MAX3243E
SLLS657E – APRIL 2005 – REVISED OCTOBER 2022
MAX3243E 3-V to 5.5-V Multichannel RS-232 Line Driver/Receiver
With ±15-kV IEC ESD Protection
1 Features
3 Description
•
The MAX3243E device consists of three line drivers,
five line receivers, and a dual charge-pump circuit
with ±15-kV ESD (HBM and IEC61000-4-2, Air-Gap
Discharge) and ±8-kV ESD (IEC61000-4-2, Contact
Discharge) protection on serial-port connection
pins. The device meets the requirements of TIA/
EIA-232-F and provides the electrical interface
between an asynchronous communication controller
and the serial-port connector. This combination of
drivers and receivers matches that needed for
the typical serial port used in an IBM PC/AT, or
compatible. The charge pump and four small external
capacitors allow operation from a single 3-V to 5.5V supply. In addition, the device includes an alwaysactive noninverting output (ROUT2B), which allows
applications using the ring indicator to transmit data
while the device is powered down.
•
•
•
•
•
•
•
•
•
•
•
•
Single-chip and single-supply interface
for IBM™ PC/AT™ serial port
ESD Protection for RS-232 bus pins
– ±15-kV Human-body model (HBM)
– ±8-kV IEC61000-4-2, contact discharge
– ±15-kV IEC61000-4-2, air-gap discharge
Meets or exceeds requirements of
TIA/EIA-232-F and ITU V.28 standards
Operates with 3-V to 5.5-V VCC supply
Always-active noninverting receiver
output (ROUT2B)
Designed to transmit at a data rate
up to 500 kbit/s
Low standby current: 1 μA typical
External capacitors: 4 × 0.1 μF
Accepts 5-V logic input with 3.3-V supply
Designed to Be interchangeable with
maxim MAX3243E
Serial-Mouse Driveability
Auto-powerdown feature to disable driver outputs
when no valid RS-232 signal is sensed
Package options include plastic small-outline
(DW), shrink small-outline (DB), and thin shrink
small-outline (PW) packages
2 Applications
•
•
•
•
•
•
•
•
Battery powered systems
Wired Networking
Data center and enterprise computing
Battery-powered systems
Notebooks
Laptops
Palmtop PCs
Hand-held equipment
Package Information
PACKAGE(1)
PART NUMBER
MAX3243E
(1)
BODY SIZE (NOM)
SSOP (DB) (28)
10,20 mm × 5,30 mm
SOIC (DW) (28)
17,90 mm × 7,50 mm
TSSOP (PW) (28)
9,70 mm × 4,40 mm
VQFN (RHB) (32)
5,00 mm × 5,00 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
3.3 V, 5 V
POWER
FORCEOFF
AUTOPOWERDOWN
FORCEON
3
DIN
3
DOUTx
RS-232
TX
5
5
ROUT
RX
RIN
RS-232
ROUT2B
RX
RIN2
RS-232
STATUS
INVALID
Simplified Circuit
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MAX3243E
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Description (continued).................................................. 2
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 6
7.1 Absolute Maximum Ratings........................................ 6
7.2 ESD Ratings............................................................... 6
7.3 ESD Ratings - IEC Specifications............................... 6
7.4 Recommended Operating Conditions.........................6
7.5 Thermal Information....................................................7
7.6 Electrical Characteristics.............................................7
7.7 Driver Electrical Characteristics.................................. 8
7.8 Receiver, Electrical Characteristics.............................8
7.9 Auto-Powerdown Electrical Characteristics................ 8
7.10 Driver Switching Characteristics............................... 9
7.11 Receiver Switching Characteristics...........................9
7.12 Auto-Powerdown Switching Characteristics............. 9
8 Parameter Measurement Information.......................... 10
9 Detailed Description......................................................12
9.1 Overview................................................................... 12
9.2 Functional Block Diagram......................................... 12
9.3 Feature Description...................................................13
9.4 Device Functional Modes..........................................13
10 Application and Implementation................................ 14
10.1 Application Information........................................... 14
10.2 Typical Application.................................................. 14
10.3 Power Supply Recommendations...........................17
10.4 Layout..................................................................... 17
11 Mechanical, Packaging, and Orderable
Information.................................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (September 2011) to Revision E (October 2022)
Page
• Added Device Information table, ESD Ratings, ESD Ratings - IEC Specifications, Thermal Information,
Detailed Description, Power Supply Recommendations, Layout, Device and Documentation Support
Mechanical, Packaging, and Orderable Information ..........................................................................................1
• Deleted Ordering Information table.....................................................................................................................1
• Changed From: 250 kbit/s To: 500 kbit/s in the Description .............................................................................. 1
• Changed the ICC Supply current auto-powerdown disabled MAX value from 1 mA to 1.2 mA in the Electrical
Characteristics ................................................................................................................................................... 7
Changes from Revision C (February 2009) to Revision D (September 2011)
Page
• Deleted "VALID RIN RS-232 LEVEL" from INPUTS.........................................................................................13
• Deleted "ROUT2B is active" RECEIVER STATUS and combined ROUT outputs............................................13
• Added table "Outputs ROUT2B and INVALID" defining truth for ROUT2B and INVALID outputs. .................. 13
5 Description (continued)
The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate.
The MAX3243EC device is characterized for operation from 0°C to 70°C. The MAX3243EI device is
characterized for operation from –40°C to 85°C.
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NC
V-
C2-
C2+
C1+
V+
V
CC
NC
32
31
30
29
28
27
26
25
6 Pin Configuration and Functions
6
19
ROUT2B
DOUT2
7
18
ROUT1
DOUT3
8
17
ROUT2
16
DOUT1
NC
INVALID
15
20
ROUT3
5
14
RIN5
13
FORCEOFF
ROUT4
21
ROUT5
4
12
FORCEON
RIN4
11
22
DIN2
3
DIN1
C1-
RIN3
9
GND
23
10
24
2
NC
1
RIN2
DIN3
RIN1
Not to scale
Figure 6-1. RHB Package, 32 Pin (VQFN), Top View
Table 6-1. Pin Functions
PIN
NO.
NAME
1
RIN1
2
RIN2
3
RIN3
4
RIN4
5
RIN5
6
DOUT1
7
DOUT2
8
DOUT3
9
NC
10
DIN3
11
DIN2
12
DIN1
13
ROUT5
14
ROUT4
15
ROUT3
16
NC
17
ROUT2
18
ROUT1
19
20
TYPE
DESCRIPTION
I
RS-232 receiver inputs
O
RS-232 driver outputs
—
Not connected internally
I
Driver inputs
O
Receiver outputs
—
Not connected internally
O
Receiver outputs
ROUT2B
O
Always-active noninverting receiver output
INVALID
O
Invalid Output Pin
21
FORCEOFF
I
Auto Powerdown Control input (Refer to Truth Table)
22
FORCEON
I
Auto Powerdown Control input (Refer to Truth Table)
23
C1-
—
Negative terminal of the voltage-doubler charge-pump capacitor
24
GND
—
Ground
25
NC
—
Not connected internally
26
VCC
—
3-V to 5.5-V supply voltage
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Table 6-1. Pin Functions (continued)
PIN
NO.
4
NAME
TYPE
DESCRIPTION
27
V+
—
28
C1+
—
Positive charge pump output voltage
29
C2+
—
30
C2-
—
Negative terminal of the voltage-doubler charge-pump capacitor
31
V-
—
Negative charge pump output voltage
32
NC
—
Not connected internally
Positive terminals of the voltage-doubler charge-pump capacitors
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C2+
1
28
C1+
C2-
2
27
V+
V-
3
26
V
CC
RIN1
4
25
GND
RIN2
5
24
C1-
RIN3
6
23
FORCEON
RIN4
7
22
FORCEOFF
RIN5
8
21
INVALID
DOUT1
9
20
ROUT2B
DOUT2
10
19
ROUT1
DOUT3
11
18
ROUT2
DIN3
12
17
ROUT3
DIN2
13
16
ROUT4
DIN1
14
15
ROUT5
Not to scale
Figure 6-2. DB, DW, or PW Package, 28 Pin (SSOP, SOIC, TSSOP), Top View
Table 6-2. Pin Functions
PIN
NO.
NAME
TYPE
DESCRIPTION
1
C2+
—
Positive terminal of the voltage-doubler charge-pump capacitor
2
C2-
—
Negative terminal of the voltage-doubler charge-pump capacitor
3
V-
4
RIN1
5
RIN2
6
RIN3
7
RIN4
8
RIN5
9
DOUT1
10
DOUT2
Negative charge pump output voltage
I
RS-232 receiver inputs
O
RS-232 driver outputs
I
Driver inputs
O
Receiver outputs
11
DOUT3
12
DIN3
13
DIN2
14
DIN1
15
ROUT5
16
ROUT4
17
ROUT3
18
ROUT2
19
ROUT1
20
ROUT2B
—
Always-active noninverting receiver output;
21
INVALID
O
Invalid Output Pin
22
FORCEOFF
I
Auto Powerdown Control input (Refer to Truth Table)
23
FORCEON
I
Auto Powerdown Control input (Refer to Truth Table)
24
C1-
—
Negative terminal of the voltage-doubler charge-pump capacitor
25
GND
—
Ground
26
VCC
—
3-V to 5.5-V supply voltage
27
V+
—
Positive charge pump output voltage
28
C1+
—
Positive terminal of the voltage-doubler charge-pump capacitor
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Supply voltage range(2)
VCC
range(2)
V+
Positive output supply voltage
V–
Negative output supply voltage range(2)
V+ – V–
Output supply voltage
Input voltage range
VO
Output voltage range
Tstg
Storage temperature range
(2)
MAX
6
V
–0.3
7
V
0.3
–7
V
13
V
difference(2)
VI
(1)
MIN
–0.3
Driver ( FORCEOFF, FORCEON)
–0.3
6
Receiver
–25
25
–13.2
13.2
–0.3
VCC + 0.3
–65
150
Driver
Receiver ( INVALID)
UNIT
V
V
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
7.2 ESD Ratings
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
DOUT1/2/3, RIN1/2/3/4/5 pins(1)
VALUE
UNIT
±15,000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 ESD Ratings - IEC Specifications
VALUE
V (ESD)
(1)
Electrostatic
discharge
IEC 61000-4-2 Contact Discharge
(1)
IEC 61000-4-2 Air-gap Discharge (1)
RIN1, RIN2, RIN3, RIN4, RIN5, DOUT1,
DOUT2 and DOUT3 pins
UNIT
±8,000
V
±15,000
For DB, PW and RHB package only: A minimum of 1-µF capacitor between VCC and GND is required to meet the specified IEC
61000-4-2 rating.
7.4 Recommended Operating Conditions
See Figure 10-1 (1)
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON
VIL
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON
VI
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
VCC = 3.3 V
VCC = 5 V
MIN
NOM
3
3.3
3.6
4.5
5
5.5
2
MAX3243EC
0.8
V
0
5.5
V
–25
25
V
0
70
–40
85
Operating free-air temperature
(1)
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
MAX3243EI
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V
2.4
TA
6
MAX UNIT
°C
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7.5 Thermal Information
THERMAL METRIC(1)
{DB} (SSOP)
{DW} (SOIC)
28 PINS
28 PINS
{PW} (TSSOP) {RHB} (VQFN)
28 PINS
32 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
76.1
59.0
70.3
34.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
35.8
28.8
21.0
25.9
°C/W
RθJB
Junction-to-board thermal resistance
37.4
30.3
29.2
14.6
°C/W
ψJT
Junction-to-top characterization parameter
7.4
7.8
1.3
0.5
°C/W
ψJB
Junction-to-board characterization parameter
37.0
30.0
28.8
14.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
N/A
5.1
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.6 Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 10-1)
PARAMETER
II
ICC
(1)
(2)
Input leakage current
Supply current
(TA = 25°C)
TEST CONDITIONS
FORCEOFF, FORCEON
MIN
TYP(2) MAX
UNIT
±0.01
±1
μA
Auto-powerdown disabled
No load,
FORCEOFF and FORCEON at VCC
For DB, PW and RHB package
0.3
1.2
mA
Auto-powerdown disabled
No load,
FORCEOFF and FORCEON at VCC
For DW package
0.3
1
mA
Powered off
No load, FORCEOFF at GND
1
10
Auto-powerdown enabled
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded,
All DIN are grounded
1
10
μA
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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7.7 Driver Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 10-1)
PARAMETER
TEST CONDITIONS
MIN
TYP(2) MAX
UNIT
VOH
High-level output voltage
All DOUT at RL = 3 kΩ to GND
5
5.4
V
VOL
Low-level output voltage
All DOUT at RL = 3 kΩ to GND
–5
–5.4
V
VO
Output voltage
(mouse driveability)
DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3,
DOUT1 = DOUT2 = 2.5 mA
±5
IIH
High-level input current
VI = VCC
±0.01
±1
μA
IIL
Low-level input current
VI at GND
±0.01
±1
μA
Vhys
Input hysteresis
±1
V
IOS
Short-circuit output current(3)
±60
mA
±25
μA
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
Ioff
Output leakage current
FORCEOFF = GND,
VO = ±12 V,
(1)
(2)
(3)
300
V
10M
VCC = 0 to 5.5 V
Ω
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
7.8 Receiver, Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 10-1)
PARAMETER
TEST CONDITIONS
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOH = 1.6 mA
TYP(2)
VCC – 0.6
VCC – 0.1
MAX
0.4
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT– )
Ioff
Output leakage current (except ROUT2B)
FORCEOFF = 0 V
ri
Input resistance
VI = ±3 V or ±25 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
V
V
V
0.5
3
UNIT
V
VCC = 3.3 V
VIT+
(1)
(2)
MIN
V
±0.05
±10
μA
5
7
kΩ
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
7.9 Auto-Powerdown Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 8-5)
PARAMETER
8
TEST CONDITIONS
MIN
VIT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VIT–(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = -1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
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MAX
2.7
UNIT
V
V
0.3
VCC – 0.6
V
V
0.4
V
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7.10 Driver Switching Characteristics
switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted)(1) (see Figure 10-1)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ
See Figure 8-1
tsk(p)
Pulse skew(3)
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ,
See Figure 8-2
SR(tr)
Slew rate, transition region
(see Figure 8-1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ,
PRR = 250 kbit/s
(1)
(2)
(3)
MIN
TYP(2)
250
500
kbit/s
100
ns
MAX
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
UNIT
V/μs
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V + 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
7.11 Receiver Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
tPLH
Propagation delay time, low- to high-level output
tPHL
Propagation delay time, high- to low-level output
ten
Output enable time
tdis
Output disable time
tsk(p)
(1)
(2)
(3)
Puse
TYP(2)
TEST CONDITIONS
CL = 150 pF, See Figure 8-3
CL = 150 pF, RL = 3 kΩ,
See Figure 8-4
skew(3)
See Figure 8-3
UNIT
150
ns
150
ns
200
ns
200
ns
50
ns
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH - tPHL| of each channel of the same device.
7.12 Auto-Powerdown Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 8-5)
PARAMETER
TEST CONDITIONS
tvalid
Propagation delay time, low- to high-level output
VCC = 5 V
tinvalid
Propagation delay time, high- to low-level output
ten
Supply enable time
(1)
TYP(1)
UNIT
1
μs
VCC = 5 V
30
μs
VCC = 5 V
100
μs
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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8 Parameter Measurement Information
3V
Input
RS-232
Output
Gen erator
(see No te B)
50 Ÿ
RL
0V
3V
FORCE OFF
Output
3V
3V
-3V
-3V
SR(tr)
TEST CIRCUIT
A.
B.
tTLH
tTHL
CL
(see No te A)
6V
VOH
VOL
VOL TA GE
WAVEFORMS
tTHL or tTLH
CL includes probe and jig capacitance
The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50 % duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 8-1. Driver Slew Rate
3V
RS-232
Output
Gen erator
(see No te B)
50 Ÿ
RL
Input
1.5 V
1.5 V
0V
tPLH
tPHL
CL
(see No te A)
VOH
3V
FORCE OFF
Output
VOL
VOL TA GE
WAVEFORMS
TEST CIRCUIT
A.
B.
50%
50%
CL includes probe and jig capacitance
The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50 % duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 8-2. Driver Pulse Skew
3 V or 0 V
FORCE ON
3V
Output
Gen erator
(see No te B)
50 Ÿ
RL
Input
1.5 V
1.5 V
0V
tPHL
CL
(see No te A)
tPLH
VOH
3V
FORCE OFF
Output
50%
VOL
VOL TA GE
WAVEFORMS
TEST CIRCUIT
A.
B.
50%
CL includes probe and jig capacitance
The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50 % duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 8-3. Receiver Propagation Delay Times
10
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VCC
3 V or 0 V
FORCE ON
GND
3V
S1
1.5 V
Input
1.5 V
RL
-3 V
Output
CL
(see No te A)
FORCE OFF
Gen erator
(see No te B)
50 Ÿ
tPZH
(S1 at G ND)
tPHZ
(S1 at G ND)
VOH
Output
50%
0.3 V
tPLZ
(S1 at V CC )
Output
tPZL
(S1 at V CC )
0.3 V
50%
VOL
VOL TA GE
WAVEFORMS
TEST CIRCUIT
A.
B.
C.
D.
CL includes probe and jig capacitance
The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50 % duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 8-4. Receiver Enable and Disable Times
Gen erator
(see No te B)
2.7 V
2.7 V
ROUT
Receiver
Input
50 Ÿ
3V
0V
0V
2.7 V
-2.7 V
3V
tin vali d
tval id
VCC
AutoPowerDown
INV ALID
50% VCC
INV ALID
Output
0V
ten
CL = 30 pF
(see No te A)
0.3 V
FORCE OFF
FORCE ON
§V+
V+
Sup ply
Voltage s
VCC
0V
0.3 V
DIN
DOUT
§V-
VVOL TA GE
WAVEFORMS
TEST CIRCUIT
Vali d RS-232 Level, INV ALID High
2.7 V
Indeterminate
0.3 V
0V
If Signa l Remains Within This Reg ion
For Mo re Tha n 30 ms,INV ALID Is Low
-0.3 V
Indeterminate
-2.7 V
Vali d RS-232 Level, INV ALID High
A.
B.
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω, 50 % duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 8-5. INVALID Propagation Delay Times and Supply Enabling Time
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9 Detailed Description
9.1 Overview
The MAX3243E device consists of three line drivers, five line receivers, and a dual charge-pump circuit with
±15-kV ESD (HBM and IEC61000-4-2, Air-Gap Discharge) and ±8-kV ESD (IEC61000-4-2, Contact Discharge)
protection on serial-port connection pins. The device meets the requirements of TIA/EIA-232-F and provides the
electrical interface between an asynchronous communication controller and the serial-port connector.
The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. In
addition, the device includes an always-active noninverting output (ROUT2B), which allows applications using
the ring indicator to transmit data while the device is powered down. The device operates at data signaling rates
up to 250 kbit/s and a maximum of 30-V/μs driver output slew rate.
9.2 Functional Block Diagram
DIN1
DIN2
14
9
13
10
12
11
DOUT2
DIN3
FORCE OFF
DOUT1
DOUT3
22
23
Auto-Powerd own
21
INV ALID
FORCE ON
ROUT1
ROUT2B
ROUT2
ROUT3
19
4
20
18
5
17
6
16
7
ROUT4
ROUT5
12
RIN1
RIN2
RIN3
RIN4
15
8
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9.3 Feature Description
Flexible control options for power management are available when the serial port is inactive. The autopowerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if
the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low, both
drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 μA. Disconnecting
the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high, and should be done when driving
a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any
receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7
V or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if all receiver input
voltages are between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 8-5 for receiver input levels.
9.4 Device Functional Modes
Figure 9-1 through 9-3 show the device functional modes.
Table 9-1. Each Driver
INPUTS(1)
OUTPUT
DRIVER STATUS
DIN
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
X
X
L
X
Z
Powered off
Normal operation with
auto-powerdown disabled
DOUT
L
H
H
X
H
H
H
H
X
L
L
L
H
Yes
H
H
L
H
Yes
L
X
L
H
No
Z
Normal operation with
auto-powerdown enabled
Powered off by auto-powerdown
feature
Table 9-2. Each Receiver
INPUTS(1)
OUTPUT
RIN
(1)
FORCEON
FORCEOFF
RECEIVER STATUS
ROUT
X
X
L
Z
L
X
H
H
H
X
H
L
Open
X
H
H
Powered off
Normal operation with
auto-powerdown disabled/enabled
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
Table 9-3. Outputs ROUT2B and INVALID
INPUTS(1)
VALID RIN
RS-232 LEVEL
Yes
(1)
OUTPUTS
RIN2
FORCEON
FORCEOFF
INVALID
ROUT2B
L
X
X
H
L
Yes
H
X
X
H
H
Yes
Open
X
X
H
L
No
Open
X
X
L
L
OUTPUT STATUS
Always active
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
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10 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
10.1 Application Information
For proper operation, add capacitors as shown in Figure 10-1. Pins 12 through 23 connect to UART or general
purpose logic lines. RS-232 lines on Pins 4 through 11 connect to a connector or cable.
10.2 Typical Application
Three driver and five receiver channels are supported for full duplex transmission with hardware flow control.
The five 5-kΩ resistors are internal to the MAX3243E.
C1+
C2
+
C2+
V+
C2-
VCC
GND
C2
+
C3
+
-
C1
CBYPASS
- = 0.1 µF
C1-
RIN2
RIN3
RIN4
RIN5
DOUT1
DOUT2
4
FORCE ON
Auto-Powerd own
RIN1
RS-232 Outputs
+
V-
-
RS-232 Inputs
+
-
-
5
6
7
FORCE OFF
8
INV ALID
9
ROUT2B
ROUT1
10
5 kŸ
DOUT3 11
ROUT2
5 kŸ
DOUT4
Log ic Outputs
12
ROUT3
Log ic In puts
DOUT5
5 kŸ
13
ROUT4
DOUT6
14
5 kŸ
ROUT5
5 kŸ
A.
B.
† C3 can be connected to VCC or GND
Resistor values shown are nominal.
Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as
shown.
Figure 10-1. Typical Operating Circuit and Capacitor Values
14
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10.2.1 Design Requirements
For this design example, use the values in Table 10-1.
• VCC minimum is 3 V and maximum is 5.5 V.
• Maximum recommended bit rate is 250 kbps.
Table 10-1. VCC vs Capacitor Values
VCC
C1
C2, C3, and C4
3.3 V ± 0.3 V
0.1 µF
0.1 µF
5 V ± 0.5 V
0.047 µF
0.33 µF
3 V to 5.5 V
0.1 µF
0.47 µF
10.2.2 Detailed Design Procedure
MAX3243E has integrated charge-pump that generates positive and negative rails needed for RS-232 signal
levels. Main design requirement is that charge-pump capacitor terminals must be connected with recommended
capacitor values. Charge-pump rail voltages and device supply pin must be properly bypassed with ceramic
capacitors.
10.2.2.1 ESD Protection
TI MAX3243E devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV in all states: normal
operation, shutdown, and powered down. The MAX3243E devices are designed to continue functioning properly
after an ESD occurrence without any latchup.
The MAX3243E devices have three specified ESD limits on the driver outputs and receiver inputs, with respect
to GND:
• ±15-kV Human Body Model (HBM)
• ±15-kV IEC61000-4-2, Air-Gap Discharge (formerly IEC1000-4-2)
• ±8-kV IEC61000-4-2, Contact Discharge
10.2.2.1.1 ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
10.2.2.1.2 Human Body Model (HBM)
The Human Body Model of ESD testing is shown in Figure 10-2, while Figure 10-3 shows the current waveform
that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to
the ESD voltage of concern, and subsequently discharged into the DUT through a 1.5k-Ω resistor.
RD
1.5 k Ω
V HBM
+
−
CS
100 pF
DUT
Figure 10-2. HBM ESD Test Circuit
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1.5
1.25
VHBM = 2 kV
IDUT (A)
1
0.75
0.5
0.25
DUT = 10-V 1-WZener Diode
0
0
25
50
75
100
125
Time (ns)
150
175
200
Figure 10-3. Typical HBM Current Waveform
10.2.2.1.3 IEC61000-4-2 (Formerly Known as IEC1000-4-2)
Unlike the HBM, MM, and CDM, ESD tests that apply to component level integrated circuits, the IEC61000-4-2
is a system-level ESD testing and performance standard that pertains to the end equipment. The MAX3243E
device is designed to enable the manufacturer in meeting the highest level (Level 4) of IEC61000-4-2 ESD
protection with no further need of external ESD protection circuitry. The more stringent IEC test standard has a
higher peak current than the HBM, due to the lower series resistance in the IEC model.
Figure 10-4 shows the IEC61000-4-2 model, and Figure 10-5 shows the current waveform for the corresponding
±8-kV Contact-Discharge (Level 4) test. This waveform is applied to a probe that has been connected to the
DUT. On the other hand, the corresponding ±15-kV (Level 4) Air-Gap Discharge test involves approaching the
DUT with an already energized probe.
50−100 MΩ
330Ω
RC
High-Voltage +
DC Source −
RD
CS
150 pF
DUT
Figure 10-4. Simplified IEC61000-4-2 ESD Test Circuit
I
(30A) 100%
(V contact = 8 kV)
I Peak
90%
(16A)
(8A)
10%
t
30 ns
60 ns
tr = 0.7 ns to 1 ns
Figure 10-5. Typical Current Waveform of IEC61000-4-2 ESD Generator
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10.2.2.1.4 Machine Model
The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.
The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and
assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins.
However, after PC board assembly, the MM test is no longer as pertinent to the RS-232 pins.
10.3 Power Supply Recommendations
The VCC voltage must be connected to the same power source used for logic device connected to DIN and
ROUT pins. VCC must be between 3 V and 5.5 V.
10.4 Layout
As shown in Layout Example, charge-pump and supply voltage capacitors must be located very close to device
pins. Non-polarized ceramic capacitors are recommended. If polarized tantalum or electrolytic capacitors are
used, they should be connected as per Typical Operating Circuit and Capacitor Values.
10.4.1 Layout Example
(GND)
1
C2+
C1+ 28
2
C2-
V+ 27
3
V-
4
RIN1
5
RIN2
C1- 24
6
RIN3
FORCEON 23
7
RIN4
FORCEOFF 22
8
RIN5
INVALID 21
9
DOUT1
ROUT2B 20
10 DOUT2
ROUT1 19
11 DOUT3
ROUT2 18
12 DIN3
ROUT3 17
13 DIN2
ROUT4 16
14 DIN1
ROUT5 15
Vcc 26
GND
25
Figure 10-6. Example Layout
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Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 Trademarks
IBM™ and PC/AT™ are trademarks of International Business Machines Corporation.
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
MAX3243ECDB
LIFEBUY
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
MAX3243ECDBG4
LIFEBUY
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
MAX3243ECDBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
Samples
MAX3243ECDW
ACTIVE
SOIC
DW
28
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
Samples
MAX3243ECDWR
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3243EC
Samples
MAX3243ECPW
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
MAX3243ECPWE4
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
MAX3243ECPWR
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
Samples
MAX3243ECPWRG4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 70
MP243EC
Samples
MAX3243ECRHBR
ACTIVE
VQFN
RHB
32
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
MP243E
Samples
MAX3243EIDB
LIFEBUY
SSOP
DB
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
MAX3243EIDBR
ACTIVE
SSOP
DB
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
Samples
MAX3243EIDW
ACTIVE
SOIC
DW
28
20
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
Samples
MAX3243EIDWR
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
Samples
MAX3243EIDWRG4
ACTIVE
SOIC
DW
28
1000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3243EI
Samples
MAX3243EIPW
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIPWE4
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIPWG4
LIFEBUY
TSSOP
PW
28
50
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
MAX3243EIPWR
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
Samples
MAX3243EIPWRE4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
Samples
MAX3243EIPWRG4
ACTIVE
TSSOP
PW
28
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP243EI
Samples
MAX3243EIRHBR
ACTIVE
VQFN
RHB
32
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MR243E
Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
18-Nov-2022
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
RoHS & Green
NIPDAU
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
MAX3243EIRHBRG4
ACTIVE
VQFN
RHB
32
3000
Level-2-260C-1 YEAR
-40 to 85
MR243E
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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