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MAX3232E
SLLS664D – AUGUST 2005 – REVISED MAY 2017
MAX3232E 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver
With ±15-kV IEC ESD Protection
1 Features
3 Description
•
The MAX3232E device consists of two line drivers,
two-line receivers, and a dual charge-pump circuit
with ±15-kV IEC ESD protection pin to pin (serial-port
connection pins, including GND).
1
•
•
•
•
•
•
•
•
ESD Protection for RS-232 Bus Pins
– ±15 kV (HBM)
– ±8 kV (IEC61000-4-2, Contact Discharge)
– ±15 kV (IEC61000-4-2, Air-Gap Discharge)
Meets or Exceeds the Requirements of TIA/EIA232-F and ITU V.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
Two Drivers and Two Receivers
Low Supply Current: 300 μA (Typical)
External Capacitors: 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
Pin Compatible to Alternative High-Speed Devices
(1 Mbit/s)
– SN65C3232E (–40°C to +85°C)
– SN75C3232E (0°C to 70°C)
The device meets the requirements of TIA/EIA-232-F
and provides the electrical interface between an
asynchronous communication controller and the
serial-port connector. The charge pump and four
small external capacitors allow operation from a
single 3-V to 5.5-V supply. The devices operate at
data signaling rates up to 250 kbit/s and a maximum
of 30-V/μs driver output slew rate.
Device Information(1)
PART NUMBER
BODY SIZE (NOM)
SOIC (16)
9.90 mm × 3.91 mm
MAX3232ExDB
SSOP (16)
6.20 mm × 5.30 mm
MAX3232ExDW
SOIC (16)
10.30 mm × 7.50 mm
MAX3232ExPW
TSSOP (16)
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
•
•
PACKAGE
MAX3232ExD
Battery-Powered Systems
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
Simplified Diagram
3.3 V, 5 V
POWER
2
DIN
2
TX
RS232
2
ROUT
DOUT
RX
2
RIN
RS232
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MAX3232E
SLLS664D – AUGUST 2005 – REVISED MAY 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
4
4
4
5
5
5
5
6
6
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics — Device .........................
Electrical Characteristics — Driver ..........................
Electrical Characteristics — Receiver ......................
Switching Characteristics .........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 7
Detailed Description .............................................. 8
8.1
8.2
8.3
8.4
9
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
8
9
Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application .................................................. 10
10 Power Supply Recommendations ..................... 12
11 Layout................................................................... 12
11.1 Layout Guidelines ................................................. 12
11.2 Layout Example .................................................... 12
12 Device and Documentation Support ................. 13
12.1
12.2
12.3
12.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
13
13
13
13
13 Mechanical, Packaging, and Orderable
Information ........................................................... 13
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (June 2015) to Revision D
•
Changed 3 V ± 5.5 V to 3 V to 5.5 V in the VCC column of Table 3 ..................................................................................... 10
Changes from Revision B (December 2013) to Revision C
•
Page
Page
Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description
section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations
section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable
Information section ................................................................................................................................................................ 1
Changes from Revision A (April 2007) to Revision B
Page
•
Updated document to new TI data sheet format. ................................................................................................................... 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
Added Thermal Information table. .......................................................................................................................................... 5
2
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SLLS664D – AUGUST 2005 – REVISED MAY 2017
5 Pin Configuration and Functions
D, DW, DB and PW Package
16-Pin SOIC, SSOP and TSSOP
Top View
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
C1+
1
—
Positive lead of C1 capacitor
V+
2
O
Positive charge pump output for storage capacitor only
C1–
3
—
Negative lead of C1 capacitor
C2+
4
—
Positive lead of C2 capacitor
C2–
5
—
Negative lead of C2 capacitor
V–
6
O
Negative charge pump output for storage capacitor only
DOUT2
7
O
RS232 line data output (to remote RS232 system)
RIN2
8
I
RS232 line data input (from remote RS232 system)
ROUT2
9
O
Logic data output (to UART)
DIN2
10
I
Logic data input (from UART)
DIN1
11
I
Logic data input (from UART)
ROUT1
12
O
Logic data output (to UART)
RIN1
13
I
RS232 line data input (from remote RS232 system)
DOUT1
14
O
RS232 line data output (to remote RS232 system)
GND
15
—
Ground
VCC
16
—
Supply Voltage, Connect to external 3-V to 5.5-V power supply
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage (2)
VCC
(2)
V+
Positive output supply voltage
V–
Negative output supply voltage (2)
V+ – V–
Supply voltage difference (2)
VI
Input voltage
VO
Output voltage
TJ
Operating virtual junction temperature
Tstg
Storage temperature
(1)
(2)
MIN
MAX
UNIT
–0.3
6
V
–0.3
7
V
0.3
–7
V
13
V
Drivers
–0.3
6
V
Receivers
–25
25
V
Drivers
–13.2
13.2
V
Receivers
–0.3
VCC + 0.3
V
150
°C
150
°C
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
6.2 ESD Ratings
VALUE
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001 (1)
V(ESD)
(1)
(2)
Electrostatic discharge
All pins except RIN and
DOUT
UNIT
±2000
RIN and DOUT Pins
±15,000
Charged-device model (CDM), per JEDEC
All pins
specification JESD22-C101 (2)
±1500
V
IEC61000-4-2, Contact Discharge
RS232 port pins
(RIN, DOUT)
±8000
IEC61000-4-2, Air-Gap Discharge
RS232 port pins
(RIN, DOUT)
±15,000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions (1)
See Figure 7.
VCC = 3.3 V
Supply voltage
VCC = 5 V
3.6
4.5
5
5.5
UNIT
V
5.5
5.5
DIN
0
0.8
V
RIN
–25
25
V
0
70
–40
85
DIN
VIL
Driver low-level input voltage
VI
Receiver input voltage
TA
Operating free-air temperature
4
MAX
3.3
2
Driver high-level input voltage
(1)
NOM
3
2.4
VIH
VCC = 3.3 V
MIN
VCC = 5 V
MAX3232EC
MAX3232EI
V
°C
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
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6.4 Thermal Information
MAX3232E
THERMAL METRIC (1)
PW (TSSOP)
D (SOIC)
DW (SOIC)
DB (SSOP)
16 PINS
16 PINS
16 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
99.3
76.1
72.3
90.9
°C/W
RθJCtop
Junction-to-case (top) thermal resistance
20.8
36.7
33.5
36.2
°C/W
RθJB
Junction-to-board thermal resistance
45.1
33.6
37.1
43.8
°C/W
ψJT
Junction-to-top characterization parameter
0.6
4.2
7.5
4.2
°C/W
ψJB
Junction-to-board characterization parameter
45.1
33.3
37.1
42.9
°C/W
RθJCbot
Junction-to-case (bottom) thermal resistance
–
–
–
–
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics — Device (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7).
PARAMETER
ICC
(1)
(2)
MIN TYP (2) MAX
TEST CONDITIONS
Supply current
No load, VCC = 3.3 V or 5 V
0.3
UNIT
1
mA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.6 Electrical Characteristics — Driver (1)
over operating free-air temperature range (unless otherwise noted) (see Figure 7).
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at GND
IOS (3)
Short-circuit output current
rO
Output resistance
(1)
(2)
(3)
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
VCC, V+, and V– = 0 V,
VO = ±2 V
300
MAX
UNIT
V
V
±0.01
±1
μA
±0.01
±1
μA
±35
±60
mA
Ω
10M
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.7 Electrical Characteristics — Receiver (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7).
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
VIT+
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
ri
Input resistance
(1)
(2)
MIN
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
UNIT
V
0.4
VCC = 3.3 V
1.5
2.4
VCC = 5 V
1.8
2.4
VCC = 3.3 V
0.6
1.2
VCC = 5 V
0.8
1.5
3
5
V
V
0.3
VI = ±3 V to ±25 V
V
V
7
kΩ
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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6.8 Switching Characteristics (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7)
PARAMETER
MIN TYP (2)
TEST CONDITIONS
Maximum data rate
RL = 3 kΩ,
One DOUT switching,
CL = 1000 pF,
see Figure 3
tsk(p)
Driver pulse skew (3)
RL = 3 kΩ to 7 kΩ,
see Figure 4
CL = 150 pF to 2500 pF,
SR(tr)
Driver slew rate, transition
region
(see Figure 3)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
tPLH
Receiver propagation delay
time, low- to high-level output
tPHL
Receiver propagation delay
time, high- to low-level output
tsk(p)
Receiver pulse skew (3)
(1)
(2)
(3)
150
MAX
250
kbit/s
300
ns
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
CL = 150 pF,
see Figure 5
UNIT
V/μs
300
ns
300
ns
300
ns
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
6.9 Typical Characteristics
6
0
5
±1
DOUT Voltage (V)
DOUT Voltage (V)
VCC = 3.3 V
4
3
2
1
±2
±3
±4
±5
VOH
VOL
0
±6
0
5
10
15
DOUT Current (mA)
20
25
Figure 1. DOUT VOH vs Load Current, Both Drivers Loaded
6
0
5
10
15
DOUT Current (mA)
C001
20
25
C001
Figure 2. DOUT VOL vs Load Current, Both Drivers Loaded
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7 Parameter Measurement Information
3V
Input
Generator
(see Note B)
1.5 V
RS-232
Output
50 Ω
0V
tTHL
CL
(see Note A)
RL
1.5 V
tTLH
3V
Output
−3 V
TEST CIRCUIT
SR(tr)
t
THL
6V
or t
VOH
3V
−3 V
VOL
VOLTAGE WAVEFORMS
TLH
A. CL includes probe and jig capacitance
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10
ns, tf ≤ 10 ns
Figure 3. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
1.5 V
0V
CL
(see Note A)
RL
1.5 V
Input
tPHL
tPLH
VOH
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10
ns, tf ≤ 10 ns
Figure 4. Driver Pulse Skew
3V
Input
Generator
(see Note B)
1.5 V
1.5 V
−3 V
Output
50 Ω
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns
Figure 5. Receiver Propagation Delay Times
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8 Detailed Description
8.1 Overview
The MAX3232E device consists of two line drivers, two-line receivers, and a dual charge-pump circuit with
IEC61000-4-2 ESD protection terminal to terminal (serial-port connection terminals, including GND). The device
meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous
communication controller and the serial-port connector. The charge pump and four small external capacitors
allow operation from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s
and a maximum of 30-V/μs driver output slew rate. Outputs are protected against shorts to ground.
8.2 Functional Block Diagram
3.3 V, 5 V
POWER
2
DIN
2
TX
RS232
2
ROUT
DOUT
RX
2
RIN
RS232
8.3 Feature Description
8.3.1 Power
The power block increases, inverts, and regulates voltage at V+ and V– pins using a charge pump that requires
four external capacitors.
8.3.2 RS232 Driver
Two drivers interface standard logic level to RS232 levels. Both DIN inputs must be valid high or low.
8.3.3 RS232 Receiver
Two receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT.
Each RIN input includes an internal standard RS232 load.
8
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8.4 Device Functional Modes
Table 1 and Table 2 list the functional modes of the drivers and receivers of MAX3232E.
Table 1. Each Driver (1)
(1)
INPUT
DIN
OUTPUT
DOUT
L
H
H
L
H = high level, L = low level
Table 2. Each Receiver (1)
(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
H = high level, L = low level,
Open = input disconnected or connected driver off
11
14
DIN1
DOUT1
10
7
DIN2
DOUT2
12
13
ROUT1
RIN1
9
8
ROUT2
RIN2
Figure 6. Logic Diagram
8.4.1 VCC Powered by 3 V to 5.5 V
The device is in normal operation.
8.4.2 VCC Unpowered, VCC = 0 V
When MAX3232E is unpowered, it can be safely connected to an active remote RS232 device.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
For proper operation, add capacitors as shown in Table 3.
9.2 Typical Application
ROUT and DIN connect to UART or general-purpose logic lines. RIN and DOUT lines connect to a RS232
connector or cable.
1
16
+ CBYPASS
− = 0.1µF
+
C1
VCC
C1+
2
(1) +
−
C3
V+
GND
15
−
3
4
14
DOUT1
C1−
13
+
C2
RIN1
C2+
5 kΩ
−
5 C2−
12
6
C4
−
V−
ROUT1
11
DIN1
+
DOUT2
RIN2
7
10
8
9
DIN2
ROUT2
5 kΩ
(1)
C3 can be connected to VCC or GND
Notes: A. Resistor values shown are nominal.
B. Nonpolorized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they
should be connected as shown.
Figure 7. Typical Operating Circuit and Capacitor Values
Table 3. VCC vs Capacitor Values
10
VCC
C1
C2, C3, C4
3.3 V ± 0.3 V
0.1 µF
0.1 µF
5 V ± 0.5 V
0.047 µF
0.33 µF
3 V to 5.5 V
0.1 µF
0.47 µF
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9.2.1 Design Requirements
The recommended VCC is 3.3 V or 5 V. 3 V to 5.5 V is also possible
The maximum recommended bit rate is 250 kbit/s.
9.2.2 Detailed Design Procedure
All DIN inputs must be connected to valid low or high logic levels.
Select capacitor values based on VCC level for best performance.
9.2.3 Application Curve
Voltage (V)
Figure 8 curves are for 3.3-V VCC and 250-kbit/s alternative bit data stream.
6
5
4
3
2
1
0
±1
±2
±3
±4
±5
±6
±7
±8
±9
DIN
DOUT to RIN
ROUT
0
1
2
3
4
5
6
7
Time ( s)
8
9
10
C001
Figure 8. 250 kbit/s Driver to Receiver Loopback Timing Waveform,
VCC= 3.3 V
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10 Power Supply Recommendations
The supply voltage, VCC, should be between 3 V and 5.5 V. Select the values of the charge-pump capacitors
using Table 3.
11 Layout
11.1 Layout Guidelines
Keep the external capacitor traces short, specifically on the C1 and C2 nodes that have the fastest rise and fall
times.
11.2 Layout Example
Ground
C3
C1
1 C1+
VCC 16
2 V+
GND 15
3 C1–
DOUT1 14
4 C2+
RIN1 13
5 C2–
ROUT1 12
VCC
0.1µF
Ground
C2
Ground
6 V–
DIN1 11
7 DOUT2
DIN2 10
C4
8 RIN2
ROUT2 9
Figure 9. Layout Diagram
12
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
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Copyright © 2005–2017, Texas Instruments Incorporated
Product Folder Links: MAX3232E
13
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX3232ECD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECDB
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP232EC
MAX3232ECDBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP232EC
MAX3232ECDBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP232EC
MAX3232ECDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECDG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECDRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECDWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3232EC
MAX3232ECPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP232EC
MAX3232ECPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP232EC
MAX3232ECPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP232EC
MAX3232EID
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3232EI
MAX3232EIDB
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIDBE4
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
24-Aug-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX3232EIDBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIDBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIDBRE4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIDE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3232EI
MAX3232EIDR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3232EI
MAX3232EIDW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3232EI
MAX3232EIDWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3232EI
MAX3232EIDWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3232EI
MAX3232EIPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
MAX3232EIPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP232EI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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