MAX208CDWR

MAX208 www.ti.com ................................................................................................................................................ SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION FEATURES 1 • • • • • • • DB OR DW PACKAGE (TOP VIEW) ESD Protection for RS-232 I/O Pins – ±15-kV Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Four Drivers and Four Receivers Operates up to 120 kbit/s External Capacitors: 4 × 0.1 µF Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II DOUT2 DOUT1 RIN2 ROUT2 DIN1 ROUT1 RIN1 GND VCC C1+ V+ C1– APPLICATIONS • • • • • • Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 DOUT3 RIN3 ROUT3 DIN4 DOUT4 DIN3 DIN2 ROUT4 RIN4 V– C2– C2+ DESCRIPTION The MAX208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with ±15-kV HBM ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output slew rate. ORDERING INFORMATION (1) PACKAGE (2) TA SOIC – DW 0°C to 70°C SSOP – DB SOIC – DW –40°C to 85°C SSOP – DB (1) (2) ORDERABLE PART NUMBER Tube of 25 MAX208CDW Reel of 2000 MAX208CDWR Tube of 60 MAX208CDB Reel of 2000 MAX208CDBR Tube of 25 MAX208IDW Reel of 2000 MAX208IDWR Tube of 60 MAX208IDB Reel of 2000 MAX208IDBR TOP-SIDE MARKING MAX208C MA208C MAX208I MB208I For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2009, Texas Instruments Incorporated MAX208 SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 ................................................................................................................................................ www.ti.com FUNCTION TABLE EACH DRIVER (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level FUNCTION TABLE EACH RECEIVER (1) (1) INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off logic diagram (positive logic) DIN1 TTL/CMOS Inputs DIN2 DIN3 DIN4 5 2 DOUT1 18 1 DOUT2 19 24 DOUT3 21 20 DOUT4 6 7 ROUT1 RIN1 4 3 ROUT2 TTL/CMOS Outputs RIN2 22 RS-232 Inputs 23 ROUT3 RIN3 17 16 ROUT4 2 RS-232 Outputs RIN4 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 MAX208 www.ti.com ................................................................................................................................................ SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range (2) V+ Positive charge pump voltage range (2) VCC – 0.3 V to 14 V V– Negative charge pump voltage range (2) –14 V to 0.3 V V+ – V– Supply voltage difference VI Input voltage range VO Output voltage range –0.3 V to 6 V (2) 13 V Drivers –0.3 V to V+ + 0.3 V Receivers ±30 V Drivers V– – 0.3 V to V+ + 0.3 V Receivers –0.3 V to VCC + 0.3 V Short-circuit duration on DOUT θJA Package thermal impedance (3) (4) TJ Operating virtual-junction temperature Tstg Storage temperature range (1) (2) (3) (4) Continuous DB package 63°C/W DW package 46°C/W 150°C –65°C to 150°C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS C1 to C4 = 0.1 µF at VCC = 5 V ± 0.5 V (see Figure 4) VCC Supply voltage VIH Driver high-level input voltage DIN VIL Driver low-level input voltage DIN Driver input voltage DIN VI TA NOM MAX 4.5 5 5.5 2 MAX208C MAX208I UNIT V V 0.8 Receiver input voltage Operating free-air temperature MIN 0 5.5 –30 30 0 70 –40 85 V V °C ELECTRICAL CHARACTERISTICS C1 to C4 = 0.1 µF at VCC = 5 V ± 0.5 V (see Figure 4), over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER ICC Supply current TEST CONDITIONS No load, VCC = 5 V, TA = 25°C MIN TYP MAX 11 20 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 UNIT mA 3 MAX208 SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 ................................................................................................................................................ www.ti.com DRIVER SECTION ELECTRICAL CHARACTERISTICS C1 to C4 = 0.1 µF at VCC = 5 V ± 0.5 V (see Figure 4), over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 9 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –9 IIH High-level input current VI = VCC 15 200 IIL Low-level input current VI = 0 V –15 –200 µA IOS Short-circuit output current (1) VCC = 5.5 V, VO = 0 V ±10 ±60 mA ro Output resistance VCC, V+, and V– = 0 V, VO = ±2 V (1) V V µA Ω 300 Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. SWITCHING CHARACTERISTICS C1 to C4 = 0.1 µF at VCC = 5 V ± 0.5 V (see Figure 4), over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER MIN TYP (1) TEST CONDITIONS MAX UNIT Maximum data rate CL = 50 to 1000 pF, One DOUT switching, RL = 3 kΩ to 7 kΩ, See Figure 1 tPLH (D) Propagation delay time, low- to high-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 1 2 µs tPHL (D) Propagation delay time, high- to low-level output CL = 2500 pF, All drivers loaded, RL = 3 kΩ, See Figure 1 2 µs 300 ns (2) tsk(p) Pulse skew SR(tr) Slew rate, transition region (see Figure 1) (1) (2) 120 CL = 150 pF to 2500 pF, See Figure 2 CL = 50 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, VCC = 5 V 3 kbit/s 6 30 V/µs TYP UNIT ±15 kV All typical values are at VCC = 5 V and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. ESD PROTECTION PIN DOUT, RIN 4 TEST CONDITIONS Human-Body Model Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 MAX208 www.ti.com ................................................................................................................................................ SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 RECEIVER SECTION ELECTRICAL CHARACTERISTICS C1 to C4 = 0.1 µF at VCC = 5 V ± 0.5 V (see Figure 4), over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 3.5 UNIT VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA V VIT+ Positive-going input threshold voltage VCC = 5 V, TA = 25°C VIT– Negative-going input threshold voltage VCC = 5 V, TA = 25°C 0.8 1.2 Vhys Input hysteresis (VIT+ – VIT–) VCC = 5 V 0.2 0.5 1 V ri Input resistance VI = ±3 V to ±25 V, VCC = 5 V, TA = 25°C 3 5 7 kΩ 1.7 0.4 V 2.4 V V SWITCHING CHARACTERISTICS C1 to C4 = 0.1 µF at VCC = 5 V ± 0.5 V (see Figure 4), over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT tPLH (R) Propagation delay time, low- to high-level output CL = 150 pF 0.5 10 µs tPHL (R) Propagation delay time, high- to low-level output CL = 150 pF 0.5 10 µs tsk(p) (1) (2) Pulse skew (2) 300 ns All typical values are at VCC = 5 V and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 5 MAX208 SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 ................................................................................................................................................ www.ti.com PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 W RL 1.5 V 0V tPHL (D) CL (see Note A) Output tPLH (D) 3V 3V –3 V –3 V TEST CIRCUIT SR(tr) = t PHL (D) 6V or t A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. VOH VOL VOLTAGE WAVEFORMS PLH (D) Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 W RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL (D) tPLH (D) VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew Input Generator (see Note B) 3V 1.5 V 1.5 V -3 V Output 50 W CL (see Note A) tPHL (R) tPLH (R) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 MAX208 www.ti.com ................................................................................................................................................ SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 APPLICATION INFORMATION DOUT2 DOUT1 1 24 2 23 DOUT3 RIN3 5 kW RIN2 3 22 5 kW ROUT2 ROUT3 5V 4 400 kW 21 DIN4 5V 20 400 kW DIN1 ROUT1 DOUT4 5V 5 400 kW 6 19 DIN3 5V 400 kW RIN1 GND 18 7 5 kW 8 17 + 5 kW 9 0.1 µF 6.3 V V10 11 0.1 µF 6.3 V C1+ C2- 15 - + 14 V+ + + - RIN4 0.1 µF 16 V VCC + ROUT4 16 0.1 µF - DIN2 12 C2+ C1- 0.1 µF 16 V 13 A. Resistor values shown are nominal. B. Non-polarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 4. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 7 MAX208 SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 ................................................................................................................................................ www.ti.com Capacitor Selection The capacitor type used for C1–C4 is not critical for proper operation. The MAX208 requires 0.1-µF capacitors, although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF capacitors. When using the minimum recommended capacitor values, ensure that the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×) nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V–. Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V–. Bypass VCC to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1 to C4). ESD Protection TI MAX208 devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down. ESD Test Conditions ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliability report that documents test setup, methodology, and results. Human-Body Model (HBM) The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of concern and subsequently discharged into the DUT through a 1.5-kΩ resistor. RD 1.5 kW VHBM + - CS 100 pF DUT Figure 5. HBM ESD Test Circuit 8 Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 MAX208 www.ti.com ................................................................................................................................................ SLLS596C – OCTOBER 2003 – REVISED AUGUST 2009 1.5 VHBM = 2 kV DUT = 10-V 1-W Zener Diode I DUT – A 1.0 0.5 0.0 0 50 100 150 200 Time – ns Figure 6. Typical HBM Current Waveform Machine Model (MM) The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC board assembly, the MM test no longer is as pertinent to the RS-232 pins. Submit Documentation Feedback Copyright © 2003–2009, Texas Instruments Incorporated Product Folder Link(s): MAX208 9 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) MAX208CDB ACTIVE SSOP DB 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C Samples MAX208CDBR ACTIVE SSOP DB 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C Samples MAX208CDBRG4 ACTIVE SSOP DB 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C Samples MAX208CDW ACTIVE SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C Samples MAX208CDWR ACTIVE SOIC DW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C Samples MAX208IDB ACTIVE SSOP DB 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I Samples MAX208IDBE4 ACTIVE SSOP DB 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I Samples MAX208IDBG4 ACTIVE SSOP DB 24 60 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I Samples MAX208IDBR ACTIVE SSOP DB 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I Samples MAX208IDW ACTIVE SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX208I Samples MAX208IDWR ACTIVE SOIC DW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX208I Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of