User's Guide
SNVU558 – February 2017
The LP8863EVM Evaluation Module
This user’s guide describes the module used to evaluate characteristics, operation, and use of the
LP8863-Q1 automotive LED backlight driver. This document includes a schematic diagram, PCB layout,
and bill of materials (BOM).
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2
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10
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Contents
Introduction ................................................................................................................... 2
Setup .......................................................................................................................... 3
2.1
Input/Output Connector/Header Descriptions ................................................................... 4
2.2
LP8863EVM Setup ................................................................................................. 6
2.3
Installation Guide for GUI program (Windows 7-compatible) ................................................. 7
Quick Start-Up Procedure ................................................................................................. 10
Additional Control Options ................................................................................................ 11
Instructions for Standalone Evaluation .................................................................................. 16
LP8863EVM Board Stackup .............................................................................................. 17
LP8863EVM Component Placement .................................................................................... 18
LP8863EVM Component List ............................................................................................. 19
LP8863EVM Schematics .................................................................................................. 22
Using the LP8863EVM .................................................................................................... 24
10.1 Power up/down sequence ........................................................................................ 24
10.2 Enable .............................................................................................................. 24
10.3 Setting Boost Switch Frequency ................................................................................ 24
10.4 Setting PWM Output Frequency................................................................................. 24
10.5 Setting the LED String Current .................................................................................. 25
10.6 LED String Configuration ......................................................................................... 25
LED Load Board ............................................................................................................ 25
Trademarks
Windows is a registered trademark of Microsoft Corporation.
All other trademarks are the property of their respective owners.
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1
Introduction
1
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Introduction
TI's LP8863-Q1 evaluation module (EVM) helps designers evaluate the operation and performance of the
LP8863-Q1 automotive LED backlight driver. The device offers configurability and can be set up through
external resistor options for boost switching frequency, LED current, and PWM out frequency. Internal
register options enable various controls such as brightness inputs, slope control, dimming options, etc.
The EVM contains one LP8863-Q1 LED driver with boost circuit and a Tiva Launchpad evaluation circuit
to provide control signals for LED driver.
Table 1.
LED DRIVER
IC
PACKAGE
U8
LP8863-Q1
HTSSOP
Figure 1. LP8863-Q1 Evaluation Board (Top View)
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Setup
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Figure 2. LP8863-Q1 Evaluation Board (Bottom View)
2
Setup
This section describes the jumpers and connectors on the EVM as well as how to properly connect and
setup to use the LP8863EVM.
Default resistor values and jumper positions are set to:
• Boost SW frequency – 300 kHz (set by external resistor R59)
• Maximum LED current per string – 120 mA (set by external resistor R57)
• PWM input to control brightness (register control)
• PWM output frequency – 9.8 kHz (set by external resistor R58)
• I2C interface to communicate with LP8863-Q1 – base address 0x2C
• Charge pump for SW gate drive enabled
• J14 : Open to disconnect VDDIO input from VLDO out
• J17 : Open to use internal charge pump
• J19 : Close to connect onboard LDO outputs (1.8 V from Tiva controller circuit) to VDDIO
• J31 : Close to connect onboard LDO output (5 V) to VDD input to LP8863-Q1 measurement
• J12 : Open – probing point of boost output
• J16 : Open – a probing/noise injecting point for stability measurement
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Setup
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System/equipment required:
• Power supplies for VIN : 24 V or higher, 6 A or higher
• Power supplies for VDD: 5.5 V or higher, 0.5 A or higher (only needed when external power supply is
used for VDD input. Not needed for default setting)
• Power cables for VIN, VDD connection – cables with banana plugs recommended
• LED load board (not included in package): 6 strings, 8 LEDs per string (LEDs per string can be
adjusted by moving jumpers on load board)
• LED cable: 7-position ribbon cable
• USB cable (USB A to mini)
• PC to run GUI software
• Windows® 7 or previous version)
• GUI software
2.1
Input/Output Connector/Header Descriptions
J3 Input— This header is the power input (VDD) terminal and also probing header for LP8863-Q1 power.
The terminal provides a power connection to allow the user to attach the EVM to a power supply
and also monitor VDD connected to J4.
J4 - Input — This banana socket is the power input (VDD) terminal for LP8863-Q1 power. The terminal
provides a power (VDD) connection to allow the user to attach the EVM to a power supply.
J5 - Input— This banana socket is the power input (VBAT) terminal for the boost converter. The terminal
provides a power (VBAT) connection to allow the user to attach the EVM to a power supply.
J6 – GND— This banana socket is the power input (GND) terminal for the boost converter. The terminal
provides a power ground (GND) connection to allow the user to attach the EVM to a power supply.
J7 – Header— This header is a probing point of SW node.
J8 – GND— This banana socket is the power input (GND) terminal for the boost converter. The terminal
provides a power ground (GND) connection to allow the user to attach the EVM to a power supply.
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Setup
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J9 – Input— This header is the power input (VBAT) terminal and also probing header for the boost
converter. The terminal provides a power connection to allow the user to attach the EVM to a power
supply and also monitor VBAT connected to J5.
J10 – Header — This header is a probing point of VIN (boost input power after power filters).
J11 – Header— This header is a probing point of VINP (boost input power after power line FET).
J12 – Headers— These headers are probing points of boost output (VBOOST).
J13 – GND— This header is the power input (GND) terminal and also probing header for the boost
converter. The terminal provides power ground connection to allow the user to attach the EVM to a
power supply and also monitor VBAT connected to J8.
J14 – Jumper— This connector is for selection of the source of VDDIO between VDD and internal LDO
out (VLDO) of LP8863-Q1.
J15 – Input— This header is the power input (VDDIO) terminal and also probing header for VDDIO. The
terminal provides a power connection to allow the user to attach the EVM to a power supply and
also monitor VDDIO selected by J14.
J16 – Headers— These headers are probing/noise injecting points for stability measurement of boost.
J17 – Connector— This connector is to connect VDD to the internal charge pump output (when charge
pump is not used).
J18 – Header— This header is a probing point of GD.
J19 – Jumper— This connector is for selection of the source of VDDIO between 1.8-V and 3.3-V output
from on-board LDOs.
J20 – Connector— This connector is to connect 5-V output from on-board LDO to VDD input.
J21 to J26 – Headers— These headers are to measure LED string current of LED0 to LED5.
J27 – GND— These headers are probing points of GND.
J28 – Header— This header is a probing point of INT.
J31 – Connector— This connector is to connect 5-V output from on-board LDO to VDD input.
J32 – Headers— These headers are probing points of SDO_PWM, SDI_SDA, SCLK_SCL, and
SS_ADDRSEL.
J33 – Connector— This connector is to connect LED load board to EVM.
J34 – GND— These headers are probing points of GND.
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Setup
2.2
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LP8863EVM Setup
External power must be provided to the board. Connect a standard type-A plug from the PC to a Mini-B
plug, which goes to the EVM connector. The I2C-compatible interface program provides all of the controls
that the LP8863-Q1 device requires.
Figure 3. LP8863EVM With LED Load Board Connected
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Setup
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2.3
Installation Guide for GUI program (Windows 7-compatible)
•
•
Run “setup_LP8863_EVM_1.0.0.exe”.
Click “Next” button on this setup screen.
Figure 4. LP8863_EVM_GUI Setup
•
Check ”I accept the agreement” and press ”Next” button again.
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Setup
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Figure 5. License Agreement
•
Choose the folder name of GUI to be installed, then press ”Next” button or simply press ”Next” button.
Figure 6. Installation Directory
8
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Setup
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•
•
Begin SW installation by pressing ”Install” button in next window.
Once installation is completed, press ”Finish” to launch SW GUI of LP8863-Q1.
Figure 7. Completing the LP8863_EVM_GUI Setup Wizard
•
Initial window of GUI. Prepare hardware connection after this window, as described in the following
sections.
Figure 8. LP8863_EVM_GUI Home Page
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Quick Start-Up Procedure
3
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Quick Start-Up Procedure
•
•
Connect USB cable between EVB and PC.
Connect external power supply to VIN: 12 V (typical), 5-A setting, output not enabled yet.
•
Run the LP8863 GUI software and click ”Control” icon
as in Figure 9.
on left of GUI, then control window appears
Figure 9. GUI Control Window
•
•
Check ”EVM connected” mark on bottom of GUI software.
Press ”IFSEL Pin” button to select I2C interface: This is not required if register control is not used.
•
Enable VIN power supply output: IIN is approximately a couple of mA at normal cases. If higher current
on either power rail is monitored, disable power supply output and begin debugging.
Click ”Enable Pin” button on GUI software: boost converter starts working, and LEDs stay off without
PWM input.
On PWM input control, check ”Enable” box of PWM input, select frequency and duty from drop-down
boxes, and press ”Update” button: LED turns on at adjusted brightness level by PWM input.
•
•
10
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Additional Control Options
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4
Additional Control Options
•
If external boost frequency sync is needed, check “Enable” box of BST SYNC, select frequency and
duty from drop-down boxes, and press ”Update” button:
•
Remove pullup and/or pulldown resistors on EVM to avoid voltage division by these resistors when
external boost sync signal is used.
•
LED driver headroom voltage can be controlled by led_driver_headroom. Use drop-down box to select
desired headroom voltage.
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Additional Control Options
12
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•
Other control options such as dither, slope control, dimming mode,and temperature sensor are
available by User Config.
•
If temp_mon_en is set, die temperature can be read by window below:
•
If brightness mode is selected to use brightness register as a brightness input, not PWM input signal,
base brightness can be controlled by window below.
•
Control windows below can be used for independent dimming where each LED string is controlled
independently. See the LP8863-Q1 data sheet for independent dimming control.
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Additional Control Options
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•
All register values on control window can be manually updated to reflect latest values by pressing
“Update All” button.
•
If additional register controls or direct register controls are needed, each register can be accessed
directly by input window below.
•
Firmware version of the Tiva Launchpad is shown here and the latest version is 1.0.6.
•
Individually programmed register values can be saved or loaded by file menu on top of the GUI.
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Additional Control Options
•
Register file is *.txt format and can be renamed in the GUI or with a file managing program such as
Windows Explorer.
•
Settings saved can be opened and programmed automatically by selecting “Load Registers” from file
menu.
Register tab can be selected by pressing icon on left side of GUI.
Initially, all register values are hidden as below.
•
•
14
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Additional Control Options
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•
All register values appear if cell for “LP8863 Registers” is pressed.
•
•
•
Press “Read All” to update all register values with current values.
“Read” button is used to read only selected register on “Register name” column to reduce read time.
Each register bit can be changed by double click each bit cell.
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Instructions for Standalone Evaluation
5
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•
Changed bit values by double click can be written immediately by selecting “Immediate” mode.
•
If Update Mode is “Deferred”, bit value change by double click can be written only when “Write” button
is clicked.
•
“Save” and “Load” functions are also supported on “Register” window.
•
Field View shows register bit name, type, and values:
Instructions for Standalone Evaluation
The LP8863EVM can be used for standalone evaluation (without evaluation software and PC connection).
These are minimum requirements to use LP8863EVM as a standalone mode:
• Power supplies for VIN – 24 V or higher, 6 A or higher
• Power supplies for VDD – 5.5 V or higher, 0.5 A or higher (if external power supply is used)
• Power cables for VIN (and/or VDD) connection – TI recommends cables with banana plugs
• LED load board (not included in package, order number EVMSVA-E99-B-250) – 6 strings, 8 LEDs per
string (LEDs per string can be adjusted by moving jumpers on load board
• LED cable – 7-position ribbon cable
16
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LP8863EVM Board Stackup
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The LP8863EVM must be modified to support standalone mode from its default settings described as
follows:
1. Remove jumper on J19.
2. Connect pin 3 and 4 of J14 to connect VLDO output from LP8863-Q1 to VDDIO input.
3. Mount R68 to pull up PWM input for 100% brightness. If brightness needs to be changed from 100%,
connect external PWM source here (SDO_PWM).
4. Mount R63 to select I2C interface, so PWM input pin is not assigned to SDO of SPI interface.
5. Mount R64 to pull up EN input.
6. Change pullup and pulldown resistors to select spread spectrum enable (R66) or disable (R71) option.
The minimum procedures for turning on the LEDs after modifications above are as follows:
• Connect external power (VBAT, 3 V to 48 V; typical 12 V, 6 A) and ground to the board (recommended
boost conversion ratio less than 10).
• Connect LED load board (6 strings, 8 LEDs per string) to J33 (use caution about the boost output pin
location).
• Enable external power supply.
6
LP8863EVM Board Stackup
Figure 10. LP8863EVM Board Stackup
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LP8863EVM Component Placement
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LP8863EVM Component Placement
Figure 11. LP8863EVM Component Placement (Top Layer)
Figure 12. LP8863EVM Component Placement (Bottom Layer)
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LP8863EVM Component List
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LP8863EVM Component List
DESIGNATOR
QTY
PCB1
1
C1, C8, C18, C20,
C21, C22
6
C2, C4, C6
3
C3, C5, C7, C9, C10,
C11, C12, C13
8
C14, C15
C16
VALU
E
DESCRIPTION
FOOTPRINT
Printed Circuit Board
1uF
CAP, CERM, 1 µF, 16 V, +/- 10%, X6S, 0402
PART NUMBER
LP8863EVM
402
C1005X6S1C105K050BC
0.01uF CAP, CERM, 0.01uF, 25V, +/-10%, X7R, 0402
402
C1005X7R1E103K
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0402
402
C1005X7R1H104K050BB
2
10pF
CAP, CERM, 10pF, 50V, +/-5%, C0G/NP0, 0402
402
500R07S100JV4T
1
10uF
CAP, CERM, 10 µF, 16 V, +/- 20%, X5R, 0603
0603L
EMK107BBJ106MA-T
C17, C19
2
10pF
CAP, CERM, 10 pF, 50 V, +/- 5%, C0G/NP0, 0603
0603L
06035A100JAT2A
C23, C24, C25, C26,
C27, C28, C29, C30,
C52, C56, C58, C60
12
0.1uF
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
402
GRM155R71C104KA88D
C31
1
220pF
CAP, CERM, 220 pF, 100 V, +/- 10%, X7R, 0603
603
06031C221KAT2A
C32, C37, C42, C67,
C68
5
1000p
F
CAP, CERM, 1000pF, 100V, +/-5%, C0G/NP0,
0603
603
GRM1885C2A102JA01D
C33, C34, C43, C44,
C76
5
33uF
CAP, AL, 33uF, 63V, +/-20%, 40 ohm, SMD
C35, C36, C38, C39,
C40, C41, C46, C47
8
10uF
CAP, CERM, 10uF, 100V, +/-20%, X7S, 2220
2220
C45, C49, C79
3
10uF
CAP, CERM, 10 µF, 50 V, +/- 10%, X7R, AECQ200 Grade 1, 1210
1210_280
C48
1
56uF
CAP, AL, 56uF, 63V, +/-20%, 30 ohm, SMD
C50
1
100pF
CAP, CERM, 100pF, 25V, +/-10%, X7R, 0603
603
06033C101KAT2A
C51
1
10uF
CAP, CERM, 10uF, 16V, +/-20%, X7R, 1206
1206
C3216X7R1C106M
C53
1
2.2uF
CAP, CERM, 2.2uF, 25V, +/-10%, X7R, 0805
0805_HV
C54
1
100pF
CAP, CERM, 100 pF, 50 V, +/- 10%, X7R, 0402
402
C55, C57
2
4.7uF
CAP, CERM, 4.7 µF, 10 V, +/- 10%, X7R, 0805
0805_HV
LMK212B7475KG-T
C59
1
10uF
CAP, CERM, 10uF, 10V, +/-10%, X7R, 0805
0805_HV
GRM21BR71A106KE51L
C61, C62, C63, C64,
C65, C66, C69, C70,
C71, C72, C73, C74
12
2200p
F
CAP, CERM, 2200 pF, 100 V, +/- 10%, X7R, 0603
C75
1
47uF
CAP, CERM, 47 µF, 16 V, +/- 20%, X7R,
C77
1
0.33uF CAP, CERM, 0.33 µF, 50 V, +/- 20%, X7R, 1206
1206
12065C334MAT2A
C78
1
0.047u CAP, CERM, 0.047 µF, 25 V, +/- 5%, X7R, 0603
F
603
06033C473JAT2A
D1
1
Rgb
LED, Rgb, SMD
D2
1
100V
Diode, Schottky, 100 V, 10 A, AEC-Q101, TO277A
D3
1
60V
Diode, Schottky, 60 V, 1 A, AEC-Q101, SMB
D4
1
Red
LED, Red, SMD
1105W_Red
F1
1
Fuse, 15 A, SMD
Fuse_SSQ
H1, H2, H3, H4
4
Machine Screw, Round, #4-40 x 1/4, Nylon, Philips
panhead
H5, H6, H7, H8
4
Standoff, Hex, 0.5"L #4-40 Nylon
J1
1
Connector, Receptacle, Mini-USB Type B, R/A,
Top Mount SMT
J2
1
Header, 100mil, 12x1, Gold, TH
TSW-112-07-G-S
TSW-112-07-G-S
J3
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J4
1
BANANA JACK, 15A, Insulated, Nylon,Yellow
CONN_108-0907001
108-0907-001
J5
1
Standard Banana Jack, Insulated, Red
6091
6091
J6, J8
2
Standard Banana Jack, Insulated, Black
6092
6092
J7
1
Header, 100mil, 1x1, Gold, TH
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SM_RADIAL_8MM
SM_RADIAL_10BM
M
603
2220_250
SML_RGB_0404
TO-277A
SMB
NY PMS 440 0025
PH
Keystone_1902C
EEHZC1J330P
C5750X7S2A106M
UMK325AB7106KMHT
EEHZC1J560P
GRM21BR71E225KA73L
CC0402KRX7R9BB101
06031C222KAT2A
C5750X7R1C476M230KB
SML-LX0404SIUPGUSB
FSV10100V
CMSH1-60 TR13
HBR1105W-TR
SSQ 15
NY PMS 440 0025 PH
1902C
CONN_USB-Mini-B- 1734035-2
1734035-2
Samtec_HTSW-101- HTSW-101-09-G-S
09-x-S
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LP8863EVM Component List
J9
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J10
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J11
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J12, J16, J20, J21,
J22, J23, J24, J25,
J26, J31
10
Header, TH, 100mil, 2x1, Gold plated, 230 mil
above insulator
TSW-102-07-G-S
TSW-102-07-G-S
J13
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J14
1
Header, TH, 100mil, 2x2, Gold plated, 230 mil
above insulator
TSW-102-07-G-D
TSW-102-07-G-D
J15
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J17
1
Header, TH, 100mil, 2x1, Gold plated, 230 mil
above insulator
TSW-102-07-G-S
TSW-102-07-G-S
J18
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J19
1
Header, TH, 100mil, 3x1, Gold plated, 230 mil
above insulator
TSW-103-07-G-S
TSW-103-07-G-S
J27, J32, J34
3
Header, 100mil, 4x1, Gold, TH
TSW-104-07-G-S
TSW-104-07-G-S
J28
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J29
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J30
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
J33
1
Header, 100mil, 9x1, Vertical, TH
Samtec_TSW-10907-G-S
TSW-109-07-G-S
J35
1
Header, TH, 100mil, 1pos, Gold plated, 230 mil
above insulator
TSW-101-07-G-S
TSW-101-07-G-S
L1
1
2.2uH
L2
1
50
ohm
Ferrite Bead, 50 ohm @ 100 MHz, 12 A, 1206
L3
1
22uH
Inductor, Shielded, Powdered Iron, 22 µH, 12 A,
0.0265 ohm, AEC-Q200 Grade 0, SMD
L4
1
9uH
Coupled inductor, 9 µH, A, 0.0036 ohm, SMD
MuRata_PLT10H
LBL1
1
Thermal Transfer Printable Labels, 0.650" W x
0.200" H - 10,000 per roll
Label_650x200
Q1, Q2, Q3
3
50 V
Transistor, NPN, 50 V, 0.1 A, AEC-Q101, SOT-416
Q4
1
-60V
MOSFET, P-CH, -60V, 30A, PowerPAK_SO-8L
Q5
1
60V
MOSFET, N-CH, 60 V, 25 A, AEC-Q101, SO-8FL
SO-8FL
NVMFS5C682NLT1G
Q6
1
60V
MOSFET, N-CH, 60 V, 25 A, AEC-Q101, SO-8FL
SO-8FL
NVMFS5C682NLT1G
R1, R5, R6
3
10k
RES, 10k ohm, 5%, 0.063W, 0402
402
CRCW040210K0JNED
R2
1
5.1
RES, 5.1, 5%, 0.75 W, AEC-Q200 Grade 0, 2010
2010
CRCW20105R10JNEF
R3
1
0.02
RES, 0.02 ohm, 1%, 3W, 2512
2512M
CRA2512-FZ-R020ELF
R4, R7, R8, R9, R10,
R11, R12, R15, R17,
R26, R29, R30, R31,
R75, R76, R77, R78,
R79, R80, R81, R82,
R83
22
0
RES, 0 ohm, 5%, 0.063W, 0402
402
CRCW04020000Z0ED
R13, R16
2
27
RES, 27, 5%, 0.1 W, 0603
0603L
CRCW060327R0JNEA
R14, R19, R28
3
10.0k
RES, 10.0k ohm, 1%, 0.063W, 0402
402
CRCW040210K0FKED
R18
1
1.0Me
g
RES, 1.0 M, 5%, 0.1 W, 0603
0603L
CRCW06031M00JNEA
1
0
RES, 0, 5%, 0.25 W, 1206
1206
RC1206JR-070RL
16
0
RES, 0 ohm, 5%, 0.1W, 0603
603
MCR03EZPJ000
R20
R21,
R38,
R45,
R62,
20
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R22,
R40,
R56,
R67,
R23,
R41,
R60,
R73,
R37,
R44,
R61,
R74
Inductor, Shielded, Powdered Iron, 2.2 µH, 10.5 A,
0.0137 ohm, SMD
The LP8863EVM Evaluation Module
IHLP-3232DZ
IHLP3232DZER2R2M01
1206
BLM31SN500SZ1L
SRP1770TA
SRP1770TA-220M
SOT-416
PLT10HH501100PNL
THT-14-423-10
DTC114EET1G, ON
Semiconductor
PowerPAK_SO-8L
SQJ461EP
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LP8863EVM Component List
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R24, R25
2
0
RES, 0, 5%, 0.1 W, 0603
603
CRCW06030000Z0EA
R27, R36
2
2.2k
RES, 2.2k ohm, 5%, 0.1W, 0603
603
CRCW06032K20JNEA
R32, R33, R34, R35
4
100k
RES, 100 k, 5%, 0.063 W, 0402
402
CRCW0402100KJNED
R39
1
20.0k
RES, 20.0k ohm, 1%, 0.1W, 0603
603
CRCW060320K0FKEA
R42
1
20
RES, 20.0 ohm, 1%, 0.1W, 0603
603
RC0603FR-0720RL
R43
1
910k
RES, 910k ohm, 1%, 0.1W, 0603
603
RC0603FR-07910KL
R46
1
100k
RES, 100k ohm, 1%, 0.1W, 0603
603
RC0603FR-07100KL
R47
1
0.015
RES, 0.015, 1%, 3 W, 2512
2512
CRA2512-FZ-R015ELF
R48, R49, R51, R52,
R53, R55
6
4.99
RES, 4.99 ohm, 1%, 0.25W, 1206
1206
CRCW12064R99FKEA
R50, R63, R64, R65,
R66, R68, R69, R70,
R71
9
10k
RES, 10k ohm, 5%, 0.1W, 0603
603
CRCW060310K0JNEA
R54
1
150
RES, 150, 5%, 0.1 W, 0603
603
CRCW0603150RJNEA
R58
1
42.2k
RES, 42.2 k, 0.1%, 0.1 W, 0603
603
RT0603BRD0742K2L
R59
1
3.92k
RES, 3.92 k, 1%, 0.1 W, 0603
603
RC0603FR-073K92L
R72
1
4.99k
RES, 4.99 k, 0.5%, 0.1 W, 0603
603
RT0603DRE074K99L
R?
1
25.5k
RES, 25.5 k, 0.1%, 0.1 W, AEC-Q200 Grade 0,
0603
603
ERA-3AEB2552V
S1
1
Switch, Tactile, SPST-NO, 0.05A, 12V , SMD
SW_EVQP7A
EVQ-P7A01P
U1
1
Tiva C Series Microcontroller, PM0064A
PM0064A_M
TM4C123GH6PMI7R
U2
1
ULTRA LOW-NOISE, 250-mA LINEAR
REGULATOR FOR RF AND ANALOG CIRCUITS
REQUIRES NO BYPASS CAPACITOR,
DBV0005A
DBV0005A_N
LP5907MFX-1.8/NOPB
U3
1
ULTRA LOW-NOISE, 250-mA LINEAR
REGULATOR FOR RF AND ANALOG CIRCUITS
REQUIRES NO BYPASS CAPACITOR,
DBV0005A
DBV0005A_N
LP5907MFX-3.3/NOPB
U4
1
TCA9406 Dual Bidirectional 1-MHz I2C-BUS and
SMBus Voltage Level-Translator, 1.65 to 3.6 V, -40
to 85 degC, 8-pin US8 (DCU), Green (RoHS & no
Sb/Br)
DCU0008A_N
TCA9406DCUR
U5, U6, U7
3
4-Bit Bidirectional Level-Shifter/Voltage Translator
With Automatic Direction Sensing, RUT0012A
RUT0012A
TXB0304RUTR
U8
1
6-Channel LED Driver with Local Dimming for
Automotive Lighting, DCP0038A
DCP0038A_N
LP8863ADCPRQ1
U9
1
Single Output Automotive LDO, 700 mA, Fixed 5 V
Output, 5.5 to 42 V Input, 5-pin PFM (KVU), -40 to
125 degC, Green (RoHS & no Sb/Br)
KVU0005A_N
TLE4275QKVURQ1
Y1
1
Crystal, 16MHz, SMD
TXC_7V
7V-16.000MAAE-T
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21
LP8863EVM Schematics
9
www.ti.com
LP8863EVM Schematics
3.3V
C1
C2
C3
C4
C5
C6
1µF
0.01uF
0.1
0.01uF
0.1 µF
0.01uF
U1
11
26
42
54
µF
2
GND
C7
C8
C9
C10
0.1µF
1µF
0.1µF
0.1µF
25
56
37
USR_SW2
GND
3.3V
3.3V
32
0
RESETn
38
R5
S1
1
2
R4
40
10k
3
4
41
C12
0.1µF
R7
1
3
GND
17
18
19
20
21
22
23
24
SCLKC1
SSIC1
SDOC1
SDIC1
0
Y1
16MHz
USR_SW2
45
46
47
48
58
57
1
4
SCLC1
SDAC1
BST_SYNCC1
ENC1
PB6C1
IFSELC1
NC
NC
C15
10pF
2
4
10pF
R14
GND
HIB
XOSC0
VDDA
VDDC
VDDC
VBAT
WAKE
33
XOSC1
36
52
51
50
49
16
15
14
13
PD0
PD1
PD2
PD3
PD4
PD5
PD6
PD7
61
62
63
64
43
44
53
10
PE0
PE1
PE2
PE3
PE4
PE5
9
8
7
6
59
60
RST
OSC0
OSC1
PA0/U0Rx
PA1/U0Tx
PA2/ SSI0Clk
PA3/SSI0Fss
PA4/SSI0Rx
PA5/SSI0Tx
PA6
PA7
PF0
PF1
PF2
PF3
PF4
PB0/USB0VID
PB1/USB0VBUS
PB2/I2C0SCL
PB3/I2C0SDA
PB4
PB5
PB6
PB7
GNDX
GNDA
GND
GND
GND
GND
GND
HB
34
PC0/TCK/SWCLK
PC1/TMS/SWDIO
PC2/TDI
PC3/TDO/SWO
PC4
PC5
PC6
PC7
R9
0
C14
VDD
VDD
VDD
VDD
3.3V
GND
28
29
30
31
5
R1
10k
USR_SW1
PWMC1
C11
PC6C1
0.1µF
GND
USB_DM
USB_DP
3.3V
R6
10k
USR_SW2
C13
INTC1
0.1µF
R8
LED_R
R10 0 LED_B
R11 0 LED_G
0
R12 USR_SW1
GND
+VBUS
C16
10µF
0
35
3
12
27
39
55
TM4C123GH6PMI7R
Q1
1
GND
C18
2
DTC114EET1G, ON Semiconductor
R15
D1
1.8V
0
PC6C
GND
4
BST_SYNCC
G
R19
3
1
+VBUS
10.0k
C20
2
Q2
1
1
B
3
LED_B
U2
+VBUS
DTC114EET1G, ON Semiconductor
2
R
SML-LX0404SIUPGUSB
Rgb
3
1µF
4
VIN
VOUT
GND
2
0
SDIC
LP5907MFX-1.8/NOPB
0
SDAC
C21
R28
0
PWMC
GND
GND
R26
3.3V
0
SCLC
0
1µF
0
ENC
GND
10.0k
0
3
IFSELC
Q3
1
0
SDOC
N/C
GND
LED_R
0
SSIC
EN
U3
2
DTC114EET1G, ON Se miconductor
+VBUS
1
C22
3
1µF
4
0
INTC
VIN
VOUT
0
0
SCLKC
5
5
Mini-USB
R75
R76
R17
R77
R78
R79
R80
R81
R82
R83
R29
R30
R31
PB6C
1.8V
0
1µF
GND
1
2
3
4
5
27
C17
10pF
3
LED_G
J1
R13
GND
USB_DM
10.0k
PB6
R16
27
GND
PC6
USB_DP
J2
BST_SYNC
BST_SYNCC
SCLKC
SSIC
SDOC
SDIC
PWMC
SDAC
SCLC
ENC
IFSELC
INTC
SCLK
SS
SDO
SDI
PWM
SDA
GND
R18
1.0Meg
1
2
3
4
5
6
7
8
9
10
11
12
C19
10pF
GND
GND
TSW-112-07-G-S
SCL
EN
GND
IFSEL
INT
0
EN
N/C
GND
2
LP5907MFX-3.3/NOPB
GND
GND
GND
U4
SCLC
SDAC
5
4
VDDIO_L 6
3
3.3V 7
R35
100k
C29
C30
0.1uF 0.1uF
SCL_A
SDA_A
SCL_B
SDA_B
3.3V
OE
VCCA
VCCB
GND
U5
C23
0.1uF GND
8 SCLC1
1 SDAC1
2
R34
100k
BST_SYNCC1
PC6C1
PB6C1
PWMC1
1
VCCA
2
3
4
5
A1
A2
A3
A4
TCA9406DCUR
12
OE
C24
0.1uF
VCCB
B1
B2
B3
B4
GND
11
VDDIO_L
10 BST_SYNCC
PC6C
9
PB6C
8
7 PWMC
C26
0.1uF
6
U6
R33
100k
C25
0.1uF
GND
3.3V
VDDIO_L
SCLKC1
SSIC1
SDOC1
SDIC1
1
2
3
4
5
12
GND
TXB0304RUTR
VCCA
A1
A2
A3
A4
OE
VCCB
B1
B2
B3
B4
GND
11
10
9
8
7
VDDIO_L
SCLKC
SSIC
SDOC
SDIC
R32
100k
C27
0.1uF
6
3.3V
1
ENC1
IFSELC1
INTC1
2
3
4
5
12
GND
TXB0304RUTR
GND
U7
GND
VCCA
A1
A2
A3
A4
VCCB
B1
B2
B3
B4
OE
GND
VDDIO_L
11
10 ENC
9 IFSELC
8 INTC
7
C28
0.1uF
6
GND
TXB0304RUTR
GND
GND
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 13. LP8863EVM Schematic(LED driver circuit)
22
The LP8863EVM Evaluation Module
SNVU558 – February 2017
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LP8863EVM Schematics
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J3
VDD
1
J4
VDD
108-0907-001
J6
Need wide trace for VBAT, V INP, VDD
J7
C31
J10
J11
L1
R39
C48
56uF
C79
10µF
C49
10µF
20.0k
C32
1000pF
NS
C43
NS33uF
C44
33uF
C35
C47
C36
10uF 10uF
NS
C46
10uF
NS
10uF
R21
2
1
R22
2
R20 SRP1770TA-220M
0
22µH
D3
FSV10100V
CMSH1-60 TR13 Place wide copper area on SW node
3.3V
0
3.3V
J19
7
C52
0.1uF
VDDIO_L
C51
10uF
8
5
2
1
6
VDD
C55
4.7µF
Place all decoupling caps
near input pins
1
C56
0.1uF
VDDIO
C57
4.7µF
C58
0.1uF
VLDO
C59
10uF
25
37
4
C1N
SD
GD
ISNS
C54
100pF
C60
0.1uF
GND
27
FB
IFSEL
N/S
5
R47
0.015
EN
EN
24
0
2
26
R54
150
LED0
22
LED0
21
LED1
20
LED2
19
LED3
18
LED4
INT
1
R27
VDDIO
SDO_PWM
29
SDI_SDA
30
SCLK_SCL
31
SDA
2.2k
R36
LED1
EN
SCL
INT
LED3
LED4
INT
C61
NS
2200pF
C62
NS
2200pF
C63
NS
2200pF
C64
NS
2200pF
C65
NS
2200pF
C66
NS
2200pF
R25
0
16
LED2
J28
C69
LED0
NS
2200pF
C70
NS
LED1
2200pF
C71
LED2
NS
2200pF
C72
NS
LED3
2200pF
C73
NS
LED4
2200pF
C74
NS
LED5
2200pF
R24
J21
15
1
D4
Red
BST_SYNC
2.2k
R58
42.2k
C68
1000pF
NS
GND
Need more than 20 vias to connect
ISNSGND to PGND layer
DISCHARGE
VDDIO
GND
R46
100k
Need wide trace for
drain/source of SW FET
13
IFSEL
IFSEL
C67
1000pF
NS
J22
J23
J24
J25
J26
2
1
GND
R50
10k
0603
R43
910k
14
VDDIO
ISNSGND
GND
R42
20.0
1
2
Need wide trace for
0.015ohm sense resistor to PGND
10
VLDO
C42
2
9
VDD
C41
10uF 1000pF
NS
J16
GND
J27
TSW-104-07-G-S
0
GND
GND
4
3
2
1
C50
3
GD
C1P
C40
10uF
Q6
NVMFS5C682NLT1G
4
100pF
C53
2.2uF
J20
3.3V
VSENSE_P
CPUMP
VSENSE_N
GND
Need wide trace for VBAT, V INP, VDD
R45
GD
CPUMP
C39
10uF
SS_ADDRSEL
32
BST_SYNC
28
PWM_FSET
34
BST_FSET
33
SDO_PWM
LED5
R48
LED0_OUT
4.99
R49
LED1_OUT
4.99
R51
LED2_OUT
4.99
R52
LED3_OUT
4.99
R53
LED4_OUT
4.99
LED5
17
2
1
R23
C38
10uF
NS
GND
2
1
VDDIO
U8
2
1
VDD
1.8V
3
2
1
C34
Alterntive part number
of Q5, Q6 is
NVMFS5C682NLT1G
J18
CPUMP
C33
33uF 33uF
Q5
NVMFS5C682NLT1G
4
0
1
2
3
J17
2
1
1
3
GND
0
0
GND
2 VDD
4 VLDO
2
1
1
VDDIO
VBOOST
1
2
3
J14
J15
VDDIO
VBOOST
C37
1000pF
1
1
J8
J13
GNDin
GND
3
R44
6092
J12
5.1
1
2
1
9µH
VINP
D2
L3
Need wide trace for both sides of jumper
5
0.02
50 ohm
12A
L4
C45
10µF
R3
VIN
220pF
SW
VINP
Q4
3
2
1
4
2.2µH
SSQ 15
1
L2
PLT10HH501100PNL
4
VBAT
3
1
F1
6091
VIN
5
VBAT
1
J9
J5
R2 NS
1 NS
GND
2
1
6092
R55
LED5_OUT
4.99
SDI_SDA
ISET
SCLK_SCL
NC
SS_ADDRSEL
ISET
23
J29
R57
25.5k
36 1
J30
NC
35
GND
38
NC2
GND
1
BST_SYNC
NC1
PWM_FSET
BST_FSET
PGND
PGND
R59
3.92k
GND_LED
SDO_PWM
11
12
R38
SDO NS R37
0
SDO
39
PWM
PWM
0
SDI_SDA
LP8863ADCPRQ1
GND
GND
SDI NS R40
0
SDI
GND
R41
SDA
SDA
0
SCLK_SCL
U9 TLE4275QKVURQ1
1
0
4
C76
C77
0.33µF
33uF
IN
OUT
DELAY
RESET
5
2
VDD_LDO
R72
4.99k
J32
4
3
2
1
VDD
C75
47µF
SCLKNS R56
0
SCLK
SDO_PWM
SDI_SDA
SCLK_SCL
SS_ADDRSEL
TSW-104-07-G-S
SS
SS
NS R62
0
GND
C78
0.047 µF
GND
PB6
PC6
NS R73
PWM_FSET
0
NS R74
BST_FSET
0
R60
0
SCL
SCL
SS_ADDRSEL
R67
ADDRSEL
0
6
R61
2
1
J31
GND
VIN
PWM input
Standalone - pullup for 100% PWM input
MCU - no pullup
Serial I/F selection
Standalone - pullup : I2C, pulldown : SPI
MCU - no pullup/no pulldown
I2C slave address selection
Standalone - pulldown
MCU - pulldown(slave addr 0x2C)
- pullup(slave addr 0x3C)
EN control
Standalone - pullup
MCU - no pullup
VDDIO
VDDIO
R68
10k
0603
NS
VDDIO
IFSEL
SDO_PWM
R63
10k
0603
NS
Boost sync input
Standalone - external sync input(no pullup/no
pulldown)
- pulldown : no spreadspectrum
- pullup : with spreadspectrum
MCU - sync input(no pullup/no pulldown) from MCU
- pulldown : no spreadspectrum
- pullup : with spreadspectrum
VDDIO
R64
10k
0603
NS
R69
10k
0603
NS
ADDRSEL
EN
R65
10k
0603
NS
J35
VDDIO
BST_SYNC
R66
10k
0603
NS
R70
10k
0603
GND
J33
VBOOST
LED0_OUT
LED1_OUT
LED2_OUT
LED3_OUT
LED4_OUT
LED5_OUT
1
2
3
4
5
6
7
8
9
1
BST_SYNC
R71
J34
4
3
2
1
TSW-104-07-G-S
GND
TSW-109-07-G-S
10k
0603
GND
GND
GND
Need wide trace for
VBOOST
Copyright © 2017, Texas Instruments Incorporated
Figure 14. LP8863EVM Schematic (Tiva Launchpad circuit)
SNVU558 – February 2017
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The LP8863EVM Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
23
Using the LP8863EVM
10
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Using the LP8863EVM
The LP8863-Q1 automotive LED driver can be set or programmed to support optimal application
configuration for boost and LED driver control. A few basic settings such as boost switch frequency, PWM
output frequency, and LED string current can be controlled by external resistor options, and other settings
for preferences such as dimming option, brightness input selection, slope control, etc can be programmed
using LP8863-Q1 GUI software. This section shows how to set hardware conditions such as power
sequences, external resistor options, etc.
10.1 Power up/down sequence
Power up: Input VIN (generating VDD from on-board LDO) a few hundred µs earlier than EN. Input VBAT
and VDDIO earlier than EN.
Power down: VIN must be high for at least 400 ms after EN is low for correct discharge operation. VDDIO
and VBAT must be low after EN is low.
10.2 Enable
The EN pin controls boost enable/disable. If brightness input is 0% while EN is high, boost output voltage
stays at the initial voltage (approximately 46 V).
10.3 Setting Boost Switch Frequency
R59 between BST_FSET and GND sets boost switch frequency. The value can be selected from Table 2.
The default switch frequency setting is 300 kHz.
Table 2.
R_FSET (kΩ)
BOOST SW FREQUENCY (kHz)
3.92
303
4.75
400
5.76
606
7.87
800
11
1000
17.8
1250
42.2
1667
140
2222
10.4 Setting PWM Output Frequency
R58 between PWM_FSET and GND sets PWM output frequency. The value can be selected from
Table 3. The default PWM output frequency setting is 9.8 kHz.
Table 3.
24
R_FSET (kΩ)
BOOST SW FREQUENCY (kHz)
3.92
152
4.75
304
5.76
610
7.87
1221
11
2441
17.8
4883
42.2
9766
140
19531
The LP8863EVM Evaluation Module
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Using the LP8863EVM
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10.5 Setting the LED String Current
R57 between ISET and GND sets LED string current. The value can be calculated from Equation 1. The
default LED string current setting is 120 mA (25.8 kΩ).
2560 u VBG
LED(n) _ current[11: 0]
u
ILED (n) =
RISET
4095
where
•
VBG = 1.2 V
(1)
10.6 LED String Configuration
LED string configuration of LP8863-Q1 is automatically detected at VDD POR. Any LED out pins (LED0 to
LED5) connected to GND are disabled and removed from adaptive loop control. Pin 2 of J21 to J26 can
be used to connect LED out pins to GND.
11
LED Load Board
The LED board is intended to be used as the load for LED drivers and can use up to 6 strings and up to
20 LEDs in the string (number of LEDs in use are defined by jumpers). Cree Xlamp ML-B LEDs with
maximum current 175 mA and maximum forward voltage 3.5 V at 80 mA (3.3 V typical) are used on the
board.
NOTE: The LED board is not included with the EVM -- contact your local TI sales representative if
board is needed.
Figure 15. LED Load Board (Top View)
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25
LED Load Board
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Figure 16. LED Load Board (Schematic Diagram)
26
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LED Load Board
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180
Forward Current (mA)
160
140
120
100
80
60
40
20
0
2.5
2.75
3
3.25
3.5
Forward Voltage (V)
3.75
4
D001
Figure 17. Forward Voltage for Cree Xlamp ML-B LEDs
Table 4. Bill of Material for LED Load Board
QTY
DESIGNATOR
DESCRIPTION
7
J1, J22, J43, J64, J85, J106, Header, TH, 100mil, 2x2, Gold plated, Samtec
J127
230 mil above insulator
TSW-102-07-G-D
J2…J21, J23…J42,
J44…J63, J65…J84,
J86…J105, J107…J126,
J129
Header, TH, 100mil, 3x1, Gold plated, Samtec
230 mil above insulator
TSW-103-07-G-S
J130
Header, TH, 100mil, 7x1, Gold plated, Samtec
230 mil above insulator
TSW-107-07-G-S
D1…D120
Cool White SMD LED Xlamp mL-B
MLBAWT-A1-0000000W51
1
120
Vishay-Dale
PART NUMBER
R1, R2, R3, R4, R5, R6
121
RES, 10.0 ohm, 1%, 0.1W, 0603
MANUFACTURER
6
Cree
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CRCW060310R0FKEA
The LP8863EVM Evaluation Module
Copyright © 2017, Texas Instruments Incorporated
27
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
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third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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