User's Guide
SNVA284A – March 2008 – Revised April 2013
AN-1702 LP5524 Evaluation Kit
1
LP5524 Overview
The LP5524 is a highly integrated dual-zone LED driver that can drive up to four LEDs in parallel with a
total output current of 100 mA. Regulated high side internal current sources deliver excellent current and
brightness matching in all LEDs. Extremely low minimum headroom voltage allows the use of operating
voltages that are close to LED forward voltages.
LED driver current sources are split into two independently controlled banks for driving secondary
displays, keypads and indicator LEDs. Brightness control is achieved by applying PWM signals to each
enable pin. Default LED current is 5mA and an optional external resistor can be used to set initial
brightness to user required values. LP5524 is available in TI’s tiny 9-bump DSBGA package.
2
Evaluation Kit Overview
LP5524 evaluation kit enables designers an easy way to evaluate the performance of the device. The
evaluation board has jumpers for each enable pin for easy on/off type control. These inputs can also be
fed with external PWM source. Jumpers on LED outputs allow easy LED current measuring. ISET pin has
a jumper for selecting between two LED current levels.
The kit supports complete functional evaluation of the circuit. The evaluation kit consists of:
• LP5524 Evaluation Board
• LP5524 Parallel LED Driver With PWM Brightness Control in DSBGA Package Data Sheet (SNVS500)
• Evaluation Kit document (this document)
All trademarks are the property of their respective owners.
SNVA284A – March 2008 – Revised April 2013
Submit Documentation Feedback
AN-1702 LP5524 Evaluation Kit
Copyright © 2008–2013, Texas Instruments Incorporated
1
Evaluation Kit Overview
www.ti.com
Figure 1. LP5524 Evaluation Board
2
AN-1702 LP5524 Evaluation Kit
SNVA284A – March 2008 – Revised April 2013
Submit Documentation Feedback
Copyright © 2008–2013, Texas Instruments Incorporated
Jumper Description
www.ti.com
3
Jumper Description
This describes the jumpers and the connectors on the LP5524 evaluation board.
Figure 2. LP5524 Evaluation Board Top View
VIN – J1
This connector is the positive input for power supply. The evaluation board can operate with supply
voltages from 2.7 V to 5.5 V. The input leads from power supply should be twisted and kept as short as
possible. There is an input capacitor (C1) on board to smooth the input voltage.
GND – J4
This is the negative input for power supply.
J2
This jumper disconnects all LED cathodes from the GND. This can be used to separate the LED currents
from the circuit current.
D1B – J6
This jumper can be used to disconnect the D1B output from the LED anode. This can be used to measure
the D1B current.
D2B - J3
This jumper can be used to disconnect the D2B output from the LED anode. This can be used to measure
the D2B current.
D2A – J7
This jumper can be used to disconnect the D2A output from the LED anode. This can be used to measure
the D2A current.
SNVA284A – March 2008 – Revised April 2013
Submit Documentation Feedback
AN-1702 LP5524 Evaluation Kit
Copyright © 2008–2013, Texas Instruments Incorporated
3
Getting Started
www.ti.com
D1A – J5
This jumper can be used to disconnect the D1A output from the LED anode. This can be used to measure
the D1A current.
D2A – J7
This jumper can be used to disconnect the D2A output from the LED anode. This can be used to measure
the D2A current.
ENB – J8
This is the ENB input. A three pin connector is applied to allow ENB to be connected either to VIN or to
GND. The center pin is connected directly to ENB pin. This pin can be used to connect external PWM
signal. Smaller than 300 Hz PWM frequency is recommended.
ISET – J10
ISET pin jumper. This can be used to connect the ISET pin either to VIN or to onboard RISET resistor.
Connecting ISET to VIN sets the LED current to default 5mA and connecting it to RISET sets the current to
15.6 mA. Center pin is connected directly to ISET pin and it can be used to connect external current set
resistors.
ENA – J9
This is the ENA input. A three pin connector is applied to allow ENA to be connected either to VIN or to
GND. The center pin is connected directly to ENA pin. This pin can be used to connect external PWM
signal. Smaller than 300 Hz PWM frequency is recommended.
4
Getting Started
The following instructions show how to set up and use the LP5524 evaluation kit. Use ESD protection to
prevent any unwanted damaging ESD events.
1. Check the onboard jumpers. Jumpers on the LED outputs (J3, J5-J7) and the jumper from LED
cathodes to gnd (J2) should be on. Remove jumpers from enables (J8 and J9). ISET can be connected
either to VDD or RISET.
2. Connect evaluation board to a power supply. Check that operation voltage is between 2.7 V to 5.5 V.
3. Set the enable jumpers to ON position. ENA jumper enables drivers D1A and D2A and ENB jumper
enables drivers D1B and D2B.
4. The Evaluation Kit is now ready to use.
4.1
Current Measurements
To measure the current of a single LED driver remove the jumper from that driver's output and connect
current meter to jumper's pins. To measure the current of all LEDs remove the J2 jumper and connect
current meter to J2 pins. To measure the current consumption of the device separate the LED ground
current from the board's ground current by removing the J2 jumper and conecting the LED ground to
power supply ground with separated wire. Then connect the current meter to evaluation board's ground
wire. Figure 3 illustrates how to measure different currents.
4
AN-1702 LP5524 Evaluation Kit
SNVA284A – March 2008 – Revised April 2013
Submit Documentation Feedback
Copyright © 2008–2013, Texas Instruments Incorporated
Board Layout
www.ti.com
4.2
PWM Dimming
To dim the LEDs, feed a proper PWM signal to ENx pin. Less than 300 Hz PWM frequency is
recommended. Ensure that the PWM signals are high and that the low levels are adequate.
Figure 3. LP5524 Evaluation Board Current Measurements
5
Board Layout
A four layer board was used to enable the use of micro-VIAs. Micro VIA is required for routing the center
pad of the LP5524. The evaluation board layers are:
• Top, component side, signal
• Layer 2, VIN plane (signal)
• Layer 3, GND plane
• Bottom, GND plane
SNVA284A – March 2008 – Revised April 2013
Submit Documentation Feedback
AN-1702 LP5524 Evaluation Kit
Copyright © 2008–2013, Texas Instruments Incorporated
5
Board Layout
6
www.ti.com
Figure 4. LP5524 Evaluation Board Layer 1 (Top).
Figure 5. LP5524 Evaluation Board Layer 2.
Figure 6. LP5524 Evaluation Board Layer 3.
Figure 7. LP5524 Evaluation Board Layer 4 (Bottom)
AN-1702 LP5524 Evaluation Kit
SNVA284A – March 2008 – Revised April 2013
Submit Documentation Feedback
Copyright © 2008–2013, Texas Instruments Incorporated
Schematic
www.ti.com
6
Schematic
U1
B2
VIN
A3
ENA
J7
B1
J6
C1
J3
D3
LP5524
A2
1
2 3
C3
D2A
J9
ENB
1
2 3
J8
C1
0.1 PF
J5
D4
2 3
J4
VIN
B3
D1A
D1B
D2
A1
ISET
D2B
GND
J10
1
J1
GND
D1
C2
J2
R1
33 k:
GND
GND
GND
GND
GND
Figure 8. LP5524 Evaluation Board Schematic
7
List of Components
Reference
Model
Type
Vendor
Size
C1
100 nF 10 V
Ceramic X5R
TDK
0402 (1005)
R1
33kΩ 1%
-
-
0402 (1005)
D1 -D4
LS T676
LED Red
Osram
3.0 mm x 3.4 mm x 2.1 mm
U1
LP5524
-
TI
1.215 mm x 1.215 mm x 0.6 mm
SNVA284A – March 2008 – Revised April 2013
Submit Documentation Feedback
AN-1702 LP5524 Evaluation Kit
Copyright © 2008–2013, Texas Instruments Incorporated
7
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated