MAX3232IDBRG4

MAX3232 SLLS410O – JANUARY 2000 – REVISED JUNE 2021 MAX3232 3-V to 5.5-V Multichannel RS-232 Line Driver and Receiver With ±15-kV ESD Protection 1 Features 3 Description • The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection terminal to terminal (serial-port connection terminals, including GND). The device meets the requirements of TIA/EIA-232F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. • • • • • • • • RS-232 Bus-terminal esd protection exceeds ±15 kV using human-body model (HBM) Meets or exceeds the requirements of TIA/ EIA-232-F and ITU V.28 standards Operates with 3-V to 5.5-V VCC supply Operates up to 250 kbit/s Two drivers and two receivers Low supply current: 300 μA Typical External capacitors: 4 × 0.1 μF Accepts 5-V logic input with 3.3-V supply Alternative high-speed terminal-compatible devices (1 Mbit/s) – SN65C3232 (–40°C to 85°C) – SN75C3232 (0°C to 70°C) Device Information PART NUMBER 2 Applications • Industrial PCs • Wired networking • Data center and enterprise networking • Battery-powered systems • PDAs • Notebooks • Laptops • Palmtop PCs • Hand-held equipment spacer MAX3232 (1) PACKAGE(1) BODY SIZE SOIC (D) (16) 9.90 mm × 3.91 mm SSOP (DB) (16) 6.20 mm × 5.30 mm SOIC (DW) (16) 10.30 mm × 7.50 mm TSSOP (PW) (16) 5.00 mm × 4.40 mm For all available packages, see the orderable addendum at the end of the data sheet. spacer spacer 3.3 V, 5 V POWER 2 DIN 2 TX RS232 2 ROUT DOUT RX 2 RIN RS232 Simplified Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information....................................................5 6.5 Electrical Characteristics — Device............................ 5 6.6 Electrical Characteristics — Driver............................. 5 6.7 Electrical Characteristics — Receiver.........................6 6.8 Switching Characteristics............................................6 6.9 Typical Characteristics................................................ 7 7 Parameter Measurement Information............................ 8 8 Detailed Description........................................................9 8.1 Overview..................................................................... 9 8.2 Functional Block Diagram........................................... 9 8.3 Feature Description.....................................................9 8.4 Device Functional Modes..........................................10 9 Application and Implementation.................................. 11 9.1 Application Information..............................................11 9.2 Standard Application................................................. 11 10 Power Supply Recommendations..............................12 11 Layout........................................................................... 13 11.1 Layout Guidelines................................................... 13 11.2 Layout Example...................................................... 13 12 Device and Documentation Support..........................14 12.1 Receiving Notification of Documentation Updates..14 12.2 Support Resources................................................. 14 12.3 Trademarks............................................................. 14 12.4 Electrostatic Discharge Caution..............................14 12.5 Glossary..................................................................14 13 Mechanical, Packaging, and Orderable Information.................................................................... 14 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision N (June 2017) to Revision O (June 2021) Page • Added Applications: Industrial PCs, Wired networking, and Data center and enterprise computing..................1 • Changed the thermal parameter values for D, DB and PW packages in the Thermal Information table............5 Changes from Revision M (April 2017) to Revision N (June 2017) Page • Changed the Thermal Information table ............................................................................................................ 5 Changes from Revision L (March 2017) to Revision M (April 2017) Page • Changed From: "±" To: "to" in the VCC column of Table 9-1 ............................................................................ 12 Changes from Revision K (January 2015) to Revision L (March 2017) Page • Changed pin 16 (VCC) in Typical Operating Circuit and Capacitor Values .......................................................11 Changes from Revision J (January 2014) to Revision K (January 2015) Page • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1 Changes from Revision I (January 2004) to Revision J (January 2014) Page • Updated document to new TI data sheet format - no specification changes...................................................... 1 • Deleted Ordering Information table.....................................................................................................................1 2 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 5 Pin Configuration and Functions C1+ 1 16 VCC V+ 2 15 GND C1± 3 14 DOUT1 C2+ 4 13 RIN1 C2± 5 12 ROUT1 V± 6 11 DIN1 DOUT2 7 10 DIN2 RIN2 8 9 ROUT2 Not to scale Figure 5-1. D, DB, DW, or PW Package, 16-Pin SOIC, SSOP, or TSSOP, Top View Table 5-1. Pin Functions PIN NAME NO. TYPE DESCRIPTION C1+ 1 — Positive lead of C1 capacitor V+ 2 O Positive charge pump output for storage capacitor only C1– 3 — Negative lead of C1 capacitor C2+ 4 — Positive lead of C2 capacitor C2– 5 — Negative lead of C2 capacitor V– 6 O Negative charge pump output for storage capacitor only DOUT2 7 O RS232 line data output (to remote RS232 system) DOUT1 14 O RS232 line data output (to remote RS232 system) RIN2 8 I RS232 line data input (from remote RS232 system) RIN1 13 I RS232 line data input (from remote RS232 system) ROUT2 9 O Logic data output (to UART) ROUT1 12 O Logic data output (to UART) DIN2 10 I Logic data input (from UART) Logic data input (from UART) DIN1 11 I GND 15 — Ground VCC 16 — Supply Voltage, Connect to external 3 V to 5.5 V power supply Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 3 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) Supply voltage range(2) VCC range(2) V+ Positive output supply voltage V– Negative output supply voltage range(2) V+ – V– Supply voltage Input voltage range VO Output voltage range TJ Operating virtual junction temperature Tstg Storage temperature range (2) MAX 6 V –0.3 7 V –7 0.3 V 13 V difference(2) VI (1) MIN –0.3 UNIT Drivers –0.3 6 Receivers –25 25 –13.2 13.2 –0.3 VCC + 0.3 150 °C –65 150 °C Drivers Receivers V V Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. All voltages are with respect to network GND. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 RIN , DOUT, and GND pins (1) 15000 Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 All other pins(1) 3000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions (see Typical Operating Circuit and Capacitor Values)(1) MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 VCC Supply voltage VIH Driver high-level input voltage DIN VIL Driver low-level input voltage DIN Driver input voltage DIN 0 5.5 Receiver input voltage RIN –25 25 VI TA (1) 4 VCC = 3.3 V Operating free-air temperature VCC = 5 V VCC = 3.3 V VCC = 5 V 2 MAX3232C V V 2.4 0.8 MAX3232I UNIT 0 70 –40 85 V V °C Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 6.4 Thermal Information MAX3232 THERMAL METRIC(1) SOIC (D) SSOP (DB) SOIC (DW) TSSOP (PW) UNIT 16 PINS RθJA 85.9 103.1 66.6 108.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 43.1 49.2 32.4 39.0 °C/W RθJB Junction-to-board thermal resistance 44.5 54.8 31.9 54.4 °C/W ψJT Junction-to-top characterization parameter 10.1 12 8.4 3.3 °C/W ψJB Junction-to-board characterization parameter 44.1 54.1 31.5 53.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a °C/W (1) Junction-to-ambient thermal resistance For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics — Device over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Typical Operating Circuit and Capacitor Values) PARAMETER ICC (1) (2) Supply current TEST CONDITIONS No load, MIN VCC = 3.3 V to 5 V TYP(1) MAX 0.3 1 UNIT mA All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 6.6 Electrical Characteristics — Driver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) (see Typical Operating Circuit and Capacitor Values) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 V VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 V IIH High-level input current VI = VCC ±0.01 ±1 μA IIL Low-level input current VI at GND ±0.01 ±1 μA IOS (2) Short-circuit output current ±35 ±60 mA rO Output resistance (1) (2) (3) VCC = 3.6 V VO = 0 V VCC = 5.5 V VO = 0 V VCC, V+, and V– = 0 V VO = ±2 V 300 10M Ω All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 5 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 6.7 Electrical Characteristics — Receiver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Typical Operating Circuit and Capacitor Values) PARAMETER VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) rI Input resistance (1) (2) MIN TYP(1) VCC – 0.6 VCC – 0.1 TEST CONDITIONS MAX UNIT V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 V V V 0.3 VI = ±3 V to ±25 V 3 5 V 7 kΩ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 6.8 Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(3) (see Typical Operating Circuit and Capacitor Values) PARAMETER Maximum data rate RL = 3 kΩ, CL = 1000 pF One DOUT switching, See Figure 7-1 tsk(p) Driver Pulse skew(2) RL = 3 kΩ to 7 kΩ, SR(tr) Slew rate, transition region (see Figure 7-1) RL = 3 kΩ to 7 kΩ, VCC = 5 V tPLH®) Propagation delay time, low- to highlevel output tPHL®) Propagation delay time, high- to lowlevel output tsk(p) Receiver Pulse skew(3) (1) (2) (3) 6 TEST CONDITIONS MIN TYP(1) 150 250 kbit/s 300 ns CL = 150 to 2500 pF See Figure 7-2 MAX CL = 150 to 1000 pF 6 30 CL = 150 to 2500 pF 4 30 UNIT V/μs 300 CL = 150 pF 300 ns 300 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 6.9 Typical Characteristics 6 1 VOH 0 5 ±1 VOL (V) VOH (V) 4 3 ±2 ±3 2 ±4 1 ±5 0 VOL ±6 0 5 10 15 Output Current (mA) 20 25 0 VCC = 3.3 V 5 10 15 Output Current (mA) C001 20 25 C001 VCC = 3.3 V Figure 6-1. DOUT VOH vs Load Current, Both Drivers Loaded Figure 6-2. DOUT VOL vs Load Current, Both Drivers Loaded Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 7 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 7 Parameter Measurement Information 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) tTLH 3V Output −3 V TEST CIRCUIT A. B. SR(tr) = t THL 6V or t VOH 3V −3 V VOL VOLTAGE WAVEFORMS TLH CL includes probe and jig capacitance. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 7-1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT A. B. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 7-2. Driver Pulse Skew 3V Input Generator (see Note B) 1.5 V 1.5 V −3 V Output 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT A. B. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 7-3. Receiver Propagation Delay Times 8 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 8 Detailed Description 8.1 Overview The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection terminal to terminal (serial-port connection terminals, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate. Outputs are protected against shorts to ground. 8.2 Functional Block Diagram 3.3 V, 5 V POWER 2 DIN 2 TX RS232 2 ROUT DOUT RX 2 RIN RS232 8.3 Feature Description 8.3.1 Power The power block increases, inverts, and regulates voltage at V+ and V- pins using a charge pump that requires four external capacitors. 8.3.2 RS232 Driver Two drivers interface standard logic level to RS232 levels. Both DIN inputs must be valid high or low. 8.3.3 RS232 Receiver Two receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT. Each RIN input includes an internal standard RS232 load. Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 9 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 8.4 Device Functional Modes Table 8-1. Each Driver(1) INPUT DIN (1) OUTPUT DOUT L H H L H = high level, L = low level Table 8-2. Each Receiver(1) INPUT RIN OUTPUT ROUT L (1) H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off 8.4.1 VCC powered by 3 V to 5.5 V The device will be in normal operation. 8.4.2 VCC unpowered, VCC = 0 V When MAX3232 is unpowered, it can be safely connected to an active remote RS232 device. 10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information For proper operation, add capacitors as shown in Typical Operating Circuit and Capacitor Values. 9.2 Standard Application ROUT and DIN connect to UART or general purpose logic lines. RIN and DOUT lines connect to a RS232 connector or cable. 3.3 V / 5 V 1 + C1 2 †+ C3 − − 3 4 C1+ VCC 16 C BYPASS = 0.1 μF V+ GND 14 DOUT1 C1− 13 C2+ + C2 15 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 − V− 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ A. B. † C3 can be connected to VCC or GND. Resistor values shown are nominal. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 9-1. Typical Operating Circuit and Capacitor Values Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 11 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 9.2.1 Design Requirements • • Recommended VCC is 3.3 V or 5 V. 3 V to 5.5 V is also possible Maximum recommended bit rate is 250 kbit/s. Table 9-1. VCC vs Capacitor Values VCC C1 C2, C3, C4 3.3 V ± 0.3 V 0.1 µF 0.1 µF 5 V ± 0.5 V 0.047 µF 0.33 µF 3 V to 5.5 V 0.1 µF 0.47 µF 9.2.2 Detailed Design Procedure • • All DIN, FORCEOFF and FORCEON inputs must be connected to valid low or high logic levels. Select capacitor values based on VCC level for best performance. Voltage (V) 9.2.3 Application Curves 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 ±9 DIN DOUT to RIN ROUT 0 1 2 3 4 5 6 7 Time ( s) 8 9 10 C001 VCC = 3.3 V Figure 9-2. 250 kbit/s Driver to Receiver Loopback Timing Waveform 10 Power Supply Recommendations VCC should be between 3 V and 5.5 V. Charge pump capacitors should be chosen using table in Typical Operating Circuit and Capacitor Values. 12 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 11 Layout 11.1 Layout Guidelines Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise and fall times. 11.2 Layout Example Ground C3 C1 1 C1+ VCC 16 2 V+ GND 15 3 C1– DOUT1 14 4 C2+ RIN1 13 5 C2– ROUT1 12 VCC 0.1µF Ground C2 Ground 6 V– DIN1 11 7 DOUT2 DIN2 10 C4 8 RIN2 ROUT2 9 Figure 11-1. Layout Diagram Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 13 MAX3232 www.ti.com SLLS410O – JANUARY 2000 – REVISED JUNE 2021 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 12.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser based versions of this data sheet, refer to the left hand navigation. 14 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: MAX3232 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) MAX3232CDBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C Samples MAX3232CDR ACTIVE SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 MAX3232C Samples MAX3232CDW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C Samples MAX3232CDWG4 ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C Samples MAX3232CDWR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 MAX3232C Samples MAX3232CDWRG4 ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3232C Samples MAX3232CPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM 0 to 70 MA3232C Samples MAX3232CPWRE4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C Samples MAX3232CPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3232C Samples MAX3232ID NRND SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I MAX3232IDBR ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I Samples MAX3232IDBRE4 ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I Samples MAX3232IDE4 NRND SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I MAX3232IDG4 LIFEBUY SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I MAX3232IDR LIFEBUY SOIC D 16 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 MAX3232I MAX3232IDRE4 LIFEBUY SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I MAX3232IDRG4 LIFEBUY SOIC D 16 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I MAX3232IDW ACTIVE SOIC DW 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I Samples MAX3232IDWR ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 MAX3232I Samples MAX3232IDWRE4 ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I Samples MAX3232IDWRG4 ACTIVE SOIC DW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3232I Samples MAX3232IPWR ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 MB3232I Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Oct-2022 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) MAX3232IPWRE4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I Samples MAX3232IPWRG4 ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3232I Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of