LSF010XEVM-001

User's Guide SDLU003A – July 2014 – Revised June 2015 LSF010XEVM-001 This document is the user's guide for the LSF010XEVM-001 Evaluation Module (EVM). The EVM allows for evaluation of the different ways that the LSF devices can be used to translate voltages between 1 V and 5.5 V. 1 2 3 4 5 6 7 8 Contents About This Manual ........................................................................................................... 2 Information About Cautions and Warnings ............................................................................... 2 Items Required for Operation .............................................................................................. 2 Introduction ................................................................................................................... 2 Setup .......................................................................................................................... 3 5.1 General Rules for Good Signal Integrity ......................................................................... 3 Schematic ..................................................................................................................... 6 6.1 Board Schematics and Pin Layout ............................................................................... 6 PCB Board Layout ......................................................................................................... 10 Bill of Materials (BOM) ..................................................................................................... 11 List of Figures ................................................................................................................... 1 EVM Board 2 Pull-up Resistors on VAPU and VBPU (200kΩ integrated within LSF0204 device) ................................ 4 3 Open Collector Input Control Circuit 4 5 6 7 8 9 10 3 ...................................................................................... 5 LSF0101 Schematic ......................................................................................................... 6 LSF0102 Schematic ......................................................................................................... 7 LSF0108 Schematic ......................................................................................................... 8 LSF0204 Schematic ......................................................................................................... 9 PCB Layer 1 (Top Layer).................................................................................................. 10 PCB (Bottom Layer)........................................................................................................ 10 BOM .......................................................................................................................... 11 List of Tables 1 LSF0101 ...................................................................................................................... 6 2 LSF0102 ...................................................................................................................... 7 3 LSF0108 ...................................................................................................................... 8 4 LSF0204 ...................................................................................................................... 9 SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback LSF010XEVM-001 Copyright © 2014–2015, Texas Instruments Incorporated 1 About This Manual 1 www.ti.com About This Manual This user’s guide describes the LSF010XEVM-001. This guide contains an introduction, setup instructions, the EVM schematic, top and bottom printed-circuit-board (PCB) layouts, and a bill of materials (BOM). 2 Information About Cautions and Warnings The information in a caution or a warning is provided for your protection. Read each caution and warning carefully. CAUTION This EVM contains components that can potentially be damaged by electrostatic discharge. Always transport and store the EVM in its supplied ESD bag when not in use. Handle using an antistatic wristband. Operate on an antistatic work surface. For more information on proper handling, see the Electrostatic Discharge (ESD) application note (SSYA008). 3 Items Required for Operation • • • 4 Volt meter Oscilloscope Square wave signal source Introduction The LSF010XEVM-001 is an EVM board that contains 4 LSF voltage clamp translators: 1bit, 2-bit, 4-bit, and 8 bit. These translators are bi-directional and only the LSF0204 requires a control pin. They can accept voltages up to 5.5 V on the inputs and the output will be equal to the VrefA voltage. Once the output reaches the VrefA level it can then be pulled to any other level between VrefA and 5.5 V. When using multi-bit LSF devices you can have many different levels of voltage translation on the same part. They can translate at medium to high speeds up to 100 MHz and cover these common voltage nodes and anything in between (1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V). These devices act like a switch when the input is between GND and Vref A and will have FET switch type characteristics such as speeds up to 200 MHz when translating down. Then the I/Os can be pulled up to any voltage between VrefA and 5.5 V. The maximum speed will then be limited by the size of the pull-up resistor and speeds up to 100 MHz can be achieved when translating up. The LSF010XEVM-001 EVM allows simplified evaluation and prototyping without the need for full board development. This EVM provides peripheral header style pads for probing and signal connection to each device pin and can be plugged into any prototype board with DIP header spacing. The boards are scored so they can easily be broken apart. 2 LSF010XEVM-001 SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Setup www.ti.com Figure 1. EVM Board 5 Setup This section describes the setup and connections of the EVM boards and describes how to set up the boards for voltage translations in either up or down direction. 5.1 General Rules for Good Signal Integrity Ensure that Vref_A , Vref_B and GND are all connected and configured properly. There should be a bypass capacitor on Vref_B (0.1 µF). When connecting signals, minimize the connection length and keep GND leads short when probing. This will ensure minimal capacitive, resistive and inductive loading caused by the connection and connector. For more device information please see the LSF0101, LSF0102, LSF0204, and LSF0108 device datasheet. 5.1.1 VCC and GND Connections Vref_B is considered VCC or device power. It will need to be 0.8 V greater than Vref_A. Vref_A will be the lowest voltage that the part can translate down to. GND is connected to pin 1 of P2 (LSF0101), Pin 1 of P4 (LSF0102), Pin 1 of P6 (LSF0108), and Pin 1 of P8 (LSF0204). See connector pin locations in Figure 1 . 5.1.2 Translation Connections On each board there will be a VAPU and a VBPU connection. These are the pull-up voltages that correspond to the voltage being translated. These pull-up voltages must be between or equal to VrefA and VrefB. Some of the I/O pins on the LSF0108 will not have pull-up resistors. This will allow the use of different pull-up resistor values and voltages on the A or B side. The A and B pins can be pulled to different levels on each pin demonstrating that the part can translate many different voltage levels at the same time. (The pull-up resistors installed on the boards are 301 Ω) The following are examples of how the parts can be set up: Each of these tests can be performed on any of the boards. SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback LSF010XEVM-001 Copyright © 2014–2015, Texas Instruments Incorporated 3 Setup www.ti.com NOTE: The LSF0101 and LSF0102 have all their pins connected to pull-up resistors on the EVM. The A and B pins without pull-up resistors on the LSF0108 are the only pins that can be pulled down. Test examples There can be multiple types of tests performed on each board. The drawing shows A as the input and B as the output; however, it can work either direction. The output on Aside or Bside will be limited to VrefA for a high level. Either side can then be pulled to any level between VrefA and 5.5 V. This allows up translation, down translation or any combination. The signals can go in both directions without the need for a direction pin. Example 1 no pull-up With no pull-up on either side (don’t connect VAPU or VBPU), you will be able to translate down to VrefA going either direction. The input can be 0 V to 5.5 V and the output will be 0 V to VrefA. Either A-side or B-side can be the input. This method can be used for down translation. Example 2 with pull-up By connecting VAPU or VBPU, you can pull the A or B side to any level between VrefA and 5.5 V. This method can be used for up translation. By connecting the outputs to multiple pull-up levels you are able to translate to a variety of different voltage nodes using a single part. Testing the part using multiple pull-up voltages can only be done on the LSF0108 or LSF0204. The first four I/O’s will be tied to the same pull-up voltage on the EVM. (VAPU or VBPU) The remaining I/Os can be connected to external pullup resistors and different pull-up voltages. Example 3 with pull-down A pull-down to GND can also be used which will give the output value of Vref_A. This is sometimes used to help with noise. If VREFA is the voltage that you are translating to then the pull-up can be tied to VREFA for another way to reduce noise. Example 4 with open drain part (Figure 3) This configuration allows you to control the input level with Vref. Using an open drain part on the input side will allow VrefA to control the input level. VBPU will control the output level of the LSF. Do not connect anything to VAPU. You can put in a 0 V to 5 V signal into the open drain part, a 2 V signal on Vref, and a 3.3 V signal on VBPU. This will then translate from 5 V to 2 V on Abus and then to 3.3 V on B bus. Figure 2. Pull-up Resistors on VAPU and VBPU (200kΩ integrated within LSF0204 device) 4 LSF010XEVM-001 SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Setup www.ti.com Figure 3. Open Collector Input Control Circuit SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback LSF010XEVM-001 Copyright © 2014–2015, Texas Instruments Incorporated 5 Schematic 6 www.ti.com Schematic The circuit diagrams in Figure 4 to Figure 7 show the schematics for the LSF010XEVM-001: 6.1 Board Schematics and Pin Layout Figure 4. LSF0101 Schematic Table 1. LSF0101 P1 6 Pin Out P2 Pin Out 1 Power pin (Connect highside supply here) 1 GND 2 Vref_A 2 Vref_B 3 VAPU A side pullup 3 VBPU B side pull-up 4 A1 signal 4 B1 signal 5 NC 5 NC 6 NC 6 NC 7 NC 7 NC 8 NC 8 NC 9 NC 9 NC 10 NC 10 NC 11 NC 11 NC 12 NC 12 NC 13 NC 13 NC LSF010XEVM-001 SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Schematic www.ti.com Figure 5. LSF0102 Schematic Table 2. LSF0102 P3 Pin out P4 1 Power pin (Connect high-side supply here) 1 GND 2 Vref_A 2 Vref_B 3 VAPU A side pull-up 3 VBPU B side pull-up 4 A1 signal 4 B1 signal 5 A2 signal 5 B2 signal 6 NC 6 NC 7 NC 7 NC 8 NC 8 NC 9 NC 9 NC 10 NC 10 NC 11 NC 11 NC 12 NC 12 NC 13 NC 13 NC SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback LSF010XEVM-001 Copyright © 2014–2015, Texas Instruments Incorporated 7 Schematic www.ti.com Figure 6. LSF0108 Schematic Table 3. LSF0108 P5 8 Pin Out P6 Pin Out 1 Power pin (Connect high-side supply here) 1 GND 2 Vref_A 2 Vref_B 3 VAPU A side pull-up 3 VBPU B side pull-up 4 A1 signal 4 B1 signal 5 A2 signal 5 B2 signal 6 A3 signal 6 B3 signal 7 A4 signal 7 B4 signal 8 A5 signal 8 A5 signal 9 A6 signal 9 A6 signal 10 A7 signal 10 A7 signal 11 A8 signal 11 A8 signal 12 NC 12 NC 13 NC 13 NC LSF010XEVM-001 SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Schematic www.ti.com Figure 7. LSF0204 Schematic Table 4. LSF0204 P5 Pin Out P6 Pin Out 1 Power pin (Connect high-side supply here) 1 GND 2 Vref_A 2 Power pin (Connect high-side supply here) 3 VAPU A side pull-up 3 VBPU B side pull-up 4 A1 signal 4 B1 signal 5 A2 signal 5 B2 signal 6 A3 signal 6 B3 signal 7 A4 signal 7 B4 signal 8 NC 8 EN pin 9 NC 9 NC 10 NC 10 NC 11 NC 11 NC 12 NC 12 NC 13 NC 13 NC SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback LSF010XEVM-001 Copyright © 2014–2015, Texas Instruments Incorporated 9 PCB Board Layout 7 www.ti.com PCB Board Layout Figure 8 and Figure 9 illustrate the PCB layout. Figure 8. PCB Layer 1 (Top Layer) Figure 9. PCB (Bottom Layer) 10 LSF010XEVM-001 SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Bill of Materials (BOM) www.ti.com 8 Bill of Materials (BOM) Figure 10 lists the BOM for the LSF EVM. Designator C101, C201, C301 P1, P2, P3, P4, P5, P6, P7, P8 Quantity Value 3 0.1uF 8 Description CAP, CERM, 0.1uF, 50V, +/-10%, C0G/NP0, 0402 PackageRef PartNumber 0402 C1005X7R1H104K Manufacturer TDK Header, 100mil, 13x1, Gold, TH 13x1 Header TSW-113-07-G-S Samtec R101, R103, R201, R202, R204, R205, R301, R302, R303, R304, R306, R307, R308, R309, R401, R402, R404, R405 18 301 RES, 301 ohm, 1%, 0.063W, 0402 0402 CRCW0402301RFKED Vishay-Dale R102, R203, R305 U1 3 200 K RESISTOR, 0402, 200K, 1% 0402 CRCW0402200KFKED Vishay-Dale 1 1-Channel Bidirectional Multi-Voltage Level Translator for Open-Drain & Push-Pull Application, DRY0006A DRY0006A LSF0101DRY Texas Instruments U2 1 2-Channel Bidirectional Multi-Voltage Level Translator for Open-Drain & Push-Pull Application, DCU0008A DCU0008A LSF0102DCUR Texas Instruments U3 1 8 Channel Bidirectional Multi-Voltage Level Translator for Open-Drain and Push-Pull Application, PW0020A PW0020A LSF0108PW Texas Instruments U4 1 4-Bits Bidirectional Multi-Voltage Level Translator for Open-Drain and PushPull Application, PW0014A PW0014A LSF0204PWR Texas Instruments Figure 10. BOM Revision History Changes from Original (February 2010) to A Revision .................................................................................................. Page • • • • • Added fourth device (LSF0204) globally. .............................................................................................. 2 Changed EVM Board graphic to Rev. C of the EVM. ................................................................................ 3 Changed schematics for each of the four pieces of the EVM board. .............................................................. 6 Changed layout pictures for top and bottom PCB layer. ........................................................................... 10 Changed BOM table. .................................................................................................................... 11 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. SDLU003A – July 2014 – Revised June 2015 Submit Documentation Feedback Revision History Copyright © 2014–2015, Texas Instruments Incorporated 11 STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. 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If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of Japan to follow the instructions below with respect to EVMs: 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. SPACER SPACER SPACER SPACER SPACER 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page SPACER 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. SPACER SPACER SPACER SPACER SPACER SPACER SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. 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EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. 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