MAX3243IPWR

MAX3243 SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 MAX3243 3-V to 5.5-V Multichannel RS-232 Line Driver/Receiver With ±15-kV ESD (HBM) Protection 1 Features 2 Applications • • • • • • • • • • • • • • • • • • • Operates With 3-V to 5.5-V VCC Supply Single-Chip and Single-Supply Interface for IBM™ PC/AT™ Serial Port RS-232 Bus-Pin ESD Protection of ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU V.28 Standards Three Drivers and Five Receivers Operates Up To 250 kbit/s Low Active Current: 300 μA Typical Low Standby Current: 1 μA Typical External Capacitors: 4 × 0.1 μF Accepts 5-V Logic Input With 3.3-V Supply Always-Active Noninverting Receiver Output (ROUT2B) Operating Temperature – MAX3243C: 0°C to 70°C – MAX3243I: –40°C to 85°C Serial-Mouse Driveability Auto-Powerdown Feature to Disable Driver Outputs When No Valid RS-232 Signal Is Sensed Battery-Powered Systems Tablets Notebooks Laptops Hand-Held Equipment 3 Description The MAX3243 device consists of three line drivers, five line receivers which is ideal for DE-9 DTE interface. ±15-kV ESD (HBM) protection pin to pin (serial- port connection pins, including GND). Flexible power features saves power automatically. Special outputs ROUT2B and INVALID are always enabled to allow checking for ring indicator and valid RS232 input. Device Information PART NUMBER MAX3243 (1) PACKAGE(1) BODY SIZE SSOP (28) 10.29 mm × 5.30 mm SOIC (28) 17.90 mm × 7.50 mm TSSOP (28) 9.70 mm × 4.40 mm For all available packages, see the orderable addendum at the end of the data sheet. 3.3 V, 5 V POWER FORCEON FORCEOFF DIN 3 5 ROUT INVALID TX RX 3 DOUT RS232 5 RIN RS232 STATUS Simplified Diagram An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information....................................................5 6.5 Electrical Characteristics –– Auto Power Down..........5 6.6 Electrical Characteristics –– Driver............................. 6 6.7 Electrical Characteristics –– Receiver........................ 6 6.8 Switching Characteristics –– Auto Power Down......... 6 6.9 Switching Characteristics –– Driver............................ 7 6.10 Switching Characteristics –– Receiver......................7 6.11 Typical Characteristics.............................................. 7 7 Parameter Measurement Information............................ 8 8 Detailed Description......................................................10 8.1 Overview................................................................... 10 8.2 Functional Block Diagram......................................... 10 8.3 Feature Description...................................................11 8.4 Device Functional Modes..........................................12 9 Application and Implementation.................................. 13 9.1 Application Information............................................. 13 9.2 Typical Application.................................................... 13 9.3 Power Supply Recommendations.............................14 9.4 Layout....................................................................... 14 10 Device and Documentation Support..........................16 10.1 Receiving Notification of Documentation Updates..16 10.2 Support Resources................................................. 16 10.3 Trademarks............................................................. 16 10.4 Electrostatic Discharge Caution..............................16 10.5 Glossary..................................................................16 11 Mechanical, Packaging, and Orderable Information.................................................................... 16 4 Revision History Changes from Revision O (January 2015) to Revision P (October 2022) Page • Changed the Thermal Information table............................................................................................................. 5 • Changed the MAX value of ICC Supply current auto-powerdown disabled from 1 mA to 1.2 mA in Electrical Characteristics—Auto Power Down ...................................................................................................................5 Changes from Revision N (May 2009) to Revision O (January 2015) Page • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section................... 1 • Deleted Ordering Information table.....................................................................................................................1 2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 5 Pin Configuration and Functions C2+ 1 28 C1+ C2– 2 27 V+ V– 3 26 V   CC RIN1:RIN5 4 25 GND RIN1:RIN5 5 24 C1– RIN1:RIN5 6 23 FORCEON RIN1:RIN5 7 22 FORCEOFF RIN1:RIN5 8 21 INVALID DOUT1:DOUT3 9 20 ROUT2B DOUT1:DOUT3 10 19 ROUT5:ROUT1 DOUT1:DOUT3 11 18 ROUT5:ROUT1 DIN3:DIN1 12 17 ROUT5:ROUT1 DIN3:DIN1 13 16 ROUT5:ROUT1 DIN3:DIN1 14 15 ROUT5:ROUT1 Not to scale Figure 5-1. DB, DW, or PW Package (Top View) Table 5-1. Pin Functions PIN NAME NO. TYPE DESCRIPTION C2+ 1 — Positive lead of C2 capacitor C2– 2 — Negative lead of C2 capacitor V– 3 O Negative charge pump output for storage capacitor only RIN1:RIN5 4, 5, 6, 7, 8 I RS232 line data input (from remote RS232 system) DOUT1:DOUT3 9, 10, 11 O RS232 line data output (to remote RS232 system) DIN3:DIN1 12, 13, 14 I Logic data input (from UART) ROUT5:ROUT1 15, 16, 17, 18, 19 O Logic data output (to UART) ROUT2B 20 O Always Active non-inverting output for RIN2 (normally used for ring indicator) INVALID 21 O Active low output when all RIN are unpowered FORCEOFF 22 I Low input forces DOUT1-5, ROUT1-5 high Z per Section 8.4 FORCEON 23 I High forces drivers on. Low is automatic mode per Section 8.4 C1– 24 — Negative lead on C1 capacitor GND 25 — Ground VCC 26 — Supply Voltage, Connect to 3V to 5.5V power supply V+ 27 O Positive charge pump output for storage capacitor only C1+ 28 — Positive lead of C1 capacitor Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 3 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage range(2) VCC range(2) V+ Positive output supply voltage V– Negative output supply voltage range(2) V+ – V– Supply voltage MAX 6 V –0.3 7 V 0.3 –7 V 13 V difference(2) VI Input voltage range VO Output voltage range TJ Operating virtual junction temperature Tstg Storage temperature range (1) MIN –0.3 Driver, FORCEOFF, FORCEON –0.3 6 Receiver –25 25 –13.2 13.2 –0.3 VCC + 0.3 Driver Receiver, INVALID UNIT V V 150 –65 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.3 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. (2) 6.2 ESD Ratings MAX V(ESD) (1) (2) Electrostatic discharge UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 RIN , DOUT, and GND pins (1) 15000 Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 All other pins(1) 3000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions (1) (See Figure 9-1) VCC = 3.3 V VCC Supply voltage VCC = 5 V NOM 3 3.3 3.6 4.5 5 5.5 V 2 5.5 5.5 DIN, FORCEOFF, FORCEON 0 0.8 V DIN, FORCEOFF, FORCEON 0 5.5 V –25 25 V 0 70 –40 85 DIN, FORCEOFF, FORCEON VIL Driver and control low-level input voltage VI Driver and control input voltage VI Receiver input voltage VCC = 5 V MAX3243C TA Operating free-air temperature (1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. 4 MAX UNIT 2.4 VIH Driver and control high-level input voltage VCC = 3.3 V MIN MAX3243I Submit Document Feedback V °C Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 6.4 Thermal Information THERMAL METRIC(1) DB DW PW 16 PINS 16 PINS 16 PINS UNIT RθJA Junction-to-ambient thermal resistance 76.1 59.0 70.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 35.8 28.8 21.0 °C/W RθJB Junction-to-board thermal resistance 37.4 30.3 29.2 °C/W ψJT Junction-to-top characterization parameter 7.4 7.8 1.3 °C/W ψJB Junction-to-board characterization parameter 37.0 30.0 28.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). 6.5 Electrical Characteristics –– Auto Power Down over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 9-1) PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT Supply current Auto-powerdown disabled No load, FORCEOFF and FORCEON at VCC. TA = 25°C For DB and PW package 0.3 1.2 mA Supply current Auto-powerdown disabled No load, FORCEOFF and FORCEON at VCC. TA = 25°C For DW package 0.3 1 mA Supply current Powered off No load, FORCEOFF at GND. TA = 25°C 1 10 Supply current Auto-powerdown enabled No load, FORCEOFF at VCC, FORCEON at GND, All RIN are open or grounded, All DIN are grounded. TA = 25°C 1 10 Input leakage current of FORCEOFF, FORCEON VI = VCC or VI at GND ±0.01 ±1 μA VIT+ Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC 2.7 V VIT– Receiver input threshold for INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC –2.7 VT Receiver input threshold for INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC –0.3 VOH INVALID high-level output voltage IOH = -1 mA, FORCEON = GND, FORCEOFF = VCC VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND, FORCEOFF = VCC ICC II (1) μA V 0.3 VCC – 0.6 V V 0.4 V Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 5 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 6.6 Electrical Characteristics –– Driver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 9-1) PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT VOH High-level output voltage All DOUT at RL = 3 kΩ to GND 5 5.4 V VOL Low-level output voltage All DOUT at RL = 3 kΩ to GND –5 –5.4 V VO Output voltage (mouse driveability) DIN1 = DIN2 = GND, DIN3 = VCC, 3-kΩ to GND at DOUT3, DOUT1 = DOUT2 = 2.5 mA ±5 IIH High-level input current VI = VCC ±0.01 ±1 μA IIL Low-level input current VI at GND ±0.01 ±1 μA Vhys Input hysteresis ±1 V IOS Short-circuit output current(3) ±60 mA ro Output resistance Ioff (1) (2) (3) Output leakage current VCC = 3.6 V, VO = 0 V VCC = 5.5 V, VO = 0 V VCC, V+, and V– = 0 V, VO = ±2 V FORCEOFF = GND, V ±35 300 10M Ω VO = ±12 V, VCC = 3 to 3.6 V ±25 VO = ±10 V, VCC = 4.5 to 5.5 V ±25 μA Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. 6.7 Electrical Characteristics –– Receiver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (see Figure 9-1) PARAMETER TEST CONDITIONS VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOH = 1.6 mA VIT+ Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) Ioff Output leakage current (except ROUT2B) FORCEOFF = 0 V rI Input resistance VI = ±3 V or ±25 V (1) (2) MIN TYP(2) VCC – 0.6 VCC – 0.1 MAX V 0.4 VCC = 3.3 V 1.6 2.4 VCC = 5 V 1.9 2.4 VCC = 3.3 V 0.6 1.1 VCC = 5 V 0.8 1.4 V V V 0.5 3 UNIT V ±0.05 ±10 μA 5 7 kΩ Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. 6.8 Switching Characteristics –– Auto Power Down over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7-5) PARAMETER TYP(1) UNIT tvalid Propagation delay time, low- to high-level output VCC = 5 V 1 μs tinvalid Propagation delay time, high- to low-level output VCC = 5 V 30 μs ten Supply enable time VCC = 5 V 100 μs (1) 6 TEST CONDITIONS All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 6.9 Switching Characteristics –– Driver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) (see Figure 9-1) MAX3243C, MAX3243I PARAMETER TEST CONDITIONS Maximum data rate RL = 3 kΩ One DOUT switching, CL = 1000 pF See Figure 7-1 tsk(p) Pulse skew(3) RL = 3 kΩ to 7 kΩ CL = 150 pF to 2500 pF See Figure 7-3 SR(tr) Slew rate, transition region (see Figure 7-1) VCC = 3.3 V, RL = 3 kΩ to 7 kΩ (1) (2) (3) MIN TYP(1) 150 250 kbit/s 100 ns MAX CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 UNIT V/μs All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V + 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. 6.10 Switching Characteristics –– Receiver over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(2) PARAMETER tPLH Propagation delay time, low- to high-level output tPHL Propagation delay time, high- to low-level output ten Output enable time tdis Output disable time tsk(p) (1) (2) (3) Pulse TYP(1) TEST CONDITIONS skew(3) UNIT CL = 150 pF, See Figure 7-3 150 ns 150 ns CL = 150 pF, RL = 3 kΩ, See Figure 7-4 200 ns 200 ns 50 ns See Figure 7-3 All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. Pulse skew is defined as |tPLH - tPHL| of each channel of the same device. 6.11 Typical Characteristics VCC = 3.3 V 0 6 5 ±1 4 ±2 VOL (V) VOH (V) VOH 3 ±3 2 ±4 1 ±5 0 ±6 VOL 0 5 10 15 20 25 30 Load Current (mA) 35 0 Figure 6-1. DOUT VOH vs Load Current 5 10 15 20 25 Load Current (mA) C001 30 35 C001 Figure 6-2. DOUT VOL vs Load Current Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 7 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 7 Parameter Measurement Information 7.1 3V Generator (see Note B) Input RS-232 Output 50 W RL 0V CL (see Note A) 3V FORCEOFF TEST CIRCUIT −3 V −3 V 6V t THL or tTLH VOH 3V 3V Output SR(tr) tTLH tTHL VOL VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s (MAX3243C/I) and 1 Mbit/s (MAX3243FC/I), ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns. Figure 7-1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 W RL Input 1.5 V 1.5 V 0V CL (see Note A) tPLH tPHL VOH 3V FORCEOFF 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s (MAX3243C/I) and 1 Mbit/s (MAX3243FC/I), ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns. Figure 7-2. Driver Pulse Skew 3 V or 0 V FORCEON 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) tPHL 50 W 3V FORCEOFF tPLH CL (see Note A) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns. Figure 7-3. Receiver Propagation Delay Times 8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 3V Input VCC 3 V or 0 V FORCEON 1.5 V GND S1 0V tPZH (S1 at GND) tPHZ (S1 at GND) RL 3 V or 0 V 1.5 V VOH Output 50% Output FORCEOFF Generator (see Note B) CL (see Note A) 0.3 V tPZL (S1 at VCC) tPLZ (S1 at VCC) 50 W 0.3 V Output 50% VOL TEST CIRCUIT NOTES: A. B. C. D. VOLTAGE WAVEFORMS CL includes probe and jig capacitance. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns. tPLZ and tPHZ are the same as tdis. tPZL and tPZH are the same as ten. Figure 7-4. Receiver Enable and Disable Times 2.7 V 2.7 V 0V Receiver Input 0V 50 W −2.7 V −2.7 V ROUT Generator (see Note B) 3V −3 V tvalid tinvalid VCC 50% VCC FORCEOFF DIN ten INVALID CL = 30 pF (see Note A) FORCEON 0V INVALID Output Autopowerdown 50% VCC V+ ≈V+ Supply Voltages 0.3 V VCC 0V 0.3 V DOUT ≈V− V− TEST CIRCUIT VOLTAGE WAVEFORMS Valid RS-232 Level, INVALID High 2.7 V Indeterminate 0.3 V 0V If Signal Remains Within This Region For More Than 30 ms, INVALID Is Low (see Note C) −0.3 V Indeterminate −2.7 V Valid RS-232 Level, INVALID High NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 W, 50% duty cycle, tr ≤10 ns, tf ≤10 ns. C. Auto-powerdown disables drivers and reduces supply current to 1 mA. Figure 7-5. INVALID Propagation Delay Times and Supply Enabling Time Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 9 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 8 Detailed Description 8.1 Overview The MAX3243 device consists of three line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV ESD (HBM) protection pin to pin (serial- port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. This combination of drivers and receivers matches that needed for the typical serial port used in an IBM PC/AT, or compatible. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output (ROUT2B), which allows applications using the ring indicator to transmit data while the device is powered down. Flexible control options for power management are available. when the serial port is inactive. The auto-power-down feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input voltages are between –0.3 V and 0.3 V for more than 30 µs. 8.2 Functional Block Diagram DIN1 DIN2 DIN3 FORCEOFF FORCEON ROUT1 ROUT2B ROUT2 14 9 13 10 12 11 DOUT1 DOUT2 DOUT3 22 23 Auto-powerdown 21 19 4 20 5 kW 18 5 INVALID RIN1 RIN2 5 kW ROUT3 17 6 RIN3 5 kW ROUT4 7 16 RIN4 5 kW ROUT5 15 8 RIN5 5 kW 10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 8.3 Feature Description 8.3.1 Auto-Power-Down Auto-Power-Down can be used to automatically save power when the receivers are unconnected or connected to a powered down remote RS232 port. FORCEON being high will override Auto power down and the drivers will be active. FORCEOFF being low will override FORCEON and will power down all outputs except for ROUT2B and INVALID. 8.3.2 Charge Pump The charge pump increases, inverts, and regulates voltage at V+ and V– pins and requires four external capacitors. 8.3.3 RS232 Driver Three drivers interface standard logic level to RS232 levels. All DIN inputs must be valid high or low. 8.3.4 RS232 Receiver Five receivers interface RS232 levels to standard logic levels. An open input will result in a high output on ROUT. Each RIN input includes an internal standard RS232 load. 8.3.5 ROUT2B Receiver ROUT2B is an always-active noninverting output of RIN2 input, which allows applications using the ring indicator to transmit data while the device is powered down. 8.3.6 Invalid Input Detection The INVALID output goes active low when all RIN inputs are unpowered. The INVALID output goes inactive high when any RIN input is connected to an active RS232 voltage level. Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 11 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 8.4 Device Functional Modes Table 8-1. Each Driver(1) INPUTS OUTPUT DIN (1) FORCEON VALID RIN RS-232 LEVEL FORCEOFF DRIVER STATUS DOUT X X L X Z Powered off L H H X H H H H X L Normal operation with auto-powerdown disabled L L H YES H H L H YES L X L H NO Z Normal operation with auto-powerdown enabled Power off by auto-powerdown feature H = high level, L = low level, X = irrelevant, Z = high impedance, YES = any RIN valid, NO = all RIN invalid Table 8-2. Each Receiver(1) INPUTS OUTPUTS RIN (1) FORCEON FORCEOFF ROUT X X L Z L X H H H X H L Open X H H RECEIVER STATUS Powered off Normal operation H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off Table 8-3. INVALID and ROUT2B Outputs(1) INPUTS OUTPUTS VALID RIN RIN2 RS-232 LEVEL (1) 12 FORCEON FORCEOFF INVALID ROUT2B YES L X X H L YES H X X H H YES OPEN X X H L NO OPEN X X L L OUTPUT STATUS Always Active Always Active H = high level, L = low level, X = irrelevant, Z = high impedance (off), OPEN = input disconnected or connected driver off, YES = any RIN valid, NO = all RIN invalid Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 9 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 9.1 Application Information It is recommended to add capacitors as shown in Figure 9-1. 9.2 Typical Application ROUT and DIN connect to UART or general purpose logic lines. RIN and DOUT lines connect to a RS232 connector or cable. C1+ 1 + C2 − 2 3 − C2− VCC V− GND + C1− RIN1 RIN2 RS-232 Inputs RIN3 RIN4 RIN5 DOUT1 RS-232 Outputs DOUT2 4 27 + − 26 25 C3(1) + + CBYPASS − = 0.1 mF − C1 24 23 FORCEON 5 Autopowerdown C4 V+ C2+ 28 6 7 22 FORCEOFF 8 21 9 20 10 19 INVALID ROUT2B ROUT1 5 kW DOUT3 18 11 ROUT2 5 kW DIN3 12 Logic Outputs 17 ROUT3 5 kW Logic Inputs DIN2 13 16 ROUT4 5 kW DIN1 14 15 ROUT5 5 kW (1) C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, and C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 mF 0.047 mF 0.1 mF 0.1 mF 0.33 mF 0.47 mF Figure 9-1. Typical Operating Circuit and Capacitor Values Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 13 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 9.2.1 Design Requirements • • VCC minimum is 3 V and maximum is 5.5V. Maximum recommended bit rate is 250 kbit/s. 9.2.2 Detailed Design Procedure • • All DIN, FORCEOFF and FORCEON inputs must be connected to valid low or high logic levels. Select capacitor values based on VCC level for best performance. 9.2.3 Application Curves Voltage (V) VCC= 3.3 V 6 5 4 3 2 1 0 ±1 ±2 ±3 ±4 ±5 ±6 ±7 ±8 ±9 DIN DOUT to RIN ROUT 0 1 2 3 4 5 Time ( s) 6 7 C001 Figure 9-2. Driver to Receiver Loopback Timing Waveform 9.3 Power Supply Recommendations VCC should be between 3 V and 5.5 V. Charge pump capacitors should be chosen using table in Figure 9-1. 9.4 Layout 9.4.1 Layout Guidelines Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise and fall times. In the Layout Example diagram, only critical layout sections are shown. Input and output traces will vary in shape and size depending on the customer application. FORCEON and FORCEOFF should be pulled up to VCC or GND via a pullup resistor, depending on which configuration the user desires upon power-up. 14 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 9.4.2 Layout Example C1 1 C2+ C1+ 28 2 C2- V+ 27 C2 Ground C3 Ground 3 V- VCC 26 4 RIN1 GND 25 5 RIN2 C1- 24 6 RIN3 FORCEON 23 7 RIN4 FORCEOFF 22 8 RIN5 INVALID 21 9 DOUT1 ROUT2B 20 10 DOUT2 ROUT1 19 11 DOUT3 ROUT2 18 12 DIN3 ROUT3 17 13 DIN2 ROUT4 16 14 DIN1 ROUT5 15 C4 VCC 0.1 μF Ground Figure 9-3. Layout Diagram Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 15 MAX3243 www.ti.com SLLS350P – APRIL 1999 – REVISED OCTOBER 2022 10 Device and Documentation Support 10.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 10.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 10.3 Trademarks IBM™ and PC/AT™ are trademarks of IBM. TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 10.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 10.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 11 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: MAX3243 PACKAGE OPTION ADDENDUM www.ti.com 18-Nov-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) (1) MAX3243CDB LIFEBUY SSOP DB 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C MAX3243CDBG4 LIFEBUY SSOP DB 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C MAX3243CDBR ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C Samples MAX3243CDBRE4 ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C Samples MAX3243CDBRG4 ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C Samples MAX3243CDW LIFEBUY SOIC DW 28 20 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C MAX3243CDWE4 LIFEBUY SOIC DW 28 20 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C MAX3243CDWR ACTIVE SOIC DW 28 1000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C Samples MAX3243CDWRG4 ACTIVE SOIC DW 28 1000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3243C Samples MAX3243CPW LIFEBUY TSSOP PW 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3243C MAX3243CPWE4 LIFEBUY TSSOP PW 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3243C MAX3243CPWR ACTIVE TSSOP PW 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3243C Samples MAX3243CPWRG4 ACTIVE TSSOP PW 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 MA3243C Samples MAX3243IDB LIFEBUY SSOP DB 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243I MAX3243IDBG4 LIFEBUY SSOP DB 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243I MAX3243IDBR ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243I Samples MAX3243IDW ACTIVE SOIC DW 28 20 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243I Samples MAX3243IDWR ACTIVE SOIC DW 28 1000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 MAX3243I Samples MAX3243IDWRG4 ACTIVE SOIC DW 28 1000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3243I Samples MAX3243IPW LIFEBUY TSSOP PW 28 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3243I MAX3243IPWR ACTIVE TSSOP PW 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3243I Samples MAX3243IPWRE4 ACTIVE TSSOP PW 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 MB3243I Samples The marketing status values are defined as follows: Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Nov-2022 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of