LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
MOSFET LDO Driver/Controller
Check for Samples: LP2975
FEATURES
DESCRIPTION
•
•
•
•
•
•
A high-current LDO regulator is simple to design with
the LP2975 LDO Controller. Using an external P-FET,
the LP2975 will deliver an ultra low dropout regulator
with extremely low quiescent current.
1
2
•
•
•
•
•
•
Simple to Use, Few External Components
Ultra-small VSSOP-8 Package
1.5% (A Grade) Precision Output Voltage
Low-power Shutdown Input
< 1 µA in Shutdown
Low Operating Current (180 µA Typical @ VIN =
5V)
Wide Supply Voltage Range (1.8V to 24V)
Built-in Current Limit Amplifier
Overtemperature Protection
5.0V, and 3.3V Standard Output Voltages
Can be Programmed Using External Divider
−40°C to +125°C Junction Temperature Range
APPLICATIONS
•
•
•
High-current 5V to 3.3V Regulator
Post Regulator for Switching Converter
Current-limited Switch
High open loop gain assures excellent regulation and
ripple rejection performance.
The trimmed internal bandgap reference provides
precise output voltage over the entire operating
temperature range.
Dropout voltage is “user selectable” by sizing the
external FET: the minimum input-output voltage
required for operation is the maximum load current
multiplied by the RDS(ON) of the FET.
Overcurrent protection of the external FET is easily
implemented by placing a sense resistor in series
with VIN. The 57 mV detection threshold of the current
sense circuitry minimizes dropout voltage and power
dissipation in the resistor.
The standard product versions available provide
output voltages of 5.0V, or 3.3V with specified 25°C
accuracy of 1.5% (“A” grade) and 2.5% (standard
grade).
Block Diagram
*RSET values are: 208k for 12V part, 72.8k for 5V part, and 39.9k for 3.3V part.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1997–2013, Texas Instruments Incorporated
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
Connection Diagram
Device Pin 6 (N / C) has no internal connection
Figure 1. 8-Lead VSSOP Surface Mount Package
Top View
See Package Number DGK0008A
2
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1)
−65°C to +150°C
Storage Temperature Range
Lead Temp. (Soldering, 5 seconds)
260°C
ESD Rating
2 kV
Power Dissipation
(2)
Internally Limited
−0.3V to +26V
Input Supply Voltage (Survival)
−0.3V to +VIN
Current Limit Pins (Survival)
Comp Pin (Survival)
−0.3V to +2V
Gate Pin (Survival)
−0.3V to +VIN
ON/OFF Pin (Survival)
−0.3V to +20V
Feedback Pin (Survival)
−0.3V to +24V
(1)
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply
when operating the device outside of its rated operating conditions.
The LP2975 has internal thermal shutdown which activates at a die temperature of about 150°C. It should be noted that the power
dissipated within the LP2975 is low enough that this protection circuit should never activate due to self-heating, even at elevated
ambient temperatures.
OPERATING RATINGS
Junction Temperature, TJ
−40°C to +125°C
Input Supply Voltage, VIN
+1.8V to +24V
ELECTRICAL CHARACTERISTICS
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating junction temperature
range. Unless otherwise specified: VON/OFF = 1.5V, VIN = 15V.
Symbol
Parameter
Conditions
LM2975AI-X.X
LM2975I-X.X
Min
Max
Min
Max
(1)
Typ
(1)
Units
Regulation Voltage
(12V Versions)
12.5 < VIN < 24V
(VIN - 0.5V) > VGATE > (VIN - 5V)
12.0
11.820
11.640
12.180
12.360
11.700
11.520
12.300
12.480
Regulation Voltage
(5V Versions)
5.5 < VIN < 24V
(VIN - 0.5V) > VGATE > (VIN - 4.5V)
5.0
4.925
4.850
5.075
5.150
4.875
4.800
5.125
5.200
Regulation Voltage
(3.3V Versions)
3.8 < VIN < 24V
(VIN - 0.5V) > VGATE > (VIN - 3.3V)
3.3
3.250
3.201
3.350
3.399
3.217
3.168
3.383
3.432
VCOMP
Comp Pin Voltage
VREG < VIN < 24V
1.240
1.215
1.209
1.265
1.271
1.203
1.196
1.277
1.284
IQ
Quiescent Current
VREG
Current Limit
Sense Voltage
VCL
VON/OFF
ION/OFF
IG
(1)
VIN = 5V
180
240
320
240
320
VON/OFF = 0V
0.01
1
1
VIN = 15V
VFB = 0.9 X VREG
45
39
69
72
V
µA
57
45
39
Output = ON
0.94
1.10
1.20
Output = OFF
0.87
0.70
0.40
0.70
0.40
ON/OFF
Input Bias Current
VON/OFF = 1.5V
34
50
75
50
75
Gate Drive Current
(Sourcing)
VG = 7.5V
VFB = 1.1 X VREG
3.5
1.3
0.3
1.3
0.3
mA
Gate Drive Current
(Sinking)
VG = 7.5V
VFB = 0.9 X VREG
1100
350
40
350
40
µA
ON/OFF Threshold
69
72
V
1.10
1.20
mV
V
µA
Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using
Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
3
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating junction temperature
range. Unless otherwise specified: VON/OFF = 1.5V, VIN = 15V.
Symbol
Parameter
Conditions
LM2975AI-X.X
LM2975I-X.X
Min
Max
Min
Max
15
19
15
19
(1)
Typ
(1)
Units
VG(MIN)
Gate Clamp Voltage
VIN = 24V
VFB = 0.9 X VREG
17
R(VIN-G)
Resistance from
Gate to VIN
VIN = 24V
VON/OFF = 0
500
kΩ
ΔVGATE/
ΔVCOMP
Open Loop
Voltage Gain
VIN = 15V
0.5V ≤ VGATE ≤ 13
5000
V/V
4
Submit Documentation Feedback
V
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
TYPICAL APPLICATION CIRCUITS
* See Application Hints: Feed-Forward Capacitor.
** If current limiting is not required, short out this resistor.
Figure 2. 5V - 3.3V @ 5A LDO Regulator
* See Application Hints: ADJUSTING THE OUTPUT VOLTAGE.
*** If current limiting is not required, short out this resistor.
Figure 3. Adjustable Voltage 5A LDO Regulator
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
5
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified: TA = 25°C, CIN = 1 µF, ON/OFF pin is tied to 1.5V.
6
Minimum Operating Voltage
VIN Referred Gate Clamp Voltage
Figure 4.
Figure 5.
ON/OFF Threshold
Current Limit Sense Voltage
Figure 6.
Figure 7.
ON/OFF Pin Current
Supply Current
Figure 8.
Figure 9.
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TA = 25°C, CIN = 1 µF, ON/OFF pin is tied to 1.5V.
ON/OFF Input Resistance
Gate Current
Figure 10.
Figure 11.
Gate-Ground Saturation
Line Regulation
Figure 12.
Figure 13.
Load Regulation
Leakage Current
Figure 14.
Figure 15.
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
7
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified: TA = 25°C, CIN = 1 µF, ON/OFF pin is tied to 1.5V.
Controller Gain and Phase Response
Figure 16.
8
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
REFERENCE DESIGNS
The LP2975 controller can be used with virtually any P-channel MOSFET to build a wide variety of linear voltage
regulators.
Since it would be impossible to document all the different voltage and current combinations that could be built, a
number of reference designs will be presented along with performance data for each.
THE PERFORMANCE DATA SHOWN IS ACTUAL TEST DATA, BUT IS NOT ENSURED. The following
reference designs have been confirmed with TA = 25°C only, and no design consideration is given for operating
at any other ambient temperature.
DESIGN #1: VOUT = 5V @ 5A
(Refer to TYPICAL APPLICATION CIRCUITS)
Components
CIN = 82 µF Aluminum Electrolytic
COUT = 120 µF Aluminum Electrolytic
CF = 220 pF
RSC = 10 mΩ
P-FET = NDP6020P
Heatsink: (assuming VIN ≤ 7V and TA ≤ 60°C) if protection against a continuous short-circuit is required, a
heatsink with θS-A ≤ 1.5 °C/W must be used. However, if continuous short-circuit survivability is not needed, a
heatsink with θS-A ≤ 6 °C/W is adequate.
Performance Data
Dropout Voltage
Dropout voltage is defined as the minumum input-to-output differential voltage required by the regulator to keep
the output in regulation. It is measured by reducing VIN until the output voltage drops below the nominal value
(the nominal value is the output voltage measured with VIN = 5.5V). IL = 5A for this test.
DROPOUT VOLTAGE = 323 mV
Load Regulation
Load regulation is defined as the maximum change in output voltage as the load current is varied. It is measured
by changing the load resistance and recording the minimum/maximum output voltage. The measured change in
output voltage is divided by the nominal output voltage and expressed as a percentage. VIN = 5.6V for this test.
5 mA ≤ IL ≤ 5A: LOAD REGULATION = 0.012%
0 ≤ IL ≤ 5A: LOAD REGULATION = 0.135%
Line Regulation
Line regulation is defined as the maximum change in output voltage as the input voltage is varied. It is measured
by changing the input voltage and recording the minimum/maximum output voltage. The measured change in
output voltage is divided by the nominal output voltage and expressed as a percentage. IL = 5A for this test.
5.4V ≤ VIN ≤ 10V: LINE REGULATION = 0.03%
Output Noise Voltage
Output noise voltage was measured by connecting a wideband AC voltmeter (HP 400E) directly across the
output capacitor. VIN = 6V and IL = 5A for this test.
NOISE = 75 µV (rms)
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
9
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
Transient Response
Transient response is defined as the change in output voltage which occurs after the load current is suddenly
changed. VIN = 5.6V for this test.
The load resistor is connected to the regulator output using a switch so that the load current increases from 0 to
5A abruptly. The change in output voltage is shown in the scope photo below (the vertical scale is 200
mV/division and the horizontal scale is 10 µs/division). The regulator nominal output (5V) is located on the center
line of the photo.
The output shows a maximum change of about −600 mV compared to nominal. This is due to the relatively small
output capacitor chosen for this design. Increasing COUT greatly improves transient response (see Design #2 and
Design #3).
Figure 17. Transient Response for 0–5A Load Step
DESIGN #2: VOUT = 3V @ 0.5A
(Refer to TYPICAL APPLICATION CIRCUITS, Adjustable Voltage Regulator)
Components
CIN = 68 µF Tantalum
COUT = 2 X 68 µF Tantalum
CC = 470 pF
R1 = 237 kΩ, 1%
R2 = NOT USED
RSC = 0.1Ω
Tie feedback pin to VOUT
P-FET = NDT452P
Heatsink: Tab of N-FET is soldered down to 0.6 in2 copper area on PC board.
Output Voltage Adjustment: For this application, a 3.3V part is “trimmed” down to 3V by using a single external
237 kΩ resistor at R1, which parallels the internal 39.9 kΩ resistor (reducing the effective resistance to 34.2 kΩ).
Because the tempco of the external resistor will not match the tempco of the internal resistor (which is typically
3000 ppm), this method of adjusting VOUT by using a single resistor is only recommended in cases where the
output voltage is adjusted ≤ 10% away from the nominal value.
10
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
Performance Data
Dropout Voltage
Dropout voltage is defined as the minimum input-to-output differential voltage required by the regulator to keep
the output in regulation. It is measured by reducing VIN until the output voltage drops below the nominal value
(the nominal value is the output voltage measured with VIN = 5V). IL = 0.5A for this test.
DROPOUT VOLTAGE = 141 mV
Load Regulation
Load regulation is defined as the maximum change in output voltage as the load current is varied. It is measured
by changing the load resistance and recording the minimum/maximum output voltage. The measured change in
output voltage is divided by the nominal output voltage and expressed as a percentage. VIN = 3.5V for this test.
0 ≤ IL ≤ 0.5A: LOAD REGULATION = 0.034%
Line Regulation
Line regulation is defined as the maximum change in output voltage as the input voltage is varied. It is measured
by changing the input voltage and recording the minimum/maximum output voltage. The measured change in
output voltage is divided by the nominal output voltage and expressed as a percentage. IL = 0.5A for this test.
3.5V ≤ VIN ≤ 6V: LINE REGULATION = 0.017%
Output Noise Voltage
Output noise voltage was measured by connecting a wideband AC voltmeter (HP 400E) directly across the
output capacitor. VIN = 5V and IL = 0.5A for this test.
NOISE = 85 µV (rms)
Transient Response
Transient response is defined as the change in output voltage which occurs after the load current is suddenly
changed. VIN = 3.5V for this test.
The load resistor is connected to the regulator output using a switch so that the load current increases from 0 to
0.5A abruptly. The change in output voltage is shown in the scope photo (the vertical scale is 20 mV/division and
the horizontal scale is 50 µs/division). The regulator nominal output (3V) is located on the center line of the
photo. A maximum change of about −50 mV is shown.
Figure 18. Transient Response for 0–0.5A Load Step
Minimizing COUT
It is often desirable to decrease the value of COUT to save cost and reduce size. The design guidelines suggest
selecting COUT to set the first pole ≤ 200 Hz (see later section, Output Capacitor), but this is not an absolute
requirement in all cases.
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
11
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
The effect of reducing COUT is to decrease phase margin. As phase margin is decreased, the output ringing will
increase when a load step is applied to the output. Eventually, if COUT is made small enough, the regulator will
oscillate.
To demonstrate these effects, the value of COUT in reference design #2 is halved by removing one of the two 68
µF output capacitors and the transient response test is repeated (see photo below). The total overshoot
increases from −50 mV to about −75 mV, and the second “ring” on the transient is noticeably larger.
Figure 19. Transient Response with Output Capacitor Halved
The design is next tested with only a 4.7 µF output capacitor (see scope photo below). Observe that the vertical
scale has been increased to 100 mV/division to accommodate the −250 mV undershoot. More important is the
severe ringing as the transient decays. Most designers would recognize this immediately as the warning sign of a
marginally stable design.
Figure 20. Transient Response with Only 4.7 µF Output Cap
The reason this design is marginally stable is that the 4.7 µF output capacitor (along with the 6Ω output load)
sets the pole fp at 5 kHz. Analysis shows that the unity-gain frequency of the loop is increased to about 100 kHz,
allowing the FET's gate capacitance pole fpg to cause significant phase shift before the loop gain goes below
unity. Also, because of the low output voltage, the feedforward capacitor provides less than 10° of positive phase
shift. For good stability, the output capcitor needs to be larger than 4.7 µF.
For detailed information on stability and phase margin, see the Application Hints section.
12
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
DESIGN #3: VOUT = 1.5V @ 6A.
(Refer to TYPICAL APPLICATION CIRCUITS, Adjustable Voltage Regulator)
Components
CIN = 1000 µF Aluminum Electrolytic
COUT = 4 X 330 µF OSCON Aluminum Electrolytic
CC = NOT USED
R1 = 261Ω, 1%
R2 = 1.21 kΩ, 1%
RSC = 6 mΩ
P-FET = NDP6020P
Heatsink: (Assuming VIN ≤ 3.3V and TA ≤ 60°C) if protection against a continuous short-circuit is required, a
heatsink with θS-A < 2.5 °C/W must be used. However, if continuous short-circuit survivability is not needed, a
heatsink with θS-A < 7 °C/W is adequate.
Performance Data
Dropout Voltage
Dropout voltage is defined as the minimum input-to-output differential voltage required by the regulator to keep
the output in regulation. It is measured by reducing VIN until the output voltage drops below the nominal value
(the nominal value is the output voltage measured with VIN = 3.3V). IL = 6A for this test.
DROPOUT VOLTAGE = 0.68V
Load Regulation
Load regulation is defined as the maximum change in output voltage as the load current is varied. It is measured
by changing the load resistance and recording the minimum/maximum output voltage. The measured change in
output voltage is divided by the nominal output voltage and expressed as a percentage. VIN = 3.3V for this test.
0 ≤ IL ≤ 6A: LOAD REGULATION = 0.092%
Line Regulation
Line regulation is defined as the maximum change in output voltage as the input voltage is varied. It is measured
by changing the input voltage and recording the minimum/maximum output voltage. The measured change in
output voltage is divided by the nominal output voltage and expressed as a percentage. IL = 6A for this test.
3.3V ≤ VIN ≤ 5V: LINE REGULATION = 0.033%
Output Noise Voltage
Output noise voltage was measured by connecting a wideband AC voltmeter (HP 400E) directly across the
output capacitor. VIN = 3.3V and IL = 6A for this test.
NOISE = 60 µV (rms)
Transient Response
Transient response is defined as the change in output voltage which occurs after the load current is suddenly
changed. VIN = 3.3V for this test.
The load resistor is connected to the regulator output using a switch so that the load current increases from 0 to
6A abruptly. The change in output voltage is shown in the scope photo (the vertical scale is 50 mV/division and
the horizontal scale is 20 µs/division. The regulator nominal output (1.5V) is located on the center line of the
photo. A maximum change of about −80 mV is shown.
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
13
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
Figure 21. Transient Response for 0–6A Load Step
Application Hints
SELECTING THE FET
The best choice of FET for a specific application will depend on a number of factors:
VOLTAGE RATING: The FET must have a Drain-to-Source breakdown voltage (sometimes called BVDSS) which
is greater than the input voltage.
DRAIN CURRENT: On-state Drain current must be specified to be greater than the worst-case (short circuit)
load current for the application.
TURN-ON THRESHOLD: The Gate-to-Source voltage where the FET turns on (called the Gate Threshold
Voltage) is very important. Many FET's are intended for use with G-to-S voltages in the 5V to 10V range. These
should only be used in applications where the input voltage is high enough to provide >5V of drive to the Gate.
Newer FET's are becoming available with lower turn-on thresholds (Logic-Level FET's) which turn on fully with a
gate voltage of only 3V to 4V. Low threshold FET's should be used in applications where the input voltage is ≤
5V.
ON RESISTANCE: FET on resistance (often called RDSON) is a critical parameter since it directly determines the
minimum input-to-output voltage required for operation at a given load current (also called dropout voltage).
RDSON is highly dependent on the amount of Gate-to-Source voltage applied. For example, the RDSON of a FET
with VG-S = 5V will typically decrease by about 25% as the VG-S is increased to 10V. RDSON is also temperature
dependent, increasing at higher temperatures.
The dropout voltage of any LDO design is directly related to RDSON, as given by:
VDROPOUT = ILOAD × (RDSON + RSC)
where
•
RSC is the short-circuit current limit set resistor (see TYPICAL APPLICATION CIRCUITS)
GATE CAPACITANCE: Selecting a FET with the lowest possible Gate capacitance improves LDO performance
in two ways:
1. The Gate pin of the LP2975 (which drives the Gate of the FET) has a limited amount of current to source or
sink. This means faster changes in Gate voltage (which corresponds to faster transient response) will occur
with a smaller amount of Gate capacitance.
2. The Gate capacitance forms a pole in the loop gain which can reduce phase margin. When possible, this
pole should be kept at a higher frequency than the cross-over frequency of the regulator loop (see later
section, Crossover Frequency and Phase Margin).
A high value of Gate capacitance may require that a feedforward capacitor be used to cancel some of the excess
phase shift (see later section, Feed-Forward Capacitor) to prevent loop instability.
14
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
POWER DISSIPATION: The maximum power dissipated in the FET in any application can be calculated from:
PMAX = (VIN − VOUT) × IMAX
where
•
IMAX is the maximum output current
It should be noted that if the regulator is to be designed to withstand short-circuit, a current sense resistor must
be used to limit IMAX to a safe value (refer to section SHORT-CIRCUIT CURRENT LIMITING).
The power dissipated in the FET determines the best choice for package type. A TO-220 package device is best
suited for applications where power dissipation is less than 15W. Power levels above 15W would almost certainly
require a TO-3 type device.
In low power applications, surface-mount package devices are size-efficient and cost-effective, but care must be
taken to not exceed their power dissipation limits.
POWER DISSIPATION AND HEATSINKING
Since the LP2975 controller is suitable for use with almost any external P-FET, it follows that designs can be built
which have very high power dissipation in the pass FET. Since the controller can not protect the FET from
overtemperature damage, thermal design must be carefully done to assure a reliable design.
THERMAL DESIGN METHOD: The temperature of the FET and the power dissipated is defined by the equation:
TJ = (θJ-A × PD) + TA
where
•
•
•
•
To
1.
2.
3.
TJ is the junction temperature of the FET.
TA is the ambient temperature.
PD is the power dissipated by the FET.
θJ-A is the junction-to-ambient thermal resistance.
ensure a reliable design, the following guidelines are recommended:
Design for a maximum (worst-case) FET junction temperature which does not exceed 150°C.
Heatsinking should be designed for worst-case (maximum) values of TA and PD.
In designs which must survive a short circuit on the output, the maximum power dissipation must be
calculated assuming that the output is shorted to ground:
PD(MAX) = VIN × ISC
where
•
ISC is the short-circuit output current.
4. If the design is not intended to be short-circuit proof, the maximum power dissipation for intended operation
will be:
PD(MAX) = (VIN − VOUT) × IMAX
where
•
IMAX is the maximum output current.
LOW POWER ( 1.
If the frequency of the Gate capacitance pole fpg has been calculated (previous section), the amount of added
phase shift may now be determined. As shown in the graph below (see Figure 24, the amount of added phase
shift increases as fpg approaches fc.
The amount of phase shift due to fpg that can occur before oscillation takes place depends on how much added
phase shift is present as a result of the COUT pole (see previous section, Output Capacitor).
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
21
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
Figure 24. Phase Shift Due to fpg
Because of this, there is no exact number for fpg/fc that can be given as a fixed limit for stable operation.
However, as a general guideline, it is recommended that fpg ≥ 3 fc.
If this is not found to be true after inital calculations, the ratio of fpg/fc can be increased by either reducing CEFF
(selecting a different FET) or using a larger value of COUT.
Along with these two methods, another technique for improving loop stability is the use of a feed-forward
capacitor (see next section, Feed-Forward Compensation). This can improve phase margin by cancelling some
of the excess phase shift.
Feed-Forward Compensation
Phase shift in the loop gain of the regulator results from fp (the pole from the output capacitor and load
resistance), fpg (the pole from the FET gate capacitance), as well as the IC's internal controller pole (see typical
curve). If the total phase shift becomes excessive, instability can result.
The total phase shift can be reduced using feed-forward compensation, which places a zero in the loop to reduce
the effects of the poles.
The feed-forward capacitor CF can accomplish this, provided it is selected to set the zero at the correct
frequency. It is important to point out that the feed-forward capacitor produces both a zero and a pole. The
frequency where the zero occurs will be defined as fzf, and the frequency of the pole will be defined as fpf. The
equations to calculate the frequencies are:
fzf = 6.6 × 10-6/ [CF × (VOUT/1.24 − 1) ]
fpf = 6.6 × 10-6/ [CF × (1 − 1.24/VOUT)]
In general, the feed-forward capacitor gives the greatest improvement in phase margin (provides the maximum
reduction in phase shift) when the zero occurs at a frequency where the loop gain is >1 (before the crossover
frequency). The pole must occur at a higher frequency (the higher the better) where most of the phase shift
added by the new pole occurs beyond the crossover frequency. For this reason, the pole-zero pair created by CF
become more effective at improving loop stability as they get farther apart in frequency.
In reviewing the equations for fzf and fpf, it can be seen that they get closer together in frequency as VOUT
decreases. For this reason, the use of CF gives greatest benefit at higher output voltages, declining as VOUT
approaches 1.24V (where CF has no effect at all).
In selecting a value of feed-forward capacitor, the crossover frequency fc must first be calculated. In general, the
frequency of the zero (fzf) set by this capacitor should be in the range:
0.2 fc ≤ fzf ≤ 1.0 fc
The equation to determine the value of the feed-forward capacitor in fixed-voltage applications is:
CF = 6.6 × 10-6/ [fzf × (VOUT/1.24 − 1) ]
In adjustable applications (using an external resistive divider) the capacitor is found using:
CC = 1/(2 π × R1 × fzf)
22
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
Summary of Stability Information
This section will present an explanation of theory and terminology used to analyze loop stability, along with
specific information related to stabilizing LP2975 applications.
Bode Plots and Phase Shift
Loop gain information is most often presented in the form of a Bode Plot, which plots Gain (in dB) versus
Frequency (in Hertz).
A Bode Plot also conveys phase shift information, which can be derived from the locations of the poles and
zeroes.
POLE: A pole causes the slope of the gain curve to decrease by an additional −20 dB/decade, and it also
causes phase lag (defined as negative phase shift) to occur.
A single pole will cause a maximum −90° of phase lag (see Figure 25). It should be noted that when the total
phase shift at 0 dB reaches (or gets close to) −180°, oscillations will result. Therefore, it can be seen that at least
two poles in the gain curve are required to cause instability.
ZERO: A zero has an effect that is exactly opposite to a pole. A zero will add a maximum +90° of phase lead
(defined as positive phase shift). Also, a zero causes the slope of the gain curve to increase by an additional
+20 dB/decade (see Figure 26).
Figure 25. Effects of a Single Pole
Total phase shift
The actual test of whether or not a regulator is stable is the amount of phase shift that is present when the gain
curve crosses the 0 dB axis (the frequency where this occurs was previously defined as fc).
The phase shift at fc can be estimated by looking at all of the poles and zeroes on the Bode plot and adding up
the contributions of phase lag and lead from each one. As shown in the graphs, most of the phase lag (or lead)
contributed by a pole (or zero) occurs within one decade of the frequency of the pole (or zero).
In general, a phase margin (defined as the difference between the total phase shift and −180°) of at least 20° to
30° is required for a stable loop.
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
23
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
Figure 26. Effects of a Single Zero
Stability Analysis of Typical Applications
The first application to be analyzed is a fixed-output voltage regulator with no feed-forward capacitor (see
Figure 27).
Figure 27. Stable Plot without Feed-Forward
In this example, the value of COUT is selected so that the pole formed by COUT and RL (previously defined as fp)
is set at 200 Hz. The ESR of COUT is selected so that zero formed by the ESR and COUT (defined as fz) is set at 5
kHz (these selections follow the general guidelines stated previously in this document). Note that the gate
capacitance is assumed to be moderate, with the pole formed by the CGATE (defined as fpg) occurring at 100 kHz.
To estimate the total phase margin, the individual phase shift contributions of each pole and zero will be
calculated assuming fp = 200 Hz, fz = 5 kHz, fc = 10 kHz and fpg = 100 kHz:
Controller pole shift = −90°
fp shift = −arctan (10k/200) = −89°
fz shift = arctan (10k/5k) = +63°
fpg shift = −arctan (10k/100k) = −6°
Summing the four numbers, the estimate for the total phase shift is −122°, which corresponds to a phase
margin of 58°. This application is stable, but could be improved by using a feed-forward capacitor (see next
section).
EFFECT OF FEED-FORWARD: The example previously used will be continued with the addition of a feedforward capacitor CF (see Figure 28). The zero formed by CF (previously defined as fzf) is set at 10 kHz and the
pole formed by CF (previously defined as fpf) is set at 40 kHz (the 4X ratio of fpf/fzf corresponds to VOUT = 5V).
24
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
Figure 28. Improved Phase Margin with Feed-Forward
To estimate the total phase margin, the individual phase shift contributions of each pole and zero will be
calculated assuming fp = 200 Hz, fz = 5 kHz, fzf = 10 kHz, fpf = 40 kHz, fc = 50 kHz, and fpg= 100 kHz:
Controller pole shift = −90°
fp shift = −arctan (50k/200) = −90°
fz shift = arctan (50k/5k) = +84°
fzf shift = arctan (50k/100k) = +79°
fpf shift = −arctan (50k/40k) = −51°
fpg shift = −arctan (50k/100k) = −27°
Summing the six numbers, the estimate for the total phase shift is −95°, which corresponds to a phase margin
of 85° (a 27° improvement over the same application without the feed-forward capacitor).
For this reason, a feed-forward capacitor is recommended in all applications. Although not always required, the
added phase margin typically gives faster settling times and provides some design guard band against COUT and
ESR variations with temperature.
Causes and Cures of Oscillations
The most common cause of oscillations in an LDO application is the output capacitor ESR. If the ESR is too high
or too low, the zero (fz) does not provide enough phase lead.
HIGH ESR: To illustrate the effect of an output capacitor with high ESR, the previous example will be repeated
except that the ESR will be increased by a factor of 20X. This will cause the frequency of the zero fz to
decrease by 20X, which moves it from 5 kHz down to 250 Hz (see Figure 29).
Figure 29. High ESR Unstable without Feed-Forward
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
25
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
As shown, moving the location of fz lower in frequency extends the bandwidth, pushing the crossover frequency
fc out to about 200 kHz. In viewing the plot, it can be seen that fp and fz essentially cancel out, leaving only the
controller pole and fpg. However, since fpg now occurs well before fc, it will cause enough phase shift to leave
very little phase margin. This application would either oscillate continuously or be marginally stable (meaning it
would exhibit severe ringing on transient steps).
This can be improved by adding a feed-forward capacitor CF, which adds a zero (fzf) and a pole (fpf) to the gain
plot (see Figure 30).
In this case, CF is selected to place fzf at about the same frequency as fpg (essentially cancelling out the phase
shift due to fpg). Assuming the added pole fpf is near or beyond the fc frequency, it will add < 45° of phase lag,
leaving a phase margin of > 45° (adequate for good stability).
Figure 30. High ESR Corrected with Feed-Forward
LOW ESR: To illustrate how an output capacitor with low ESR can cause an LDO regulator to oscillate, the same
example will be shown except that the ESR will be reduced sufficiently to increase the original fz from 5 kHz to 50
kHz.
The plot now shows (see Figure 31) that the crossover frequency fc has moved down to about 8 kHz. Since fz is
6X fc, it means that the zero fz can only provide about 9° of phase lead at fc, which is not sufficient for stability.
Figure 31. Low ESR Unstable without Feed-Forward
This application can also be improved by adding a feed-forward capacitor. CF will add both a zero fzf and pole fpf
to the gain plot (see Figure 32).
The crossover frequency fc is now about 10 kHz. If CF is selected so that fzf is about 5 kHz, and fpf is about 20
kHz (which means VOUT = 5V), the phase margin will be considerably improved. Calculating out all the poles and
zeroes, the phase margin is increased from 9° to 43° (adequate for good stability).
26
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
Figure 32. Low ESR Corrected with Feed-Forward
EXCESSIVE GATE CAPACITANCE: Higher values of gate capacitance shift the pole fpg to lower frequencies,
which can cause stability problems (see previous section Gate Capacitance Pole Frequency (fpg)). As shown in
Figure 23, the pole fpg will likely fall somewhere between 40 kHz and 500 kHz. How much phase shift this adds
depends on the crossover frequency fc.
The effect of gate capacitance becomes most important at high values of ESR for the output capacitor (see
Figure 29). Higher values of ESR increase fc, which brings fpg more into the positive gain portion of the curve. As
fpg moves to a lower frequency (corresponding to higher values of gate capacitance), this effect becomes even
worse.
This points out why FET's should be selected with the lowest possible gate capacitance: it makes the design
more tolerant of higher ESR values on the output capacitor.
The use of a feed-forward capacitor CF will help reduce excess phase shift due to fpg, but its effectiveness
depends on output voltage (see next section).
LOW OUTPUT VOLTAGE AND CF
The feed-forward capacitor CF will provide a positive phase shift (lead) which can be used to cancel some of the
excess phase lag from any of the various poles present in the loop. However, it is important to note that the
effectiveness of CF decreases with output voltage.
This is due to the fact that the frequencies of the zero fzf and pole fpf get closer together as the output voltage is
reduced (see equations in Feed-Forward Compensation).
CF is more effective when the pole-zero pair are farther apart, because there is less self cancellation. The net
benefit in phase shift provided by CF is the difference between the lead (positive phase shift) from fzf and the lag
(negative phase shift) from fpf which is present at the crossover frequency fc. As the pole and zero frequency
approach each other, that difference diminishes to nothing.
The amount of phase lead at fC provided by CF depends both on the fzf/fpf ratio and the location of fz with respect
to fc. To illustrate this more clearly, a graph is provided which shows how much phase lead can be obtained for
VOUT = 12V, 5V, and 3.3V (see Figure 33).
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
27
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
Figure 33. Phase Lead Provided by CF
The most important information on the graph is the frequency range of fzf which will provide the maximum benefit
(most positive phase shift):
For VOUT = 12V: 0.1 fc < fz < 1.0 fc
For VOUT = 5V: 0.2 fc < fz < 1.2 fc
For VOUT = 3.3V: 0.2 fc < fz < 1.3 fc
It's also important to note how the maximum available phase shift that CF can provide drops off with VOUT. At
12V, more than 50° can be obtained, but at 3.3V less than 30° is possible. The lesson from this is that higher
voltage designs are more tolerant of phase shifts from both fpg (the gate capacitance pole) and incorrect
placement of fz (which means the output capacitor ESR is not at its nominal value). At lower values of VOUT,
these parameters must be more precisely selected since CF can not provide as much correction.
28
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
LP2975
www.ti.com
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
GENERAL DESIGN PROCEDURE
Assuming that VIN, VOUT, and RL are defined:
1. Calculate the required value of capacitance for COUT so that the pole fp ≤ 200 Hz (see previous section,
Output Capacitor. For this calculation, an ESR of about 0.1Ω can be assumed for the purpose of determining
COUT.
IMPORTANT: If a smaller value of output capacitor is used (so that the value of fp >200 Hz), the phase
margin of the control loop will be reduced. This will result in increased ringing on the output voltage during a
load transient. If the output capacitor is made extremely small, oscillations will result.
To illustrate this effect, scope photos have been presented showing the output voltage of reference design
#2 as the output capacitor is reduced to approximately 1/30 of the nominal value (the value which sets fp =
200 Hz). As shown, the effect of deviating from the nominal value is gradual and the regulator is quite robust
in resisting going into oscillations.
2. Approximate the crossover frequency fc using the equation in the previous section Crossover Frequency and
Phase Margin.
3. Calculate the required ESR of the output capacitor so that the frequency of the zero fz is set to 0.5 fc (see
previous section, Output Capacitor).
4. Calculate the value of the feed-forward capacitor CF so that the zero fzf occurs at the frequency which yields
the maximum phase gain for the output voltage selected (see previous section, LOW OUTPUT VOLTAGE
AND CF). The formula for calculating CF is in the previous section, Feed-Forward Capacitor.
Lower ESR electrolytics are available which use organic electrolyte (OSCON types), but are more costly than
typical aluminum electrolytics.
If the calculated value of ESR is higher than what is found in the selected capacitor, an external resistor can be
placed in series with COUT.
LOW VOLTAGE DESIGNS: Designs which have a low output voltage (where the positive effects of CF are very
small) may be marginally stable if the COUT and ESR values are not carefully selected.
Also, if the FET gate capacitance is large (as in the case of a high-current FET), the pole fpg could possibly get
low enough in frequency to cause a problem.
The solution in both cases is to increase the amount of output capacitance which will shift fp to a lower frequency
(and reduce overall loop bandwidth). The ESR and CF calculations should be repeated, since this changes the
crossover frequency fc.
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
29
LP2975
SNVS006F – SEPTEMBER 1997 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision E (April 2013) to Revision F
•
30
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 29
Submit Documentation Feedback
Copyright © 1997–2013, Texas Instruments Incorporated
Product Folder Links: LP2975
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
LP2975AIMM-3.3
ACTIVE
VSSOP
DGK
8
LP2975AIMM-3.3/NOPB
ACTIVE
VSSOP
DGK
8
LP2975AIMM-5.0
ACTIVE
VSSOP
DGK
LP2975AIMM-5.0/NOPB
ACTIVE
VSSOP
LP2975AIMMX-5.0
ACTIVE
LP2975AIMMX-5.0/NOPB
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
TBD
Call TI
Call TI
-40 to 125
L45A
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L45A
8
1000
TBD
Call TI
Call TI
-40 to 125
L46A
DGK
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L46A
VSSOP
DGK
8
3500
TBD
Call TI
Call TI
-40 to 125
L46A
ACTIVE
VSSOP
DGK
8
3500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L46A
LP2975IMM-3.3
ACTIVE
VSSOP
DGK
8
TBD
Call TI
Call TI
-40 to 125
L45B
LP2975IMM-3.3/NOPB
ACTIVE
VSSOP
DGK
8
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L45B
LP2975IMM-5.0
ACTIVE
VSSOP
DGK
8
TBD
Call TI
Call TI
-40 to 125
L46B
LP2975IMM-5.0/NOPB
ACTIVE
VSSOP
DGK
8
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L46B
LP2975IMMX-5.0
ACTIVE
VSSOP
DGK
8
TBD
Call TI
Call TI
-40 to 125
L46B
LP2975IMMX-5.0/NOPB
ACTIVE
VSSOP
DGK
8
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L46B
1000
1000
3500
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Sep-2013
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP2975AIMM-3.3/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LP2975AIMM-5.0
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LP2975AIMM-5.0/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LP2975AIMMX-5.0
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LP2975AIMMX-5.0/NOPB VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LP2975IMM-3.3/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LP2975IMM-5.0/NOPB
VSSOP
DGK
8
1000
178.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LP2975IMMX-5.0/NOPB
VSSOP
DGK
8
3500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP2975AIMM-3.3/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LP2975AIMM-5.0
VSSOP
DGK
8
1000
210.0
185.0
35.0
LP2975AIMM-5.0/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LP2975AIMMX-5.0
VSSOP
DGK
8
3500
367.0
367.0
35.0
LP2975AIMMX-5.0/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
LP2975IMM-3.3/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LP2975IMM-5.0/NOPB
VSSOP
DGK
8
1000
210.0
185.0
35.0
LP2975IMMX-5.0/NOPB
VSSOP
DGK
8
3500
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
工商网监
湘ICP备2023018690号
