LP2996LQEVAL

User's Guide SNOA429A – May 2004 – Revised May 2013 AN-1268 LP2996 Evaluation Board 1 Introduction The LP2996 evaluation board is designed to provide the design engineer with a fully functional prototype system in which to evaluate the LP2996 in both a static environment and with a complete memory system. There are two versions of the board, and while identical in functionality they differ in the package implemented; either a SO PowerPAD™-8 or WQFN-16 is used. This application note contains information regarding the board. For more information regarding the LP2996 please refer to the datasheet. 2 Schematic The following schematic was used to create the layout. Table 1. Bill of Materials Name Value U1 3 Manufacturer Model Number LP2996 DDR Linear Regulator Description Texas Instruments LP2996 CAVIN 0.1µF 1206 Ceramic Capacitor X7R 25V Vishay Vitrammon VJ1206Y104KXXAT COUT1 330µF 6.3V Electrolytic Radial FC Series Panasonic EEU-FC0J331S COUT2 330µF 6.3V Electrolytic Radial FC Series Panasonic EEU-FC0J331S CREF 0.01µF 1206 Ceramic Capacitor X7R 25V Vishay Vitrammon VJ1206Y103KXXAT CPVIN 68µF 6.3V Electrolytic Radial FC series Panasonic EEU-FC0J680 Application The LP2996 evaluation board can be used immediately in either a static test environment to check functionality, or in a memory termination scheme on a motherboard. In either implementation, the following steps should be taken to ensure correct operation. 1. Connect leads from the evaluation board. The board layout has been designed to allow banana jack sockets to be directly soldered. 2. Connect AVIN and PVIN to a 2.5V power supply. PowerPAD is a trademark of Texas Instruments. SNOA429A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1268 LP2996 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 1 Performance www.ti.com 3. The VDDQ input provides the internal divide by two reference voltage. Both VREF and VTT will track this internal voltage, nominally a 2.5V will be applied. 4. The VREF pad is the output for the VREF from the LP2996 after being bypassed by a ceramic capacitor. This can be connected either to a multimeter for confirmation or directly to the memory controller and DIMMS. 5. The SD pin can be initially left floating as it has an internal pull-up 6. The remaining two pads are for the force and sense leads of the VTT output. These should be connected directly to the termination plane or a multimeter if interested in verification. The output will be regulated where the VSENSE leads connect to the VTT leads permitting the connection to a motherboard without suffering from large resistance drops. 4 Performance The LP2996 has been designed to accommodate several different capacitor options to allow the designer to optimize the solution for the specific application. For most desktop systems, large aluminum electrolytic capacitors will be used for their low cost. However, in height limited situations such as laptops fewer high performance capacitors might be implemented such as specialty polymers. Table 2 lists some of the capacitors that can be used and a vendor that offers that product line. Table 2. Capacitors and Available Vendors Capacitor Series Oscon SP MLCC Aluminum 2 Vendor Vendor Phone Number Vishay (207)-324-4140 Panasonic (714)-373-7857 Taiyo Yuden (800)-348-2496 Panasonic (714)-373-7857 AN-1268 LP2996 Evaluation Board SNOA429A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Performance www.ti.com Figure 1. SO PowerPAD Top Layer SNOA429A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1268 LP2996 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 3 Performance www.ti.com Figure 2. SO PowerPAD Bottom Layer 4 AN-1268 LP2996 Evaluation Board SNOA429A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated Performance www.ti.com Figure 3. WQFN Top Layer SNOA429A – May 2004 – Revised May 2013 Submit Documentation Feedback AN-1268 LP2996 Evaluation Board Copyright © 2004–2013, Texas Instruments Incorporated 5 Performance www.ti.com Figure 4. WQFN Bottom Layer Information Board Material Size Board Thickness Layers Copper Thickness Plating Thermal Vias Thermal Vias Size Board Thickness 6 SO PowerPAD-8 Board WQFN-16 Board FR4 FR4 1.0 x 1.5 inches 1.0 x 1.5 inches 0.062 inch 0.062 inch 2 2 1oz. 1oz. HASL HASL 6 4 10 mil 13 mil 0.062 inch 0.062 inch AN-1268 LP2996 Evaluation Board SNOA429A – May 2004 – Revised May 2013 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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