LP3919RLX-B/NOPB

LP3919 www.ti.com SNVS493D – MAY 2007 – REVISED JUNE 2007 CDMA Power Management Unit Check for Samples: LP3919 DESCRIPTION The LP3919 is a complete Power Management Unit (PMU) designed for CDMA cellular phones. The LP3919 PMU contains a Li-Ion battery charger, low-noise low-dropout voltage regulators, buck regulators, a USB Transceiver, comparators and a high-speed serial interface to program on/off conditions and output voltages of individual regulators, and to read status information of the PMU. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. System Diagram Li-Ion Charger AC Adapter ADC 2 x DC/DC BB Processor Power Domains 9 x LDO Memory MPL I/O Interface of Baseband Processor Control RF USB Transceiver 2 x Comparator LP3919 PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Peripheral Devices Connector Copyright © 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LP3919RL-A/NOPB ACTIVE DSBGA YPG 49 250 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM V02 LP3919RL-B/NOPB ACTIVE DSBGA YPG 49 250 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM V09 LP3919RL-C/NOPB ACTIVE DSBGA YPG 49 250 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM V10 LP3919RLX-A/NOPB ACTIVE DSBGA YPG 49 1000 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM V02 LP3919RLX-B/NOPB ACTIVE DSBGA YPG 49 1000 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM V09 LP3919RLX-C/NOPB ACTIVE DSBGA YPG 49 1000 Green (RoHS & no Sb/Br) SNAG Level-1-260C-UNLIM V10 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LP3919RL-A/NOPB DSBGA YPG 49 250 178.0 12.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.63 3.63 0.76 8.0 12.0 Q1 LP3919RL-B/NOPB DSBGA YPG 49 250 178.0 12.4 3.63 3.63 0.76 8.0 12.0 Q1 LP3919RL-C/NOPB DSBGA YPG 49 250 178.0 12.4 3.63 3.63 0.76 8.0 12.0 Q1 LP3919RLX-A/NOPB DSBGA YPG 49 1000 178.0 12.4 3.63 3.63 0.76 8.0 12.0 Q1 LP3919RLX-B/NOPB DSBGA YPG 49 1000 178.0 12.4 3.63 3.63 0.76 8.0 12.0 Q1 LP3919RLX-C/NOPB DSBGA YPG 49 1000 178.0 12.4 3.63 3.63 0.76 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LP3919RL-A/NOPB DSBGA YPG 49 250 210.0 185.0 35.0 LP3919RL-B/NOPB DSBGA YPG 49 250 210.0 185.0 35.0 LP3919RL-C/NOPB DSBGA YPG 49 250 210.0 185.0 35.0 LP3919RLX-A/NOPB DSBGA YPG 49 1000 210.0 185.0 35.0 LP3919RLX-B/NOPB DSBGA YPG 49 1000 210.0 185.0 35.0 LP3919RLX-C/NOPB DSBGA YPG 49 1000 210.0 185.0 35.0 Pack Materials-Page 2 MECHANICAL DATA YPG0049xxx D 0.650±0.075 E RLA49XXX (Rev B) D: Max = 3.49 mm, Min = 3.43 mm E: Max = 3.49 mm, Min = 3.43 mm 4214898/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com 12/12 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. 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