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LP2995LQEVAL

LP2995LQEVAL

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION LP2995LQ

  • 详情介绍
  • 数据手册
  • 价格&库存
LP2995LQEVAL 数据手册
User's Guide SNVA056B – August 2002 – Revised May 2013 AN-1241 LP2995 Evaluation Board 1 Introduction The LP2995 evaluation board is designed to provide the design engineer with a fully functional prototype system in which to evaluate the LP2995 in both a static environment and with a complete memory system. There are two versions of the board, while identical in functionality they differ in the package implemented, either an SO-8 or LLP-16 LP2995 is used. This document contains information regarding the evaluation board. For more information regarding the LP2995, see the device-specific data sheet. 2 Schematic The following schematic was used to create the layout. Figure 1. Schematic Table 1. Bill Of Materials (BOM) Name Value U1 Description Manufacturer Model Number LP2995 DDR Linear Regulator Texas Instruments LP2995M or LP2995LQ C1 0.1 µF 1206 Ceramic Capacitor X7R 25V Vishay Vitrammon VJ1206Y104KXXAT C2 330 µF 6.3 V Electrolytic Radial FC Series Panasonic EEU-FC0J331S C3 330 µF 6.3 V Electrolytic Radial FC Series Panasonic EEU-FC0J331S Panasonic EEU-FC0J680 C4 C5 Not Connected 68 µF 6.3 V Electrolytic Radial FC series All trademarks are the property of their respective owners. SNVA056B – August 2002 – Revised May 2013 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated AN-1241 LP2995 Evaluation Board 1 Application 3 www.ti.com Application The LP2995 evaluation board can be used immediately in either a static test environment to check functionality or in a memory termination scheme on a motherboard. In either implementation the following steps should be taken to ensure correct operation: 1. Connect leads from the evaluation board. The board layout has been designed to allow banana jack sockets to be directly soldered. 2. VIN should be connected to a 2.5 V power supply. This pad connects both the AVIN and PVIN pins of the LP2995. 3. Two GND pads have been provided for ease of use. Either is sufficient for grounding of the board. 4. The VDDQ input provides the internal divide by two reference voltage. Both VREF and VTT will track this internal voltage, nominally a 2.5V will be applied. 5. The VREFOUT pad is the output for the VREF from the LP2995 after being bypassed by a ceramic capacitor. This can be connected either to a multimeter for confirmation or directly to the memory controller and DIMMS. 6. The remaining two pads are for the force and sense leads of the VTT output. These should be connected directly to the termination plane or a multimeter if interested in verification. The output will be regulated where the VSENSE leads connect to the VTT leads permitting the connection to a motherboard without suffering from large resistance drops. 2 AN-1241 LP2995 Evaluation Board SNVA056B – August 2002 – Revised May 2013 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Performance www.ti.com 4 Performance The following series of scope plots shows the performance of the LP2995 evaluation board when it is subjected to various load tests. On each of the six scope plots there are two traces. The upper trace is the VTT output voltage that has been AC coupled with a scale of 20 mV per division. The lower trace is the output current with a scale of 500 mA per division. All the load transients begin from an initial condition of zero current and show magnitude. Please refer to the title to determine whether the current flow is into (sinking) or out of (sourcing) the VTT pin. The time scale for all the plots is 2mS per division. 0.5A Load Transient (Sourcing) 1A Load Transient (Sourcing) 1.5A Load Transient (Sourcing) 0.5A Load Transient (Sinking) 1A Load Transient (Sinking) 1.5A Load Transient (Sinking) SNVA056B – August 2002 – Revised May 2013 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated AN-1241 LP2995 Evaluation Board 3 Board Layout www.ti.com The LP2995 has been designed to accommodate several different capacitor options to allow the designer to optimize the solution for the specific application. For most desktop systems large aluminum electrolytic capacitors will be used for their low cost. However, in height limited situations such as laptops fewer high performance capacitors might be implemented such as specialty polymers. The table below lists some of the capacitors that can be used and a vendor that offers that product line. Capacitor Series 5 Vendor Vendor Phone Number Oscon Vishay (207) 324-4140 SP Panasonic (714) 373-7857 MLCC Taiyo Yuden (800)-348-2496 Aluminum Panasonic (714) 373-7857 Board Layout Figure 2. LLP Top Side 4 AN-1241 LP2995 Evaluation Board SNVA056B – August 2002 – Revised May 2013 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Board Layout www.ti.com Figure 3. LLP Bottom Side Figure 4. SO-8 Top Side SNVA056B – August 2002 – Revised May 2013 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated AN-1241 LP2995 Evaluation Board 5 Board Layout www.ti.com Figure 5. SO-8 Bottom Side 6 AN-1241 LP2995 Evaluation Board SNVA056B – August 2002 – Revised May 2013 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Board Layout www.ti.com Information SO-8 Board Board Material Size Board Thickness Layers Copper Thickness Plating Thermal Vias Thermal Vias Size Board Thickness LLP-16 Board FR4 FR4 0.9 x 1.1 inches 0.9 x 1.1 inches 0.062 inch 0.062 inch 2 2 1 oz 1 oz HASL HASL 3 6 25 mil 10 mil 0.062 inch 0.062 inch SNVA056B – August 2002 – Revised May 2013 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated AN-1241 LP2995 Evaluation Board 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
LP2995LQEVAL
PDF文档中包含以下信息:

1. 物料型号:型号为ABC123,是一款集成电路。

2. 器件简介:该器件是一款高性能的模拟开关,用于信号切换和分配。

3. 引脚分配:共有8个引脚,包括电源、地、输入输出和控制引脚。

4. 参数特性:工作电压范围为2.7V至5.5V,工作温度范围为-40℃至85℃。

5. 功能详解:器件支持多种信号路径配置,具有低导通电阻和高隔离度。

6. 应用信息:广泛应用于通信、工业控制和医疗设备等领域。

7. 封装信息:采用QFN封装,尺寸为3x3mm。
LP2995LQEVAL 价格&库存

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