LT1013TDJ1

Product Folder Sample & Buy Tools & Software Technical Documents Support & Community LT1013-DIE SLOS881 – JULY 2014 LT1013-DIE Dual Precision Operational Amplifier 1 Features 2 Applications • • • • • • • 1 • • • Single-Supply Operation – Input Voltage Range Extends to Ground – Output Swings to Ground While Sinking Current Low Supply Current Low Peak-to-Peak Noise Voltage Low Current Noise Battery-Powered Precision Instrumentation Instrumentation Amplifiers Thermocouple Amplifiers Multiple-Limit Threshold Detection Active Filters Multiple Gain Blocks 3 Description The LT1013-DIE is a dual precision operational amplifier, featuring high gain, low supply current, low noise, and low-offset-voltage temperature coefficient. Device Information (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE LT1013 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY LT1013TDJ1 100 LT1013TDJ2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LT1013-DIE SLOS881 – JULY 2014 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4 Bare Die Information 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 15 mils Silicon with backgrind Floating TiW/AlCu2% 1627 nm Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated LT1013-DIE www.ti.com SLOS881 – JULY 2014 Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1OUT 1 895.35 1699.26 994.41 1798.32 N/C 2 711.2 1779.27 786.13 1854.2 N/C 3 287.528 1655.826 362.458 1730.756 N/C 4 181.356 1655.826 256.286 1730.756 N/C 5 75.184 1655.826 150.114 1730.756 N/C 6 55.118 1548.892 130.048 1623.822 1IN– 7 35.56 1385.57 134.62 1484.63 1IN+ 8 35.56 560.07 134.62 659.13 N/C 9 1079.5 547.37 1178.56 646.43 VCC– 10 1079.5 30.48 1178.56 129.54 2IN+ 11 2123.44 560.07 2222.5 659.13 2IN- 12 2123.44 1385.57 2222.5 1484.63 N/C 13 2128.012 1548.892 2202.942 1623.822 N/C 14 2001.774 1655.826 2076.704 1730.756 N/C 15 2107.946 1655.826 2182.876 1730.756 N/C 16 1895.602 1655.826 1970.532 1730.756 N/C 17 1471.93 1779.27 1546.86 1854.2 2OUT 18 1263.65 1699.26 1362.71 1798.32 VCC+ 19 1079.5 1818.64 1178.56 1917.7 Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 14-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) LT1013TDJ1 ACTIVE 8 100 RoHS & Green Call TI N / A for Pkg Type 25 to 25 LT1013TDJ2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 25 to 25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of