LMZ31530RLGT

Order Now Product Folder Support & Community Tools & Software Technical Documents Reference Design LMZ31530 SLVSBC7E – OCTOBER 2013 – REVISED SEPTEMBER 2018 LMZ31530 30-A Power Module With 3-V to 14.5-V Input in QFN Package 1 Features 3 Description • The LMZ31530 power module is an easy-to-use integrated power solution that combines a 30-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process. 1 • • • • • • • • • • • • • • • • Complete Integrated Power Solution; Smaller than a Discrete Design 15 mm × 16 mm × 5.8 mm Package Size - Pin Compatible with LMZ31520 Ultra-Fast Load Step Response Efficiencies Up To 96% Wide-Output Voltage Adjust 0.6 V to 3.6 V, with 1% Reference Accuracy Optional Split Power Rails Allows Input Voltage Down to 3 V Selectable Switching Frequency; (300 kHz to 850 kHz) Selectable Slow-Start Adjustable Over Current Limit Power Good Output Output Voltage Sequencing Over Temperature Protection Pre-bias Output Start-up Operating Temperature Range: –40°C to 85°C Enhanced Thermal Performance: 8.6°C/W Meets EN55022 Class A Emissions - Integrated Shielded Inductor Create a Custom Design Using the LMZ31530 With the WEBENCH® Power Designer 2 Applications • • • Broadband and Communications Infrastructure DSP and FPGA Point of Load Applications High Density Power Systems The 15 × 16 × 5.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency, has ultra-fast load step response and excellent power dissipation capability with a thermal impedance of 8.6°C/W. The LMZ31530 offers the flexibility and the feature-set of a discrete point-ofload design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques. Simplified Application VIN CI PVIN VIN V5V LMZ31530 SENSE+ VOUT INH ILIM FREQ_SEL VADJ PWRGD AGND SS_SEL VOUT CO RSET PGND Efficiency 100 95 90 Efficiency (%) 85 80 75 Vout = 1.8 V Fsw = 500 kHz 70 65 PVIN = 3.3 V, VIN = 5 V 60 PVIN = VIN = 5 V 55 PVIN = VIN = 12 V 50 0 5 10 15 20 Output Current (A) 25 30 C001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LMZ31530 SLVSBC7E – OCTOBER 2013 – REVISED SEPTEMBER 2018 www.ti.com 4 Specifications Absolute Maximum Ratings (1) 4.1 over operating temperature range (unless otherwise noted) VALUE Input Voltage Output Voltage UNIT MIN MAX VIN, PVIN –0.3 20 V INH, VADJ, PWRGD, PWRGD_PU, ILIM, FREQ_SEL, SS_SEL, V5V –0.3 7 V PH –1 25 V PH 10ns Transient –2 27 –0.3 6 V ±200 mV VOUT VDIFF (GND to exposed thermal pad) Operating Junction Temperature –40 125 (2) °C Storage Temperature –55 150 °C Peak Reflow Case Temperature (3) 245 (4) Maximum Number of Reflows Allowed (3) 3 (4) Mechanical Shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 250 Mechanical Vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20 (1) (2) (3) (4) °C G Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. See the temperature derating curves in the Typical Characteristics section for thermal information. For soldering specifications, refer to the Soldering Requirements for BQFN Packages application note. Devices with a date code prior to week 14 2018 (1814) have a peak reflow case temperature of 240°C with a maximum of one reflow 4.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT 14.5 V 14.5 V PVIN Input Switching Voltage VIN Input Bias Voltage VOUT Output Voltage 0.6 3.6 V fSW Switching Frequency 300 850 kHz 2 4.5 Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: LMZ31530 LMZ31530 www.ti.com SLVSBC7E – OCTOBER 2013 – REVISED SEPTEMBER 2018 4.3 Thermal Information LMZ31530 THERMAL METRIC (1) RLG UNIT 72 PINS θJA Junction-to-ambient thermal resistance (2) Natural Convection 8.6 °C/W (3) 100 LFM θJA(100LFM) Junction-to-ambient thermal resistance 7.8 °C/W ψJT Junction-to-top characterization parameter (4) 1.6 °C/W ψJB Junction-to-board characterization parameter (5) 4.2 °C/W (1) For more information about traditional and new thermal metrics, see the ISemiconductor and IC Package Thermal Metrics application report. The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA. The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz. copper and 100 LFM forced air cooling. Additional airflow reduces θJA. The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device. The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device. (2) (3) (4) (5) 4.4 Package Specifications LMZ31530 UNIT Weight Flammability MTBF Calculated reliability 4.96 grams Meets UL 94 V-O Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign 26.5 MHrs 4.5 Electrical Characteristics TA = -40°C to 85°C, PVIN = VIN = 12 V, VOUT = 1.8 V, IOUT = 30 A CIN = 2 × 22 µF ceramic and 330 µF bulk, COUT = 4 × 100 µF ceramic (unless otherwise noted) PARAMETER IOUT Output current VIN Input bias voltage range PVIN Input switching voltage range UVLO VIN Undervoltage lockout VOUT(adj) Output voltage adjust range TEST CONDITIONS MIN TYP A Over IOUT range 4.5 14.5 V Over IOUT range 3 (1) 14.5 V VIN Increasing 4.0 4.33 V 3.6 V Hysteresis 4.2 0.25 Over IOUT range Temperature variation -40°C ≤ TA ≤ +85°C Load regulation Over IOUT range Total output voltage variation Includes set-point, load, and temperature variation Line regulation (1) (2) UNIT 30 0.6 Set-point voltage tolerance VOUT MAX 0 ±1.0% (2) ±2.0% (2) ±0.25% +0.4% PVIN ±10% ±0.1% Over PVIN range ±0.7% The minimum PVIN voltage is 3.0V or (VOUT+ 1.1V), whichever is greater. See VIN and PVIN Input Voltage for more details. The stated limit of the set-point voltage tolerance includes the tolerance of both the internal voltage reference and the internal adjustment resistor. The overall output voltage tolerance will be affected by the tolerance of the external RSET resistor. Submit Documentation Feedback Copyright © 2013–2018, Texas Instruments Incorporated Product Folder Links: LMZ31530 3 LMZ31530 SLVSBC7E – OCTOBER 2013 – REVISED SEPTEMBER 2018 www.ti.com Electrical Characteristics (continued) TA = -40°C to 85°C, PVIN = VIN = 12 V, VOUT = 1.8 V, IOUT = 30 A CIN = 2 × 22 µF ceramic and 330 µF bulk, COUT = 4 × 100 µF ceramic (unless otherwise noted) PARAMETER TEST CONDITIONS PVIN = VIN = 12 V IO = 15 A Efficiency η PVIN = VIN = 5 V IO = 15 A MIN 94 VOUT = 1.8 V, fSW = 500kHz 92 VOUT = 1.2 V, fSW = 500kHz 88 VOUT = 0.9 V, fSW = 500kHz 86 VOUT = 0.6 V, fSW = 500kHz 82 VOUT = 3.3 V, fSW = 500kHz 96 VOUT = 1.8 V, fSW = 500kHz 94 VOUT = 1.2 V, fSW = 500kHz 91 VOUT = 0.9 V, fSW = 500kHz 88 VOUT = 0.6 V, fSW = 500kHz Output voltage ripple ILIM VINH Inhibit Control IIN(stby) VIN standby current 2.5 A/µs load step from 25 to 75% IOUT(max) Recovery time VOUT over/undershoot V INH pin to AGND FREQ_SEL pin OPEN, IOUT = 10 A fSEL Frequency Select (4) (4) (5) (6) 4 mV 0.6 Switching frequency (3) 30 -0.3 fSW External output capacitance µs Inhibit Low Voltage I(PWRGD) = 2 mA COUT A 30 Open (3) PWRGD Low Voltage External input capacitance VOUT 40 1.8 VOUT falling CIN % Inhibit High Voltage PWRGD Thresholds Thermal Shutdown UNIT % 1% VOUT rising Power Good MAX 85 20 MHz bandwith Current limit threshold Transient response TYP VOUT = 3.3 V, fSW = 500kHz V VIN = 5 V 0.5 0.7 mA VIN = 12 V 1.2 1.5 mA Good 95 Fault 115 Fault 90 Good 110 470 % 0.2 0.3 V 520 570 kHz 66 kΩ resistor between FREQ_SEL pin and PGND 300 kHz FREQ_SEL pin connected to V5V (pin 61) 850 kHz 145 °C 10 °C Thermal shutdown Thermal shutdown hysteresis Ceramic 44 (5) Non-ceramic 94 µF 330 100 (6) 400 5000 µF This pin has an internal pull-up. If this pin is left open circuit, the device operates when a valid input voltage is applied. A small, lowleakage (