MAX232DR

Product Folder Order Now Support & Community Tools & Software Technical Documents MAX232, MAX232I SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 MAX232x Dual EIA-232 Drivers/Receivers 1 Features 3 Description • The MAX232 device is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels. These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. 1 • • • • • • • Meets or Exceeds TIA/EIA-232-F and ITU Recommendation V.28 Operates From a Single 5-V Power Supply With 1.0-µF Charge-Pump Capacitors Operates up to 120 kbit/s Two Drivers and Two Receivers ±30-V Input Levels Low Supply Current: 8 mA Typical ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) Upgrade With Improved ESD (15-kV HBM) and 0.1-µF Charge-Pump Capacitors is Available With the MAX202 Device Device Information(1) ORDER NUMBER MAX232x BODY SIZE SOIC (16) 9.90 mm × 3.91 mm SOIC (16) 10.30 mm × 7.50 mm PDIP (16) 19.30 mm × 6.35 mm SOP (16) 10.3 mm × 5.30 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 2 Applications • • • • • PACKAGE (PIN) TIA/EIA-232-F Battery-Powered Systems Terminals Modems Computers 4 Simplified Schematic 5V POWER 2 2 ROUT 2 TOUT RS232 2 RIN RS232 TX TIN RX 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. MAX232, MAX232I SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 9 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 4 4 4 4 4 5 5 5 6 Absolute Maximum Ratings ..................................... Handling Ratings....................................................... Recommended Operating Conditions ...................... Thermal Information .................................................. Electrical Characteristics –– Device ......................... Electrical Characteristics –– Driver ........................... Electrical Characteristics –– Receiver ..................... Switching Characteristics ......................................... Typical Characteristics .............................................. Parameter Measurement Information .................. 7 Detailed Description .............................................. 9 9.1 9.2 9.3 9.4 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 9 9 9 9 10 Application and Implementation........................ 10 10.1 Application Information.......................................... 10 10.2 Typical Application ................................................ 10 11 Power Supply Recommendations ..................... 11 12 Layout................................................................... 11 12.1 Layout Guidelines ................................................. 11 12.2 Layout Example .................................................... 11 13 Device and Documentation Support ................. 12 13.1 13.2 13.3 13.4 Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 14 Mechanical, Packaging, and Orderable Information ........................................................... 12 5 Revision History Changes from Revision L (March 2004) to Revision M Page • Removed Ordering Information table. .................................................................................................................................... 1 • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1 • Moved Tstg to Handling Ratings table. .................................................................................................................................... 4 2 Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 MAX232, MAX232I www.ti.com SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 6 Pin Configuration and Functions Top View MAX232 . . . D, DW, N, OR NS PACKAGE MAX232I . . . D, DW, OR N PACKAGE (TOP VIEW) C1+ VS+ C1− C2+ C2− VS− T2OUT R2IN 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND T1OUT R1IN R1OUT T1IN T2IN R2OUT Pin Functions PIN NAME NO. C1+ 1 VS+ C1- TYPE DESCRIPTION — Positive lead of C1 capacitor 2 O Positive charge pump output for storage capacitor only 3 — Negative lead of C1 capacitor C2+ 4 — Positive lead of C2 capacitor C2- 5 — Negative lead of C2 capacitor VS- 6 O Negative charge pump output for storage capacitor only T2OUT, T1OUT 7, 14 O RS232 line data output (to remote RS232 system) R2IN, R1IN 8, 13 I RS232 line data input (from remote RS232 system) R2OUT, R1OUT 9, 12 O Logic data output (to UART) T2IN, T1IN 10, 11 I Logic data input (from UART) GND 15 — Ground VCC 16 — Supply Voltage, Connect to external 5V power supply Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 3 MAX232, MAX232I SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Input Supply voltage range (2) VS+ Positive output supply voltage range VS– Negative output supply voltage range VI Input voltage range VO Output voltage range (1) (2) MAX 6 V VCC – 0.3 15 V –0.3 –15 V –0.3 VCC + 0.3 T1IN, T2IN R1IN, R2IN Short-circuit duration TJ MIN –0.3 UNIT V ±30 T1OUT, T2OUT VS– – 0.3 VS+ + 0.3 R1OUT, R2OUT –0.3 VCC + 0.3 T1OUT, T2OUT V Unlimited Operating virtual junction temperature 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. 7.2 Handling Ratings Tstg V(ESD) (1) (2) MIN MAX UNIT -65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 0 2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) 0 1000 Storage temperature range Electrostatic discharge V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN NOM MAX 4.5 5 5.5 UNIT VCC Supply voltage VIH High-level input voltage (T1IN,T2IN) V VIL Low-level input voltage (T1IN, T2IN) 0.8 V R1IN, R2IN Receiver input voltage ±30 V TA Operating free-air temperature 2 V MAX232 0 70 MAX232I –40 85 °C 7.4 Thermal Information THERMAL METRIC (1) RθJA (1) Junction-to-ambient thermal resistance MAX232xD MAX232xDW MAX232xN SOIC SOIC wide PDIP MAX232xNS SOP 16 PINS 16 PINS 16 PINS 16 PINS 73 57 67 64 UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). 7.5 Electrical Characteristics –– Device over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6) TEST CONDITIONS (1) PARAMETER ICC (1) (2) 4 Supply current VCC = 5.5V, all outputs open, TA = 25°C MIN TYP (2) MAX 8 10 UNIT mA Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V All typical values are at VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 MAX232, MAX232I www.ti.com SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 7.6 Electrical Characteristics –– Driver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VOH High-level output voltage T1OUT, T2OUT RL = 3 kΩ to GND VOL Low-level output voltage (3) T1OUT, T2OUT RL = 3 kΩ to GND rO Output resistance T1OUT, T2OUT VS+ = VS– = 0, VO = ±2 V IOS (4) Short-circuit output current T1OUT, T2OUT VCC = 5.5 V, VO = 0 V IIS Short-circuit input current T1IN, T2IN VI = 0 (1) (2) (3) (4) MIN TYP (2) 5 MAX 7 –7 UNIT V –5 300 V Ω ±10 mA 200 µA Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V All typical values are at VCC = 5 V, TA = 25°C. The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only. Not more than one output should be shorted at a time. 7.7 Electrical Characteristics –– Receiver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TEST CONDITIONS (1) PARAMETER MIN TYP (2) MAX High-level output voltage R1OUT, R2OUT IOH = –1 mA VOL Low-level output voltage (3) R1OUT, R2OUT IOL = 3.2 mA VIT+ Receiver positive-going input threshold voltage R1IN, R2IN VCC = 5 V, TA = 25°C VIT– Receiver negative-going input threshold R1IN, R2IN voltage VCC = 5 V, TA = 25°C 0.8 1.2 Vhys Input hysteresis voltage R1IN, R2IN VCC = 5 V 0.2 0.5 1 V rI Receiver input resistance R1IN, R2IN VCC = 5 V, TA = 25°C 3 5 7 kΩ (1) (2) (3) 3.5 UNIT VOH V 1.7 0.4 V 2.4 V V Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 5 V, TA = 25°C. The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only. 7.8 Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) TEST CONDITIONS (1) PARAMETER SR Driver slew rate RL = 3 kΩ to 7 kΩ, see Figure 4 SR(t) Driver transition region slew rate see Figure 5 Data rate tPLH®) tPHL®) (1) MIN TYP (1) MAX UNIT 30 V/μs 3 V/μs One TOUT switching 120 kbit/s Receiver propagation delay time, low- to high-level output TTL load, see Figure 3 500 ns Receiver propagation delay time, high- to low-level output TTL load, see Figure 3 500 ns Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V. Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 5 MAX232, MAX232I SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 www.ti.com 10 9 8 7 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 ±9 ±10 ±11 ±12 Voltage (V) Voltage (V) 7.9 Typical Characteristics VOL VOH 1 2 3 4 5 Load resistance (k ) 6 7 TIN TOUT (to RIN) ROUT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Time ( s) C001 Figure 1. TOUT VOH & VOL vs Load Resistance, Both Drivers Loaded 6 12 11 10 9 8 7 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 C001 Figure 2. Driver to Receiver Loopback Timing Waveform Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 MAX232, MAX232I www.ti.com SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 8 Parameter Measurement Information VCC Pulse Generator (see Note A) RL = 1.3 kΩ R1OUT or R2OUT R1IN or R2IN See Note C CL = 50 pF (see Note B) TEST CIRCUIT ≤10 ns ≤10 ns Input 10% 90% 50% 90% 50% 3V 10% 0V 500 ns tPLH tPHL VOH Output 1.5 V 1.5 V VOL WAVEFORMS A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. B. CL includes probe and jig capacitance. C. All diodes are 1N3064 or equivalent. Figure 3. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 7 MAX232, MAX232I SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 www.ti.com Parameter Measurement Information (continued) T1IN or T2IN Pulse Generator (see Note A) T1OUT or T2OUT EIA-232 Output CL = 10 pF (see Note B) RL TEST CIRCUIT ≤10 ns ≤10 ns 90% 50% Input 10% 3V 90% 50% 10% 0V 5 µs tPLH tPHL 90% Output VOH 90% 10% 10% VOL tTLH tTHL 0.8 (V SR = –V ) 0.8 (V –V ) OH OL OL OH or t t TLH THL WAVEFORMS A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. B. CL includes probe and jig capacitance. Figure 4. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-μs Input) Pulse Generator (see Note A) EIA-232 Output 3 kΩ CL = 2.5 nF TEST CIRCUIT ≤10 ns ≤10 ns Input 90% 1.5 V 10% 90% 1.5 V 10% 20 µs tTLH tTHL Output 3V 3V −3 V −3 V SR = t THL 6V or t VOH VOL TLH WAVEFORMS A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%. Figure 5. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-μs Input) 8 Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 MAX232, MAX232I www.ti.com SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 9 Detailed Description 9.1 Overview The MAX232 device is a dual driver/receiver that includes a capacitive voltage generator using four capacitors to supply TIA/EIA-232-F voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5V TTL/CMOS levels. These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver, and voltage-generator functions are available as cells in the Texas Instruments LinASIC™ library. Outputs are protected against shorts to ground. 9.2 Functional Block Diagram 5V POWER 2 2 TOUT RS232 2 RIN RS232 TX TIN 2 ROUT RX 9.3 Feature Description 9.3.1 Power The power block increases and inverts the 5V supply for the RS232 driver using a charge pump that requires four 1-µF external capacitors. 9.3.2 RS232 Driver Two drivers interface standard logic level to RS232 levels. Internal pull up resistors on TIN inputs ensures a high input when the line is high impedance. 9.3.3 RS232 Receiver Two receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT. 9.4 Device Functional Modes 9.4.1 VCC powered by 5V The device will be in normal operation. 9.4.2 VCC unpowered When MAX232 is unpowered, it can be safely connected to an active remote RS232 device. Table 1. Function Table Each Driver (1) (1) INPUT OUTPUT TIN TOUT L H H L H = high level, L = low level, X = irrelevant, Z = high impedance Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 9 MAX232, MAX232I SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 www.ti.com Table 2. Function Table Each Receiver (1) (1) INPUTS OUTPUT RIN ROUT L H H L Open H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = disconnected input or connected driver off 10 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 10.1 Application Information For proper operation add capacitors as shown in Figure 6. Pins 9 through 12 connect to UART or general purpose logic lines. EIA-232 lines will connect to a connector or cable. 10.2 Typical Application 5V CBYPASS = 1 µF + − 16 1 C1 1 µF 3 4 C2 1 µF 5 From CMOS or TTL To CMOS or TTL C3† VCC C1+ 8.5 V VS+ C1− VS− C2+ 1 µF 2 6 −8.5 V C4 + C2− 11 14 10 7 12 13 9 8 1 µF EIA-232 Output EIA-232 Output EIA-232 Input EIA-232 Input 0V 15 GND † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. In addition to the 1-µF capacitors shown, the MAX202 can operate with 0.1-µF capacitors. Figure 6. Typical Operating Circuit 10.2.1 Design Requirements • • VCC minimum is 4.5 V and maximum is 5.5 V. Maximum recommended bit rate is 120 kbps. 10.2.2 Detailed Design Procedure Use 1 uF tantalum or ceramic capacitors. 10 Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 MAX232, MAX232I www.ti.com SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 Typical Application (continued) 10 9 8 7 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 ±9 ±10 ±11 ±12 Voltage (V) Voltage (V) 10.2.3 Application Curves VOL VOH 1 2 3 4 5 6 7 Load resistance (k ) 12 11 10 9 8 7 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 TIN TOUT (to RIN) ROUT 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Time ( s) C001 Figure 7. TOUT VOH & VOL vs Load Resistance, Both Drivers Loaded C001 Figure 8. Driver to Receiver Loopback Timing Waveform 11 Power Supply Recommendations The VCC voltage should be connected to the same power source used for logic device connected to TIN pins. VCC should be between 4.5V and 5.5V. 12 Layout 12.1 Layout Guidelines Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise and fall times. 12.2 Layout Example Ground 1 C1+ VCC 16 1 µF 1 µF 2 VS+ GND 15 3 C1- T1OUT 14 4 C2+ R1IN 13 5 C2- R1OUT 12 6 VS- T1IN 11 7 T2OUT T2IN 10 VCC 1 µF Ground 1 µF Ground 1 µF 8 R2IN R2OUT 9 Figure 9. Layout Schematic Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 11 MAX232, MAX232I SLLS047M – FEBRUARY 1989 – REVISED NOVEMBER 2014 www.ti.com 13 Device and Documentation Support 13.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY MAX232 Click here Click here Click here Click here Click here MAX232I Click here Click here Click here Click here Click here 13.2 Trademarks All trademarks are the property of their respective owners. 13.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 13.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. 14 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. 12 Submit Documentation Feedback Copyright © 1989–2014, Texas Instruments Incorporated Product Folder Links: MAX232 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MAX232D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWE4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 MAX232ID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MAX232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX232I MAX232IN ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 MAX232IN MAX232INE4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type -40 to 85 MAX232IN MAX232N ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 MAX232N MAX232NE4 ACTIVE PDIP N 16 25 Green (RoHS & no Sb/Br) CU NIPDAU N / A for Pkg Type 0 to 70 MAX232N MAX232NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX232 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of