MAX3232MDBREP

MAX3232-EP www.ti.com......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION FEATURES APPLICATIONS • • 1 RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s Two Drivers and Two Receivers Low Supply Current . . . 300 µA Typical External Capacitors . . . 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device (1 Mbit/s) – SNx5C3232 • • • • • • • • Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment DB OR PW PACKAGE (TOP VIEW) C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS • • • • Controlled Baseline One Assembly/Test Site One Fabrication Site Available in Military (–55°C/125°C) Temperature Range (1) Extended Product Life Cycle Extended Product-Change Notification Product Traceability • • • (1) Additional temperature ranges are available - contact factory ORDERING INFORMATION (1) PACKAGE (2) TA –55°C to 125°C (1) (2) ORDERABLE PART NUMBER SSOP (DB) Reel of 2000 MAX3232MDBREP TSSOP(PW) Reel of 2000 MAX3232MPWREP TOP-SIDE MARKING MB3232M For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DESCRIPTION The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2009, Texas Instruments Incorporated MAX3232-EP SGLS337A – APRIL 2006 – REVISED MARCH 2009......................................................................................................................................................... www.ti.com FUNCTION TABLE EACH DRIVER EACH RECEIVER INPUT DIN OUTPUT DOUT INPUT RIN OUTPUT ROUT L H L H H L H L Open H H = high level, L = low level, Open = input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 13 12 ROUT1 RIN1 9 8 ROUT2 RIN2 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VALUE UNIT VCC Supply voltage range (1) –0.3 to 6 V V+ Positive output supply voltage range (1) –0.3 to 7 V 0.3 to –7 V 13 V –0.3 to 6 V V– Negative output supply voltage range V+ – V– Supply voltage difference (1) VI VO θJA (1) Input voltage range Drivers Receivers Output voltage range Package thermal impedance (2) Operating virtual junction temperature Tstg Storage temperature range V DB package 82 °C/W PW package 108 °C/W 150 °C –65 to 150 °C (1) and Figure 4) VCC = 3.3 V Supply voltage VCC = 5 V VIH Driver high-level input voltage DIN VIL Driver low-level input voltage DIN 2 V –0.3 to VCC + 0.3 All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. RECOMMENDED OPERATING CONDITIONS (see (1) V Receivers TJ (1) (2) –25 to 25 –13.2 to 13.2 Drivers VCC = 3.3 V VCC = 5 V MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 2 UNIT V V 2.4 0.8 V Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3232-EP MAX3232-EP www.ti.com......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009 RECOMMENDED OPERATING CONDITIONS (see and Figure 4) (continued) MIN VI TA Driver input voltage DIN Receiver input voltage Operating free-air temperature MAX3232M NOM MAX 0 5.5 –25 25 -55 125 UNIT V °C ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER ICC (1) (2) Supply current TEST CONDITIONS No load, VCC = 3.3 V or 5 V MIN (1) and TYP (2) MAX 0.3 2 UNIT mA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3232-EP 3 MAX3232-EP SGLS337A – APRIL 2006 – REVISED MARCH 2009......................................................................................................................................................... www.ti.com DRIVER SECTION ELECTRICAL CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS MIN TYP (2) VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC IIL Low-level input current VI at GND IOS (3) Short-circuit output current ro Output resistance (1) (2) (3) VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = ±2 V 300 (1) and MAX UNIT V V ±0.01 ±1 µA ±0.01 ±1 µA ±35 ±60 mA Ω 10M Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. SWITCHING CHARACTERISTICS over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4) PARAMETER TEST CONDITIONS Maximum data rate CL = 1000 pF, One DOUT switching, RL = 3 kΩ, See Figure 1 tsk(p) Pulse skew (1) CL = 150 pF to 2500 pF RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see RL = 3 kΩ to 7 kΩ, Figure 1) VCC = 3.3 V (1) (2) 4 (1) and MIN TYP (2) 150 250 kbit/s 300 ns MAX CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 UNIT V/µs Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3232-EP MAX3232-EP www.ti.com......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009 RECEIVER SECTION ELECTRICAL CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted (see PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = -1 mA VOL Low-level output voltage IOL = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) ri Input resistance (1) (2) MIN VCC–0.6 TYP and Figure 4) (2) MAX UNIT VCC–0.1 V 0.4 VCC = 3.3 V 1.5 2.4 VCC = 5 V 1.8 2.4 VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 V V V 0.3 VI = ±3 V to ±25 V 3 V 5 8 kΩ Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C. SWITCHING CHARACTERISTICS (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted (see PARAMETER TEST CONDITIONS tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output tsk(p) Pulse skew (3) (1) (2) (3) MIN and Figure 3) TYP (2) CL = 150 pF MAX UNIT 300 ns 300 ns 300 ns Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ±0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. PARMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) tTLH 3V Output 3V −3 V −3 V TEST CIRCUIT SR(tr) + t THL 6V or t VOH VOL VOLTAGE WAVEFORMS TLH Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL tPLH VOH Output 50% 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3232-EP 5 MAX3232-EP SGLS337A – APRIL 2006 – REVISED MARCH 2009......................................................................................................................................................... www.ti.com PARMETER MEASUREMENT INFORMATION (continued) 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3232-EP MAX3232-EP www.ti.com......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009 APPLICATION INFORMATION 1 − 16 + CBYPASS − = 0.1µF + C1 VCC C1+ 2 C3 A+ V+ GND 15 − 3 4 14 DOUT1 C1− 13 C2+ + C2 RIN1 5 kΩ − 5 C2− 12 6 C4 − V− 11 ROUT1 DIN1 + DOUT2 RIN2 7 10 8 9 DIN2 ROUT2 5 kΩ VCC vs CAPACITOR VALUES VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF A. C3 can be connected to VCC or GND. B. Resistor values shown are nominal. C. Nonpolarized ceramic capacitros are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 4. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): MAX3232-EP 7 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) MAX3232MDBREP ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 MB3232M MAX3232MPWREP ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 MB3232M V62/06623-01XE ACTIVE SSOP DB 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 MB3232M V62/06623-01YE ACTIVE TSSOP PW 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 MB3232M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of