_2 RPULL 1 U3 L2 7 5V 8 +VCC RST 4 D2 2 COUT_B SLAVE (J3) 5 Cbyp RBTM D3 Cbt (350 -600 kHz) CLK Cbyp2 RST DIS OUT TRIG 3 R2 2 6 CVOLT THR GND 1 LMC555CM U2 R_freq_adj R3 Ct RTOP Figure 7. Evaluation Board Schematic SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 7 Bill of Materials 6 www.ti.com Bill of Materials Table 2. Current Sharing Evaluation Board Bill of Materials, VIN = 6V to 36V (20V), VOUT = 1.2 / 3.3V / 5V, IOUT (MAX) = 10/08/06A 8 Designator Description Case Size Manufacturer Manufacturer P/N Quantit y U1 SIMPLE SWITCHER® TO-PMOD-11 Texas Instruments LMZ23610/08/06 or LMZ22010/08/06 1 U2 Timer, 8-pin Narrow SOIC, Pb-Free TSSOP-8 Texas Instruments LMC555CM/NOPB 1 U3 300 mA/600 mA up to 42V Input Step-Down DC/DC Regulator SOT23 Texas Instruments LM2841XMK-ADJL/NOPB 1 Cin1 Cin6 Co1 Co5 0.047uF, X7R, 50V 0805 Kemet C0805C473K5RACTU 4 Cin_b Cin2 Cin3 Cin4 10 µF, X7S, 50V 1210 TDK C3225X7S1H106M 4 Cin5 150 µF, Aluminum Electrolytic, 50V G Panasonic EEE-FK1H151P 1 Co2 Cout_b 47uF, X5R, 10V 1210 Murata GRM32ER61A476KE20L 2 Co3 Co4 330µF, 6.3V, 0.015 ohm, 2917 Kemet T520D337M006ATE015 2 Cff 4700 pF, X7R, 50V 0805 Kemet C0805C472K5RACTU 1 Css Cbt 0.15uF, X7R, 10V 0603 Murata GRM188R71A154KA01D 2 Cbyp, Cbyp2 0.1uF, X7R, 50V 0805 TDK C2012X7R1H104K 2 Ct 470pF, C0G/NP0, 50V 0805 AVX 08055A471FAT2A 1 D1 4.7V, 500mW SOD-123 Vishay MMSZ4688-V-GS08 1 D2 Diode, Schottky, 40V, 1A SMA Diodes Inc. B140-13-F 1 D3 Diode, Schottky, 20V, 1A SOD_123FL ON Semiconductor MBR120LSFT1G 1 Rent Rrst2 Rsync 1.0k ohm, 5%, 0.125W 0805 Vishay-Dale CRCW08051K00JNEA 1 Renb Not Populated 0805 Rtop 5.62k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08055K62FKEA 1 Rbtm 1.02k ohm, 1%, 0.125W, 0805 Vishay-Dale CRCW08051K02FKEA 1 Rfbb 1.07k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08051K07FKEA 1 0 Rfbt_1.2 576 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW0805576RFKEA 1 Rfbt_1.2b 9.53 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08059R53FKEA 1 Rfbt_2.5 3.74k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08053K74FKEA 1 Rfbt_2.5b 84.5 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW080584R5FKEA 1 Rfbt_3.3 8.06k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08058K06FKEA 1 Rfbt_3.3b 169 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW0805169RFKEA 1 Rfbt_5 5.6k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08055K60FKEA 1 Rfbt_5b 73.2 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW080573R2FKEA 1 RFB_LP 20 Ω 0805 Vishay-Dale CRCW080520R0FKEA 1 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback Bill of Materials www.ti.com Table 2. Current Sharing Evaluation Board Bill of Materials, VIN = 6V to 36V (20V), VOUT = 1.2 / 3.3V / 5V, IOUT (MAX) = 10/08/06A (continued) Designator Description Case Size Manufacturer Manufacturer P/N Quantit y Rpull 200 ohm, 1%, 0.125W 0805 Vishay-Dale CRCW0805200RFKEA 1 Rshrt 0 ohm, 5%, 0.125W 0805 Vishay-Dale CRCW08050000Z0EA 1 Rts 100 ohm,Temp Sense Resistor 0805 Vishay PTS08051B100RP 100 1 R_freq_adj ADJ, 100K ohm, 0.5W Round - 0.350" Dia x 0.150" H Bourn 3352T-1-104LF 1 R2 R3 3.48k ohm, 1%, 0.125W 0805 Vishay-Dale CRCW08053K48FKEA 2 L2 Inductor, Shielded Drum Core, Ferrite, 22uH, 0.7A, 0.155 ohm SMD Wurth Elektronik 744043220 1 SYNC EN Test Point, TH, Miniature, Red Keystone Electronics 5000 2 GND GND Test Point, TH, Miniature, Black Keystone Electronics 5001 2 GND GND VIN VOUT Banana Jack Connector Keystone Electronics 575-8 6 J1 Header, 4x2, Gold plated, 230 mil above insulator TH, 100mil Samtec Inc. TSW-104-07-G-D 1 J2 J3 Header, 2x1, Gold plated, 230 mil above insulator TH, 100mil Samtec Inc. TSW-102-07-G-S 2 SH-1 SH-2 SH-3 Shunt, 100mil, Gold plated, Black Amp 382811-6 3 H1 H2 H3 H4 Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead B and FFastener Supply NY PMS 440 0025 PH 4 H5 H6 H7 H8 Standoff, Hex, 0.5"L #4-40 Nylon Keystone 1902C 4 J4 44-Pin Edge Connector EDAC 305-044-555-201 1 Rrst1 Not Populated SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback 0 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 9 Performance Characteristics 7 www.ti.com Performance Characteristics Efficiency, VOUT = 5.0V 100 Thermal Derating, VOUT = 5.0V 12 OUTPUT CURRENT (A) EFFICIENCY (%) 90 80 70 60 10 Vin 12 Vin 16 Vin 20 Vin 50 40 0 1 2 3 4 5 6 7 8 OUTPUT CURRENT (A) 10A 8A 10 8 6 4 2 0 9 10 -40 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE (°C) Startup, VIN = 12V, VOUT = 3.3V Enable 3.3 Vout 1V/Div TIME (1 ms/Div) 10 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback PCB Layout Diagrams www.ti.com 8 PCB Layout Diagrams Gerber and CAD files can be downloaded from the associated product folder. Figure 8. Top Layer Figure 9. Internal Layer I (Ground) Heat Sinking Layer SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 11 PCB Layout Diagrams www.ti.com Figure 10. Internal Layer II (Routing) Heat Sinking Layer Figure 11. Bottom Layer (Ground and Routing) Heat Sinking Layer 12 AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback PCB Layout Diagrams www.ti.com Figure 12. Top Silkscreen Figure 13. Bottom Silkscreen SNVA460B – April 2011 – Revised April 2013 Submit Documentation Feedback AN-2093 LMZ23610/8/6 and LMZ22010/8/6 Current Sharing Evaluation Board Copyright © 2011–2013, Texas Instruments Incorporated 13 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated