LP3984
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SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
LP3984 Micropower 150 mA Ultra Low-Dropout CMOS Voltage Regulator in Subminiature
4-I/O DSBGA Package
Check for Samples: LP3984
FEATURES
DESCRIPTION
•
•
•
•
•
•
The LP3984 is designed for portable and wireless
applications with demanding performance and space
requirements.
1
2
Miniature 4-I/O DSBGA or SOT-23-5 Package
Logic controlled enable
Stable with Tantalum Capacitors
1 µF Tantalum Output Capacitor
Fast Turn-On
Thermal Shutdown and Short-Circuit Current
Limit
The LP3984's performance is optimized for battery
powered systems to deliver extremely low dropout
voltage and low quiescent current. Regulator ground
current increases only slightly in dropout, further
prolonging the battery life.
Power supply rejection is better than 60 dB at low
frequencies and starts to roll off at 10 kHz. High
power supply rejection is maintained down to low
input voltage levels common to battery operated
circuits.
KEY SPECIFICATIONS
•
•
•
•
•
•
•
•
2.5 to 6.0V Input Range
150 mA Output
60 dB PSRR at 1 kHz, 40 dB at 10 kHz @ 3.1VIN
≤ 1.2 µA Quiescent Current when Shut Down
Fast Turn-On Time: 20 µs (typ.)
75 mV typ Dropout with 150 mA Load
−40 to +125°C Junction Temperature Range for
Operation
1.5V, 1.8V, 2.9V and 3.1V
The device is ideal for mobile phone and similar
battery powered wireless applications. It provides up
to 150 mA from a 2.5V to 6V input. The LP3984
consumes less than 1.2 µA in disable mode and has
fast turn-on time less than 20 µs.
The LP3984 is available in a 4-bump DSBGA and 5pin SOT-23 packages. Performance is specified for
−40°C to +125°C temperature range and is available
in 1.5V, 1.8V, 2.9V and 3.1V output voltages. For
other output voltage options from 1.5V to 3.5V,
please contact TI sales office.
APPLICATIONS
•
•
•
•
CDMA Cellular Handsets
Wideband CDMA Cellular Handsets
GSM Cellular Handsets
Portable Information Appliances
Typical Application Circuit
1(B2)
5(B1)
VIN
VOUT
1PF Tant
1PF
LP3984
3(A2)
VEN
4
NC
2(A1)
Note: Pin Numbers in parenthesis indicate DSBGA package.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2013, Texas Instruments Incorporated
LP3984
SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
www.ti.com
Block Diagram
Pin Descriptions
Name
DSBGA
SOT
Function
VEN
A2
3
Enable Input Logic, Enable High
GND
A1
2
Common Ground
VOUT
B1
5
Output Voltage of the LDO
VIN
B2
1
Input Voltage of the LDO
4
No Connection
N.C.
(1)
(1)
The pin numbering scheme for the DSBGA package was revised in April 2002 to conform to JEDEC standards. Only the pin numbers
were revised. No changes to the physical locations of the inputs/outputs were made. For reference purposes, the obsolete numbering
scheme had GND as pin 1, VOUT as pin 2, VIN as pin 3 and VEN as pin 4.
Connection Diagram
SOT-23-5 Package
Figure 1. Top View
See Package Number DBV
DSBGA, 4-Bump Package
Figure 2. Top View
See Package Number YPB0004
2
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SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2) (3)
−0.3 to 6.5V
VIN, VEN
–0.3 to (VIN+0.3) ≤ 6.5V
VOUT
Junction Temperature
150°C
Storage Temperature
−65°C to +150°C
Lead Temp.
235°C
Pad Temp. (4)
Maximum Power Dissipation
235°C
(5)
ESD Rating (6)
SOT-23-5
364 mW
DSBGA
235 mW
Human Body Model
2kV
Machine Model
(1)
(2)
(3)
(4)
(5)
(6)
200V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pin.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Additional information on pad temperature can be found in the TI AN-1112 Application Report ().
The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula: PD = (TJ TA)/θJA,where TJ is the junction temperature, TA is the ambient temperature, and θ JA is the junction-to-ambient thermal resistance. The
364 mW rating for SOT23-5 appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction
temperature, 150°C, for TJ, 70°C for TA, and 220°C/W for θJA. More power can be dissipated safely at ambient temperatures below
70°C . Less power can be dissipated safely at ambient temperatures above 70°C. The Absolute Maximum power dissipation for SOT235 can be increased by 4.5 mW for each degree below 70°C, and it must be derated by 4.5mW for each degree above 70°C.
The human body model is 100pF discharged through 1.5kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
OPERATING RATINGS (1) (2)
VIN
2.5 to 6V
VEN
0 to (VIN+0.3V) ≤ 6V
−40°C to +125°C
Junction Temperature
Thermal Resistance
Maximum Power Dissipation
(1)
(2)
(3)
(3)
θJA (SOT23-5)
220°C/W
θJA (DSBGA)
340°C/W
SOT-23-5
250mW
DSBGA
160mW
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pin.
Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The
250mW rating for SOT23-5 appearing under Operating Ratings results from substituting the maximum junction temperature for
operation, 125°C, for TJ, 70°C for TA, and 220°C/W for θJA using the formula: PD = (TJ - TA)/θJA. More power can be dissipated at
ambient temperatures below 70°C . Less power can be dissipated at ambient temperatures above 70°C. The maximum power
dissipation for operation can be increased by 4.5 mW for each degree below 70°C, and it must be derated by 4.5mW for each degree
above 70°C.
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LP3984
SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
Unless otherwise specified: VIN = 2.5V for 1.5V and 1.8V options, VIN = VOUT + 0.5 for output options higher than 2.5V, CIN = 1
µF, IOUT = 1mA, COUT = 1 µF, tantalum. Typical values and limits appearing in standard typeface are for TJ = 25°C. Limits
appearing in boldface type apply over the entire junction temperature range for operation, −40°C to +125°C. (1) (2)
Symbol
Parameter
Conditions
Typ
Output Voltage Tolerance
Line Regulation Error
ΔVOUT
Load Regulation Error (3)
PSRR
IQ
Power Supply Rejection Ratio
Quiescent Current
0.15
%/V
LP3984IBP (DSBGA)
0.0009
0.002
VIN = VOUT(nom) + 0.2V,
f = 1 kHz,
IOUT = 50 mA, Figure 4
60
VIN = VOUT(nom) + 0.2V,
f = 10 kHz,
IOUT = 50 mA, Figure 4
40
VEN = 1.4V, IOUT = 0 mA
80
125
%/mA
dB
110
150
VEN = 0.4V
0.005
1.2
IOUT = 1 mA
0.6
2.5
IOUT = 50 mA
25
40
IOUT = 100 mA
50
80
120
75
600
IOUT(PK)
Peak Output Current
VOUT ≥ VOUT(nom) - 5%
600
TON
Turn-On Time (5)
en
Output Noise Voltage
IEN
Maximum Input Current at EN
VIL
Maximum Low Level Input Voltage VIN = 2.5 to 6.0V
at EN
VIH
Minimum High Level Input Voltage VIN = 2.5 to 6.0V
at EN
COUT
Output Capacitor
4
−0.15
0.005
Output Grounded
(Steady State)
(5)
% of
VOUT(nom)
0.002
IOUT = 150 mA
(2)
(3)
(4)
1.2
2.0
IOUT = 1 mA to 150 mA
LP3984IM5 (SOT-23-5)
Short Circuit Current Limit
(1)
−1.2
−2.0
0.05
ISC
TSD
Units
Max
VIN = 2.5V to 4.5V for 1.5V and 1.8V
options
VIN = (VOUT + 0.5V) to 4.5V for Voltage
options higher than 2.5V
VEN = 1.4V, IOUT = 0 to 150 mA
Dropout Voltage (4)
Limit
Min
µA
mV
mA
300
mA
20
µs
BW = 10 Hz to 100 kHz,
COUT = 1µF tant.
90
µVrms
VEN = 0.4 and VIN = 6.0
±1
nA
0.4
1.4
V
V
Capacitance
1
22
ESR
2
10
µF
Ω
Thermal Shutdown Temperature
160
°C
Thermal Shutdown Hysteresis
20
°C
Min and Max Limits are verified by design, test, or statistical analysis. Typical (Typ.) numbers are not verified, but do represent the most
likely norm.
The target output voltage, which is labeled VOUT(nom), is the desired voltage option.
An increase in the load current results in a slight decrease in the output voltage and vice versa.
Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This
specification does not apply for input voltages below 2.5V.
Turn-on time is time measured between the enable input just exceeding VIH and the output voltage just reaching 95% of its nominal
value.
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LP3984
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SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
Figure 3. Line Transient Input Test Signal
Figure 4. PSRR Input Test Signal
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LP3984
SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise specified, CIN = COUT = 1 µF Tantalum, VIN = 2.5 for 1.5V and 1.8V options, VIN = VOUT + 0.2V for output
options higher than 2.5V, TA = 25°C, Enable pin is tied to VIN.
6
Power Supply Rejection Ratio (VIN = 3.5V)
Power Supply Rejection Ratio (VIN = 3.5V)
Figure 5.
Figure 6.
Power Supply Rejection Ratio (VIN = 3.5V)
Power Supply Rejection Ratio (LP3984-1.5, VIN = 2.5V)
Figure 7.
Figure 8.
Line Transient Response (LP3984-3.1)
Line Transient Response (LP3984-3.1)
Figure 9.
Figure 10.
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SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, CIN = COUT = 1 µF Tantalum, VIN = 2.5 for 1.5V and 1.8V options, VIN = VOUT + 0.2V for output
options higher than 2.5V, TA = 25°C, Enable pin is tied to VIN.
Line Transient Response (LP3984-3.1)
Line Transient Response (LP3984-3.1)
Figure 11.
Figure 12.
Line Transient Response (LP3984-3.1)
Line Transient Response (LP3984-3.1)
Figure 13.
Figure 14.
Start Up Response
Start Up Response
Figure 15.
Figure 16.
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LP3984
SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise specified, CIN = COUT = 1 µF Tantalum, VIN = 2.5 for 1.5V and 1.8V options, VIN = VOUT + 0.2V for output
options higher than 2.5V, TA = 25°C, Enable pin is tied to VIN.
8
Enable Response
Load Transient Response (LP3984-3.1
Figure 17.
Figure 18.
Load Transient Response (LP3984-3.1)
Load Transient Response (VIN = 4.2V)
Figure 19.
Figure 20.
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LP3984
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SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
APPLICATION HINTS
External Capacitors
Like any low-dropout regulator, the LP3984 requires external capacitors for regulator stability. The LP3984 is
specifically designed for portable applications requiring minimum board space and smallest components. These
capacitors must be correctly selected for good performance.
Input Capacitors
An input capacitance of ≊ 1 µF is required between the LP3984 input pin and ground (the amount of the
capacitance may be increased without limit).
This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a lowimpedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input,
it must be specified by the manufacturer to have a surge current rating sufficient for the application.
There are no requirements for the ESR on the input capacitor, but tolerance and temperature coefficient must be
considered when selecting the capacitor to ensure the capacitance will be ≊ 1 µF over the entire operating
temperature range.
Output Capacitor
The LP3984 is designed specifically to work with tantalum output capacitors. A tantalum capacitor in 1 to 22 µF
range with 2Ω to 10Ω ESR range is suitable in the LP3984 application circuit.
It may also be possible to use film capacitors at the output, but these are not as attractive for reasons of size and
cost.
The output capacitor must meet the requirement for minimum amount of capacitance and also have an ESR
(Equivalent Series Resistance) value which is within a stable range (2Ω to 10Ω).
No-Load Stability
The LP3984 will remain stable and in regulation with no external load. This is specially important in CMOS RAM
keep-alive applications.
On/Off Input Operation
The LP3984 is turned off by pulling the VEN pin low, and turned on by pulling it high. If this feature is not used,
the VEN pin should be tied to VIN to keep the regulator output on at all times. To assure proper operation, the
signal source used to drive the VEN input must be able to swing above and below the specified turn-on/off voltage
thresholds listed in the Electrical Characteristics section under VIL and VIH.
Fast On-Time
The LP3984 output is turned on after Vref voltage reaches its final value (1.23V nominal). To speed up this
process, the noise reduction capacitor at the bypass pin is charged with an internal 70 µA current source. The
current source is turned off when the bandgap voltage reaches approximately 95% of its final value. The turn-on
time is determined by the time constant of the bypass capacitor. The smaller the capacitor value, the shorter the
turn-on time, but less noise gets reduced. As a result, turn-on time and noise reduction need to be taken into
design consideration when choosing the value of the bypass capacitor.
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LP3984
SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
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DSBGA Mounting
The DSBGA package requires specific mounting techniques which are detailed in the AN-1112 Application
Report (SNVA009). Referring to the section PCB Layout ; note that the pad style which must be used with the 5pin package is NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
DSBGA device.
DSBGA Light Sensitivity
Exposing the DSBGA device to direct sunlight will cause mis-operation of the device. Light sources such as
halogen lamps can affect electrical performance if brought near to the device.
The wavelengths which have most detrimental effect are reds and infra-reds, which means that the fluorescent
lighting used inside most buildings has very little effect on performance. A DSBGA test board was brought to
within 1 cm of a fluorescent desk lamp and the effect on the regulated output voltage was negligible, showing a
deviation of less than 0.1% from nominal.
10
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LP3984
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SNVS160F – OCTOBER 2001 – REVISED OCTOBER 2013
REVISION HISTORY
Changes from Revision D (May 2013) to Revision E
•
Page
Changed layout of National Data Sheet to TI format; correct typos ................................................................................... 10
Changes from Revision E (May 2013) to Revision F
Page
•
Deleted 2.0V option which is obsoleted ................................................................................................................................ 1
•
Deleted legacy ordering table ............................................................................................................................................... 3
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP3984IMF-1.5
LIFEBUY
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
LEAB
LP3984IMF-1.5/NOPB
LIFEBUY
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LEAB
LP3984IMF-1.8
LIFEBUY
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
LEBB
LP3984IMF-1.8/NOPB
LIFEBUY
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LEBB
LP3984IMF-3.1/NOPB
LIFEBUY
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LEDB
LP3984IMFX-1.8
NRND
SOT-23
DBV
5
TBD
Call TI
Call TI
-40 to 125
LEBB
LP3984IMFX-1.8/NOPB
LIFEBUY
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LEBB
LP3984ITP-2.9/NOPB
LIFEBUY
DSBGA
YPB
4
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
LP3984ITPX-1.8/NOPB
LIFEBUY
DSBGA
YPB
4
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2016
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LP3984IMF-1.5
SOT-23
DBV
5
1000
178.0
8.4
LP3984IMF-1.5/NOPB
SOT-23
DBV
5
1000
178.0
LP3984IMF-1.8
SOT-23
DBV
5
1000
178.0
LP3984IMF-1.8/NOPB
SOT-23
DBV
5
1000
LP3984IMF-3.1/NOPB
SOT-23
DBV
5
LP3984IMFX-1.8/NOPB
SOT-23
DBV
LP3984ITP-2.9/NOPB
DSBGA
YPB
LP3984ITPX-1.8/NOPB
DSBGA
YPB
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
4
250
178.0
8.4
1.02
1.09
0.66
4.0
8.0
Q1
4
3000
178.0
8.4
1.02
1.09
0.66
4.0
8.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP3984IMF-1.5
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3984IMF-1.5/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3984IMF-1.8
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3984IMF-1.8/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3984IMF-3.1/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LP3984IMFX-1.8/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LP3984ITP-2.9/NOPB
DSBGA
YPB
4
250
210.0
185.0
35.0
LP3984ITPX-1.8/NOPB
DSBGA
YPB
4
3000
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
YPB0004
DSBGA - 0.575 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
0.575 MAX
C
SEATING PLANE
BALL TYP
0.15
0.11
0.05 C
0.5
B
SYMM
0.5
D: Max = 1.019 mm, Min =0.958 mm
E: Max = 0.905 mm, Min =0.844 mm
A
1
4X
0.015
0.18
0.16
C A B
2
SYMM
4215097/B 07/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YPB0004
DSBGA - 0.575 mm max height
DIE SIZE BALL GRID ARRAY
(0.5)
4X ( 0.16)
2
1
A
SYMM
(0.5)
B
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
( 0.16)
METAL
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.16)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4215097/B 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YPB0004
DSBGA - 0.575 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
4X ( 0.3)
(R0.05) TYP
2
1
A
SYMM
(0.5) TYP
B
METAL
TYP
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125mm THICK STENCIL
SCALE:50X
4215097/B 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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