MAX3232EIDR

Order Now Product Folder Support & Community Tools & Software Technical Documents MAX3232E SLLS664D – AUGUST 2005 – REVISED MAY 2017 MAX3232E 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver With ±15-kV IEC ESD Protection 1 Features 3 Description • The MAX3232E device consists of two line drivers, two-line receivers, and a dual charge-pump circuit with ±15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). 1 • • • • • • • • ESD Protection for RS-232 Bus Pins – ±15 kV (HBM) – ±8 kV (IEC61000-4-2, Contact Discharge) – ±15 kV (IEC61000-4-2, Air-Gap Discharge) Meets or Exceeds the Requirements of TIA/EIA232-F and ITU V.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates up to 250 kbit/s Two Drivers and Two Receivers Low Supply Current: 300 μA (Typical) External Capacitors: 4 × 0.1 μF Accepts 5-V Logic Input With 3.3-V Supply Pin Compatible to Alternative High-Speed Devices (1 Mbit/s) – SN65C3232E (–40°C to +85°C) – SN75C3232E (0°C to 70°C) The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. Device Information(1) PART NUMBER BODY SIZE (NOM) SOIC (16) 9.90 mm × 3.91 mm MAX3232ExDB SSOP (16) 6.20 mm × 5.30 mm MAX3232ExDW SOIC (16) 10.30 mm × 7.50 mm MAX3232ExPW TSSOP (16) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications • • • • • PACKAGE MAX3232ExD Battery-Powered Systems Notebooks Laptops Palmtop PCs Hand-Held Equipment Simplified Diagram 3.3 V, 5 V POWER 2 DIN 2 TX RS232 2 ROUT DOUT RX 2 RIN RS232 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. MAX3232E SLLS664D – AUGUST 2005 – REVISED MAY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 4 4 4 5 5 5 5 6 6 Absolute Maximum Ratings ..................................... ESD Ratings ............................................................ Recommended Operating Conditions ...................... Thermal Information .................................................. Electrical Characteristics — Device ......................... Electrical Characteristics — Driver .......................... Electrical Characteristics — Receiver ...................... Switching Characteristics ......................................... Typical Characteristics .............................................. Parameter Measurement Information .................. 7 Detailed Description .............................................. 8 8.1 8.2 8.3 8.4 9 Overview ................................................................... Functional Block Diagram ......................................... Feature Description................................................... Device Functional Modes.......................................... 8 8 8 9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application .................................................. 10 10 Power Supply Recommendations ..................... 12 11 Layout................................................................... 12 11.1 Layout Guidelines ................................................. 12 11.2 Layout Example .................................................... 12 12 Device and Documentation Support ................. 13 12.1 12.2 12.3 12.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 13 13 13 13 13 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (June 2015) to Revision D • Changed 3 V ± 5.5 V to 3 V to 5.5 V in the VCC column of Table 3 ..................................................................................... 10 Changes from Revision B (December 2013) to Revision C • Page Page Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................................................................................ 1 Changes from Revision A (April 2007) to Revision B Page • Updated document to new TI data sheet format. ................................................................................................................... 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 • Added Thermal Information table. .......................................................................................................................................... 5 2 Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664D – AUGUST 2005 – REVISED MAY 2017 5 Pin Configuration and Functions D, DW, DB and PW Package 16-Pin SOIC, SSOP and TSSOP Top View C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 Pin Functions PIN NAME NO. I/O DESCRIPTION C1+ 1 — Positive lead of C1 capacitor V+ 2 O Positive charge pump output for storage capacitor only C1– 3 — Negative lead of C1 capacitor C2+ 4 — Positive lead of C2 capacitor C2– 5 — Negative lead of C2 capacitor V– 6 O Negative charge pump output for storage capacitor only DOUT2 7 O RS232 line data output (to remote RS232 system) RIN2 8 I RS232 line data input (from remote RS232 system) ROUT2 9 O Logic data output (to UART) DIN2 10 I Logic data input (from UART) DIN1 11 I Logic data input (from UART) ROUT1 12 O Logic data output (to UART) RIN1 13 I RS232 line data input (from remote RS232 system) DOUT1 14 O RS232 line data output (to remote RS232 system) GND 15 — Ground VCC 16 — Supply Voltage, Connect to external 3-V to 5.5-V power supply Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E 3 MAX3232E SLLS664D – AUGUST 2005 – REVISED MAY 2017 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage (2) VCC (2) V+ Positive output supply voltage V– Negative output supply voltage (2) V+ – V– Supply voltage difference (2) VI Input voltage VO Output voltage TJ Operating virtual junction temperature Tstg Storage temperature (1) (2) MIN MAX UNIT –0.3 6 V –0.3 7 V 0.3 –7 V 13 V Drivers –0.3 6 V Receivers –25 25 V Drivers –13.2 13.2 V Receivers –0.3 VCC + 0.3 V 150 °C 150 °C –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. 6.2 ESD Ratings VALUE Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) V(ESD) (1) (2) Electrostatic discharge All pins except RIN and DOUT UNIT ±2000 RIN and DOUT Pins ±15,000 Charged-device model (CDM), per JEDEC All pins specification JESD22-C101 (2) ±1500 V IEC61000-4-2, Contact Discharge RS232 port pins (RIN, DOUT) ±8000 IEC61000-4-2, Air-Gap Discharge RS232 port pins (RIN, DOUT) ±15,000 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions (1) See Figure 7. VCC = 3.3 V Supply voltage VCC = 5 V 3.6 4.5 5 5.5 UNIT V 5.5 5.5 DIN 0 0.8 V RIN –25 25 V 0 70 –40 85 DIN VIL Driver low-level input voltage VI Receiver input voltage TA Operating free-air temperature 4 MAX 3.3 2 Driver high-level input voltage (1) NOM 3 2.4 VIH VCC = 3.3 V MIN VCC = 5 V MAX3232EC MAX3232EI V °C Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664D – AUGUST 2005 – REVISED MAY 2017 6.4 Thermal Information MAX3232E THERMAL METRIC (1) PW (TSSOP) D (SOIC) DW (SOIC) DB (SSOP) 16 PINS 16 PINS 16 PINS 16 PINS UNIT RθJA Junction-to-ambient thermal resistance 99.3 76.1 72.3 90.9 °C/W RθJCtop Junction-to-case (top) thermal resistance 20.8 36.7 33.5 36.2 °C/W RθJB Junction-to-board thermal resistance 45.1 33.6 37.1 43.8 °C/W ψJT Junction-to-top characterization parameter 0.6 4.2 7.5 4.2 °C/W ψJB Junction-to-board characterization parameter 45.1 33.3 37.1 42.9 °C/W RθJCbot Junction-to-case (bottom) thermal resistance – – – – °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics — Device (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7). PARAMETER ICC (1) (2) MIN TYP (2) MAX TEST CONDITIONS Supply current No load, VCC = 3.3 V or 5 V 0.3 UNIT 1 mA Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 6.6 Electrical Characteristics — Driver (1) over operating free-air temperature range (unless otherwise noted) (see Figure 7). PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS (3) Short-circuit output current rO Output resistance (1) (2) (3) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = ±2 V 300 MAX UNIT V V ±0.01 ±1 μA ±0.01 ±1 μA ±35 ±60 mA Ω 10M Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 6.7 Electrical Characteristics — Receiver (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7). PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) MIN TYP (2) VCC – 0.6 VCC – 0.1 MAX UNIT V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 3 5 V V 0.3 VI = ±3 V to ±25 V V V 7 kΩ Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E 5 MAX3232E SLLS664D – AUGUST 2005 – REVISED MAY 2017 www.ti.com 6.8 Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7) PARAMETER MIN TYP (2) TEST CONDITIONS Maximum data rate RL = 3 kΩ, One DOUT switching, CL = 1000 pF, see Figure 3 tsk(p) Driver pulse skew (3) RL = 3 kΩ to 7 kΩ, see Figure 4 CL = 150 pF to 2500 pF, SR(tr) Driver slew rate, transition region (see Figure 3) RL = 3 kΩ to 7 kΩ, VCC = 3.3 V tPLH Receiver propagation delay time, low- to high-level output tPHL Receiver propagation delay time, high- to low-level output tsk(p) Receiver pulse skew (3) (1) (2) (3) 150 MAX 250 kbit/s 300 ns CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 CL = 150 pF, see Figure 5 UNIT V/μs 300 ns 300 ns 300 ns Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. 6.9 Typical Characteristics 6 0 5 ±1 DOUT Voltage (V) DOUT Voltage (V) VCC = 3.3 V 4 3 2 1 ±2 ±3 ±4 ±5 VOH VOL 0 ±6 0 5 10 15 DOUT Current (mA) 20 25 Figure 1. DOUT VOH vs Load Current, Both Drivers Loaded 6 0 5 10 15 DOUT Current (mA) C001 20 25 C001 Figure 2. DOUT VOL vs Load Current, Both Drivers Loaded Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664D – AUGUST 2005 – REVISED MAY 2017 7 Parameter Measurement Information 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω 0V tTHL CL (see Note A) RL 1.5 V tTLH 3V Output −3 V TEST CIRCUIT SR(tr) t THL 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS TLH A. CL includes probe and jig capacitance B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns Figure 3. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω 1.5 V 0V CL (see Note A) RL 1.5 V Input tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns Figure 4. Driver Pulse Skew 3V Input Generator (see Note B) 1.5 V 1.5 V −3 V Output 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns Figure 5. Receiver Propagation Delay Times Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E 7 MAX3232E SLLS664D – AUGUST 2005 – REVISED MAY 2017 www.ti.com 8 Detailed Description 8.1 Overview The MAX3232E device consists of two line drivers, two-line receivers, and a dual charge-pump circuit with IEC61000-4-2 ESD protection terminal to terminal (serial-port connection terminals, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. Outputs are protected against shorts to ground. 8.2 Functional Block Diagram 3.3 V, 5 V POWER 2 DIN 2 TX RS232 2 ROUT DOUT RX 2 RIN RS232 8.3 Feature Description 8.3.1 Power The power block increases, inverts, and regulates voltage at V+ and V– pins using a charge pump that requires four external capacitors. 8.3.2 RS232 Driver Two drivers interface standard logic level to RS232 levels. Both DIN inputs must be valid high or low. 8.3.3 RS232 Receiver Two receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT. Each RIN input includes an internal standard RS232 load. 8 Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664D – AUGUST 2005 – REVISED MAY 2017 8.4 Device Functional Modes Table 1 and Table 2 list the functional modes of the drivers and receivers of MAX3232E. Table 1. Each Driver (1) (1) INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level Table 2. Each Receiver (1) (1) INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 9 8 ROUT2 RIN2 Figure 6. Logic Diagram 8.4.1 VCC Powered by 3 V to 5.5 V The device is in normal operation. 8.4.2 VCC Unpowered, VCC = 0 V When MAX3232E is unpowered, it can be safely connected to an active remote RS232 device. Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E 9 MAX3232E SLLS664D – AUGUST 2005 – REVISED MAY 2017 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information For proper operation, add capacitors as shown in Table 3. 9.2 Typical Application ROUT and DIN connect to UART or general-purpose logic lines. RIN and DOUT lines connect to a RS232 connector or cable. 1 16 + CBYPASS − = 0.1µF + C1 VCC C1+ 2 (1) + − C3 V+ GND 15 − 3 4 14 DOUT1 C1− 13 + C2 RIN1 C2+ 5 kΩ − 5 C2− 12 6 C4 − V− ROUT1 11 DIN1 + DOUT2 RIN2 7 10 8 9 DIN2 ROUT2 5 kΩ (1) C3 can be connected to VCC or GND Notes: A. Resistor values shown are nominal. B. Nonpolorized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 7. Typical Operating Circuit and Capacitor Values Table 3. VCC vs Capacitor Values 10 VCC C1 C2, C3, C4 3.3 V ± 0.3 V 0.1 µF 0.1 µF 5 V ± 0.5 V 0.047 µF 0.33 µF 3 V to 5.5 V 0.1 µF 0.47 µF Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664D – AUGUST 2005 – REVISED MAY 2017 9.2.1 Design Requirements The recommended VCC is 3.3 V or 5 V. 3 V to 5.5 V is also possible The maximum recommended bit rate is 250 kbit/s. 9.2.2 Detailed Design Procedure All DIN inputs must be connected to valid low or high logic levels. Select capacitor values based on VCC level for best performance. 9.2.3 Application Curve Voltage (V) Figure 8 curves are for 3.3-V VCC and 250-kbit/s alternative bit data stream. 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 ±9 DIN DOUT to RIN ROUT 0 1 2 3 4 5 6 7 Time ( s) 8 9 10 C001 Figure 8. 250 kbit/s Driver to Receiver Loopback Timing Waveform, VCC= 3.3 V Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E 11 MAX3232E SLLS664D – AUGUST 2005 – REVISED MAY 2017 www.ti.com 10 Power Supply Recommendations The supply voltage, VCC, should be between 3 V and 5.5 V. Select the values of the charge-pump capacitors using Table 3. 11 Layout 11.1 Layout Guidelines Keep the external capacitor traces short, specifically on the C1 and C2 nodes that have the fastest rise and fall times. 11.2 Layout Example Ground C3 C1 1 C1+ VCC 16 2 V+ GND 15 3 C1– DOUT1 14 4 C2+ RIN1 13 5 C2– ROUT1 12 VCC 0.1µF Ground C2 Ground 6 V– DIN1 11 7 DOUT2 DIN2 10 C4 8 RIN2 ROUT2 9 Figure 9. Layout Diagram 12 Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E MAX3232E www.ti.com SLLS664D – AUGUST 2005 – REVISED MAY 2017 12 Device and Documentation Support 12.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. Submit Documentation Feedback Copyright © 2005–2017, Texas Instruments Incorporated Product Folder Links: MAX3232E 13 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MAX3232ECD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC MAX3232ECDBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC MAX3232ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC MAX3232ECDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECDWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232EC MAX3232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC MAX3232ECPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC MAX3232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP232EC MAX3232EID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI MAX3232EIDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIDBE4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 24-Aug-2018 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MAX3232EIDBG4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI MAX3232EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI MAX3232EIDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI MAX3232EIDWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI MAX3232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232EI MAX3232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI MAX3232EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP232EI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of