LP5900TL-2.1/NOPB

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents Reference Design LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 LP5900 150-mA Ultra-Low-Noise LDO for RF and Analog Circuits Requires No Bypass Capacitor 1 Features 3 Description • • • The LP5900 is an LDO capable of supplying 150-mA output current. Designed to meet the requirements of RF and analog circuits, the LP5900 device provides low noise, high PSRR, low quiescent current, and low line transient response figures. Using new innovative design techniques the LP5900 offers class-leading device noise performance without a noise bypass capacitor. 1 • • • • • • • • • • • • Input Voltage Range, 2.5 V to 5.5 V Output Voltage Range, 1.5 V to 4.5 V Stable with 0.47-μF Ceramic Input and Output Capacitors No Noise Bypass Capacitor Required Logic Controlled Enable Thermal-Overload and Short-Circuit Protection −40°C to 125°C Junction Temperature Range for Operation Output Current, 150 mA Low Output Voltage Noise, 6.5 μVRMS PSRR, 75 dB at 1 kHz Output Voltage Tolerance, ±2% Virturally Zero IQ (Disabled), < 1 µA Very Low IQ (Enabled), 25 μA Start-up Time, 150 μs Low Dropout, 80 mV Typ. The device is designed to work with 0.47-μF input and output ceramic capacitors (no bypass capacitor required). The device is available in a DSBGA (YZR) package and a WSON package; the device is also available in an extremely thin DSBGA (YPF) package. For all voltage and package options available today, see the Package Option Addendum (POA) at the end of this data sheet. For any other fixed output voltages from 1.5 V to 4.5 V in 25-mV steps and all other package options, contact your local TI Sales office. Device Information(1) PART NUMBER 2 Applications • • • Cellular Phones PDA Handsets Wireless LAN Devices LP5900 PACKAGE BODY SIZE DSBGA (4) 1.108 mm × 1.083 mm (MAX) WSON (6) 2.50 mm × 2.20 mm (NOM) (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic OUT IN INPUT 0.47 PF OUTPUT 0.47 PF LP5900 ENABLE EN GND GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 Absolute Maximum Ratings ..................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Output and Input Capacitor, Recommended Specifications ............................................................. 6.7 Typical Characteristics .............................................. 7 7.4 Device Functional Modes........................................ 11 8 Application and Implementation ........................ 12 8.1 Application Information............................................ 12 8.2 Typical Application .................................................. 12 9 Power Supply Recommendations...................... 14 10 Layout................................................................... 15 10.1 10.2 10.3 10.4 10.5 Layout Guidelines ................................................. Layout Examples................................................... DSBGA Mounting.................................................. DSBGA Light Sensitivity ....................................... WSON Mounting ................................................... 15 15 15 16 16 11 Device and Documentation Support ................. 17 6 7 Detailed Description ............................................ 10 7.1 Overview ................................................................. 10 7.2 Functional Block Diagram ....................................... 10 7.3 Feature Description................................................. 10 11.1 11.2 11.3 11.4 Documentation Support ........................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 12 Mechanical, Packaging, and Orderable Information ........................................................... 17 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision Q (February 2015) to Revision R • Page Changed "Linear Regulator" to "LDO" in title and first sentence of Description ................................................................... 1 Changes from Revision P (December 2014) to Revision Q Page • Added NC and Thermal Pad descriptions in Pin Functions .................................................................................................. 3 • Changed Handling Ratings to ESD Ratings table format; move storage temp spec to Ab Max; delete soldering info (in POA) .................................................................................................................................................................................. 4 • Changed Unit for Line and Load regulation .......................................................................................................................... 5 • Changed Il to Iout ..................................................................................................................................................................... 7 • Changed Il to Iout ..................................................................................................................................................................... 8 • Changed Il to Iout ..................................................................................................................................................................... 9 • Added WSON Mounting subsection .................................................................................................................................... 16 • Added another related doc link ............................................................................................................................................ 17 Changes from Revision O (April 2013) to Revision P • Added Pin Configuration and Functions section, Handling Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated pin names and thermal information ........................................................................................................... 1 Changes from Revision N (April 2013) to Revision O • Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 16 this is the ROD for SNVS358 2 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 5 Pin Configuration and Functions IN A2 YZR and YPF Packages 4-Pin DSBGA OUT OUT B2 B2 IN A2 A1 EN B1 GND B1 GND A1 EN Top View Bottom View NGF Package 6-Pin WSON with Exposed Thermal Pad OUT 1 6 IN Thermal Pad N/C 2 GND 3 1 OUT IN 6 5 N/C N/C 5 4 EN EN 4 Top View Thermal Pad 2 N/C 3 GND Bottom View Pin Functions PIN DSBGA WSON TYPE DESCRIPTION EN I Enable input; disables the regulator when ≤ 0.4 V. Enables the regulator when ≥ 1.2 V. An internal 1-MΩ pull-down resistor connects this input to ground. 6 IN I Input voltage supply. Connect a 0.47-µF capacitor at this input. 3 GND — Common ground OUT O Output voltage. A 0.47-μF Low ESR capacitor should be connected to this pin. Connect this output to the load circuit. NC — No internal connection. — The exposed thermal pad on the bottom of the packagemust be connected to a copper area on the PCB under the package. TI recommends use of thermal vias to remove heat from the package into the PCB. Connect the thermal pad to ground potential or leave floating. Do not connect the thermal pad to any potential other than the same ground potential seen at device pin 3. For additional information on using TI's non-pullback WSON package, see AN-1187 Leadless Leadframe Package (LLP) (SNOA401). A1 4 A2 B1 B2 1 — 2 — NAME Thermal Pad Thermal Pad Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 3 LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX Input voltage, VIN –0.3 6 Output voltage, VOUT –0.3 VIN + 0.3 Enable input voltage, VEN –0.3 VIN + 0.3 Continuous power dissipation (4) Storage temperature, Tstg (2) (3) (4) V Internally Limited Junction temperature, TJMAX (1) UNIT –65 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to the potential at the GND pin. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. Internal thermal shutdown circuitry protects the device from permanent damage. 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT ±2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) Input voltage, VIN Enable voltage, VEN Output current, IOUT (2) MIN MAX 2.5 5.5 UNIT V 0 VIN + 0.3 V 0 150 mA Junction temperature, TJ –40 125 °C Ambient temperature, TA (2) –40 85 °C (1) (2) All voltages are with respect to the potential at the GND pin. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Application and Implementation. 6.4 Thermal Information LP5900 THERMAL METRIC (1) NGF YZR/YPF 6 PINS 4 PINS UNIT RθJA Junction-to-ambient thermal resistance 79.8 177.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 84.4 0.7 °C/W RθJB Junction-to-board thermal resistance 20.4 35.6 °C/W ψJT Junction-to-top characterization parameter 2.6 5.8 °C/W ψJB Junction-to-board characterization parameter 20.3 35.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 11.2 — °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 6.5 Electrical Characteristics Unless otherwise noted, specifications apply in Figure 16 with: VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = COUT = 0.47 μF, IOUT = 1 mA. (1) (2) PARAMETER VIN TEST CONDITIONS Input voltage ΔVOUT ILOAD Output voltage tolerance VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA to 150 mA, –40°C ≤ TJ ≤ 125°C Line regulation VIN = (VOUT(NOM) + 1 V) to 5.5 V, IOUT = 1 mA Load regulation IOUT = 1 mA to 150 mA MIN TYP 5.5 −2% 2% %V 0.001 %mA 25 50 VEN = 1.2 V, IOUT = 150 mA Quiescent current (4) 160 VEN = 1.2 V, IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C 0.003 VEN = 0.3 V (disabled, –40°C ≤ TJ ≤ 125°C Dropout voltage (6) 1 IOUT = 0 mA (VOUT = 2.5 V) 30 IOUT = 150 mA 80 IOUT = 150 mA, –40°C ≤ TJ ≤ 125°C PSRR Power supply rejection ratio (8) Output noise voltage (8) en Thermal shutdown mV 300 f = 100 Hz, IOUT = 150 mA 85 f = 1 kHz, IOUT = 150 mA 75 f = 10 kHz, IOUT = 150 mA 65 f = 50 kHz, IOUT = 150 mA 52 f = 100 kHz, IOUT = 150 mA 40 BW = 10 Hz to 100 kHz, VIN = 4.2 V IOUT = 0 mA 7 IOUT = 1 mA 10 IOUT = 150 mA TSHUTDOWN µA 150 Short-circuit current limit (7) ISC µA 230 VEN = 0.3 V (disabled) Ground current (5) mA 150 VEN = 1.2 V, IOUT = 0 mA, –40°C ≤ TJ ≤ 125°C VDO V 0.05 –40°C ≤ TJ ≤ 125°C VEN = 1.2 V, IOUT = 0 mA IG UNIT See (3) Load current Maximum output current IQ MAX 2.5 mA dB μVRMS 6.5 Temperature 160 Hysteresis ºC 20 LOGIN INPUT THRESHOLDS VIL Low input threshold (VEN) VIN = 2.5 V to 5.5 V, –40°C ≤ TJ ≤ 125°C VIH High input threshold (VEN) VIN = 2.5 V to 5.5 V, –40°C ≤ TJ ≤ 125°C IEN (1) (2) (3) (4) (5) (6) (7) (8) (9) Input current at EN pin (9) VEN = 5.5 V and VIN = 5.5 V VEN = 0 V and VIN = 5.5 V 0.4 1.2 V V 5.5 0.001 μA All voltages are with respect to the potential at the GND pin. Minimum and Maximum limits are specified by design, test, or statistical analysis. Typical numbers are not ensured, but do represent the most likely norm. The device maintains a stable, regulated output voltage without a load current. Quiescent current is defined here as the difference in current between the input voltage source and the load at the OUT pin. Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its nominal value. This parameter only applies to output voltages above 2.5 V. Short-circuit current is measured with OUT pulled to 0 V and IN worst case = 6 V. This specification is specified by design. There is a 1-MΩ resistor between EN pin and ground on the device. Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 5 LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com Electrical Characteristics (continued) Unless otherwise noted, specifications apply in Figure 16 with: VIN = VOUT (NOM) + 1 V, VEN = 1.2 V, CIN = COUT = 0.47 μF, IOUT = 1 mA.(1)(2) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TRANSIENT CHARACTERISTICS Line transient (8) ΔVOUT VIN = (VOUT(NOM) + 1 V) to (VOUT(NOM) + 1.6 V) in 30 μs, IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C −2 mV VIN = (VOUT(NOM) + 1.6 V) to (VOUT(NOM) + 1 V) in 30 μs, IOUT = 1 mA, –40°C ≤ TJ ≤ 125°C Load transient (8) 2 IOUT = 1 mA to 150 mA in 10 μs, –40°C ≤ TJ ≤ 125°C −110 mV IOUT = 150 mA to 1 mA in 10 μs, –40°C ≤ TJ ≤ 125°C 50 Overshoot on start-up (8) –40°C ≤ TJ ≤ 125°C 20 mV Turnon time To 95% of VOUT(NOM) 300 μs MAX UNIT 150 6.6 Output and Input Capacitor, Recommended Specifications (1) PARAMETER CIN Input capacitance TEST CONDITIONS Capacitance for stability, –40°C ≤ TJ ≤ 125°C COUT Output capacitance (1) 6 Output/Input capacitance NOM 0.47 µF 0.33 Capacitance for stability Capacitance for stability, –40°C ≤ TJ ≤ 125°C ESR MIN Capacitance for stability 0.47 0.33 10 5 500 mΩ The minimum capacitance must be greater than 0.33 µF over the full range of operating conditions. The capacitor tolerance must be 30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application should be considered during device selection to ensure this minimum capacitance specification is met. TI recommends X7R capacitors; however, capacitor types X5R, Y5V and Z5U may be used with consideration of the application and conditions. Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 6.7 Typical Characteristics Unless otherwise specified, CIN = COUT = 0.47 µF, VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA , T A = 25°C. Figure 1. Output Noise Density Figure 2. Power Supply Rejection Ratio Figure 3. Power Supply Rejection Ratio Figure 4. Output Voltage Change vs Temperature Figure 5. Ground Current vs VIN, I LOAD = 0 mA Figure 6. Ground Current vs VIN, I LOAD = 1 mA Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 7 LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com Typical Characteristics (continued) Unless otherwise specified, CIN = COUT = 0.47 µF, VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA , T A = 25°C. 8 Figure 7. Ground Current vs VIN, I LOAD = 100 mA Figure 8. Ground Current vs Load Current Figure 9. Short-Circuit Current Figure 10. Load Transient Figure 11. Line Transient Figure 12. Enable Start-up Time, (IOUT= 1 mA, VOUT = 2.8 V) Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 Typical Characteristics (continued) Unless otherwise specified, CIN = COUT = 0.47 µF, VIN = VOUT(NOM) + 1 V, VEN = 1.2 V, IOUT = 1 mA , T A = 25°C. Figure 13. Enable Start-up Time, (IOUT= 100 mA, VOUT = 2.8 V) Figure 14. Enable Start-up Time, (IOUT= 1 mA, VOUT = 2.8 V) Figure 15. Dropout Over Temperature (100 mA) Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 9 LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com 7 Detailed Description 7.1 Overview Designed to meet the needs of sensitive RF and analog circuits, the LP5900 provides low noise, high PSRR, and low quiescent current, as well as low line and load transient response figures. Using new innovative design techniques, the LP5900 offers class-leading noise performance without the need for a separate noise filter capacitor. 7.2 Functional Block Diagram OUT IN POR EN + RF CF + VBG 1.2 V GND EN + 1M EN VIH 7.3 Feature Description 7.3.1 No-Load Stability The LP5900 remains stable and in regulation with no external load. 7.3.2 Enable Control The LP5900 enable (EN) pin is internally held low by a 1-MΩ resistor to GND. The EN must be higher than the VIH threshold to ensure that the device is fully enabled under all operating conditions. The EN pin voltage must be lower than the VIL threshold to ensure that the device is fully disabled. 7.3.3 Low Noise Output Any internal noise at the LP5900 reference voltage is reduced by a first order low-pass RC filter before it is passed to the output buffer stage. This eliminates the need for the external bypass capacitor for noise suppression. 10 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 Feature Description (continued) 7.3.4 Thermal-Overload Protection Thermal-overload protection disables the output when the junction temperature rises to approximately 160°C which allows the device to cool. When the junction temperature cools to approximately 140°C, the output is enabled. Based on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This thermal cycling limits the dissipation of the regulator and protects it from damage as a result of overheating. 7.4 Device Functional Modes 7.4.1 Operation with Enable Control The LP5900 may be switched ON or OFF by a logic input at the EN pin. A high voltage at this pin turns the device on. When the EN pin is low, the regulator output is off, and the device typically consumes 3 nA. However, if the application does not require the shutdown feature, the EN pin can be tied to IN pin to keep the regulator output permanently on. In this case the supply voltage must be fully established 500 μs or less to ensure correct operation of the start-up circuit. Failure to comply with this condition may cause a delayed start-up time of several seconds. A 1 MΩ pull-down resistor ties the EN input to ground, and this ensures that the device will remain off when the EN pin is left open circuit. To ensure proper operation, the signal source used to drive the EN input must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. 7.4.2 Operation with Minimum Operating Input Voltage (VIN) The LP5900 does not include any dedicated UVLO circuitry. The LP5900 internal circuitry is not fully functional until VIN is at least 2.5 V. The output voltage is not regulated until VIN ≥ (VOUT + VDO). Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 11 LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LP5900 is a linear regulator capable of supplying a 150-mA output current. Designed to meet the requirements of RF and nalog circuits, the device provides low noise, high PSRR, low quiescent current, and low line transient response figures. Using new innovative design techniques the LP5900 offers class-leading device noise performance and is designed to work with 0.47-μF input and output ceramic capacitors (no bypass capacitor is required). 8.2 Typical Application Figure 16 shows the typical application circuit for the LP5900. Input and output capacitances may need to be increased above the 0.47-μF minimum for some applications. OUT IN INPUT 0.47 PF OUTPUT 0.47 PF LP5900 EN ENABLE GND GND Figure 16. LP5900 Typical Application 8.2.1 Design Requirements DESIGN PARAMETER Input voltage range MIN MAX 2.5 5.5 V 2.8 V 150 mA Output voltage Output current Output capacitor range Input/Output capacitor ESR range UNITS 0.47 10 μF 5 500 mΩ 8.2.2 Detailed Design Procedure 8.2.2.1 Power Dissipation The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the device, to the ultimate heat sink, the ambient environment. Thus the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air. As stated in Recommended Operating Conditions, the allowable power dissipation for the device in a given package can be calculated using Equation 1: 12 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 (TJMAX - TA) PD = RTJA (1) The actual power dissipation across the device can be represented by Equation 2: PD = (VIN – VOUT) × IOUT (2) This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage drop across the device, and the continuous current capability of the device. These two equations should be used to determine the optimum operating conditions for the device in the application. 8.2.2.2 External Capacitors Like any low-dropout regulator, the LP5900 requires external capacitors for regulator stability. The LP5900 is specifically designed for portable applications requiring minimum board space and smallest components. These capacitors must be correctly selected for good performance. 8.2.2.2.1 Input Capacitor An input capacitor is required for stability. The input capacitor should be at least equal to or greater than the output capacitor. It is recommended that a 0.47-µF capacitor be connected between the LP5900 IN pin and ground. This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input. Important: To ensure stable operation it is essential that good PCB practices are employed to minimize ground impedance and keep input inductance low. If these conditions cannot be met, or if long leads are to be used to connect the battery or other power source to the LP5900, then it is recommended to increase the input capacitor to at least 2.2 µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input, it must be ensured by the manufacturer to have a surge current rating sufficient for the application. There are no requirements for the equivalent series resistance (ESR) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain 0.47 μF ±30% over the entire operating temperature range. 8.2.2.2.2 Output Capacitor The LP5900 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor (dielectric types X5R or X7R) in the 0.47 μF to 10 μF range, and with ESR between 5 mΩ to 500 mΩ, is suitable in the LP5900 application circuit. For this device the output capacitor should be connected between the OUT pin and a good ground connection and should be mounted within 1 cm of the device. It may also be possible to use tantalum or film capacitors at the device output, OUT, but these are not as attractive for reasons of size and cost (see the Capacitor Characteristics section below). The output capacitor must meet the requirement for the minimum value of capacitance and have an ESR value that is within the range 5 mΩ to 500 mΩ for stability. 8.2.2.2.3 Capacitor Characteristics The LP5900 is designed to work with ceramic capacitors on the input and output to take advantage of the benefits they offer. For capacitance values in the range of 0.47 μF to 4.7 μF, ceramic capacitors are the smallest, least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a typical 0.47-μF ceramic capacitor is in the range of 20 mΩ to 40 mΩ, which easily meets the equivalent series resistance (ESR) requirement for stability for the LP5900. The temperature performance of ceramic capacitors varies by type and manufacturer. Most large value ceramic capacitors (≥ 2.2 µF) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by more than 50% as the temperature goes from 25°C to 85°C. A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable and holds the capacitance within ±15% over the temperature range. Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 0.47 μF to 4.7 μF range. Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 13 LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com Another important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about 2:1 as the temperature goes from 25°C down to −40°C, so some guard band must be allowed. 8.2.3 Application Curve Figure 17. Enable Start-up Time, IOUT = 100 mA, VOUT = 2.8 V 9 Power Supply Recommendations The device is designed to operate from an input voltage supply range between 2.5 V and 5.5 V. This input supply must be well regulated. To ensure that the LP5900 output voltage is well regulated, the input supply must be at least VOUT + 1 V. 14 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 10 Layout 10.1 Layout Guidelines The device is designed to operate from an input voltage supply range between 2.5 V and 5.5 V. This input supply must be well regulated. To ensure that the LP5900 output voltage is well regulated, the input supply must be at least VOUT + 1 V. 10.2 Layout Examples IN OUT LP5900TL A2 B2 COUT CIN 1 A1 B1 Power Ground EN Figure 18. DSBGA Layout LP5900SD CIN OUT COUT 1 2 Power Ground 3 IN 6 PAD 5 4 EN Figure 19. WSON Layout 10.3 DSBGA Mounting The DSBGA package requires specific mounting techniques, which are detailed in AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009). For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the DSBGA device. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the DSBGA device. Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 15 LP5900 SNVS358R – JULY 2005 – REVISED JUNE 2016 www.ti.com 10.4 DSBGA Light Sensitivity Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as halogen lamps can affect electrical performance if they are situated in proximity to the device. Light with wavelengths in the red and infra-red part of the spectrum has the most detrimental effect; thus, the fluorescent lighting used inside most buildings has very little effect on performance. 10.5 WSON Mounting The 6-lead WSON package requires specific mounting techniques which are detailed in AN-1187 Leadless Leadframe Package (LLP) (SNOA401). Referring to the section PCB Design Recommendations, it should be noted that the pad style which should be used with the WSON package is the NSMD (non-solder mask defined) type. Additionally, it is recommended the PCB terminal pads to be 0.2 mm longer than the package pads to create a solder fillet to improve reliability and inspection. The exposed thermal pad on the bottom of the WSON package must be connected to a copper area on the PCB under the package. TI recommends use of thermal vias to remove heat from the package into the PCB is recommended. Connect the thermal pad to ground potential or leave floating. Do not connect the thermal pad to any potential other than the same ground potential seen at device pin 3. 16 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 LP5900 www.ti.com SNVS358R – JULY 2005 – REVISED JUNE 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009) AN-1112 AN-1112 Leadless Leadframe Package (LLP) (SNOA401) IC Package Thermal Metrics application report (SPRA953) 11.2 Trademarks All trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated Product Folder Links: LP5900 17 PACKAGE OPTION ADDENDUM www.ti.com 30-Sep-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) LP5900SD-1.5/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L15 LP5900SD-1.8/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L17 LP5900SD-2.0/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L18 LP5900SD-2.2/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L19 LP5900SD-2.5 NRND WSON NGF 6 1000 Non-RoHS & Green Call TI Level-1-260C-UNLIM -40 to 125 L13 LP5900SD-2.5/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L13 LP5900SD-2.7/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L14 LP5900SD-2.8/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L12 LP5900SD-3.0/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L20 LP5900SD-3.3/NOPB ACTIVE WSON NGF 6 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L16 LP5900SDX-1.8/NOPB ACTIVE WSON NGF 6 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L17 LP5900SDX-2.5/NOPB ACTIVE WSON NGF 6 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L13 LP5900SDX-2.7/NOPB ACTIVE WSON NGF 6 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L14 LP5900SDX-2.8/NOPB ACTIVE WSON NGF 6 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L12 LP5900SDX-3.0/NOPB ACTIVE WSON NGF 6 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L20 LP5900SDX-3.3/NOPB ACTIVE WSON NGF 6 4500 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 L16 LP5900TL-1.5/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-1.8/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-1.9/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.0/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 30-Sep-2021 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) (4/5) (6) LP5900TL-2.2/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.3/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.5/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.6/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.65/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.7/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.75/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.8/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-2.85/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-3.0/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-3.3/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TL-4.5/NOPB ACTIVE DSBGA YZR 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-1.5/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-1.8/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-2.1/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-2.3/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-2.5/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-2.6/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-2.7/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-2.75/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-2.8/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 Addendum-Page 2 Device Marking Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 30-Sep-2021 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) LP5900TLX-2.85/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-3.0/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900TLX-3.3/NOPB ACTIVE DSBGA YZR 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900XR-2.8/NOPB ACTIVE DSBGA YPF 4 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 LP5900XRX-2.8/NOPB ACTIVE DSBGA YPF 4 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of