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LP38841EVAL

LP38841EVAL

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION LP38841

  • 数据手册
  • 价格&库存
LP38841EVAL 数据手册
User's Guide SNVA156A – June 2006 – Revised April 2013 AN-1457 LP3884X-ADJ Evaluation Board 1 Introduction The LP38841-ADJ and LP38842-ADJ are ultra low dropout linear regulators that provide adjustable output voltages and load currents up to 800 mA (LP38841) and 1.5A (LP38842). This document describes the evaluation board provided to demonstrate the performance of these parts. 2 Basic Application Circuit The basic application circuit shown in Figure 1 reflects the electrical connections and component identifiers used on the evaluation board. TP1 TP2 TP6 IN VIN U1 LP3884X-ADJ R3 51k S/D S/D VOUT OUT BIAS GND BIAS 1.2V R1 9.31k C4 220pF C3 4.7 PF ADJ R2 5.62k C1 0.1 PF C2 10 PF TP3 TP4 TP5 GND Figure 1. Basic Application Circuit Schematic 3 Capacitor C4 (Feedforward Compensation) The feedforward capacitor C4 is used to provide increased phase margin. Any good quality X5R/X7R dielectric ceramic capacitor can be used. The value of capacitance for C4 depends on the value of R1. C4 may be calculated using the formula in Equation 1: C4 = 1 / (2 X π X 70k X R1) (1) The value of C4 is calculated after R1 is selected to set the output voltage needed for the specific application. All trademarks are the property of their respective owners. SNVA156A – June 2006 – Revised April 2013 Submit Documentation Feedback AN-1457 LP3884X-ADJ Evaluation Board Copyright © 2006–2013, Texas Instruments Incorporated 1 Setting the Output Voltage 4 www.ti.com Setting the Output Voltage The first build of evaluation boards used R1/R2 values, which set the output voltage to 1.2 V. The nominal output voltage is easily changed by replacing R1. The formula that can be used to calculate the new value of R1 for a different output voltage is shown in Equation 2: VOUT = VADJ (R1/R2) + VADJ (2) Solved for R1: R1 = (VOUT - VADJ) / VADJ X R2 (3) The evaluation board is shipped with a 5.62 kΩ resistor installed at R2. 5 Power Dissipation Power dissipation must be limited so that the junction temperature does not exceed 125°C. Power dissipation can be calculated using Equation 4: PDISS = ((VIN - VOUT) X ILOAD ) + (VIN X IQ(VIN)) + (VBIAS X IQ(VBIAS)) (4) In calculating junction temperature, a value of θJ-A (junction-to-ambient thermal resistance) of approximately 50°C/W should be assumed for this board. Junction temperature (TJ) is calculated using Equation 5: TJ = PDISS X θ(J-A) + TAMBIENT = PDISSX 50 + TAMBIENT (5) Table 1. Component List PCB U1 TP1, TP2, TP3, TP4, TP5, TP6 LP38842 Test point terminal, NEWARK 97H6311 VIN CONNECTOR Banana jack (RED): DIGI-KEY 108-0902-001 VOUT CONNECTOR Banana jack (BLUE): DIGI-KEY 108-0910-001 GROUND CONNECTOR S/D CONNECTOR BIAS CONNECTOR 2 551012613-001 Rev A Banana jack (BLACK): DIGI-KEY 108-0903-001 Banana jack (YELLOW): DIGI-KEY 108-0907-001 Banana jack (GREEN): DIGI-KEY 108-0904-001 R1 Banana, 0805 case, 9.31 kΩ, 1% DIGI-KEY 311-(9.31K)CCT-ND R2 Resistor, 0805 case, 5.62 kΩ, 1% DIGI-KEY 311-(5.62K)CCT-ND R3 R3: resistor, 0805 case, 51 kΩ, 5% DIGI-KEY 311-(51K)ACT-ND C1 Ceramic capacitor, 0805 case, 0.1 µF, X5R/X7R dielectric: DIGI-KEY 478-3351-1-ND C2 Ceramic capacitor, 10 µF, Taiyo-Yuden #LMK325BJ106MN C3 Ceramic capacitor, 4.7 µF, Taiyo-Yuden # JMK316BJ475MD C4 Ceramic capacitor, 0805 case, 220 pF, X5R/X7R dielectric: DIGI-KEY 311-1123-1-ND AN-1457 LP3884X-ADJ Evaluation Board Copyright © 2006–2013, Texas Instruments Incorporated SNVA156A – June 2006 – Revised April 2013 Submit Documentation Feedback PCB Layout Diagram www.ti.com 6 PCB Layout Diagram GND GND TP3 C1 +BIAS SD TP2 TP4 S/D BIAS U1 TP5 R3 TP1 VIN VIN C2 R1 TP6 VOUT C4 R2 VOUT C3 NSC LP3884XMR-ADJ Figure 2. Top View SNVA156A – June 2006 – Revised April 2013 Submit Documentation Feedback AN-1457 LP3884X-ADJ Evaluation Board Copyright © 2006–2013, Texas Instruments Incorporated 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
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