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LP5900TL-2.6EV

LP5900TL-2.6EV

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    BOARD EVALUATION LP5900TL-2.6

  • 数据手册
  • 价格&库存
LP5900TL-2.6EV 数据手册
User's Guide SNVA123C – September 2005 – Revised April 2013 AN-1396 LP5900 DSBGA Evaluation Board Information 1 Introduction This evaluation board is designed to enable the evaluation of the LP5900 voltage regulator. Each board is assembled and tested in the factory. This evaluation board has the DSBGA-4 bump package mounted. 2 General Description The LP5900 is a linear regulator capable of suppling 150 mA output current. Designed to meet the requirements of RF/Analog circuits, the LP5900 provides low device noise, high PSRR, low quiescent current, and low line transient response. Using new innovative design techniques the LP5900 offers classleading noise performance without a noise bypass capacitor. The device has been designed to work with 0.47 µF input and output ceramic capacitors down to 0603 component size. 3 Operation The input voltage, applied between VIN and GND, should be at least 1.0 V greater than VOUT and no more than 5.5 V. The minimum operating voltage is 2.5 V. Loads can be connected to VOUT with reference to GND. VOUT and VIN sense pins are provided on the board to allow accurate measurements directly onto the input and output pins of the device, eliminating any voltage drop on the PCB traces or connecting wires to the load. ON/OFF control is provided by a logic signal on the VEN pin. A minimum of 1.2 V is required at this pin to enable the LDO. The LDO will be shutdown when the VEN pin is set to 0.4 V or less. VIN and VEN can be tied together in applications where the LP5900 is operated continuously from the battery. However, if ON/OFF control is required, the VEN pin should be driven from a separate signal to ensure correct operation of the fast start-up circuit. The device has a 1MΩ internal resistor from VEN to GND. All trademarks are the property of their respective owners. SNVA123C – September 2005 – Revised April 2013 Submit Documentation Feedback AN-1396 LP5900 DSBGA Evaluation Board Information Copyright © 2005–2013, Texas Instruments Incorporated 1 Schematic Diagram 4 www.ti.com Schematic Diagram The evaluation board schematic is shown in Figure 1. VIN sense VOUT sense (A2) VIN VIN (B2) 0.47 PF CIN LP5900 (A1) VEN VOUT VOUT 0.47 PF COUT VEN GND (B1) GND Figure 1. Evaluation Board Schematic 5 PCB Layout The layout of the evaluation board is shown in Figure 2. Figure 2. Evaluation Board Component and Pin Layout Board Size:- 21mm x 21mm 2 AN-1396 LP5900 DSBGA Evaluation Board Information SNVA123C – September 2005 – Revised April 2013 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Hardware www.ti.com 6 Hardware Designator Value Amount Footprint U1 LP5900 1 YZR0004CDA CIN 0.47µF 1 0603 X7R, X5R COUT 0.47µF 1 0603 X7R, X5R Test Pins 6 IN, OUT, IN SENSE, OUT SENSE, ON/OFF, GND SNVA123C – September 2005 – Revised April 2013 Submit Documentation Feedback Note AN-1396 LP5900 DSBGA Evaluation Board Information Copyright © 2005–2013, Texas Instruments Incorporated 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. 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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated
LP5900TL-2.6EV 价格&库存

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LP5900TL-2.6EV
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